CN201522995U - Non-contact type silicon chip counting system - Google Patents

Non-contact type silicon chip counting system Download PDF

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Publication number
CN201522995U
CN201522995U CN2009200701720U CN200920070172U CN201522995U CN 201522995 U CN201522995 U CN 201522995U CN 2009200701720 U CN2009200701720 U CN 2009200701720U CN 200920070172 U CN200920070172 U CN 200920070172U CN 201522995 U CN201522995 U CN 201522995U
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China
Prior art keywords
silicon wafer
contact type
wafer
image processing
module
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Expired - Fee Related
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CN2009200701720U
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Chinese (zh)
Inventor
李福荣
曹伟兵
邓超明
尹国贤
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SYNWORLD INSTRUMENTS (SHANGHAI) CO Ltd
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SYNWORLD INSTRUMENTS (SHANGHAI) CO Ltd
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Priority to CN2009200701720U priority Critical patent/CN201522995U/en
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Abstract

The utility model relates to a non-contact type silicon chip counting system, which is a non-contact type semi-conductor silicon chip counting system. The non-contact type silicon chip counting system comprises a measuring module, an industrial camera, two groups of LED strip-shaped illumination light sources, a photoelectric sensor, an image processing module and a control module, wherein the measuring module comprises an image acquisition mechanical platform used for placing to-be-counted silicon chips, the industrial camera is arranged on one side of the image acquisition mechanical platform, is perpendicular to one lateral surface of each to-be-counted silicon chip and is used for acquiring images of textures of the lateral surfaces of the silicon chips, the two groups of LED strip-shaped illumination light sources are respectively located on the left side and the right side of the industrial camera and approach one lateral surface of each to-be-counted silicon chip, the photoelectric sensor is arranged below the inner portion of the image acquisition mechanical platform, the image processing module processes silicon chip images acquired by the industrial camera and stores counting results, and the control module is connected with the image processing module through the Ethernet and receives control commands of the image processing module to control the measuring module. The counting system has the advantages that the counting system can measure at one step, is non-contact, fast and accurate and the like.

Description

Silicon wafer non-contact type number system
Technical field
The utility model relates to the counting field of semiconductor wafers, relates in particular to the non-contact type number system that can finish the semiconductor wafers counting in the once-through operation process.
Technical background
The number needs of semiconductor wafers will be through statistics after production.For example: all semiconductor wafer manufacturing enterprises need count silicon wafer in the terminal stage of whole process of production, satisfy solar industry or requirement of client with the silicon wafer quantity that guarantees finally to dispatch from the factory.And present fast development along with semicon industry, the production scale of the manufacturing enterprise of each big silicon wafer is increasing, more and more higher to the requirement that a large amount of silicon wafers of producing are counted, lack a kind of checkout equipment on the market and can possess multi-functional, reliability, high efficiency, characteristics such as portable simultaneously, to satisfy the growing rival demand of silicon wafer industry.Specifically, traditional counting mode is mainly manually to check, and this mode is because a large amount of labours' participation, the production cost of enterprise increases day by day, and manually check and have subjectivity and the people is easy to generate visual fatigue, thereby cause the mistake counted, simultaneously, the breakage of silicon wafer, fragment rate also can obviously improve.Because the data record after checking also can't once be finished with preservation, cause the process of checking record very loaded down with trivial details equally, these have all influenced production efficiency greatly.
Therefore, a kind ofly can only need once-through operation can finish the accurate counting of one group of silicon wafer and have data storage function, and have both simultaneously fast, accurately, the number system of the contactless silicon wafer of characteristics such as reasonable price become the market demand of enjoying popular confidence.
The utility model content
Technical problem to be solved in the utility model provides a kind of silicon wafer non-contact type number system, only needs once-through operation can finish contactless counting to one group of silicon wafer.
The utility model is to solve the problems of the technologies described above the technical scheme that adopts to provide a kind of semiconductor wafers non-contact type number system, it is characterized in that, described system comprises: measurement module, and described measurement module comprises: an IMAQ mechanical platform is used for putting silicon wafer to be counted; An industrial camera is installed in described IMAQ mechanical platform one side, waits that with this side of counting silicon wafer is vertical, in order to gather the side grain image of silicon wafer; Two groups of LED bar shaped lighting sources lay respectively at the left and right sides of described industrial camera, wait to count a side of silicon wafer near this; A photoelectric sensor is installed on below the inside of described IMAQ mechanical platform; One image processing module is handled the silicon wafer image of described industrial camera collection, and preserves count results; One control module connects described image processing module by Ethernet, and the control command that receives described image processing module is to control described measurement module.
Reasonable is to have a pair of silicon chip liner plate and the spacer pin that the protection silicon wafer slides in order to limit wafer position on the described wafer-supporting platform.
Reasonable is that described control module is connected with a photoelectric sensor, in order to judge whether be placed with silicon wafer to be measured on the described wafer-supporting platform.
Reasonablely be, described LED bar shaped lighting source is installed in respectively on the two separate motors, and described control module is controlled described motor by control command, to adjust the irradiating angle of LED bar shaped lighting source.
Reasonablely be, described control module is connected with an intensity of light source by-pass cock, and described control module responds described intensity of light source by-pass cock and adjusts illumination intensity in the measurement environment in real time.
Reasonable is that described image processing module further comprises: a LCD display is used to show described count results; One database is used to store silicon wafer thickness, the intensity of light source, testing result and silicon wafer image.
The utility model makes it compared with prior art owing to adopt above technical scheme, can obtain the accurate counting of silicon wafer by single stepping simultaneously, and simultaneously, the once action of cooperation switch will be finished the storage of wafer.The heed contacted measure that is measured as of the present utility model will reduce greatly to the damage of wafer.
Description of drawings
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, below in conjunction with accompanying drawing embodiment of the present utility model is elaborated, wherein:
Fig. 1 is the silicon wafer number system structure chart of an embodiment of the utility model;
Fig. 2 is the actual count flow chart of number system shown in Figure 1;
Fig. 3 is the count results schematic diagram of the utility model number system;
Fig. 4 is the vertical view of the wafer-supporting platform of number system shown in Figure 1;
Fig. 5 is the end view of the wafer-supporting platform of number system shown in Figure 1.
Embodiment
Fig. 1 is the silicon wafer number system structure chart of an embodiment of the utility model.
Native system is applicable to the quantity of statistics semiconductor wafers.We are described in further detail shall know that native system can realize the quantity of wafer is carried out the non-contact type counting of high accuracy and high reliability by following.
As shown in Figure 1, native system has comprised silicon wafer measurement module 1, control module 2 and image processing module 3, and wherein wafer measurement module 1 links to each other with control module 2, and control module 2 is connected with image processing module 3.As shown in Figure 1, in silicon wafer measurement module 1, wafer 14 is a semiconductor wafers, and wafer is generally thin positive square body, and is made by the high-purity semi-conducting material (as silicon) with fixed resistance rate scope.Its two surperficial opposing parallel, and overall dimension meets industrial standard, however under special application background, semiconductor wafers also can be made other shape according to demand.
Measurement module 1 is provided with two groups and is positioned at industrial camera 13 left and right sides, near the side of silicon wafer, at a distance of the LED bar shaped lighting source 121 and 122 of certain distance.LED bar shaped lighting source 121 and 122 is separately fixed on motor 112 and 113.Industry camera 13 relies on the illumination of LED bar shaped lighting source 121 and 122, obtains the side image of silicon wafer 14.Two LED bar shaped lighting sources 121 all are connected with light source controller 22 with 122, drive signal are provided and produce corresponding light illumination intensity according to the adjustable electric resistance for LED bar shaped lighting source 121 and 122 by light source controller 22.Because the quality of silicon wafer counting depends on the illuminating effect of silicon wafer side,, need to adjust the position of led light source in order to satisfy the requirement of Different Silicon wafer side.As shown in Figure 1, LED bar shaped lighting source 121 and 122 is separately fixed on motor 112 and 113, and according to the quality of silicon wafer side image, the control motor is adjusted led light source to comparatively ideal lighting position.
Measurement module 1 (as Fig. 1) comprises an industrial camera 13, is installed in a side of wafer-supporting platform 11, is vertical with a side of this desire counting silicon wafer 14, in order to gather the side stripe pattern of silicon wafer 14.Industry camera 13 is fixed on the base plate 17 by support and camera box.Industry camera 13 can collect the side stripe pattern of silicon wafer.Industry camera 13 with the IMAQ card connection, provides power supply by the GPIO interface by 1394 interfaces, and can obtain image under the varying environment according to the setting of relevant parameter.The picture signal that industry camera 13 obtains arrives image processing module 3 by 1394 bus transfer.
