CN201523006U - Electrical component packaging structure and circuit board thereof - Google Patents
Electrical component packaging structure and circuit board thereof Download PDFInfo
- Publication number
- CN201523006U CN201523006U CN2009201681283U CN200920168128U CN201523006U CN 201523006 U CN201523006 U CN 201523006U CN 2009201681283 U CN2009201681283 U CN 2009201681283U CN 200920168128 U CN200920168128 U CN 200920168128U CN 201523006 U CN201523006 U CN 201523006U
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- metal layer
- circuit board
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Abstract
The utility model discloses an electrical component packaging structure which comprises a circuit board and an electrical component, wherein the circuit board comprises a first metal layer, a first adhesive layer, a second metal layer, a second adhesive layer and a heat radiating adhesive layer; the first adhesive layer is arranged on one side of the first metal layer, and the partial first metal layer is exposed for forming at least one first contact pad; the second metal layer is arranged on the first adhesive layer; the second adhesive layer is arranged on the second metal layer, and the partial second metal layer is exposed for forming at least one second contact pad; the heat radiating adhesive layer is arranged on the other side of the first metal layer relative to the first adhesive layer; and the electrical component comprises a plurality of electrical pins, wherein at least one electrical pin is electrically connected with the at least one second contact pad.
Description
Technical field
The utility model provides a kind of electric component encapsulating structure and circuit board thereof, particularly a kind of electric component encapsulating structure and circuit board thereof with high cooling efficiency.
Background technology
Society has entered electronic age now, and along with making rapid progress of science and technology, different types of electric component is developed gradually and is extensively applied to various aspects.Generally speaking, electric component can further be assembled on the printed circuit board (PCB) (Printed Circuit Board) after making finishes, and finishes the connection of each assembly to see through electronic circuit.But along with the development of electric component, problem that each inter-module faced and demand are also inequality, and known board design also can't satisfy various demands simultaneously.
For example in the known backlit module, often (light emitting diode, LED) as the light source of module backlight, it is light-emitting diode is arranged on the circuit board and forms lamp bar (lightbar) with light-emitting diode.And in order to improve illumination efficiency, it arranges a plurality of light-emitting diodes usually on circuit board.But along with the configuration quantity and the power output of light-emitting diode increases, in the transfer process of electricity → light → heat, produce the high-temperature heat relatively, if the poor heat radiation of circuit board, intensity and the useful life that will lower lumination of light emitting diode greatly.
Please refer to Fig. 1, Fig. 1 is assembled in the structural representation of circuit board for known light-emitting diode.As shown in Figure 1, substrate 112 is provided with a circuit board 102 and a light-emitting diode 104.Circuit board 102 is a sandwich construction, and it is sequentially provided with heat radiation glue-line 110, polyimides (polyimide, PI) glue-line 106a, Copper Foil 108a, PI glue-line 106b, Copper Foil 108b and PI glue-line 106c.Copper Foil 108a, 108b can outwards connect the usefulness of a power supply (not shown) with supply light-emitting diode component 104 or other electric component (not shown) driven mainly as the binding of electric path.As shown in Figure 1, light-emitting diode 104 sees through its a plurality of pins 105 and electrically connects Copper Foil 108b, can drive this light-emitting diode 104 to form an electric path.In order to connect other electric component (not shown), circuit board 102 also has another layer Copper Foil 108a, PI glue-line 106a and heat radiation glue-line 110, and wherein Copper Foil 108a upwards sees through PI glue-line 106b and Copper Foil 108b insulation.
Because light-emitting diode 104 is easy to generate high temperature when running, its high temperature can conduct to Copper Foil 108b along pin 105.But under existing circuit board 102 frameworks, Copper Foil 108b is across PI glue-line 106b Copper Foil 108a and PI glue-line 106a, its heat energy can't be passed to heat radiation glue-line 110 or substrate 112 and dispel the heat, and therefore most heat will be accumulated on the Copper Foil 108b, will make light-emitting diode
Be in during running under the high temperature, influence its luminous efficiency.The heat energy of accumulation even also can pass to other light-emitting diode or electric component (not shown) by Copper Foil 108b makes that the problem of accumulation of heat is more serious.
Therefore, also need the good circuit board of a design, to overcome the problem that the heat radiation of known circuits plate is difficult for.
The utility model content
The utility model provides a kind of electric component encapsulating structure and circuit board thereof, to improve the problem of known circuits plate poor heat radiation.
The utility model is to disclose a kind of circuit board, and it comprises, and a first metal layer, one first sticks together glue-line, one second metal level, one second sticks together a glue-line and a heat radiation glue-line.Wherein first sticks together the side that glue-line is arranged at the first metal layer, and it exposes the part the first metal layer and forms one first contact mat.Second metal level is arranged at first and sticks together on the glue-line.Second sticks together glue-line is arranged on second metal level and exposes part second metal level and form one second contact mat.The heat radiation glue-line is arranged at the first metal layer compared to first opposite side that sticks together glue-line.
The utility model also discloses a kind of electric component encapsulating structure, and it comprises a circuit board and an electric component.Circuit board comprises a first metal layer, one first and sticks together glue-line, one second metal level, one second and stick together a glue-line and a heat radiation glue-line.First sticks together the side that glue-line is arranged at the first metal layer, and it exposes the part the first metal layer and forms at least one first contact mat.Second metal level then is arranged at first and sticks together on the glue-line.Second sticks together glue-line is arranged on second metal level and exposes part second metal level and form at least one second contact mat.The heat radiation glue-line is arranged at the first metal layer compared to first opposite side that sticks together glue-line.Electric component has a plurality of electric pins, and wherein at least one electric pin electrically connects at least one second contact mat.
Electric component encapsulating structure and circuit board thereof that the utility model proposed, its second metal level can provide the electric component driving voltage, the first metal layer then can be directly with heat transferred that electric component produced to lower substrate to dispel the heat, therefore have good heat sinking function, can effectively solve the problem of circuit board poor heat radiation in the known technology.
Description of drawings
Fig. 1 is assembled in the structural representation of circuit board for known light-emitting diode.
Fig. 2 is the structural representation of circuit board in the utility model.
Fig. 3 is the generalized section of electric component encapsulating structure first embodiment in the utility model.
Fig. 4 is the floor map of electric component encapsulating structure first embodiment in the utility model.
Fig. 5 is the floor map of electric component encapsulating structure second embodiment in the utility model.
Fig. 6 is the generalized section of electric component encapsulating structure the 3rd embodiment in the utility model.
Fig. 7 is the generalized section of electric component encapsulating structure the 4th embodiment in the utility model.
Embodiment
In the middle of specification and aforesaid claim scope, used some vocabulary to censure specific assembly.The person with usual knowledge in their respective areas should understand, and same assembly may be called with different nouns by manufacturer.This specification and aforesaid claim scope are not used as distinguishing the mode of assembly with the difference of title, but the benchmark that is used as distinguishing with the difference of assembly on function.Be to be an open term mentioned " comprising " in the middle of specification and the aforesaid claim in the whole text, thus should be construed to " comprise but be not limited to ", this hold chat earlier bright.
Please refer to Fig. 2, Fig. 2 is the structural representation of circuit board in the utility model.As shown in Figure 2, circuit board 300 of the present utility model comprises a first metal layer 302, one first and sticks together glue-line 304, one second metal level 306, one second and stick together a glue-line 308 and a heat radiation glue-line 310.First sticks together glue-line 304 is covered in the first metal layer 302 tops, and first stick together glue-line 304 expose the part the first metal layer 302, make the first metal layer 302 form at least one first contact mat 312 in its exposure place.Second metal level 306 is positioned at first and sticks together on the glue-line 304, then is coated with second and sticks together glue-line 308 above second metal level 306.Second to stick together glue-line 308 be partly to be covered on second metal level 306, and expose second metal level 306 partly and form at least one second contact mat 314.First contact mat 312 provides the usefulness that circuit board 300 outwards is connected the electric component (not shown) with second contact mat 314, will be in describing after a while about its connected mode.Heat radiation glue-line 310 is arranged at the first metal layer 302 compared to first opposite side that sticks together glue-line 304.Then have one the 3rd between the first metal layer 302 and the heat radiation glue-line 310 and stick together glue-line 316, be positioned at the below of this first contact mat 312, to provide the first metal layer 312 good supporting.
