CN204991690U - Radiator - Google Patents

Radiator Download PDF

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Publication number
CN204991690U
CN204991690U CN201520650486.3U CN201520650486U CN204991690U CN 204991690 U CN204991690 U CN 204991690U CN 201520650486 U CN201520650486 U CN 201520650486U CN 204991690 U CN204991690 U CN 204991690U
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China
Prior art keywords
heat pipe
substrate
containing hole
close
relative
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Expired - Fee Related
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CN201520650486.3U
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Chinese (zh)
Inventor
林胜煌
林源忆
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Priority to CN201520650486.3U priority Critical patent/CN204991690U/en
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Publication of CN204991690U publication Critical patent/CN204991690U/en
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Abstract

The utility model relates to a radiator, this radiator include a base plate and an at least heat pipe, and this heat pipe holding is downthehole in the holding that this base plate has, and it is downthehole double -phase on to the inner wall that the both sides limit that makes this heat pipe is hugged closely in this holding by the compressional deformation, and it is as an organic whole to make this base plate and heat pipe close -fitting combine, use to reach and solve known ditch hole and need secondary operation and lead to the fact pingdu bad problem in the back because of processing, and can reach sparingly the effect of cost and samming simultaneously.

Description

Heat abstractor
[technical field]
The utility model has about a kind of heat abstractor, espespecially a kind of have can save material and the degree of depth that can control containing hole and the top side and the bottom side evenness that maintain substrate, and then also effectively reach the heat abstractor of effect of samming.
[background technology]
In recent years along with the fast development of information, communication and opto-electronics, electronic product moves towards high-order and lightening gradually, under the demand of high speed, high-frequency and miniaturization, the heat generation density of electronic component is more and more higher, and therefore radiating efficiency has become the key factor determining electronic product stability; Because heat pipe or conducting strip have high efficiency thermal conduction characteristic, be one of heat conducting element of extensive use in electronic product.Heat pipe or conducting strip are mainly by the airtight vacuum copper pipe or the copper sheet that have capillary layer at its wall sintering, the working fluid in pipe is utilized to absorb thermal source (as CUP etc.) at evaporation ends and gasify, the steam of heating end condenses into liquid and capillary force effect by capillary layer is back to evaporation ends at condensation end after heat radiation (such as with radiating fin and fan etc.), forms a sealing and circulating.
Mainly comprise as TaiWan, China patent gazette Application No. the 097202791st discloses a kind of radiator: a pedestal, this pedestal has the first relative side and the second side, the first side of this pedestal offers a S connected in star; One S shape heat pipe correspondence is arranged in this S connected in star; And complex cooling fin is arranged on the first side of this pedestal; It is characterized in that: the first side of this pedestal also offers at least one U-shaped groove, the opening of described U-shaped groove towards the opening in two openings of this S connected in star, so that an opening portion of described S connected in star is closed; And this radiator also comprises at least one U-shaped heat pipe, described U-shaped heat pipe correspondence is arranged in described U-shaped groove, and wherein the heat accumulating in this base central can be transmitted to the edge of this pedestal by this S shape heat pipe and this U-shaped heat pipe rapidly.When the S connected in star of pedestal and U-shaped groove are in time being formed in known technology, S connected in star and U-shaped depth of groove wayward and have tolerance issues, and when S connected in star and U-shaped Pocket Machining are formed, its Stress Release causes pedestal poor with the back side (i.e. the side of the relative lower shoe of the pedestal) levelness of U-shaped groove in S connected in star 111, and then causes this pedestal to correspond to S connected in star and U-shaped groove front and S connected in star and the U-shaped groove back side cannot to distinguish the problem effectively attaching fin and heater element (as central processing unit or pattern processor).Separately, because pedestal uses copper material many, this pedestal preponderance is caused.
The above, known technology has its own shortcomings:
1. preponderance.
2. consume material.
3. groove has tolerance issues.
4. back side levelness difference (or poor flatness) of pedestal.
Therefore how will solve the above-mentioned problem commonly used and disappearance, the utility model people being this case and the relevant manufactures being engaged in the industry desire most ardently the place, direction studying improvement.
[utility model content]
For effectively solving above-mentioned problem, the main purpose of the utility model is providing a kind of through the deformation phase tight fit that is squeezed in the containing hole of at least one heat pipe in a substrate, heat pipe and substrate close-fitting is made to integrally combine, effectively to avoid the heat abstractor causing the true Pingdu of substrate front side and the back side bad.
Another object of the utility model provides one can reduce materials to reach saving cost, and then also effectively reaches the heat abstractor of even temperature effect.
Another object of the utility model provides a kind of through the deformation phase tight fit that is squeezed in the containing hole of at least one heat pipe in a substrate, heat pipe and substrate close-fitting is made to integrally combine, effectively to avoid the heat abstractor manufacture method causing the true Pingdu of substrate front side and the back side bad.
Another object of the utility model provides one can reduce materials to reach saving cost, and then also effectively reaches the heat abstractor manufacture method of even temperature effect.
For reaching above-mentioned purpose, the utility model provides a kind of heat abstractor, comprising: a substrate, has at least one containing hole, a top side and a bottom side, and this containing hole penetrates this bottom side relatively by this top side; At least one heat pipe, close-fitting is placed in this this containing hole relative, and this heat pipe has the 4th side of one first side, the second side of this first side relative, one the 3rd side and relative 3rd side, the top side of concordant this substrate adjacent of this first and second side difference and bottom side, the deformation that is squeezed of this third and fourth side is close to should in two opposed inner walls in containing hole, make this substrate and this heat pipe close-fitting integrally combine.
This containing hole has at least one interference part, and this interference part is formed at least one inwall of this containing hole, and this interference part and relative 3rd side or the 4th side interference close-fitting, it is in order to increase the frictional force of close-fitting.
This interference part is a matsurface or an embossing or a protuberance or a recess or a concave, convex portion wherein arbitrary or and combination.
The shape of this containing hole is linearity or oblique line shape or meander-like wherein arbitrary shape.
First and second side of this heat pipe is sticked mutually with relative plural heater element respectively.
Second side of this heat pipe is sticked relatively with a relative heater element, and a radiator is docked in first side of this heat pipe.
This substrate formed with metal material.
For reaching above-mentioned purpose, the utility model separately provides a kind of heat abstractor manufacture method, comprise and a substrate and at least one heat pipe are provided, this substrate has at least one containing hole, this containing hole runs through top side and the bottom side of this substrate, and be positioned over by this heat pipe in this containing hole relative, and the height of this heat pipe is higher than the top side of this substrate, is formed with a gap between this heat pipe and two opposed inner walls of this containing hole relative; And a mould is provided, the side of the top die comprised with this mould to this heat pipe of the top side of this substrate adjacent imposes and presses processing, the dual-side of this heat pipe is made to be squeezed deformation and this gap is filled up in lateral magnification and be close to should in two opposed inner walls in containing hole, make this substrate and this heat pipe close-fitting integrally combine.
One mould is provided, the side of the top die comprised with this mould to this heat pipe of the top side of this substrate adjacent imposes the step pressing processing, more comprise and provide this mould, this top die comprised with this mould and a dip mold impose the opposite side of the heat pipe of the side of this heat pipe of the top side of this substrate adjacent and the bottom side of this substrate adjacent respectively simultaneously and press processing.
One mould is provided, the side of the top die comprised with this mould to this heat pipe of the top side of this substrate adjacent imposes and presses processing, the dual-side of this heat pipe is made to be squeezed deformation and this gap is filled up in lateral magnification and be close to should in two opposed inner walls in containing hole, after the step making this substrate and this heat pipe close-fitting integrally combine, more comprise to the side of the top side of this substrate this heat pipe adjacent carry out punch process or milling pin processing or planing operation, make the side of this heat pipe of top side truncation of this substrate.
This mould is provided, this top die comprised with this mould and a dip mold impose the opposite side of this heat pipe of the side of this heat pipe of the top side of this substrate adjacent and the bottom side of this substrate adjacent respectively simultaneously and press processing, the dual-side of this heat pipe is made to be squeezed deformation and this gap is filled up in lateral magnification and be close to should in two opposed inner walls in containing hole, after the step making this substrate and this heat pipe close-fitting integrally combine, more comprise the side of the top side of this substrate this heat pipe adjacent respectively with bottom side and opposite side carries out punch process or milling pin is processed or planing operation, the top side of this substrate and bottom side is made to distinguish side and the opposite side of this heat pipe of truncation.
At least one inwall in this containing hole forms at least one interference part.
These interference parts are a matsurface or an embossing or a protuberance or a recess or a concave, convex portion wherein arbitrary or and combination.
The shape of this containing hole is linearity or oblique line shape or meander-like wherein arbitrary shape.
First and second side of this heat pipe is sticked mutually with relative plural heater element respectively.
A radiator is docked in first side of this heat pipe, and second side of this heat pipe is sticked relatively with a relative heater element.
[accompanying drawing explanation]
Fig. 1 is the exploded perspective schematic diagram of first embodiment of the utility model;
Fig. 2 A is the combination schematic perspective view of first embodiment of the utility model;
Fig. 2 B is the combination generalized section of first embodiment of the utility model;
Fig. 3 A is another combination schematic perspective view of first embodiment of the utility model;
Fig. 3 B is another combination schematic perspective view of first embodiment of the utility model;
Fig. 4 is another exploded perspective schematic diagram of first embodiment of the utility model;
Fig. 5 is the exploded perspective schematic diagram of second embodiment of the utility model;
Fig. 5 A is the combination generalized section of second embodiment of the utility model;
Fig. 6 is the schematic flow sheet of the 3rd embodiment of the utility model;
Fig. 7 A is the schematic diagram that the heat pipe of the 3rd embodiment of the utility model puts in substrate;
Fig. 7 B is the generalized section that the heat pipe of the 3rd embodiment of the utility model puts in substrate;
Fig. 7 C is the schematic diagram that the mould of the 3rd embodiment of the utility model carries out for the heat pipe in substrate pressing;
Fig. 8 is the schematic flow sheet of the 4th embodiment of the utility model;
Fig. 9 is the schematic flow sheet of the 5th embodiment of the utility model;
The circular shaping heat pipe that provides of the 5th embodiment that Figure 10 A is the utility model is just preparing the schematic diagram putting into counterpart substrate;
Figure 10 B is the schematic diagram that the shaping heat pipe of the circle of the 5th embodiment of the utility model puts in substrate;
Figure 10 C is the generalized section that the shaping heat pipe of the circle of the 5th embodiment of the utility model puts in substrate;
Figure 10 D be the utility model the 5th embodiment on, bed die carries out the schematic diagram that presses for the heat pipe that the circle in substrate is shaping;
What Figure 11 was the utility model provide, and circular shaping heat pipe just preparing puts into the schematic diagram that correspondence has the substrate of interference part;
Figure 12 is on the utility model, another aspect of bed die for the heat pipe that the circle in substrate is shaping sequentially carry out roll extrusion to roll extrusion complete after the schematic diagram of this heat abstractor of disengaging.
Element in accompanying drawing representated by each sequence number is:
Heat abstractor ... 1
Substrate ... 11
Containing hole ... 111
Interference part ... 112
Top side ... 113
Bottom side ... 114
Heat pipe ... 13
First side ... 131
Second side ... 132
3rd side ... 133
4th side ... 134
Endotherm section ... 135
Radiating segment ... 136
Chamber ... 137
Capillary structure ... 138
Gap ... 14
Heater element ... 2
Mould ... 3
Top die ... 31
Dip mold ... 32
Radiator ... 4
Radiating fin ... 41
[embodiment]
Characteristic on the above-mentioned purpose of the utility model and structure and fuction thereof, will be explained according to the embodiment of institute's accompanying drawings.
The utility model provides a kind of heat abstractor and manufacture method thereof.Refer to Fig. 1, Fig. 2 A, Fig. 2 B, the Decomposition and composition for first embodiment of the utility model is three-dimensional and combine generalized section.This heat abstractor 1 comprises a substrate 11 and at least one heat pipe 13, this substrate 11 with metal material (as copper material) formed, and this substrate 11 has at least one containing hole 111, this containing hole 111 penetrates the bottom side 114 of this substrate 11 relatively by the top side 113 of this substrate 11, and explain in the shape of the containing hole 111 of this preferred embodiments with meander-like (as S shape), but be not limited thereto, when implementing when concrete, the shape of this containing hole 111 also may be selected to be linearity (as Fig. 3 A) or oblique line shape (as Fig. 3 B) or other shapes (as U-shaped or random geometry).And described heat pipe 13 close-fitting is placed in this this containing hole 111 relative, illustrate in this preferred embodiments with single heat pipe 13, and the shape of this heat pipe 13 is chosen as the heat pipe 13 of S shape, explains so that Corresponding matching aforementioned containing hole 111 shape is S-shaped, but be not limited thereto.In time specifically implementing, the shape of aforementioned heat pipe 13 also may be selected to be the heat pipe 13 (heat pipe as U-shaped) of other shapes, and aforementioned containing hole 111 is not limited to above-mentioned quantity with the quantity of heat pipe 13, also can illustrate by design drawing 3A, Fig. 3 B, plural number containing hole 111 (as four containing holes 111) runs through and is formed on this substrate 11, and plural heat pipe 13 (as four heat pipes 13) mates these containing holes 111, and these heat pipe 13 close-fittings are made to be located in these containing holes 111 corresponding.
And this heat pipe 13 has the 4th side 134, endotherm section 135 and a radiating segment 136 of relative 3rd side 133, the second side 133, side 132, the 3rd of one first this first side 131 relative, side 131, there is in this heat pipe 13 chamber 137, this chamber 137 inwall is formed with a capillary structure 138 (as sintering powder or grid or groove), and is filled with a working fluid in this chamber 137, and first of this heat pipe 13, two sides 131, 132 in flat condition, and this heat pipe 13 is through machining (punch process or extrusion process or the mode such as rolling and processing or forging processing) to this first side 131 (or first in this better enforcement, two sides 131, 132) process, make this first, two sides 131, the top side 113 of 132 difference concordant (or truncation) these substrates 11 adjacent and bottom side 114, simultaneously this heat pipe 13 the 3rd, four sides 133, 134 can be squeezed deformation and lateral magnifications are closely affixed on this to should in two opposed inner walls in containing hole 111, make this substrate 11 be combined as a whole with heat pipe 13 close-fitting and form described heat abstractor 1.So be squeezed deformation with the design integrally combined with substrate 11 phase close-fitting through third and fourth side 133,134 of this heat pipe 13, make to allow the top side 113 of this substrate 11 good with the levelness of bottom side 114, and except reducing materials, can also dispense extra support fix heat pipe 13 element (as known palpus one upper plate loosely be installed with heat pipe, a lower shoe connects upper plate to support fixing heat pipe).
Continue and consult Fig. 2 A, Fig. 2 B, Fig. 4, the centre of this substrate 11 is positioned in the endotherm section 135 of the heat pipe 13 of this embodiment, and the second side 132 of this endotherm section 135 is attached at a heater element 2 (as central processing unit or graphic process unit), because of the top side 113 (or front) of this substrate 11 and the levelness of bottom side 114 (or back side) good, the bottom side 114 of this substrate 11 and the second side 132 of heat pipe 13 are in same level, make the second side 132 of the bottom side 114 of this substrate 11 and heat pipe 13 can smooth with to fitting by heater element 2, and the edge that the radiating segment 136 of heat pipe 13 in this containing hole 111 extends to this substrate 11 adjacent away from this endotherm section 135 explains, but be not limited thereto, in time specifically implementing, user can in advance according to solution thermal source Demand Design, adjustment is positioned at first of this endotherm section 135, two sides 131, 132 are sticked a heater element 2 (as central processing unit and graphic process unit) simultaneously respectively.Separately, the radiator 4 that one has plurality of radiating fins 41 can be docked in first side 131 of aforementioned heat pipe 13, and the side of this radiator 4 smooth with to should the first side 131 of heat pipe 13 and the top side 113 of substrate 11 fit, make the second side 132 of this heat pipe 13 heat absorbed be conducted to respectively radiating segment 136 and this first side 131 radiator 4 on it externally dispel the heat, partial heat also can by the 3rd simultaneously, four sides 133, 134 are transmitted in containing hole 111 liang of opposed inner walls of being closely sticked, make heat evenly can be transmitted to whole substrate 11 fast to reach the effect of samming, and then radiator 4 can externally be dispelled the heat by the heat absorbed on whole substrate 11 rapidly.
Therefore through the design of the heat abstractor 1 of the utility model, make effectively to reach the evenness (i.e. the front of substrate 11 and back side levelness good) of the top side 113 and bottom side 114 controlling substrate 11, and also effective materials that reduce come cost-effective effect, and solve the overweight problem of known pedestal, and then more can reach the effect of samming.In addition, the utility model utilizes this containing hole 111 directly to run through this substrate 11, makes the problem needing controlling depth when effectively solving known formation groove and have tolerance.
Refer to Fig. 5, Fig. 5 A, the Decomposition and composition broken isometric schematic diagram of second embodiment of display the utility model.The structure of this embodiment and connection relationship and effect roughly identical with aforementioned first embodiment, therefore again do not repeat at this, difference both it be in: aforementioned containing hole 111 has at least one interference part 112, this interference part 112 explains in this better protuberance that is embodied as, but be not limited thereto, in time specifically implementing, this interference part 112 also may be selected to be a matsurface or an embossing or a recess or aforementioned protuberance or a concave, convex portion and wherein appoints one or more additive combination to apply, and wherein aforementioned crude exasperate can be as the little flank of tooth or little convex surface or granule face.And this interference part 112 is formed at least one inwall of this containing hole 111, in the present embodiment with protuberance (salient point, raised line or random geometry) for this interference part 112 illustrates, at least one protuberance one continuously and/or interval and/or staggered aspect projection be formed in (as Fig. 5, Fig. 5 A) at least one inner wall surface of this containing hole 111, and this interference part 112 and relative 3rd side 133 or the 4th side 134 interference close-fitting, in order to increase the frictional force (or grasping force) of close-fitting; And another implements aspect, and to can be this interference part 112 be that a rectangular protuberance extends to continuously the centre of containing hole 111 1 inwall of this containing hole 111 rear end from the centre of containing hole 111 1 inwall of this containing hole 111 front end and formed, and this interference part 112 and relative 3rd side 133 or the 4th side 134 interference close-fitting, in order to increase the frictional force (or grasping force) of close-fitting.So produce the close-fitting degree of interfering and can strengthen this substrate 11 and heat pipe 13 through previous intervention portion 112; Therefore previous intervention portion 112 aspect be formed in two opposed inner walls of this containing hole 111 can be arranged in pairs or groups arbitrarily according to user's demand in advance and be selected design, closes first Chen Ming.
Referring to Fig. 6, is the schematic flow sheet of the 3rd embodiment of the utility model, and is aided with and consults Fig. 1, Fig. 2 A, Fig. 2 B, Fig. 7 C.This present embodiment is the manufacture method of the heat abstractor 1 of aforementioned first preferred embodiments, and this heat abstractor 1 manufacture method comprises the following steps:
(S10) substrate 11 and at least one heat pipe 13 are provided, this substrate 11 has at least one containing hole 111, this containing hole 111 runs through top side 113 and the bottom side 114 of this substrate 11, and this heat pipe 13 is positioned in this containing hole 111 relative, and the height of this heat pipe 13 is higher than the top side of this substrate 11, between this heat pipe 13 and two opposed inner walls of this containing hole 111 relative, be formed with a gap 14 (namely the footpath degree of containing hole 111 is greater than the footpath degree of heat pipe 13);
There is provided one with metal material (as copper, aluminium material) substrate 11 and at least one heat pipe 13 that form, this substrate 11 has at least one containing hole 111, this containing hole 111 is run through towards this bottom side 114 relative by the top side 113 of this substrate 11, and this heat pipe 13 is positioned over this containing hole 111 interior (Fig. 7 A) relatively, the height of aforementioned heat pipe 13 is higher than the top side 113 of this substrate 11, the width of this heat pipe 13 is less than the width of this containing hole 111, then namely be formed with a gap 14 between this heat pipe 13 with two opposed inner walls in this containing hole 111 relative, in other words, be exactly now heat pipe 13 be loosely located in containing hole 111 (Fig. 7 B).Shape wherein in the containing hole 111 of this preferred embodiments explains with meander-like (as S shape), but be not limited thereto, when implementing when concrete, the shape of this containing hole 111 also may be selected to be linearity (Fig. 3 A) or oblique line shape (Fig. 3 B) or other shapes (as U-shaped or geometry), and the shape of the shape of this heat pipe 13 and this containing hole 111 of quantity Matching and quantity.So utilize this containing hole 111 directly to run through this substrate 11 through the utility model the method, need controlling depth when effectively can solve known formation groove and have the problem of tolerance.Wherein in the heat pipe 13 of this better enforcement be pre-molding and S-shaped flat hot pipe 13, explain so that Corresponding matching aforementioned containing hole 111 shape is S-shaped, but be not limited thereto, in time specifically implementing, the shape of aforementioned heat pipe 13 also may be selected to be the heat pipe 13 (heat pipe as U-shaped) of other shapes.
(S11) mould 3 is provided, the side of a top die 31 to the heat pipe 13 of the top side 113 of this substrate 11 adjacent comprised with this mould 3 imposes and presses processing, the dual-side of this heat pipe 13 is made to be squeezed deformation and this gap is filled up in lateral magnification and be close to should in two opposed inner walls in containing hole 111, make this substrate 11 integrally combine with this heat pipe 13 close-fitting.
One mould 3 is provided, comprise the side (i.e. first side 131 of aforementioned heat pipe 13) of a top die 31 to the heat pipe 13 of the top side 113 of this substrate 11 adjacent with this mould 3 and press processing, the dual-side of this heat pipe 13 (i.e. third and fourth side 133,134 of this heat pipe 13) is made to be squeezed deformation and aforementioned gap 14 is filled up in lateral magnification, and then allow third and fourth side 133,134 of this heat pipe 13 closely be affixed on should in two opposed inner walls in containing hole 111, integrally combining with this heat pipe 13 close-fitting to make this substrate 11 is formed described heat abstractor 1.So above method can solve the known problem causing the back side poor flatness of pedestal because of processing problems, and then more can improve the problem of known consume material and preponderance.
After this step S11, the processing of milling pin or planing operation are carried out in the side (i.e. the first side 131 of heat pipe 13) more comprised this adjacent heat pipe 13 of the top side 113 of this substrate 11, make the side of top side 113 truncation (or concordant) this heat pipe 13 of this substrate 11.
In addition, Fig. 4 can be consulted, second side 132 (being namely positioned at the second side 132 of endotherm section 135) of aforementioned heat pipe 13 can be attached at a heater element 2 (as central processing unit or graphic process unit), because the top side 113 of this substrate 11 is good with the levelness of bottom side 114, the bottom side 114 of this substrate 11 and the second side 132 of heat pipe 13 are in same level, make the second side 132 of the bottom side 114 of this substrate 11 and heat pipe 13 can smooth with to fitting by heater element 2, and the edge that the radiating segment 136 of heat pipe 13 in this containing hole 111 extends to this substrate 11 adjacent away from this endotherm section 135 explains, but be not limited thereto, in time specifically implementing, user can in advance according to solution thermal source Demand Design, adjustment is positioned at first of this endotherm section, two sides 131, 132 are sticked a heater element 2 (as central processing unit and graphic process unit) simultaneously respectively.Separately, the radiator 4 that has plurality of radiating fins 41 can be docked in the first side 131 of aforementioned heat pipe 13, and the side of this radiator 4 smooth with to should the first side 131 of heat pipe 13 and the top side 113 of substrate 11 fit.
Therefore be bonded the method design of heat abstractor 1 through substrate 11 and heat pipe 13 close-fitting of the utility model, obtain the front and the back side evenness that effectively control substrate 11 and effectively reduce materials, and then more can reach the effect of samming.
Refer to Fig. 8, the schematic flow sheet of the 4th embodiment of display the utility model, and be aided with and consult Fig. 5, Fig. 5 A.This present embodiment is the manufacture method of the heat abstractor 1 of aforementioned second preferred embodiments, and this heat abstractor 1 manufacture method comprises the following steps:
(S20) substrate 11 and at least one heat pipe 13 are provided, this substrate 11 has at least one containing hole 111, this containing hole 111 runs through top side 113 and the bottom side 114 of this substrate 11, and by least one interference part 112 shaping at least one inwall in this containing hole 111, and this heat pipe 13 is positioned in this containing hole 111 relative, and the height of this heat pipe 13 is higher than the top side of this substrate 11, between this heat pipe 13 and two opposed inner walls of this containing hole 111 relative, be formed with a gap 14;
One substrate formed with metal material (as copper, aluminium material) 11 and at least one heat pipe 13 are provided, this substrate 11 has at least one containing hole 111, this containing hole 111 is run through towards this bottom side 114 relative by the top side 113 of this substrate 11, and form at least one interference part 112 by least one inwall in this containing hole 111, this interference part 112 can be a protuberance (as Fig. 5) or is that a rectangular protuberance (as Figure 11) explains, but is not limited thereto.In time specifically implementing, this interference part 112 also may be selected to be with machining mode be shaped to a matsurface or an embossing or a recess or a jog wherein arbitrary or and combination, wherein aforementioned crude exasperate can be as the little flank of tooth or little convex surface or granule face, and then this interference part 112 also can select not machine-shaping to go out this interference part 112, as as described in interference part 112 be that recess (or protuberance or recess or jog) is integrally formed on an inwall of this containing hole 111, or previous intervention portion 112 also can be changed to a plurality of interference part 112 and is formed on this containing hole 111 1 inwall, close first Chen Ming.The flat hot pipe 13 being wherein pre-molding in the heat pipe 13 of this better enforcement explains, but is not limited thereto.In time specifically implementing, aforementioned heat pipe 13 also can be selected to be provided as a circular shaping heat pipe 13 (as Figure 11).
Then, this heat pipe 13 is positioned in this containing hole 111 relative, the height of aforementioned heat pipe 13 is higher than the top side 113 of this substrate 11, the width of this heat pipe 13 is less than the width of this containing hole 111, and be formed with a gap 14 between this heat pipe 13 with two opposed inner walls in this containing hole 111 relative, in other words, be exactly now heat pipe 13 be loosely located in containing hole 111.Shape wherein in the containing hole 111 of this preferred embodiments explains with meander-like (as S shape), but be not limited thereto, when implementing when concrete, the shape of this containing hole 111 also may be selected to be linearity (as Fig. 3 A) or oblique line shape (as Fig. 3 B), and the shape of the shape of this heat pipe 13 and this containing hole 111 of quantity Matching and quantity.So utilize this containing hole 111 directly to run through this substrate 11 through the utility model the method, need controlling depth when effectively can solve known formation groove and have the problem of tolerance.(S21) mould 3 is provided, the side of this top die 31 to the heat pipe 13 of the top side 113 of this substrate 11 adjacent comprised with this mould 3 imposes and presses processing, a side of this heat pipe 13 is made to be squeezed deformation and this gap 14 is filled up in lateral magnification, and close-fitting is interferenceed with the interference part 112 of an inwall of this containing hole 111, another side of this heat pipe 13 is squeezed deformation and this gap 14 is filled up in lateral magnification and be close on another inwall of relatively this containing hole 111 simultaneously, makes this substrate 11 integrally combine with this heat pipe 13 close-fitting.
There is provided a mould 3, heat pipe 13 side (i.e. first side 131 or second side 132 of aforementioned heat pipe 13) of the top die 31 (as Fig. 7 C) comprised with this mould 3 to the top side 113 of this substrate 11 adjacent presses processing.And in time specifically implementing, as Figure 10 D, foregoing mould 3 also makes a dip mold 32 that can comprise this top die 31 this top die 31 relative to into, imposes respectively simultaneously press processing through top die 31 and dip mold 32 to the opposite side of the heat pipe 13 of the side of this heat pipe 13 of the top side of this substrate 11 adjacent and the bottom side of this substrate 11 adjacent.Processing mode wherein in the mould 3 of this better enforcement is that punch process mode explains, but is not limited thereto, and in time specifically implementing, also may be selected to be extrusion process or the mode such as rolling and processing or forging processing, closes first Chen Ming.
Then, a side of this heat pipe 13 (as the 3rd side 133) is made to be squeezed deformation and aforementioned gap 14 is filled up in lateral magnification, and the interference part 112 interference close-fitting of inwall with this containing hole 111 relative, another side (as the 4th side 134) of this heat pipe 13 also can be squeezed deformation and aforementioned gap 14 is filled up in lateral magnification simultaneously, in two opposed inner walls be closely affixed in this containing hole 111 relative to allow third and fourth side 133,134 of this heat pipe 13, formed described heat abstractor 1 to make this substrate 11 and this heat pipe 13 close-fitting integrally combine.Be wherein that the first side 131 explains in the side of the heat pipe 13 of this better enforcement, but be not limited thereto.Increase urgent frictional force (or grasping force) so produce to interfere through previous intervention portion 112, use the effect of the close-fitting degree of this substrate 11 of strengthening and heat pipe 13.
In addition, in time specifically implementing, if plural interference part 112 design forming is in two opposed inner walls of this containing hole 111 and carry out pressing adding man-hour, the dual-side of this heat pipe 13 is made to be squeezed deformation and this gap 14 is filled up in lateral magnification, and close-fitting is interferenceed with the plural interference part 112 of two opposed inner walls of this containing hole 111, this substrate 11 is made to integrally combine with this heat pipe 13 close-fitting, increase urgent frictional force (or grasping force) so produce to interfere through plural interference part 112, use the effect of the close-fitting degree of this substrate 11 of strengthening and heat pipe 13.
After this step S21, more comprise and punch process is carried out to the top side 113 of this substrate 11 and the side of this heat pipe 13 adjacent or milling pin is processed or planing operation, make the side (i.e. the first side 131) of this heat pipe 13 of top side 113 truncation of this substrate 11.
Therefore be bonded the method design of heat abstractor 1 through substrate 11 and heat pipe 13 close-fitting of the utility model, obtain the front and back side evenness that effectively control substrate 11, and reach saving cost, and then more can reach the effect of samming.
Refer to Fig. 9, the schematic flow sheet of the 5th embodiment of display the utility model, and be aided with and consult Fig. 2 A, Fig. 2 B, Figure 10 D.Manufacture method step S40, the S41 of this present embodiment are roughly the same with step S10, the S11 of aforementioned 4th embodiment, therefore same section is not then repeated, and the flat hot pipe of abovementioned steps S10 mainly changes and is designed to circular shaping heat pipe by the step S40 of the present embodiment, and the mould of abovementioned steps S11 is changed design and become and comprise a top die 31 and a dip mold 32 explains.That is the manufacture method of this better enforcement comprises lower step:
(S40) heat pipe 13 (Figure 10 A) that this substrate 11 is shaping with at least one circle is provided, this substrate 11 has at least one containing hole 111, this containing hole 111 runs through top side 113 and the bottom side 114 of this substrate 11, and this heat pipe 13 is positioned over this containing hole 111 interior (Figure 10 B) relatively, and the height of this heat pipe 13 is higher than the top side of this substrate 11, between this heat pipe 13 and two opposed inner walls of this containing hole 111 relative, be formed with this gap 14 (Figure 10 C); Heat pipe 13 wherein in this better enforcement is a circular shaping and S-shaped heat pipe 13, explains, but be not limited thereto so that Corresponding matching aforementioned containing hole 111 shape is S-shaped.In time specifically implementing, aforementioned heat pipe 13 also can select the flat hot pipe 13 (as Fig. 7 A) being provided as pre-molding, and the shape of this heat pipe 13 also can be the heat pipe 13 (heat pipe as U-shaped) of other shapes.
(S41) this mould 3 is provided, the aforementioned top die 31 comprised with this mould 3 and a dip mold 32 (as Figure 10 D) impose the opposite side of the heat pipe 13 of the side of this heat pipe 13 of the top side of this substrate 11 adjacent and the bottom side of this substrate 11 adjacent respectively simultaneously and press processing, the dual-side of this heat pipe 13 is made to be squeezed deformation and this gap 14 is filled up in lateral magnification and be close to should, in two opposed inner walls in containing hole 111 (Fig. 2 B), make this substrate 11 integrally combine with this heat pipe 13 close-fitting.So above method of the present utility model can solve the known problem causing the back side poor flatness of pedestal because of processing problems, and then more can improve the problem of known consume material and preponderance.Processing mode wherein in the mould 3 of this better enforcement is that punch process mode explains, but is not limited thereto, and in time specifically implementing, also may be selected to be extrusion process or the mode such as rolling and processing (Figure 12) or forging processing, closes first Chen Ming.
After this step S41, more comprise the side of the top side 113 of this substrate 11 this heat pipe 13 adjacent with bottom side 114 and opposite side (i.e. first and second side 131,132 of heat pipe 13) carries out punch process or milling pin is processed or planing operation, make the top side 113 of this substrate 11 and bottom side 114 side of this heat pipe 13 of truncation and opposite side respectively.
Therefore be bonded the method design of heat abstractor 1 through substrate 11 and heat pipe 13 close-fitting of the utility model, obtain the front and the back side evenness that effectively control substrate 11 and effectively reduce materials, and then more can reach the effect of samming.
The above, the utility model has following advantage:
1. can not destroy top side and the bottom side of substrate, make the evenness of the top side of substrate and bottom side good.
2. can reduce materials to reach cost-effective effect.
3. there is the effect of samming.
Only the above, the only better feasible embodiment of the utility model, such as utilizes the above-mentioned method of the utility model, shape, structure, device to change for it, all should be contained in the interest field of this case.

Claims (7)

1. a heat abstractor, is characterized in that, comprising:
One substrate, has at least one containing hole, a top side and a bottom side, and this containing hole penetrates this bottom side relatively by this top side;
At least one heat pipe, close-fitting is placed in this this containing hole relative, and this heat pipe has the 4th side of one first side, the second side of this first side relative, one the 3rd side and relative 3rd side, the top side of concordant this substrate adjacent of this first and second side difference and bottom side, the deformation that is squeezed of this third and fourth side is close to should in two opposed inner walls in containing hole, make this substrate and this heat pipe close-fitting integrally combine.
2. heat abstractor according to claim 1, it is characterized in that, described containing hole has at least one interference part, and this interference part is formed at least one inwall of this containing hole, and this interference part and relative 3rd side or the 4th side interference close-fitting, it is in order to increase the frictional force of close-fitting.
3. heat abstractor according to claim 2, is characterized in that, described interference part is a matsurface or an embossing or a protuberance or a recess or a concave, convex portion wherein arbitrary or and combination.
4. heat abstractor according to claim 1, is characterized in that, the shape of described containing hole is linearity or oblique line shape or meander-like wherein arbitrary shape.
5. heat abstractor according to claim 1, is characterized in that, first and second side of described heat pipe is sticked mutually with relative plural heater element respectively.
6. heat abstractor according to claim 1, is characterized in that, the second side of described heat pipe is sticked relatively with a relative heater element, and a radiator is docked in first side of this heat pipe.
7. heat abstractor according to claim 1, is characterized in that, described substrate formed with metal material.
CN201520650486.3U 2015-08-26 2015-08-26 Radiator Expired - Fee Related CN204991690U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486434A (en) * 2015-08-26 2017-03-08 奇鋐科技股份有限公司 Heat abstractor and its manufacture method
WO2017124029A1 (en) * 2016-01-13 2017-07-20 CoolChip Technologies, Inc. Layered thermal spreader
CN107458218A (en) * 2017-08-17 2017-12-12 三重型装备有限公司 Dual chamber fuel tank and quarry tipper

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486434A (en) * 2015-08-26 2017-03-08 奇鋐科技股份有限公司 Heat abstractor and its manufacture method
WO2017124029A1 (en) * 2016-01-13 2017-07-20 CoolChip Technologies, Inc. Layered thermal spreader
CN107458218A (en) * 2017-08-17 2017-12-12 三重型装备有限公司 Dual chamber fuel tank and quarry tipper

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