Measurement module 1 has comprised a wafer-supporting platform 11 that plays the supporting wafers effect in counting process.Wafer-supporting platform 11 supports silicon wafer 14, simultaneously by silicon chip liner plate 15 on the front panel and the spacer pin 16 on the wafer-supporting platform 11, plays the effect of aiming at silicon wafer 14 sides and industrial camera 13 focal plane position.For instance, wafer-supporting platform 11 has 1 pair of silicon chip liner plate 15, and purpose is that the side of determining silicon wafer 14 is positioned on the imaging focal plane of industrial camera 13.Wafer to 156 millimeters of the wafer that is of a size of 125 millimeters of 125 millimeters * and 156 millimeters * all can satisfy.And the spacer pin 16 on the wafer-supporting platform 11 can effectively guarantee the nonvoluntary slip of wafer to be measured, reduces fragment rate.These spacing designs can guiding operation person be placed wafer exactly on wafer-supporting platform 11.And to accurately the laying of wafer, can guarantee in counting process, obtain count results accurately.Wafer-supporting platform 11 is X-shaped platforms, and its size is bigger a little than 156 millimeters of 156 millimeters *, is suitable for the measurement of any contour structure size wafer, and this wafer-supporting platform 11 and base plate 17 cooperation.
Measurement module 1 comprises a photoelectric sensor 18 that is installed on the below, inside of wafer-supporting platform 11, and when silicon wafer 14 was positioned over wafer-supporting platform 11, it sent signal and lights LED bar shaped lighting source 12, and simultaneously industrial camera 13 beginnings are gathered in real time; When not having silicon wafer 14 on the wafer-supporting platform 11, industrial camera 13 is closed collection, and time-delay closing LED bar shaped lighting source 12, plays the useful life of energy efficient and prolongation LED bar shaped lighting source.
The motor 112 and 113 of wafer-supporting platform 11, camera box and LED bar shaped lighting source 121 and 122 all is installed on the base plate 17.Base plate 17 is made by enough thick aluminum alloy materials, and has very high rigidity.Simultaneously, base plate 17 is fixed on to have on the rubber mat 19, and rubber mat 19 can play buffering and isolate the effect of vibrations.
Four independently signal processing units are arranged in the control module 2.Wherein input/output interface 21 receives the status signal of photoelectric sensor 18 and foot switch 4, and is transferred to embedded controller 26.Embedded controller 26 obtains signal, compares with preset value, makes judged result, sends to image processing module 3 by Ethernet.And light source controller 22 at first obtains the light intensity signal of image processing module 3, adjusts by the illumination intensity of adjustable resistance to LED bar shaped lighting source again.Whirligig driving 25 is used to control the position of LED bar shaped lighting source 121 and 122.In addition, communication interface 23 is communication interfaces of control module 2 and image processing module 3, and the data communication between all images processing module 3 and the control module 2 realizes by this interface.Embedded controller 26 is controlled and coordination input/output interface 21, light source controller 22, communication interface 23, whirligig drive 25, makes whole system realize adjustment automatically, automatic function of gathering rationally, exactly.
Image processing module 3 comprises database 33, LCD display 32 and graphics processing unit 31.Graphics processing unit 31, mainly the image striped is carried out the processing of following steps: a) stripe segmentation: the computed image segmentation threshold becomes bianry image with image transitions; B) striped extracts: all stripeds are carried out morphology handle, remove noise jamming, improve the stripe pattern quality; C) striped search: the position of all stripeds in sequential search and the definite image; D) fringe count:,, calculate silicon wafer quantity in conjunction with Principle of Statistics by calculating the number of striped.Be saved in the database 33 through the data that obtain after the image processing, simultaneously count results be presented on the LCD display 32.
Fig. 2 is according to a schematic flow sheet that embodiment counts silicon wafer of the present utility model.
At first, step 60 places silicon wafer 14 on the wafer-supporting platform 11.Step 61 makes wafer one side near silicon chip liner plate 15, makes silicon wafer 14 sides overlap with the camera focal plane as far as possible.If desired, before measurement, can calibrate the focal length of industrial camera 13.
Be positioned at the photoelectric sensor 18 of wafer-supporting platform 11 middle lower portion because blocking of silicon wafer 14, step 62 photoelectric sensor sends acquired signal, send to host computer by TCP communication, application software is made judgement, controls industrial camera 13 beginning images acquired (step 63).
Click-through count button or foot switch 4, host computer is made corresponding, obtains the side image of a width of cloth silicon wafer 14, by step 64 image analysis processing, obtains count results.Then gained count results and preset count value are compared judgement, be presented on the display 32 (step 65) the result is eye-catching again.
Step 66 is preserved switch control for data, presses data and preserves switch control, and host computer responds, and measured data (comprising counting and detected image) are kept in the database 33 (step 67).Silicon wafer to be measured on the wafer-supporting platform 11 is added sheet or subtracts after the sheet, press measuring switch after, will detect (step 69) to this group silicon wafer again.Can repeatedly count silicon wafer to be measured according to aforesaid way, and be provided with according to operating personnel, numerical value is presented on the display 32 (step 65) the most at last.Each detect finish after, be saved in data in the database and will comprise count results, gate time and obtain image and operating personnel's relevant information etc.
After finishing measurement, tested silicon wafer 14 is removed the person of being operated from wafer-supporting platform 11, the photoelectric sensor 18 that is positioned at wafer-supporting platform 11 middle lower portion sends signal, send to host computer by TCP communication, application software is made judgement, closes industrial camera 13 images acquired, pick up counting simultaneously, time-delay closing LED bar shaped lighting source 121 and 122, the detection of next group silicon wafer will repeat above process, and one time silicon wafer detects required time less than 2 seconds.
As mentioned above, native system is very suitable for the demand of semiconductor enterprise to the silicon wafer accurate counting: a reasonable price, and possess the autonomous system of high speed detection function.Fig. 3 has showed the testing result schematic diagram of native system.The one-tenth-value thickness 1/10 that this silicon wafer is demarcated by metering institute of country is 180 microns.
In sum, number system of the present utility model can obtain the accurate counting result of one group of silicon wafer by single stepping.Native system is around digital image processing techniques, utilize hardware such as an industrial camera, LED bar shaped lighting source and photoelectric sensor, made up non-contact type silicon wafer number system, communicate by letter by TCP, rationally the utilization resource has reached the purpose of quickly and accurately silicon wafer being counted.The heed contacted measure that is measured as of the present utility model will reduce greatly to the damage of wafer.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when doing a little modification and perfect, therefore protection range of the present utility model is worked as with being as the criterion that claims were defined.

Claims (6)

1. semiconductor wafers non-contact type number system is characterized in that described system comprises: measurement module, and described measurement module comprises:
An IMAQ mechanical platform is used for putting silicon wafer to be counted;
An industrial camera is installed in described IMAQ mechanical platform one side, waits that with this side of counting silicon wafer is vertical, in order to gather the side grain image of silicon wafer;
Two groups of LED bar shaped lighting sources lay respectively at the left and right sides of described industrial camera, wait to count a side of silicon wafer near this;
A photoelectric sensor is installed on below the inside of described IMAQ mechanical platform;
One image processing module is handled the silicon wafer image of described industrial camera collection, and preserves count results;
One control module connects described image processing module by Ethernet, and the control command that receives described image processing module is to control described measurement module.
2. silicon wafer non-contact type number system as claimed in claim 1 is characterized in that, has a pair of silicon chip liner plate and the spacer pin that the protection silicon wafer slides in order to limit wafer position on the described wafer-supporting platform.
3. silicon wafer non-contact type number system as claimed in claim 1 or 2 is characterized in that described control module is connected with a photoelectric sensor, in order to judge whether be placed with silicon wafer to be measured on the described wafer-supporting platform.
4. silicon wafer non-contact type number system as claimed in claim 3, it is characterized in that, described LED bar shaped lighting source is installed in respectively on the two separate motors, and described control module is controlled described motor by control command, to adjust the irradiating angle of LED bar shaped lighting source.
5. silicon wafer non-contact type number system as claimed in claim 4 is characterized in that described control module is connected with an intensity of light source by-pass cock, and described control module responds described intensity of light source by-pass cock and adjusts illumination intensity in the measurement environment in real time.
6. silicon wafer non-contact type number system as claimed in claim 5 is characterized in that described image processing module further comprises:
One LCD display is used to show described count results;
One database is used to store silicon wafer thickness, the intensity of light source, testing result and silicon wafer image.
CN2009200701720U 2009-04-10 2009-04-10 Non-contact type silicon chip counting system Expired - Fee Related CN201522995U (en)

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CN2009200701720U CN201522995U (en) 2009-04-10 2009-04-10 Non-contact type silicon chip counting system

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Application Number Priority Date Filing Date Title
CN2009200701720U CN201522995U (en) 2009-04-10 2009-04-10 Non-contact type silicon chip counting system

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CN201522995U true CN201522995U (en) 2010-07-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111687861A (en) * 2017-09-12 2020-09-22 长鑫存储技术有限公司 Manipulator arm assembly with camera shooting detection device and semiconductor production equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111687861A (en) * 2017-09-12 2020-09-22 长鑫存储技术有限公司 Manipulator arm assembly with camera shooting detection device and semiconductor production equipment
CN111687861B (en) * 2017-09-12 2021-12-21 长鑫存储技术有限公司 Manipulator arm assembly with camera shooting detection device and semiconductor production equipment

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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100707

Termination date: 20140410