The material of the first metal layer 302 and second metal level 306 comprises various metal conductive materials, for example copper, aluminium, silver etc.First sticks together glue-line 304, second sticks together the material that glue-line 308 and the 3rd sticks together glue-line 316 and comprises various pliabilities, has the insulation material of sticking together function, for example polyimide film (PI glue).310 of glue-lines of heat radiation comprise various flexual heat conducting materials, but should have insulation effect equally.Since the assembly of the utility model circuit board 300 be multiselect from flexible materials, (flexible printed circuited board FPC), and is widely used in various fields therefore to can be used as a flexible printed wiring board.
Structure about circuit board of the present utility model combines with electric component please then refer to Fig. 3, and Fig. 3 is the generalized section of electric component encapsulating structure first embodiment in the utility model.As shown in Figure 3, electric component encapsulating structure of the present utility model has an electric component 320 and circuit board 300.Electric component 320 is arranged on the circuit board 300, and it can be various driving components or passive component, for example can produce the electric component of heat energy when light-emitting diode, semiconductor chip (chip) or other work.Electric component 320 has a plurality of electric pins 322, the scolding tin (solder) 323 that electric component 320 sees through on each electric pin 322 and the electric pin electrically connects with each first contact mat 312 and second contact mat 314 simultaneously, so the first metal layer of conducting simultaneously 302 and second metal level 306.Wherein, second metal level 306 is as an electric path layer, and meaning i.e. second metal level 306 outwards connects a power supply (not shown), to provide a driving voltage to drive this electric component 320.And the first metal layer 302 is as a heat dissipating layer, the heat that is produced by electric component 320 can conduct to the first metal layer 302 along electric pin 322, and then directly be passed to substrate 318 along heat conduction glue-line 310, dispel the heat to the external world by substrate 318 more at last, shown in the heat dissipation path H among Fig. 3.Therefore, electric component 320 can and operate by second metal level, 306 acquisition driving voltages on the one hand by its pin 322, the heat that produced of running then can be passed to the first metal layer 302 and is passed to substrate 318 via heat dissipation path H and dispels the heat on the other hand, so can solve (as Fig. 1) in the known technology, its heat can't be passed to substrate 318 heat radiations and the problem of continuous accumulation.
For clearer driving and the mode of connection that presents electric component 320 in the utility model, please then refer to Fig. 4, Fig. 4 is the floor map of electric component encapsulating structure first embodiment in the utility model, wherein Fig. 3 is along the section of tangent line A-A ' among Fig. 4.As shown in Figure 4, please in the lump with reference to figure 3, electric component 320 is arranged on the circuit board 300, wherein area B 1 is the covering position of second metal level 306 of electric component 320 belows with area B 2, zone C 1 is the electric pin 322 of electric component 320 and the contact position of circuit board 300 with zone C 2, and region D 1 is the covering position of first contact mat 312 with region D 2.As shown in Figure 4, electric component 320 sees through its electric pin 322 (zone C 1 and zone C 2), electrically connects the first metal layer 302 (region D 1 and region D 2) and second metal level 306 (area B 1 and area B 2) simultaneously.As mentioned before, second metal level 306 is as an electric path layer, and therefore as shown in Figure 3, second metal level 306 comprises one first electric path pattern 306a and one second electric path pattern 306b, to connect positive voltage or negative voltage respectively.As shown in Figure 4, area B 1 (i.e. the first gas via pattern 306a) outwards is connected a positive electricity with area B 2 (i.e. the second electric path pattern 306b)
And a negative voltage, and see through each electric pin 322 (zone C 1 and zone C 2) and be connected to electric component 320 to drive this electric component 320.The first electric path pattern 306a and the second electric path pattern 306b are electrically insulated each other, for example are provided with heat radiation glue-line 310a among Fig. 3 between the first electric path pattern 306a and the second electric path pattern 306b, to avoid short circuit phenomenon.Same, as mentioned before, the first metal layer 302 is as a heat dissipating layer, it has the one first radiating pattern 302a and the second radiating pattern 302b, and the first radiating pattern 302a and the second radiating pattern 302b are electrically insulated each other, for example are provided with heat radiation glue-line 310b among Fig. 3 between its first radiating pattern 302a and the second radiating pattern 302b.
The first electric path pattern 306a and the visual circuit board arrangement demand of the second electric path pattern 306b and do various variations please refer to Fig. 5, and Fig. 5 is the floor map of electric component encapsulating structure second embodiment in the utility model.As shown in Figure 5, electric component 320 is arranged on the circuit board 300, the places different with Fig. 4 are that its second metal level 306 is disposed at by the Ce that originally was positioned at electric component 320 (area B 1 and the area B 2 of Fig. 4) and moves to its two outside and form four zones (area B 3, area B 4, area B 5 and area B 6).Be different among Fig. 4 its generating positive and negative voltage and be " monolaterally advancing; monolaterally go out ", but this embodiment elasticity is selected the allocation position of its generating positive and negative voltage, for example area B 3 connects a negative voltage and area B 5 connections one positive voltage, perhaps area B 4 connects a negative voltage and area B 5 connections one positive voltage, perhaps area B 3 is connected a negative voltage simultaneously with area B 4 and area B 5 is connected a positive voltage simultaneously with area B 6, all can drive this electric component 320.So design and can increase by the configuration elasticity of the first electric path pattern 306a and the second electric path pattern 306b on the circuit board 300 when being connected to other electric component, can have the degree of freedom greatly in the design of its second metal level 306 of circuit board.
In addition, in the 3rd embodiment of the present utility model, in order to cooperate different electric components, and can change the position of its corresponding first contact mat 312 and second contact mat 314, and still can have good radiating efficiency.Please refer to Fig. 6, Fig. 6 is the generalized section of electric component encapsulating structure the 3rd embodiment in the utility model.As shown in Figure 6, have a circuit board 300 on the substrate 318, this circuit board 300 from bottom to top comprises a first metal layer 302, one first in regular turn and sticks together glue-line 304, one second metal level 306, one second and stick together a glue-line 308 and a heat radiation glue-line 310.Wherein first sticks together glue-line 304 and exposes the first metal layer 302 of part to form one first contact mat 312 on the first metal layer 302; Second sticks together glue-line 308 exposes second metal level 306 partly to form at least one second contact mat 314 on second metal level 306.Electric component 320 is arranged on the circuit board 300, and has a plurality of electric pins 322, and wherein each electric pin 322 sees through each second contact mat 314 and electrically connects second metal level, 306 formation electric paths to drive this electric component 320.Specifically, this electric component 320 also comprises a heat-conducting part 324, is arranged at electric component 320 belows and contacts first contact mat 312.The material of heat-conducting part 324 comprises various heat-conductings, for example copper, aluminium, silver etc.As shown in Figure 6, second metal level 306 is as an electric path layer, provides a generating positive and negative voltage to drive electric component 320.The heat energy that this electric component 320 is produced then sees through conducting part 324 and reaches the first metal layer 302, is passed to substrate 318 by heat radiation glue-line 310 again and dispels the heat, as the heat dissipation path I of Fig. 6.Thus, the heat transferred that can effectively electric component 320 be produced equally is to substrate 318.
If electric component is when being an inductance, electric component encapsulating structure of the present utility model also can increase the contact area of assembly and metal level and increases its magnitude of current except improving radiating efficiency.Please refer to Fig. 7, Fig. 7 is the generalized section of electric component encapsulating structure the 4th embodiment in the utility model.As shown in Figure 7, electric component 320 is to be an inductance, and the electric pin 322 of this inductance electrically connects the first metal layer 302 and second metal level 306 simultaneously.As the heat dissipation path J of Fig. 7, the heat that inductance produced can dispel the heat through heat radiation glue-line 310 to substrates 318 via flow through the first metal layer 302 of pin.On the other hand, because the contact area of Inductive component and metal level increases, therefore also can strengthen the inductive effect of inductance, so can increase the current flow of being flowed through by second metal level 306.
To sum up, the electric component encapsulating structure that the utility model proposed and the circuit utmost point thereof, its second metal level can provide the driving voltage of electric component, the first metal layer then can be directly with heat transferred that electric component produced to lower substrate to dispel the heat, therefore have good heat sinking function, can effectively solve the problem of circuit board poor heat radiation in the known technology.
The above only is preferred embodiment of the present utility model, and all equalizations of being done according to the utility model claim scope change and modify, and all should belong to covering scope of the present utility model.
Claims (10)
1. a circuit board is characterized in that, comprises:
One the first metal layer;
One first sticks together glue-line, is arranged at a side of this first metal layer, and this first sticks together glue-line and expose part this first metal layer and form at least one first contact mat;
One second metal level is arranged at this and first sticks together on the glue-line;
One second sticks together glue-line, be arranged on this second metal level, and this second sticks together glue-line and expose part this second metal level and form at least one second contact mat; And
One heat radiation glue-line is arranged at this first metal layer compared to this first opposite side that sticks together glue-line.
2. circuit board as claimed in claim 1 is characterized in that, this heat radiation glue-line contacts with this first metal layer.
3. circuit board as claimed in claim 1 is characterized in that, also comprises a substrate, is arranged at the opposite side of this heat radiation glue-line with respect to this first metal layer.
4. circuit board as claimed in claim 1 is characterized in that, also comprises one the 3rd and sticks together glue-line, be arranged between this first metal layer and this heat radiation glue-line, and the 3rd sticks together glue-line to should first contact mat.
5. circuit board as claimed in claim 1 is characterized in that, this first sticks together glue-line and this second and stick together glue-line and comprise polyimide film.
6. circuit board as claimed in claim 1, it is characterized in that, this the first metal layer is to be a heat dissipating layer, this heat dissipating layer comprises one first radiating pattern and one second radiating pattern, wherein this first radiating pattern and this second radiating pattern are electrically insulated each other, have one second heat radiation glue-line between this first radiating pattern and this second radiating pattern.
7. circuit board as claimed in claim 1, it is characterized in that, this second metal level is to be an electric path layer, and this electric path layer comprises one first electric path layer and one second electric path layer, and wherein this first electric path layer and this second electric path layer are electrically insulated each other.
8. electric component encapsulating structure comprises:
Circuit board comprises:
One the first metal layer;
One first sticks together glue-line, is arranged at a side of this first metal layer, and this first sticks together glue-line and expose part this first metal layer and form at least one first contact mat;
One second metal level is arranged at this and first sticks together on the glue-line;
One second sticks together glue-line, be arranged on this second metal level, and this second sticks together glue-line and expose part this second metal level and form at least one second contact mat; And
One heat radiation glue-line is arranged at this first metal layer compared to this first opposite side that sticks together glue-line;
One electric component has a plurality of electric pins, it is characterized in that, at least one this electric pin electrically connects at least one this second contact mat.
9. electric component encapsulating structure as claimed in claim 8 is characterized in that, at least one this electric pin of this electric component contacts at least one this first contact mat or the heat-conducting part of at least one this first contact mat of a contact is set.
10. electric component encapsulating structure as claimed in claim 8 is characterized in that this electric component comprises driving component, passive component or luminescence component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201681283U CN201523006U (en) | 2009-08-24 | 2009-08-24 | Electrical component packaging structure and circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201681283U CN201523006U (en) | 2009-08-24 | 2009-08-24 | Electrical component packaging structure and circuit board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201523006U true CN201523006U (en) | 2010-07-07 |
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ID=42509182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201681283U Expired - Fee Related CN201523006U (en) | 2009-08-24 | 2009-08-24 | Electrical component packaging structure and circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201523006U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
-
2009
- 2009-08-24 CN CN2009201681283U patent/CN201523006U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111837171A (en) * | 2019-02-20 | 2020-10-27 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
| CN111837171B (en) * | 2019-02-20 | 2022-07-01 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100707 Termination date: 20170824 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |