CN201527966U - Apparatus for bonding wafer - Google Patents
Apparatus for bonding wafer Download PDFInfo
- Publication number
- CN201527966U CN201527966U CN2009202562826U CN200920256282U CN201527966U CN 201527966 U CN201527966 U CN 201527966U CN 2009202562826 U CN2009202562826 U CN 2009202562826U CN 200920256282 U CN200920256282 U CN 200920256282U CN 201527966 U CN201527966 U CN 201527966U
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- CN
- China
- Prior art keywords
- wafer
- heating plate
- anchor clamps
- electric furnace
- glue
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- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model is an apparatus for bonding a wafer, the structure is that an adhesion iron plate (1) is arranged on an A electric furnace heating plate (2), a heating plate frame (60 is arranged on a B electric furnace heating plate (5), the adhesion iron plate (1), the heating plate frame (6) and a clamper frame (4) are mounted on a worktable (AA), a moveable clamper (3) is arranged on the clamper frame (4). The bottom and the side surface of the moveable clamper and the bottom and the side surface of the clamper frame are all provided with one layer of 46 # lubricating oil. The utility model has advantages that, the bonding strength of the wafer is increased, the sufficient dissolving and the uniform pervasion of the wafer and the glue are improved, the seal performance between wafers is improved, the product subsequent machining is reduced, meanwhile, and each quality index of the termination product is improved.
Description
Technical field
The utility model relates to a kind of method and device thereof that is used for bonding wafer, belong to bonding wafer technologies field.
Background technology
The existing process that is used for bonding wafer comprises following processing step:
1) configuration of bonding wafer glue: the weight ratio between each composition is a ceresine: rosin: PUR=10: 6: 6; Be put into after the mixing in the aluminium pan on heating plate, make ceresine, rosin, PUR make it fully dissolve the back and stir after make glue with 60 purpose metal filter screens in the pallet of 30cm*50cm;
2) anchor clamps of bonding wafer carry out preheating: be put into the anchor clamps that use and carry out preheating on the electric hot plate;
3) clamp stone roller that the uniform wafer of infiltration forms with long forceps and be put in the anchor clamps with the hands extrusion clamp, and with perching knife the extruding unnecessary glue that comes out, flatten then, press together.Treat at last from anchor clamps, to take out by hand after the normal temperature cooling.
Above-mentioned defective workmanship: the anchor clamps of bonding wafer carry out preheating: be put into the anchor clamps that use and carry out preheating on the electric hot plate; To clamp stone roller that the uniform wafer of infiltration forms with long forceps and be put in the anchor clamps with the hands extrusion clamp, and with perching knife the extruding unnecessary glue that comes out, flatten then, press together.Treat at last from anchor clamps, to take out by hand after the normal temperature cooling.And the intensity of bonding wafer is little, and wafer and glue can not fully dissolve, and the sealing between wafer and the wafer is poor, and postorder is processed the spoilage height of this product.
Summary of the invention
The utility model proposes a kind of bonding wafer device that is used for, be intended to overcome the above-mentioned defective of existing in prior technology, need not stone roller and be put in the anchor clamps with the hands extrusion clamp, and can effectively guarantee bonding wafer intensity, wafer and glue fully dissolve, thus the sealing between raising wafer and the wafer and the qualification rate of product.
Technical solution of the present utility model: the device that is used for bonding wafer, it is characterized in that A electric furnace heating plate is provided with gummed iron plate, B electric furnace heating plate is provided with the heating grillage, gummed iron plate, heating grillage, fixture stand are installed on the workbench, removable anchor clamps are arranged on the fixture stand, and there is one deck 46# lubricating oil the bottom of mobile anchor clamps and side.There is one deck 46# lubricating oil the bottom of fixture stand and side.
Advantage of the present utility model: need not stone roller and be put in the anchor clamps with the hands extrusion clamp, and can effectively improve the intensity of bonding wafer, the abundant dissolving and the infiltration that improve wafer and glue are even, improve the sealing between wafer and the wafer simultaneously, reduce postorder and process every quality index that the damage of this product improves final products simultaneously.
Description of drawings
Among the figure 1 is gummed iron plate, the 2nd, A electric furnace heating plate, the 3rd, removable anchor clamps, the 4th, fixture stand, the 5th, B electric furnace heating plate, the 6th, heating grillage.
Embodiment
Contrast accompanying drawing, its structure are that A electric furnace heating plate 2 is provided with gummed iron plate 1, and B electric furnace heating plate 5 is provided with heating grillage 6, and gummed iron plate 1, heating grillage 6, fixture stand 4 are installed on the workbench AA, and removable anchor clamps 3 are arranged on the fixture stand 4.There is one deck 46# lubricating oil the bottom and the side that have removable anchor clamps to move anchor clamps on the fixture stand.There is one deck 46# lubricating oil the bottom of fixture stand and side.
One, the configuration of bonding wafer glue: No. 85 ceresine 0.5kg, rosin 0.3kg, be put into after PUR 0.5kg mixes on the heating plate in the aluminum pot and heat, the power 1000W of heating plate, after ceresine, rosin, PUR are fully dissolved, stir, after stirring, glue is put into the pallet of 30cm * 50cm with 60 purpose metal filtration net filtrations;
Two, bonding wafer bake: wafer is put in the pallet in the roaster, and the temperature of roaster is 170 ℃, and stoving time is 35 minutes;
Three, fixture stand 4 on the B electric furnace heating plate and the removable anchor clamps on the fixture stand 43 carry out preheating: 30 ℃ of preheat temperatures;
Four, the glue that configures is put on the A electric furnace heating plate heats 140 ℃ of the temperature of the epoxy glue after the fusing;
Five, the wafer that has heated in the above-mentioned processing step two is put on the gummed iron plate of heating, gummed iron plate is gone up 140 ℃ of heating-up temperatures, the glue that has configured in the above-mentioned processing step one is placed on to carry out the surface of abundant solution pervasion to each wafer on the gummed iron plate then:
Six, rub the crystal pulling sheet with the hands with instrument and make the wafer infiltration evenly: make the epoxy glue on the surface of wafer be distributed to the everywhere full and uniformly;
Seven, the bottom of the removable anchor clamps that preheating is good on B electric furnace heating plate and side are coated with last layer 46# lubricating oil 0.32 Kilograms Per Square Meter equably, the bottom of fixture stand and side also are coated with last layer 46# lubricating oil 0.32 Kilograms Per Square Meter equably, clamp stone roller that the uniform wafer of infiltration forms with long forceps then and be put in the removable anchor clamps with the hands extrusion clamp, and the extruding unnecessary glue that comes out is shoveled with perching knife, detect squareness with square then and require 91 °, detect evenness with edge of a knife chi and clearance gauge and require, treat at last from anchor clamps, to take out after the normal temperature cooling less than 0.15mm.
One, the configuration of bonding wafer glue: No. 85 ceresine 0.2kg, rosin 0.12kg, be put into after PUR 0.2kg mixes on the heating plate in the aluminum pot and heat, the power 1000W of heating plate, after ceresine, rosin, PUR are fully dissolved, stir, after stirring, glue is put into the pallet of 30cm * 50cm with 60 purpose metal filtration net filtrations;
Two, bonding wafer bake: wafer is put in the pallet in the roaster, and the temperature of roaster is 190 ℃, and stoving time is 45 minutes;
Three, the fixture stand of bonding wafer and the removable anchor clamps on the fixture stand are carried out preheating: 50 ℃ of preheat temperatures;
Four, the glue that configures is put on the A electric furnace heating plate heats: the bonded adhesives that configures is put on the A electric furnace heating plate 160 ℃ of the temperature of the epoxy glue after the fusing;
Five, the wafer that has heated in the above-mentioned technology stride two is put on the gummed iron plate of heating, gummed iron plate is gone up 160 ℃ of heating-up temperatures, the glue that has configured in the above-mentioned processing step one is placed on to carry out the surface of abundant solution pervasion to each wafer on the gummed iron plate then:
Six, rubbing the crystal pulling sheet with the hands with instrument makes wafer infiltration evenly: make the epoxy glue on the surface of wafer be distributed to the everywhere of wafer surface full and uniformly;
Seven, the bottom of the removable anchor clamps that preheating is good on B electric furnace heating plate and side are coated with last layer 46# lubricating oil 0.32 Kilograms Per Square Meter equably, the bottom of fixture stand and side also are coated with last layer 46# lubricating oil 0.32 Kilograms Per Square Meter equably, clamp stone roller that the uniform wafer of infiltration forms with long forceps then and be put in the removable anchor clamps with the hands extrusion clamp, and the extruding unnecessary glue that comes out is shoveled with perching knife, detect 89 ° of squarenesses with square then, detect evenness with edge of a knife chi and clearance gauge and require, treat at last from anchor clamps, to take out after the normal temperature cooling less than 0.10mm.
Claims (1)
1. the device that is used for bonding wafer, it is characterized in that A electric furnace heating plate (2) is provided with gummed iron plate (1), B electric furnace heating plate (5) is provided with heating grillage (6), gummed iron plate (1), heating grillage (6), fixture stand (4) are installed on the workbench (AA), removable anchor clamps (3) are arranged on the fixture stand (4), there is one deck 46# lubricating oil the bottom of mobile anchor clamps and side, and there is one deck 46# lubricating oil the bottom of fixture stand and side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202562826U CN201527966U (en) | 2009-11-19 | 2009-11-19 | Apparatus for bonding wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202562826U CN201527966U (en) | 2009-11-19 | 2009-11-19 | Apparatus for bonding wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527966U true CN201527966U (en) | 2010-07-14 |
Family
ID=42519248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202562826U Expired - Fee Related CN201527966U (en) | 2009-11-19 | 2009-11-19 | Apparatus for bonding wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527966U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014089895A1 (en) * | 2012-12-11 | 2014-06-19 | 上海现代先进超精密制造中心有限公司 | Method and clamp for gluing detection board assembly |
-
2009
- 2009-11-19 CN CN2009202562826U patent/CN201527966U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014089895A1 (en) * | 2012-12-11 | 2014-06-19 | 上海现代先进超精密制造中心有限公司 | Method and clamp for gluing detection board assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100714 Termination date: 20171119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |