CN201509365U - PCB (printed circuit board) with isolated welding-resistant zone - Google Patents
PCB (printed circuit board) with isolated welding-resistant zone Download PDFInfo
- Publication number
- CN201509365U CN201509365U CN2009202049479U CN200920204947U CN201509365U CN 201509365 U CN201509365 U CN 201509365U CN 2009202049479 U CN2009202049479 U CN 2009202049479U CN 200920204947 U CN200920204947 U CN 200920204947U CN 201509365 U CN201509365 U CN 201509365U
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- China
- Prior art keywords
- via hole
- welding resistance
- resistance zone
- welding
- pad
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- Expired - Fee Related
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model relates to a PCB (printed circuit board) with an isolated welding-resistant zone in the field of a printed circuit. The PCB with the isolated welding-resistant zone comprises a through hole and a welding disc. The isolated welding-resistant zone is arranged between the through hole and the welding disc, and is arranged surrounding the through hole. The minimum distance between the rim of the through hole and the welding disc is larger than or equal to 0.075mm. The PCB with the isolated welding-resistant zone can effectively avoid the disadvantage that printing ink in the through hole can easily overflow onto the welding disc.
Description
[technical field]
The utility model belongs to printed circuit field, relates in particular to a kind of printed substrate with isolation welding resistance zone in the printed circuit field.
[background technology]
Printed substrate (Printde Circuit Board is called for short PCB) is the important electron parts, is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.Along with developing rapidly of electronics industry, printed substrate is also towards multiple stratification, the fast development of high density direction, and is therefore, also more and more higher to the requirement of printed substrate.
Via hole is one of important component part of printed substrate, via hole is also referred to as plated-through hole (perhaps being called conductive hole), on technology, method with chemical deposition on the inner hole wall face of cylinder of via hole plates layer of conductive material (this technology is called heavy copper), in order to the Copper Foil of each layer needs connection in the middle of being communicated with.
In process of production; printed substrate is to generate circuit through processing (as etching); for preventing that the electric conducting material on the via hole inwall from suffering to destroy (as the etch of etching solution), via hole need be covered or clogs with the protection via hole, this technology is commonly referred to as the via hole consent.
At present, the method that consent is commonly used mainly is to fill printing ink by similar mode of printing in via hole, makes the material of inserting corrosion-resisting function in via hole, with this electric conducting material that prevents via hole not etched liquid destroyed.But, behind consent, when carrying out the production of solder mask, need carry out the roasting plate of high temperature to printed substrate, because when design, often there are pad and via hole crossing or tangent, and the printing ink in the via hole defective of quick-fried oil occurs easily behind the roasting plate of high temperature, makes printing ink overflow via hole and overflow to go up pad, cause whole printed substrate to be reprocessed, even scrap.
Printed substrate as shown in Figure 1, comprise solder mask 11, pad 12 and via hole 13, via hole 13 and pad 12 tangent (be not limited to tangent, comprise crossing, base to the distance of pad and via hole hour), after via hole 13 is carried out consent, when high temperature was baked plate, the printing ink in the via hole 13 overflow easily and go up pad 12, the then easier excessive defective that goes up pad of printing ink that occurs of the plank that thickness is bigger, cause whole printed substrate to be reprocessed, even scrap.
[utility model content]
In order better to overcome above-mentioned printed substrate when the via hole consent, printing ink overflows easily and goes up pad, causes whole printed substrate to be reprocessed, even scraps, and the utility model provides a kind of printed substrate of isolating the welding resistance zone that has.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of printed substrate of isolating the welding resistance zone that has is provided, comprise via hole and pad, be provided with between described via hole and the described pad and isolate the welding resistance zone, described isolation welding resistance zone is around described via hole setting, and the edge of described via hole and the minimum range of described pad are greater than or equal to 0.075 millimeter.
Further improvement of the utility model is: the ring-type of described isolation welding resistance zone for being provided with around described via hole, the ring width in described isolation welding resistance zone is greater than or equal to 0.075 millimeter.
Further improvement of the utility model is: the inwall of described via hole is provided with electric conducting material.
Compare with present technology, the beneficial effect that the utlity model has is: by such scheme, can effectively avoid the excessive easily defective that goes up pad of printing ink in the via hole.
[description of drawings]
Fig. 1 is the schematic diagram of printed substrate in the prior art;
Fig. 2 has the schematic diagram of the printed substrate of isolating the welding resistance zone for the utility model is a kind of.
[embodiment]
Below in conjunction with accompanying drawing the utility model is described in further detail: in conjunction with Fig. 2, a kind of printed substrate with isolation welding resistance zone, comprise solder mask 21, via hole 23, the pad 22 adjacent with via hole, the inner hole wall of via hole 23 is provided with electric conducting material, as copper, be provided with the etch-proof printing ink that covers this electric conducting material in the via hole 23, be provided with between via hole 23 and the pad 22 and isolate welding resistance zone 24, isolating the welding resistance zone is provided with around via hole 23, isolating the welding resistance zone is the part of solder mask 21, and the minimum range of the edge of via hole 23 and pad 22 is greater than or equal to 0.075 millimeter.
For ease of processing, will isolate welding resistance zone 24 and be set to annular around via hole 23, the ring width in this isolation welding resistance zone is greater than or equal to 0.075 millimeter.
The utility model is usually used in pad and via hole when tangent or crossing, when the width of pad is greater than or equal to 0.5 millimeter, by on the film negative of exposure usefulness, setting up this isolation welding resistance zone 24 corresponding figures, the shape of windowing when controlling solder mask 22 productions, further control the minimum range at pad 22 and via hole 23 edges, thereby after effectively having avoided via hole 23 plug oil, printing ink overflows and goes up the defective of pad 22 in the via hole 23, and the utility model is particularly useful for the bigger printed substrate of thickness of slab, surpasses 2 millimeters printed substrate as thickness of slab.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (3)
1. one kind has the printed substrate of isolating the welding resistance zone, comprise via hole (23) and pad (22), it is characterized in that: be provided with between described via hole (23) and the described pad (22) and isolate welding resistance zone (24), described isolation welding resistance zone (24) is provided with around described via hole (23), and the minimum range of the edge of described via hole (23) and described pad (22) is greater than or equal to 0.075 millimeter.
2. according to the described printed substrate of claim 1 with isolation welding resistance zone, it is characterized in that: the ring-type of described isolation welding resistance zone (24) for being provided with around described via hole (23), the ring width in described isolation welding resistance zone (24) is greater than or equal to 0.075 millimeter.
3. according to the described printed substrate with isolation welding resistance zone of claim 1, it is characterized in that: the inwall of described via hole (23) is provided with electric conducting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202049479U CN201509365U (en) | 2009-09-22 | 2009-09-22 | PCB (printed circuit board) with isolated welding-resistant zone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202049479U CN201509365U (en) | 2009-09-22 | 2009-09-22 | PCB (printed circuit board) with isolated welding-resistant zone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201509365U true CN201509365U (en) | 2010-06-16 |
Family
ID=42470483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202049479U Expired - Fee Related CN201509365U (en) | 2009-09-22 | 2009-09-22 | PCB (printed circuit board) with isolated welding-resistant zone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201509365U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103702509A (en) * | 2013-12-25 | 2014-04-02 | 深圳市迅捷兴电路技术有限公司 | Step-shaped circuit board and manufacturing method thereof |
| CN105282971A (en) * | 2015-09-08 | 2016-01-27 | 浪潮电子信息产业股份有限公司 | PCB BGA area zero-distance through hole design method |
-
2009
- 2009-09-22 CN CN2009202049479U patent/CN201509365U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103702509A (en) * | 2013-12-25 | 2014-04-02 | 深圳市迅捷兴电路技术有限公司 | Step-shaped circuit board and manufacturing method thereof |
| CN103702509B (en) * | 2013-12-25 | 2017-09-29 | 深圳市迅捷兴科技股份有限公司 | Step-like wiring board and preparation method thereof |
| CN105282971A (en) * | 2015-09-08 | 2016-01-27 | 浪潮电子信息产业股份有限公司 | PCB BGA area zero-distance through hole design method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20140922 |
|
| EXPY | Termination of patent right or utility model |