CN201523000U - Fast-heat annealing machine platform - Google Patents
Fast-heat annealing machine platform Download PDFInfo
- Publication number
- CN201523000U CN201523000U CN2009202699180U CN200920269918U CN201523000U CN 201523000 U CN201523000 U CN 201523000U CN 2009202699180 U CN2009202699180 U CN 2009202699180U CN 200920269918 U CN200920269918 U CN 200920269918U CN 201523000 U CN201523000 U CN 201523000U
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- wafer case
- platform
- crystal wafer
- wafer box
- transducer
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Abstract
The utility model discloses a fast-heat annealing machine platform, belonging to the technical field of semiconductor processing. The fast-heat annealing machine platform comprises a platform for placing a crystal wafer box; the platform is square and is provided with crystal wafer box sensors used for detecting whether the crystal wafer box is placed firmly; the crystal wafer box sensor comprises a first crystal wafer box sensor, a second crystal wafer box sensor and a third crystal wafer box sensor which are respectively positioned at three corners of the platform, wherein the crystal wafer box sensor also comprises a fourth crystal wafer box sensor which is positioned at the fourth corner of the platform. The fast-heat annealing machine platform can detect that the whole crystal wafer box is not placed smoothly, thus avoiding the risk that the three crystal wafer box sensors in the existing machine platform can not detect that the crystal wafer box is not placed smoothly.
Description
Technical field
The utility model relates to the Equipment for Heating Processing in the semiconductor fabrication process, particularly a kind of rapid thermal annealing board.
Background technology
In semiconductor fabrication processes, wafer (wafer) need be placed in the wafer case (cassette), wafer case is placed on carries out thermal anneal process on the board then.At present, rapid thermal annealing RTP 2800 boards that U.S. Mattson company produces, whether whether its platform (port) of placing wafer case is provided with three wafer case transducers (Cassette Sensor), be used for surveying wafer case and be placed on the platform and place steadily.As shown in Figure 1, three wafer case transducers lay respectively at three bights ( position 1,2 and 3 places) of platform, and these three wafer case transducers are sensitive switch, and series connection mutually.When wafer case was placed on this platform, three wafer case transducers all can be depressed, and the series circuit conducting sends to main frame to this Continuity signal, and main frame just can carry out next step action.When arbitrary wafer case transducer was not depressed, series circuit can conducting, and main frame can not carry out next step action.
The wafer case that above-mentioned board exists three wafer case transducers to detect is not placed risk stably, insufficiency, that is: as shown in Figure 1, if the wafer case that is placed on the platform is not placed steadily at 4 places in the position, and all place steadily at 1 to 3 place, then main frame still can receive Continuity signal by existing three wafer case transducers, and carries out next step action.
Like this, will also place steadily owing to wafer case, the wafer in the wafer case still tilts, and when the transmission arm of main frame grasps wafer, causes accidents such as wafer scratch, breakage and the damage of transmission arm.
Summary of the invention
The utility model provides a kind of rapid thermal annealing board, and the wafer case that it can avoid in the existing board three wafer case transducers to detect is not placed risk stably.
For achieving the above object, the utility model adopts following technical scheme:
A kind of rapid thermal annealing board, comprise the platform that is used to place wafer case, described platform is square, described platform is provided with and is used to detect described wafer case and whether places wafer case transducer stably, described wafer case transducer comprises first to the 3rd wafer case transducer, described first to the 3rd wafer case transducer lays respectively at three bights of described platform, wherein
Described wafer case transducer also comprises the 4th wafer case transducer, and described the 4th wafer case transducer is positioned at the 4th bight of described platform.
As the optimization to technique scheme, described first to fourth wafer case transducer is sensitive switch, and described first to fourth wafer case transducer is in series.
As the optimization to technique scheme, described rapid thermal annealing board is rapid thermal annealing RTP 2800 boards that U.S. Mattson company produces.
The rapid thermal annealing board that the utility model provides, the 4th bight at its platform is provided with the 4th wafer case transducer, thereby when the wafer case that is placed on the platform is not placed steadily in the 4th bight, and all place in other three bights of platform when steady, the utility model can detect wafer case integral body and not place steadily, thereby the wafer case of having avoided in the existing board three wafer case transducers to detect is not placed risk stably.
Description of drawings
Fig. 1 is the position view of wafer case transducer on the rapid thermal annealing board in the prior art;
Fig. 2 is the position view of wafer case transducer on the rapid thermal annealing board of the present utility model.
Embodiment
Do not place risk stably for solving the wafer case that board of the prior art exists three wafer case transducers to detect, Insufficient problem, the utility model provides a kind of rapid thermal annealing board.Below in conjunction with accompanying drawing the utility model is elaborated.
As shown in Figure 2, rapid thermal annealing board of the present utility model, comprise the platform that is used to place wafer case, this platform is square, platform is provided with and is used to detect wafer case and whether places wafer case transducer stably, and the wafer case transducer comprises first to the 3rd wafer case transducer, and first to the 3rd wafer case transducer lays respectively at three bights ( position 1,2 and 3 places) of platform, wherein
The wafer case transducer also comprises the 4th wafer case transducer, and the 4th wafer case transducer is positioned at the 4th bight (4 places, position) of platform.
Rapid thermal annealing board of the present utility model, the 4th bight at its platform is provided with the 4th wafer case transducer, thereby when the wafer case that is placed on the platform is not placed steadily in the 4th bight, and all place in other three bights of platform when steady, the utility model can detect wafer case integral body and not place steadily, thereby the wafer case of having avoided in the existing board three wafer case transducers to detect is not placed risk stably.Like this, improved board and surveyed wafer case and whether place accuracy stably, greatly reduced when not placing the transmission arm that steadily causes and grasp wafer because of wafer case, wafer scratch, breakage and main frame transmit accidents such as arm damage.
In the utility model, first to fourth wafer case transducer can adopt the transducer of any type, only after four wafer case transducers all detect the pressure signal of wafer case, just sends an index signal to main frame, indicates main frame to carry out next step action.For the ease of implementing, first to fourth wafer case transducer preferably adopts sensitive switch, and first to fourth wafer case transducer is in series, like this, when wafer case after placing steadily on the platform fully, four wafer case transducers all can be depressed, the circuit turn-on of their series connection, this Continuity signal is sent to main frame, can make main frame carry out next step action.
The utility model is applicable to have three wafer case transducers, exist the wafer case that can't detect not place the board of steady risk to the improvement of rapid thermal annealing board, be specially adapted to rapid thermal annealing RTP 2800 boards that U.S. Mattson company produces.
Above-mentioned only is preferred embodiment of the present utility model, certainly, with further exploration other execution modes can also be arranged according to actual needs.But, should be clear and definite be that the conversion based on similar execution mode with same idea above-mentioned or that other are not explained out all should be encompassed among the protection range of the utility model claim.
Claims (3)
1. rapid thermal annealing board, comprise the platform that is used to place wafer case, described platform is square, described platform is provided with and is used to detect described wafer case and whether places wafer case transducer stably, described wafer case transducer comprises first to the 3rd wafer case transducer, described first to the 3rd wafer case transducer lays respectively at three bights of described platform, it is characterized in that
Described wafer case transducer also comprises the 4th wafer case transducer, and described the 4th wafer case transducer is positioned at the 4th bight of described platform.
2. rapid thermal annealing board according to claim 1 is characterized in that, described first to fourth wafer case transducer is sensitive switch, and described first to fourth wafer case transducer is in series.
3. rapid thermal annealing board according to claim 1 and 2 is characterized in that, described rapid thermal annealing board is rapid thermal annealing RTP 2800 boards that U.S. Mattson company produces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202699180U CN201523000U (en) | 2009-10-30 | 2009-10-30 | Fast-heat annealing machine platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202699180U CN201523000U (en) | 2009-10-30 | 2009-10-30 | Fast-heat annealing machine platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201523000U true CN201523000U (en) | 2010-07-07 |
Family
ID=42509176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202699180U Expired - Lifetime CN201523000U (en) | 2009-10-30 | 2009-10-30 | Fast-heat annealing machine platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201523000U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839860A (en) * | 2012-11-23 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine lifting device and film magazine transmission system with film magazine lifting device |
-
2009
- 2009-10-30 CN CN2009202699180U patent/CN201523000U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839860A (en) * | 2012-11-23 | 2014-06-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine lifting device and film magazine transmission system with film magazine lifting device |
| CN103839860B (en) * | 2012-11-23 | 2017-03-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Piece box lifting device and the film magazine Transmission system with which |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215025 333 Xinghua street, Suzhou Industrial Park, Jiangsu Patentee after: Warship chip manufacturing (Suzhou) Limited by Share Ltd Address before: 215025 Xinghua street, Suzhou Industrial Park, Suzhou, Jiangsu 333 Patentee before: Hejian Technology (Suzhou) Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100707 |
|
| CX01 | Expiry of patent term |