CN201497610U - Surface acoustic wave pressure sensor - Google Patents

Surface acoustic wave pressure sensor Download PDF

Info

Publication number
CN201497610U
CN201497610U CN2009201907699U CN200920190769U CN201497610U CN 201497610 U CN201497610 U CN 201497610U CN 2009201907699 U CN2009201907699 U CN 2009201907699U CN 200920190769 U CN200920190769 U CN 200920190769U CN 201497610 U CN201497610 U CN 201497610U
Authority
CN
China
Prior art keywords
pressure
acoustic wave
surface acoustic
substrate
base
Prior art date
Application number
CN2009201907699U
Other languages
Chinese (zh)
Inventor
刘峰
叶学松
夏宗仁
方璐
王琼
蔡秀军
Original Assignee
浙江大学;中电科技德清华莹电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浙江大学;中电科技德清华莹电子有限公司 filed Critical 浙江大学;中电科技德清华莹电子有限公司
Priority to CN2009201907699U priority Critical patent/CN201497610U/en
Application granted granted Critical
Publication of CN201497610U publication Critical patent/CN201497610U/en

Links

Abstract

The utility model discloses a surface acoustic wave pressure sensor with small volume and high sensitivity. The surface acoustic wave pressure sensor comprises a top cap, and a base with two metal electrodes penetrating through, wherein the top cap is hermetically mounted on the base, a pressure conductivity through hole is formed on the base, a fluid diaphragm is hermetically fixed on the inner surface of the base, the fluid diaphragm covers the pressure conductivity through hole, a closed chamber is formed among the base, the top cover and the fluid diaphragm, a long strip shaped substrate is fixed on the fluid diaphragm, the substrate stretches over the pressure conductivity through hole, a surface acoustic wave pressure sensing resonator, a surface acoustic wave standard resonator and two bonding pads are fixed on the substrate, the surface acoustic wave pressure sensing resonator rightly faces the central part of the pressure conductivity through hole, two ends of the surface acoustic wave pressure sensing resonator and two ends of the surface acoustic wave standard resonator are respectively connected with the two bonding pads, the two metal electrodes are positioned at one end inside the closed chamber and respectively connected with two bonding pads, and the frontal projected area of a pressure sensitive region on the substrate is smaller than that of the cross section of the pressure conductivity through hole.

Description

一种声表面波压力传感器 A surface acoustic wave pressure sensor

技术领域 FIELD

[0001] 本实用新型涉及一种声表面波压力传感器。 [0001] The present invention relates to a surface acoustic wave pressure sensor.

背景技术 Background technique

[0002] 声表面波压力传感器可以用于检测机械或流体的压力,所需检测的压力作用在压电衬底上,使衬底发生形变,则声表面波在衬底上传播的速度发生变化,导致声表面波谐振器的谐振频率发生变化,通过检测频率的变化可以得到作用在衬底上的压力值。 [0002] The SAW pressure sensor may detect a pressure of a fluid or mechanical, detecting the required pressure on the piezoelectric substrate, the substrate is deformed, the speed of the acoustic wave propagating in the substrate is changed , resulting in surface acoustic wave resonator resonance frequency is changed, it can be obtained in the pressure acting on the substrate by detecting a change in frequency. 当被测压力处于难以接触或者移动物体的内部时,声表面波传感器由于其无源无线的优点而倍受青睐。 When the measured internal pressure is hard to reach or moving objects, advantages because of its surface acoustic wave sensor and the passive wireless acclaimed.

[0003] 目前市面上多数声表面波压力传感器是在测量环境压力较高、测量灵敏度要求不高的条件下使用的,例如汽车胎压和汽缸内压的无线检测。 [0003] Most currently available pressure sensor is a surface acoustic wave in a high ambient pressure measurements, the measurement sensitivity under less demanding conditions of use, such as tire pressure and a wireless in-cylinder pressure detection. 而在对一些压力测量范围相对较小、检测分辨率要求较高(如动物或人体的血压检测)的对象进行检测时,那么目前市上的声表面波压力传感器就基本上不能达到测量指标的要求。 In some relatively low pressure ranges, higher detection resolution requirements (e.g., animal or human blood is detected) when the object is detected, then the current market to make the surface acoustic wave pressure sensor can measure not achieve substantially the Claim. 我们知道,通过增大弹性衬底面积和减小弹性衬底的厚度来提高传感器的灵敏度是一种十分有效的方法。 We know that, by increasing the area of ​​the substrate and the elastic substrate to reduce the thickness of the elastic to improve sensitivity of the sensor is a very effective method. 但如果同时对传感器体积和重量制作有严格要求,如在植入式医用电子医疗器械和航空航天等特殊应用领域,那么通过增大衬底面积提高灵敏度性能指标会牺牲器件的封装体积性能指标而造成综合指标不合格。 But if there are strict requirements on the production volume and weight sensors, in special applications such as implantable medical devices of medical electronics and aerospace, then the volume of the package to improve the sensitivity performance metrics sacrifice device performance by increasing the substrate area resulting in a comprehensive index failed. 衬底厚度的减薄具有一定的范围,但当衬底厚度减薄到一定的程度时造成基片易碎,从目前压电衬底材料的制作工艺和器件封装工艺来看存在较大的困难。 The thickness of the thinned substrate having a certain range, but cause a frangible substrate when the substrate thickness is thinned to a certain extent, greater difficulty from the current production process and packaging process of the piezoelectric device substrate material view . 下面我们将简要介绍几种典型的声表面波压力传感器的结构及其性能指标,并以此提出本实用新型的内容。 Below we will briefly describe the structure and performance of several typical SAW pressure sensor, and thus the present invention proposes the content.

[0004] 中国专利CN101248339A公开了一种压力传感器,它是将一长方形的衬底覆盖在基座的圆形通孔上,衬底其余部分固定在基座上(相当于结构力学中的周边固支圆膜片), 通过基座上的通孔施加压力,使得衬底发生形变,通过测量谐振器频率的变化来得到应变的大小,从而得到压力的大小。 [0004] Chinese Patent CN101248339A discloses a pressure sensor, which is a rectangular substrate covering the circular through hole of the base, remaining fixed to the base substrate portion (corresponding to structural mechanics Clamped cIRCULAR diaphragm), pressure is applied through the through hole in the base, so that the substrate is deformed, the size of the strain obtained by measuring a change in the resonator frequency to obtain a magnitude of the pressure. 在该方案中,由于衬底周边完全固定在基座上,形变区域的周边也是固定的。 In this embodiment, since the outside periphery of the substrate is completely fixed to the base, the deformation region is also fixed. 根据材料力学和弹性力学的理论计算可知,在同样的外力作用和外形尺寸下,这种薄膜结构的压力弹性敏感元件,即衬底相比通常悬臂梁和双端固支梁结构的压力弹性敏感元件具有相对较低的应变。 Theoretical calculation in mechanics of materials seen from the elasticity and, at the same external dimensions and external force, such a pressure-sensitive elastic element thin film structure, i.e., compared to double-ended and generally cantilever beam structure clamped sensitive element having an elastic substrate relatively low strain. 这样导致了衬底上方的声表面波压力谐振器的灵敏度较低。 This results in lower sensitivity of the surface acoustic wave resonator pressure above the substrate.

[0005] 另外,在中国专利CN101251599A中,公开了一种压力传感器。 [0005] In addition, in Chinese Patent CN101251599A discloses a pressure sensor. 该传感器采用类似于悬臂梁的结构固定衬底,将压力作用在衬底的一端,而衬底的另一端固定在封装的基座上。 The sensor uses a cantilever structure similar to the fixed substrate, the pressure acting on one end of the substrate, the substrate and the other end is fixed to the base package. 这样,在相同的外形尺寸和压力作用下,悬臂梁结构的衬底的应变比上述中国专利CN101248339A周边固定的衬底大,所以传感器的灵敏度也相应要高。 Thus, the dimensions and the same pressure, the strain of the substrate is larger than the cantilever structure Chinese patent CN101248339A fixed periphery of the substrate, the sensitivity of the sensor is correspondingly higher. 但从一方面来看, 这样的结构设计增加了制作、安装和封装设计上复杂性。 However, one point of view, such a design increases the complexity of the production, installation and package design. 例如,首先,在上述悬臂梁结构的专利中所采用的衬底需要通过蚀刻工艺在原来的矩形衬底上刻出一个悬臂梁的结构, 使得衬底的制作比较复杂;其次,在安装中通过固定悬臂梁一端而将另一受力端与下方较小的流体隔膜对齐并相平具有一定的难度;再者,在结构的稳定性上相比上述中国专利CN101248339A中提到的设计安装结构要差。 For example, first, a substrate in the above-described Patent cantilever structure employed in need engraved by etching process on the original rectangular substrate a cantilever structure, so that the substrate is made more complicated; Secondly, in the installation end cantilever beam is fixed and the other end of the smaller force fluid downward and is aligned with a flat membrane having a certain degree of difficulty; Furthermore, the structural stability to the design compared to the above-described mounting structure mentioned Chinese patent CN101248339A difference. 实用新型内容 SUMMARY

[0006] 本实用新型所要解决的技术问题是提供一种体积小、灵敏度高的声表面波压力传感器。 [0006] The present invention is to solve the technical problem is to provide a small size, high sensitivity acoustic wave pressure sensor.

[0007] 本实用新型的发明构思是:将长条形结构的衬底作为传感器的敏感部件,长条形衬底的两端固定(相当于结构力学中的双端固支梁结构),长条形衬底的中间部分为压力敏感区,该压力敏感区完全处于压力传导通孔之上,由结构力学的知识可以知道,在同样大小的压力作用下,双端固支梁结构的应变比长度相等的周边固支圆膜片的应变大,所以长条形衬底的应变比传统的周边固定的衬底的应变有所提高,压力传感器的灵敏度也相应提高。 [0007] The inventive concept of the present invention is: the two ends of the elongated structure of the substrate as a sensor sensitive member, fixed elongated substrate (corresponding to the clamped-clamped beam structure Structural Mechanics in) long the intermediate portion of the strip substrate is a pressure-sensitive region, the pressure in the pressure-sensitive conductive zone completely above the through hole, by the knowledge of the mechanical structure can be known, under pressure of the same size, double-ended strain clamped beam structure than strain equal length clamped circular diaphragm is large, the strain has increased the elongated substrate than traditional fixed strain periphery of the substrate, the sensitivity of the pressure sensor is also increased accordingly. 同时,与单端固定(相当于结构力学中的悬臂梁结构)的衬底相比较,采用双端固定的长条形结构衬底,使得衬底的制作和安装更加简化,也使得传感器的结构稳定性提高。 Meanwhile, compared with the substrate holding (corresponding to structural mechanics of the cantilever structure) single-ended, double end fixed elongated structural substrate, so that a more simplified fabrication and installation of the substrate, but also the structure of the sensor stability is improved. [0008] 流体不直接作用在本实用新型的衬底上,流体和衬底之间通过流体隔膜来对流体进行隔离,同时起到传递压力的作用。 [0008] The fluid does not act directly on the substrate of the present invention, between the fluid and the substrate to isolate the fluid flow through the membrane, while the pressure transfer functions. 流体通过压力传导通孔引导到流体隔膜上。 Directing fluid through the membrane to the fluid pressure of the conductive vias. 当压力传导通孔为一圆孔时,压力传导的直径可与长条形衬底中间的压力敏感区部分的长度相同; 压力传导通孔也可为矩形通孔,只要保证压力传导通孔的横截面面积大于长条形衬底的压力敏感区的在压力传导通孔的横截面上的正投影面积即可。 When the pressure is a circular conductive vias, the same length of the pressure sensitive areas may be conducted with the diameter of the intermediate pressure portion of the elongate substrate; pressure conductive vias through hole may be rectangular, as long as the pressure of the conductive vias orthogonal projection area of ​​the cross section to a pressure greater than the cross-sectional area of ​​the elongated substrate of the pressure sensitive areas of the conductive vias. 作为一个可用的例子,本实用新型中选用圆形的压力传导通孔。 Examples of a usable, in the present invention, a pressure selected circular conductive via. 流体隔膜固定在基座上,并完全覆盖压力传导通孔,长条形衬底横跨压力传导通孔,衬底上的压力敏感区与压力传导通孔正对,长条形衬底的两端安装在流体隔膜上,所选用的流体隔膜为一弹性模量相对衬底弹性模量较低,温度传导系数较低的膜。 A diaphragm fixed to the base fluid, and a pressure conductive vias completely covers the elongated conductive vias pressure across the substrate, the pressure and the pressure sensitive area on the substrate opposite the conductive vias, two elongated substrate end to a fluid separator, the fluid separator is chosen a lower modulus of elasticity modulus of elasticity relative to the substrate, low temperature coefficient of the conductive film. 压力传导通孔的直径与长条形衬底的压力敏感区长度相等,而压力传导通孔的截面积大于其上方衬底压力敏感区的面积。 Pressure sensitive area of ​​the pressure conductive vias with a diameter equal to the length of the elongated substrate, the conductive vias and the pressure is greater than the cross sectional area of ​​the pressure-sensitive region over the substrate area. 在一定流体压力的作用下,由流体隔膜和衬底压力敏感区的力学平衡条件可知,在相对柔性流体隔膜的作用下,采用较大截面积的压力传导通孔将使衬底获得较大的外部应力,从而对被测衬底压力敏感区的流体压力有放大作用。 Under a certain fluid pressure, the fluid is clear from mechanical equilibrium conditions of a pressure sensitive membrane and the substrate region, at a relatively flexible fluid membrane action, using a larger cross-sectional area of ​​the pressure conductive vias of the substrate will get a larger an external stress, thereby amplifying the fluid pressure acting on the pressure-sensitive region of the substrate measured. 通过ANSYS仿真计算可得,当采用石英材料且作用的压强为8000Pa时,长度10mm、宽度lmm、厚度100um的长条形衬底应变是直径长度10mm、厚度100um的圆形薄膜衬底应变的15倍左右,所以传感器的灵敏度有较大的提高。 Calculated by ANSYS simulation available, when using a quartz material and functions as 8000 Pa pressure, length 10mm, width lmm, the elongated substrate is strained 100um thickness 10mm, the diameter of the circular substrate strain length 100um film thickness of 15 around times, so the sensitivity of the sensor is greatly improved.

[0009] 本实用新型解决其技术问题所采取的技术方案是:该声表面波压力传感器包括顶盖、贯穿有第一金属电极和第二金属电极的基座,所述顶盖密封安装在基座上,其中,所述基座设有压力传导通孔,所述基座的内表面密封固定有流体隔膜,所述流体隔膜覆盖压力传导通孔,所述基座、顶盖和流体隔膜之间形成密闭腔,所述流体隔膜上固定有长条形衬底,所述衬底横跨压力传导通孔,所述衬底上固定有声表面波压力传感谐振器、声表面波基准谐振器、第一焊盘和第二焊盘,所述声表面波压力传感谐振器正对压力传导通孔的中心部分,所述声表面波压力传感谐振器和声表面波基准谐振器各自的两端分别与第一焊盘、 第二焊盘连接,所述第一金属电极置于密闭腔内的一端和第一焊盘连接,所述第二金属电极置于密闭腔内的一端和第二焊盘连接,所述 [0009] The present invention solve the technical problem technical solution adopted: the surface acoustic wave sensor comprises a pressure cover, through a first metal electrode and the base metal of the second electrode, the sealing cap mounted on the base base, wherein the base is provided with pressure conductive vias, the inner surface of the base of the seal is fixed to the fluid separator, the membrane covering the fluid pressure conductive vias, the base, the cap and the fluid separator a sealed chamber formed between the membrane is fixed to the elongated fluid substrate, said conductive vias pressure across the substrate, the substrate is fixed to the pressure sensing surface acoustic wave resonator, surface acoustic wave resonators reference the first and second pads, the surface acoustic wave pressure sensor resonator conducting positive pressure center portion of the through hole, the pressure sensor surface acoustic wave resonator surface acoustic wave resonators each reference both ends, a second pad connected to the first pad, the first metal electrode disposed within the cavity and a closed end connected to the first pad, the second metal electrode disposed at one end and the second sealed chamber two pads are connected, said 底上的压力敏感区的正投影面积小于压力传导通孔的横截面的面积。 Pressure sensitive area of ​​the orthogonal projection area of ​​the bottom is smaller than the cross-sectional area of ​​the pressure conductive vias.

[0010] 进一步地,本实用新型所述衬底呈工字型结构,所述声表面波压力传感谐振器置于工字型结构的中间部分,所述声表面波基准谐振器置于工字型结构的端部。 [0010] Further, the present invention was I-shaped structure of said substrate, said resonator surface acoustic wave pressure sensor placed in the middle part of the I-shaped structure, the reference surface acoustic wave resonators disposed ENGINEERING shaped structure of the end portion. [0011] 进一步地,本实用新型所述衬底上设有匹配电路,所述第一焊盘和第二焊盘分别与匹配电路连接。 [0011] Further, the substrate provided with the matching circuit of the present invention, the first and second pads are connected to the matching circuit.

[0012] 进一步地,本实用新型可用固定有环形天线的基座代替贯穿有第一金属电极和第 [0012] Further, the present invention can be used with a fixed base instead of a loop antenna through a first metal and a second electrode

二金属电极的基座,所述环形天线的两端分别与第一焊盘和第二焊盘连接。 Two base metal electrode, both ends of the loop antenna are connected to the first and second pads.

[0013] 与现有技术相比,本实用新型的有益效果是:通过采用长条形结构的衬底,并采用 [0013] Compared with the prior art, the beneficial effects of the present invention is: through the use of a substrate elongated structure, and the use of

相对于衬底压力敏感区尺寸更大的压力传导通孔,使得声表面波压力传感器的灵敏度有了 With respect to the larger size of the substrate a pressure sensitive areas pressure conductive vias, so that the sensitivity of the surface acoustic wave with a pressure sensor

较大的提高,而且长条形的结构使得衬底的制作比较简单,双端固定的结构也使得传感器 Greatly improved, and the elongated substrate made of such a structure is relatively simple, double-ended fixed structure such that the sensor

的稳定性提高。 The increased stability. 由于采用了非增加衬底面积的方法提高了传感器的灵敏度,所以本实用新 As a result of the method of non-substrate area is increased to improve the sensitivity of the sensor, the present utility model

型传感器的体积可以大大减小。 A volume type sensor can be greatly reduced. 这种高灵敏度、小体积的压力传感器及其结构设计在航空 This high sensitivity, small size design and structure of the pressure sensor in the aviation

航天,植入式医用电子医疗器械中有广阔的应用前景。 Aerospace, medical implantable electronic medical devices has broad application prospects.

附图说明 BRIEF DESCRIPTION

[0014] 图1是本实用新型声表面波压力传感器的结构剖视图; [0015] 图2是图1的AA剖视图; [0014] FIG. 1 is a cross-sectional view of the structure of the present invention, the surface acoustic wave pressure sensor; [0015] FIG. 2 is a sectional view AA of Figure 1;

[0016] 图3是本实用新型声表面波压力传感器采用工字型衬底时的结构示意图; [0017] 图4是本实用新型声表面波压力传感器衬底上加上匹配电路时的结构示意图; [0018] 图5是本实用新型声表面波压力传感器基座上加上环形天线时的结构示意图。 [0016] FIG. 3 is a schematic view of the I-shaped substrate of the present invention, a pressure sensor using a surface acoustic wave; [0017] FIG. 4 is a schematic view of the structure plus the matching circuit of the present invention, the surface acoustic wave pressure sensor substrate ; [0018] FIG. 5 is a schematic structural view of a loop antenna of the present invention together with the SAW pressure sensor base.

具体实施方式 Detailed ways

[0019] 如图1所示,本实用新型声表面波流体压力传感器,它包括基座1和顶盖2,基座1 采用温度传导系数较低的材料制作,如塑料等,可以减小温度对传感器的影响。 [0019] As shown, the present invention is the surface acoustic wave fluid pressure sensor, which comprises a base 1 and the cover 2, the base 1 using a low temperature coefficient of the conductive material, such as plastic or the like, the temperature can be reduced impact on the sensor. 顶盖2密封安装在基座1上,顶盖2选用的材料应能保证无线电磁波信号的顺利通过,以免对无线信号造成屏蔽例如可以为塑料、陶瓷。 A sealing cap 2 is mounted on the base 1, the cover 2 to ensure the selection of materials should pass radio frequency electromagnetic signals, for example, to avoid shielding plastic, ceramic wireless signal.

[0020] 基座1的内表面上固定有流体隔膜IO,基座1上的压力传导通孔4可用于将流体的压力引导到流体隔膜10上。 On the inner surface of the [0020] base 1 is fixed a fluid separator IO, a base pressure conductive vias 4 may be used to guide the pressure fluid to the fluid separator 10. 该流体隔膜10是一层弹性模量小且温度传导系数较低的薄膜,可以将压力传递给衬底3并同时将温度隔离,使得衬底3对压力敏感,而对温度的灵敏度降低。 The fluid separator 10 is a small layer of the elastic modulus and low temperature coefficient of conductivity of the thin film, can be passed to the pressure while the temperature of the substrate 3 and the spacer, so that the pressure sensitive substrate 3, while the sensitivity to temperature decrease. 流体隔膜10完全覆盖压力传导通孔4,以形成对压力传导通孔4周边的流体的密封结构,流体隔膜10与基座1、顶盖2 —起形成一个密封的密闭腔12,该密闭腔12作为压力检测时的基准压力腔。 Fluid pressure membrane 10 completely covers the conductive vias 4, to form a seal structure surrounding the through-hole 4 the pressure transfer fluid, the fluid separator 10 and the base 1, the cap 2 - sealed together to form a sealed chamber 12, the sealed chamber when the reference pressure chamber 12 is detected as a pressure.

[0021] 基座1上贯穿有第一金属电极71和第二金属电极72,第一金属电极71和第二金属电极72用密封胶固定在基座1上。 [0021] The metal electrode 71 through a first and a second metal electrode on a base 72, a first metal electrode 71 and the second metal electrode with a sealant 72 fixed to the base 1. 第一金属电极71和第二金属电极72的一端置于密闭腔12内;第一金属电极71和第二金属电极72的另一端置于本实用新型传感器的外部, 可以用于连接外置天线或者电路等。 The first metal electrode 71 and the second end of the metal electrode 72 is placed inside the sealed chamber 12; a first metal electrode 71 and the other end of the second metal electrode 72 of the present invention is placed outside the sensor can be used to connect an external antenna circuit or the like. 第一金属电极71置于密闭腔12内的一端和第一焊盘81连接,第二金属电极72置于密闭腔12内的一端和第二焊盘82连接。 The first metal electrode 71 is placed in a sealed chamber and a first end 81 connected to the pad 12, the second end of the metal electrode 72 disposed in the sealed chamber 12 and the second pad 82 are connected. [0022] 如图2所示,流体隔膜10上固定有长条形衬底3,衬底3横跨压力传导通孔4并固定在流体隔膜10上,以确保在流体压力的作用下,衬底3上正对压力传导通孔4的压力敏感区31以外的区域都是固定的。 [0022] 2, the fluid separator 10 is fixed to the elongated substrate 3, three conductive vias pressure across the substrate 4 and the diaphragm 10 is fixed to the fluid to ensure that under the influence of fluid pressure, the liner 3 n-bottom area than the through hole 31 of the pressure-sensitive region of the pressure conduction 4 are fixed. 这个结构相当于结构力学中的双端固支梁结构。 This structure corresponds to the clamped-clamped beam structure in structural mechanics. 由结构力学的知识可知,在同样的压力作用下,衬底的应变比与其尺寸和厚度都相等的周边固定的圆形膜片的应变大,这对传感器的压力灵敏度有一定的提高。 Knowledge of the structure seen from the mechanics, the strain under the same pressure, strain ratio, and its dimensions are equal to the thickness of the substrate surrounding the large fixed circular diaphragm, which has a pressure sensitivity of the sensor is improved to some extent. 衬底3的上表面安装有 Upper surface of the substrate 3 is mounted

5声表面波压力传感谐振器5和声表面波基准谐振器6,其中声表面波压力传感谐振器5正对压力传导通孔4的中心部分,以使得该声表面波压力传感谐振器5在流体压力的作用下处于衬底3应变最大的区域,由此可提高传感器的灵敏度。 5 SAW pressure sensor reference resonator surface acoustic wave resonator 5 6, wherein the pressure sensing surface acoustic wave resonator 5 is on the central portion of the pressure transfer through-hole 4, so that the pressure sensing surface acoustic wave resonator 5 at a maximum strain of the area of ​​the substrate 3 under the effect of fluid pressure, thereby to improve the sensitivity of the sensor. 衬底3正对压力传导通孔4的部分为压力敏感区31,压力传导通孔4的横截面积大于位于其上方的衬底3的压力敏感区31的在该压力传导通孔4的横截面上的正投影面积。 In the horizontal pressure transfer through-hole 4 of the substrate 3 facing the pressure-conducting portion through-hole 4 of the pressure-sensitive region 31, conductive vias pressure is greater than the cross-sectional area 4 positioned above the substrate on which the pressure sensitive areas 3 31 orthogonal projection area of ​​the cross-section. 由流体隔膜10和衬底3压力敏感区31的力学平衡条件可知,在一定流体压力的作用下,在相对柔性流体隔膜10的作用下,采用较大截面积的压力传导通孔4将使衬底3获得较大的外部应力,从而对被测衬底3的压力敏感区31的流体压力有放大作用,所以本实用新型传感器有较高的压力灵敏度。 Mechanical equilibrium condition seen by a fluid 31 to the diaphragm 10 and the substrate 3 pressure-sensitive region, under a certain fluid pressure in the fluid under the action of a relatively flexible membrane 10, using a larger cross-sectional area of ​​the pressure conductive vias enable lining 4 bottom 3 to obtain a large external stress, thus amplifying the measured fluid pressure acting on the pressure-sensitive area 3 of the substrate 31, the present invention has high pressure sensitivity of the sensor. [0023] 如图3所示,本实用新型中的长条形衬底3可以呈工字型结构,该工字型衬底横跨压力传导通孔4,其中,该工字型衬底的两端3a分别固定在基座1上方的流体隔膜10上, 中间部分3b为压力敏感区,该压力敏感区正对压力传导通孔4 ;声表面波压力传感谐振器5 位于该工字型衬底的压力敏感区上表面的中心位置,声表面波基准谐振器6位于工字型衬底一端3a的上表面。 [0023] As shown in FIG. 3, in the present invention may be in the elongated I-shaped substrate structure 3, the I-shaped pressure across the substrate conductive vias 4, wherein the I-shaped substrate 3a are fixed to the two ends of a fluid separator over a base 10, intermediate portion 3b of the pressure sensitive areas, the positive pressure zone to a pressure-sensitive conductive vias 4; resonator surface acoustic wave pressure sensor 5 located shaped shaped substrate 6 is positioned on the end surface 3a of the center position, the reference surface acoustic wave resonator on the surface of the pressure-sensitive region of the substrate. 该工字型衬底结构也相当于结构力学中的双端固支梁结构,梁的两端由于固定,对压力的变化是不敏感的,而中间部分由于受到流体隔膜10的作用,对压力敏感。 Shaped substrate corresponds to the structure of the station also clamped-clamped beam structure of structural mechanics, due to the fixed ends of the beam, the pressure change is not sensitive, and the intermediate portion of the fluid due to the action of the diaphragm 10, pressure sensitive. 由结构力学的知识可知,在同样的压力作用下,该工字型衬底3的应变要大于周边固定的衬底的应变,压力灵敏度也相应提高了。 It is seen from the mechanics of the knowledge structure, under the same pressure, the strain I-shaped substrate 3 is greater than the peripheral fixed strain of the substrate, but also a corresponding increase in pressure sensitivity.

[0024] 如图4所示,在传感器的衬底3上还可以制作有匹配电路ll,该匹配电路11可以直接通过光刻技术制作在衬底3上,也可以通过光刻技术在衬底3上制作有几个电路连接焊盘,然后将匹配电路11焊接在焊盘上。 [0024] As shown in FIG. 4, sensor 3 on the substrate may also be fabricated with a matching circuit ll, the matching circuit 11 by a photolithography technique can be directly formed on the substrate 3 may be a substrate by a photolithography technique 3 has several circuits making connection pads, and then the matching circuit 11 on the solder pads.

[0025] 作为本实用新型的另一种实施方式,如图5所示,传感器的基座1不再设有第一金属电极71和第二金属电极72,而是在基座1上固定有环形天线13。 [0025] As the present invention to another embodiment, shown in Figure 5, the base 1 of the sensor are no longer provided with the first electrode metal 71 and second metal electrodes 72, but is fixed to the base 1 loop antenna 13. 该环形天线13可通过喷墨技术直接印制在基座1上,环形天线13的两端通过导线9连接到衬底3上的第一焊盘81和第二焊盘82上,衬底3上的第一焊盘81和第二焊盘82可通过光刻技术直接在衬底3 上形成,声表面波压力传感谐振器5和声表面波基准谐振器6各自的两端分别与第一焊盘81、第二焊盘82连接。 The loop antenna 13 can be directly printed by inkjet technology on the base 1, both ends of the loop antenna 13 is connected to the first pad 81 on the substrate 3 and the second pad 82 through a wire 9, the substrate 3 a first pad 81 and second pad 82 may be formed on the substrate 3 by a photolithography technique direct, both ends of each resonator surface acoustic wave pressure sensor reference surface acoustic wave resonator 5 are respectively the first 6 a pad 81, second pad 82 are connected. 环形天线13的形状可以是环绕成矩形、圆形或其他形状;可以在衬底3的两端或同一侧,甚至可以在衬底3的任何一个地方对环形天线13与第一焊盘81和第二焊盘82进行连接,这由环形天线13的长度决定。 Annular shape surrounding the antenna 13 may be rectangular, circular or other shape; the two ends of the substrate 3 may be the same side or even anywhere on the loop antenna 3 of the substrate 13 and the first pad 81 the second connecting pad 82, which is determined by the length of the loop antenna 13.

[0026] 本实用新型声表面波流体压力和温度传感器主要用于流体(液体或气体)的压力和温度的检测,也可用于对机械压力的检测,当用于对机械压力检测时,可将压力作用于流体隔膜10上正对衬底3上压力敏感区31的部分,传感器的灵敏度比使用周边固定衬底的传感器也有一定的提高。 [0026] The present invention SAW fluid pressure and temperature sensors are used in a fluid (liquid or gas) pressure and temperature detection, it can also be used to detect mechanical stress, for detecting when a mechanical pressure can be fluid pressure acting on the diaphragm portion 10 of the positive pressure sensitive areas 3 on the substrate 31, the sensitivity of the sensor using the peripheral fixed ratio sensor substrate is also improved to some extent.

[0027] 以上是本实用新型的具体制作安装方式,本领域的技术人员可以通过应用本实用新型公开的方法以及实用新型中提到的一些替代方式制作出本实用新型声表面波压力传感器。 [0027] The present invention is more specific production installation, some alternative ways skilled in the art can, by applying the present invention and the disclosure of the invention mentioned in the present invention to produce a SAW pressure sensor. 本实用新型由于采用了非增加衬底面积的方法提高了传感器的灵敏度,传感器的体积可以大大减小。 Since the present invention uses a method of increasing the non-substrate area increases the sensitivity of the sensor, the size of the sensor can be greatly reduced. 这种高灵敏度、小体积的压力传感器及其结构设计在航空航天,植入式医用电子医疗器械中有广阔的应用前景。 This high sensitivity, small size design and structure of the pressure sensor in the aerospace, medical implantable electronic medical devices has broad application prospects.

Claims (4)

  1. 一种声表面波压力传感器,它包括顶盖(2)、贯穿有第一金属电极(71)和第二金属电极(72)的基座(1),所述顶盖(2)密封安装在基座(1)上,其特征是:所述基座(1)设有压力传导通孔(4),所述基座(1)的内表面密封固定有流体隔膜(10),所述流体隔膜(10)覆盖压力传导通孔(4),所述基座(1)、顶盖(2)和流体隔膜(10)之间形成密闭腔(12),所述流体隔膜(10)上固定有长条形衬底(3),所述衬底(3)横跨压力传导通孔(4),所述衬底(3)上固定有声表面波压力传感谐振器(5)、声表面波基准谐振器(6)、第一焊盘(81)和第二焊盘(82),所述声表面波压力传感谐振器(5)正对压力传导通孔(4)的中心部分,所述声表面波压力传感谐振器(5)和声表面波基准谐振器(6)各自的两端分别与第一焊盘(81)、第二焊盘(82)连接,所述第一金属电极(71)置于密闭腔(12)内的一端和第一焊盘(81)连接,所述第二金属电极(7 A surface acoustic wave pressure sensor, which comprises a top cover (2), a first metal electrode inserted through the base (71) and a second metal electrode (72) (1), the cap (2) is mounted in sealed the base (1), characterized in that: said base (1) provided with a pressure conductive vias (4), the base (1) fixed to the inner surface of the sealing fluid separator (10), said fluid diaphragm (10) covering the pressure of conductive vias (4), the base (1), forming a sealed cavity (12) between the top cover (2) and a fluid separator (10), fixing (10) said fluid separator long strip substrate (3), said substrate (3) pressure across the conductive vias (4), fixed on said substrate (3) a pressure sensing surface acoustic wave resonator (5), a surface acoustic wave reference resonator (6), a first pad (81) and the second pad (82), the pressure sensing surface acoustic wave resonator (5) facing the central portion of the pressure transmission through hole (4), the pressure sensor surface acoustic wave resonator (5) reference surface acoustic wave resonator (6) of each of the two ends, respectively, the second pad (82) connected to the first pad (81), said first a metal electrode (71) placed in a sealed chamber and a first end pad (81) inside (12) connected to said second metal electrode (7 2)置于密闭腔(12)内的一端和第二焊盘(82)连接,所述衬底(3)上的压力敏感区(31)的正投影面积小于压力传导通孔(4)的横截面的面积。 2) placed in a sealed chamber (a second end and a pad (82) within 12), said pressure-sensitive region of the substrate (31) on the (3) orthogonally projected area smaller than the pressure conductive vias (4) the cross-sectional area.
  2. 2. 根据权利要求1所述的一种声表面波压力传感器,其特征是:所述衬底(3)呈工字型结构,所述声表面波压力传感谐振器(5)置于工字型结构的中间部分(3b),所述声表面波基准谐振器(6)置于工字型结构的端部(3a)。 2. A surface acoustic wave pressure sensor according to claim 1, characterized in that: said substrate (3) as a I-shaped structure, the surface acoustic wave resonator pressure sensor (5) is placed ENGINEERING shaped structure of the intermediate portion (3b), the reference surface acoustic wave resonator (6) is placed in an end portion of the work-shaped structure (3a).
  3. 3. 根据权利要求1或2所述的声表面波流体压力传感器,其特征是:所述衬底(3)上设有匹配电路(ll),所述第一焊盘(81)和第二焊盘(82)分别与匹配电路(11)连接。 3. The surface acoustic wave sensor or a fluid pressure according to claim 1, wherein: the matching circuit is provided (LL) on the substrate (3), the first pad (81) and a second pads (82) are connected to the matching circuit (11).
  4. 4. 根据权利要求3所述的一种声表面波压力传感器,其特征是:用固定有环形天线(13)的基座代替贯穿有第一金属电极(71)和第二金属电极(72)的基座(l),所述环形天线(13)的两端分别与第一焊盘(81)和第二焊盘(82)连接。 4. A surface acoustic wave pressure sensor according to claim 3, characterized in that: the base is fixed in place with a loop antenna (13) through a first metal electrode (71) and second metal electrodes (72) base (l), two ends of the loop antenna (13) are connected to a first pad (81) and the second pad (82).
CN2009201907699U 2009-08-06 2009-08-06 Surface acoustic wave pressure sensor CN201497610U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201907699U CN201497610U (en) 2009-08-06 2009-08-06 Surface acoustic wave pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201907699U CN201497610U (en) 2009-08-06 2009-08-06 Surface acoustic wave pressure sensor

Publications (1)

Publication Number Publication Date
CN201497610U true CN201497610U (en) 2010-06-02

Family

ID=42440814

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201907699U CN201497610U (en) 2009-08-06 2009-08-06 Surface acoustic wave pressure sensor

Country Status (1)

Country Link
CN (1) CN201497610U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2710959A1 (en) * 2012-09-20 2014-03-26 Masimo Corporation Acoustic patient sensor coupler
US8771204B2 (en) 2008-12-30 2014-07-08 Masimo Corporation Acoustic sensor assembly
US9192351B1 (en) 2011-07-22 2015-11-24 Masimo Corporation Acoustic respiratory monitoring sensor with probe-off detection
US9370335B2 (en) 2009-10-15 2016-06-21 Masimo Corporation Physiological acoustic monitoring system
US9386961B2 (en) 2009-10-15 2016-07-12 Masimo Corporation Physiological acoustic monitoring system
US9538980B2 (en) 2009-10-15 2017-01-10 Masimo Corporation Acoustic respiratory monitoring sensor having multiple sensing elements
US9782110B2 (en) 2010-06-02 2017-10-10 Masimo Corporation Opticoustic sensor

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9795358B2 (en) 2008-12-30 2017-10-24 Masimo Corporation Acoustic sensor assembly
US8771204B2 (en) 2008-12-30 2014-07-08 Masimo Corporation Acoustic sensor assembly
US9028429B2 (en) 2008-12-30 2015-05-12 Masimo Corporation Acoustic sensor assembly
US9131917B2 (en) 2008-12-30 2015-09-15 Masimo Corporation Acoustic sensor assembly
US10098610B2 (en) 2009-10-15 2018-10-16 Masimo Corporation Physiological acoustic monitoring system
US9370335B2 (en) 2009-10-15 2016-06-21 Masimo Corporation Physiological acoustic monitoring system
US9386961B2 (en) 2009-10-15 2016-07-12 Masimo Corporation Physiological acoustic monitoring system
US9538980B2 (en) 2009-10-15 2017-01-10 Masimo Corporation Acoustic respiratory monitoring sensor having multiple sensing elements
US9867578B2 (en) 2009-10-15 2018-01-16 Masimo Corporation Physiological acoustic monitoring system
US9782110B2 (en) 2010-06-02 2017-10-10 Masimo Corporation Opticoustic sensor
US9192351B1 (en) 2011-07-22 2015-11-24 Masimo Corporation Acoustic respiratory monitoring sensor with probe-off detection
US9955937B2 (en) 2012-09-20 2018-05-01 Masimo Corporation Acoustic patient sensor coupler
EP2710959A1 (en) * 2012-09-20 2014-03-26 Masimo Corporation Acoustic patient sensor coupler

Similar Documents

Publication Publication Date Title
CA2006672C (en) Capacitive pressure sensor with encircling third plate
EP1325296B1 (en) Pressure monitor incorporating saw device
US7150195B2 (en) Sealed capacitive sensor for physical measurements
EP1790963B1 (en) Mechanical deformation amount sensor
US6874367B2 (en) Pressure sensor
US7353711B2 (en) Capacitive sensor
US6571638B2 (en) Surface-acoustic-wave pressure sensor and associated methods
CN103278681B (en) Microwave power sensor with multi-cantilever structure
US4574640A (en) Integrated dual-range pressure transducer
CN101900625B (en) Design of wet/wet differential pressure sensor based on microelectronic packaging process
EP0832424A4 (en) Vapor pressure sensor and method
JP2008522193A (en) Piezo-resistive strain concentrator
US8297124B2 (en) Pressure sensor
CN1387740A (en) Pressure transducer
CN102589761A (en) Force Sensors
CN101858929B (en) Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof
US9073746B2 (en) MEMS pressure sensor and manufacturing method therefor
JP2004053329A (en) Semiconductor sensor assembly body and tire monitoring sensor
US8580127B2 (en) Method of manufacturing RFID based thermal bubble type accelerometer
EP2270455A2 (en) Force sensor apparatus
US7100452B2 (en) Surface acoustic wave multiple sense element
US8015881B2 (en) Pressure sensor
CN101644718B (en) Capacitive acceleration sensor with acoustic cavity
CN101226092A (en) SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor
CN101672710B (en) Beam-film combined micro-pressure sensor

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
C17 Cessation of patent right