CN216815825U - MEMS high-precision oil seal pressure sensor - Google Patents
MEMS high-precision oil seal pressure sensor Download PDFInfo
- Publication number
- CN216815825U CN216815825U CN202220347422.6U CN202220347422U CN216815825U CN 216815825 U CN216815825 U CN 216815825U CN 202220347422 U CN202220347422 U CN 202220347422U CN 216815825 U CN216815825 U CN 216815825U
- Authority
- CN
- China
- Prior art keywords
- pressure sensor
- base
- lead
- cavity
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a MEMS high-precision oil seal pressure sensor, which comprises: the pressure sensor comprises a base, insulating ceramics, an insulator, a pressure sensor chip, a corrugated diaphragm, a lead and a pressure signal acquisition and processing element. Wherein: the insulating ceramic is of an annular structure and is fixed on the bottom surface of the cavity of the base. The insulator is fixed on the bottom surface of the base in the insulating ceramic. The pressure sensor chip is fixed on the insulator. The corrugated diaphragm is fixed in an upper port of a cavity of the base in a sealing mode, the insulating ceramic, the insulator and the pressure sensor chip are all located below the corrugated diaphragm, and the cavity of the base below the corrugated diaphragm is filled with silicone oil. The lead is connected with the pressure sensor chip through a wire, and the pressure signal acquisition processing element is connected with the lead. The pressure sensor of the utility model can transmit the external pressure to the pressure sensing chip with lowest loss and high linearity by designing the corrugated diaphragm and the internal insulating ceramic.
Description
Technical Field
The utility model relates to the technical field of MEMS sensors, in particular to an MEMS high-precision oil seal pressure sensor.
Background
The information disclosed in this background of the utility model is only for the purpose of increasing an understanding of the general background of the utility model and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.
Micro-electro-mechanical systems (MEMS) are micro-electromechanical systems developed on the basis of micro-electronics technology, and incorporate technologies such as lithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining, and precision machining. While pressure sensors are an important component of MEMS. At present, domestic pressure sensors are generally piezoresistive sensors, but the problems of low precision and poor stability exist, and the piezoresistive effect of a silicon piezoresistive sensing chip of the sensor is greatly influenced by temperature, so that zero drift and thermal sensitivity drift phenomena exist in devices generally.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides an MEMS high-precision oil seal pressure sensor which can transfer external pressure to a pressure sensing chip with lowest loss and high linearity through the design of a corrugated diaphragm and internal insulating ceramics, and effectively overcomes the problems. In order to achieve the above object, the technical solution of the present invention is as follows.
A MEMS high-precision oil seal pressure sensor comprises: the pressure sensor comprises a base, insulating ceramics, an insulator, a pressure sensor chip, a corrugated diaphragm, a lead and a pressure signal acquisition and processing element. Wherein: the insulating ceramic is of an annular structure and is fixed on the bottom surface of the cavity of the base. The insulator is fixed on the bottom surface of the base in the insulating ceramic. The pressure sensor chip is fixed on the insulator. The corrugated diaphragm is fixed in an upper port of a cavity of the base in a sealing mode, the insulating ceramic, the insulator and the pressure sensor chip are all located below the corrugated diaphragm, and the cavity of the base below the corrugated diaphragm is filled with silicone oil. The lead is connected with the pressure sensor chip through a wire, and the pressure signal acquisition processing element is connected with the lead.
The corrugated diaphragm is pressed and fixed on the end face of the upper port of the cavity of the base by the diaphragm fixing piece.
Further, the diaphragm mount includes an annular pressing plate and a fastener. Wherein: the edge of the corrugated diaphragm is pressed on the end face of the upper port of the cavity of the base by the annular pressing sheet, and the annular pressing sheet is tightly connected on the end face of the upper port of the cavity of the base by the fastening piece.
Furthermore, the edge of the corrugated membrane is planar so as to be tightly attached to the end face of the upper port of the chamber of the base, and the corrugated membrane is better in sealing connection.
Further, the corrugations of the corrugated diaphragm are sine waves. Preferably, the number of corrugations is an integer multiple of 0.5.
Furthermore, an oil filling hole is formed in the bottom surface of the cavity of the base and is communicated with the inner cavity of the base after passing through the insulating ceramic. And a sealing plug is arranged in the oil filling hole to prevent silicone oil in the base cavity from leaking.
Further, the bottom surface of the cavity of the base is provided with a lead hole, the lead hole extends into the insulating ceramic, the upper end of the lead is positioned in the lead hole, and the lead hole are sealed and fixed.
Furthermore, a groove communicated with the lead hole is formed in the inner wall of the upper portion of the insulating ceramic, one end of the lead is connected with the lead, and the other end of the lead penetrates through the groove and is connected with the pressure sensor chip.
Furthermore, the pressure signal acquisition processing element is fixed in the bottom lower chamber of the base, the lower end of the lead hole is located in the bottom lower chamber of the base, and the lower end of the lead hole is connected with the pressure signal acquisition processing element.
Furthermore, the outer wall of the base is sleeved with a sealing ring for sealing and fixing the sensor at the later stage.
Compared with the prior art, the utility model has the following beneficial effects: the MEMS high-precision oil-sealed pressure sensor disclosed by the utility model can transfer the external pressure to the sensor chip with the lowest loss and high linearity through the design of the corrugated diaphragm, so that the sensor has better sensitivity, and the problems of zero drift and thermal sensitivity drift of devices generally caused by low precision and poor stability of the existing piezoresistive sensor are effectively solved. The structural characteristics of the corrugated membrane can effectively reduce the influence of the thermal expansion of the silicone oil on the chip, particularly change the thermal expansion direction of the silicone oil, effectively control the thermal influence of the silicone oil and keep high linearity and stability.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the utility model, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model.
FIG. 1 is a schematic structural diagram of an MEMS high-precision oil-sealed pressure sensor in the embodiment.
FIG. 2 is a top view of the base of the embodiment.
FIG. 3 is a schematic structural diagram of a corrugated diaphragm in an embodiment.
Fig. 4 is a schematic diagram of a pressure signal acquisition processing element in an embodiment.
FIG. 5 is a schematic diagram of a gain phase shifting circuit and an amplitude stabilizing circuit in an embodiment.
The scores in the figure represent: 1-base, 2-insulating ceramic, 3-glass insulator, 4-sensor chip, 5-corrugated diaphragm, 6-lead, 7-pressure signal acquisition processing element, 8-annular pressing sheet, 9-oil filling hole, 10-sealing plug, 11-lead hole, 12-sealing ring, 13-base inner cavity and 14-groove.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the utility model as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
For convenience of description, the words "up", "down", "left" and "right" in the present invention, if any, merely indicate that the directions of movement are consistent with those of the drawings, and do not limit the structure, but merely facilitate the description of the utility model and simplify the description, rather than indicate or imply that the referenced device or element needs to have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.
Term interpretation section: the terms "mounted," "connected," "fixed," and the like in the present invention are to be understood in a broad sense, and for example, the terms "mounted," "connected," and "fixed" may be fixed, detachable, or integrated; the connecting lines may be mechanical, direct or indirect through an intermediate, and those skilled in the art will understand the specific meaning of the above terms in the present invention according to specific situations. The specimen diagnosis negative pressure airing rack of the utility model is further explained by combining the drawings and the specific embodiment of the specification.
Referring to fig. 1 to 3, there is illustrated a MEMS high-precision oil seal pressure sensor, which mainly includes: the pressure sensor comprises a base 1, insulating ceramics 2, a glass insulator 3, a pressure sensor chip 4, a corrugated diaphragm 5, a lead 6 and a pressure signal acquisition and processing element 7. Wherein:
the base 1 is a copper cylindrical structure, and the middle of the inner cavity of the base 1 is provided with a bottom surface, so that the inner cavity 13 of the base 1 is divided into an upper part and a lower part. The insulating ceramic 2 is of a circular ring structure, the outer diameter of the insulating ceramic 2 is smaller than the diameter of the inner cavity of the base 1, the insulating ceramic 2 is fixed on the bottom surface of the inner cavity of the base 1 in a sealing mode through a sealant, and the outer portion of the insulating ceramic 2 is connected with the inner wall of the inner cavity of the base 1 in a sealing mode.
The center of the insulating ceramic 2 is provided with a square through hole, the glass insulator 3 is positioned in the square through hole, and the glass insulator 3 is fixedly bonded on the bottom surface of the base 1, so that the pressure sensor chip 4 is insulated and isolated from the base 1 made of metal.
The pressure sensor chip 4 is fixed on the glass insulator 3 in a sticking mode, the pressure sensor chip 4 is a resonance pressure sensor chip and is provided with a silicon sensitive layer and a resonator, and the silicon sensitive layer deforms after being stressed, so that the resonator deforms, and the vibration frequency of the resonator changes.
The corrugated diaphragm 5 is fixed on an upper port of an inner cavity of the base 1 in a sealing mode, the insulating ceramic 2, the glass insulator 3 and the pressure sensor chip 4 are located below the corrugated diaphragm 5, and silicone oil is filled in the inner cavity of the base below the corrugated diaphragm 5. The corrugations of the corrugated membrane 5 are sine waves, and the number of the corrugations is an integer multiple of 0.5, that is, the corrugations are either a plurality of complete sine waves or a plurality of complete cycles plus a half cycle sine wave. The edge of the corrugated diaphragm 5 is planar so as to be tightly attached to the end face of the upper end port of the inner cavity of the base 1, and the corrugated diaphragm is better in sealing connection. In this embodiment, the number of the corrugations of the corrugated diaphragm 5 is 4.5 sine corrugations, the corrugation depth is 0.2mm, the influence on pressure transmission due to the fact that the corrugated diaphragm touches the lower insulating ceramic 2 due to stress deformation can be avoided, and the corrugated diaphragm 5 is made of 316L stainless steel.
The lead 6 (metal lead or pin) is connected with the pressure sensor chip 4 through a wire, the pressure signal acquisition processing element 7 is fixed at the lower part of the bottom surface of the base 1, and the pressure signal acquisition processing element 7 is connected with the lead 6. The lead 6 is a metal lead or a pin, and the pressure signal acquisition processing element 7 is a PCB.
In another embodiment, the corrugated diaphragm 5 is fixed on the upper end face of the inner cavity of the base 1 by a diaphragm fixing member. Specifically, with continued reference to fig. 1 and 2, the diaphragm mount includes an annular pressing tab 8. Wherein: the annular pressing plate 8 presses the planar edge of the corrugated diaphragm 5 against the upper end face of the inner cavity of the base 1, and then the annular pressing plate is fastened to the upper end face of the inner cavity of the base 1 by laser welding.
In another embodiment, referring to fig. 1, the bottom surface of the inner cavity of the base 1 is provided with an oil filling hole 9, and the oil filling hole 9 is communicated with the inner cavity 13 of the base 1 after passing through the insulating ceramic 2. And a sealing plug 10 is arranged in the oil filling hole 9 to prevent silicone oil in the inner cavity of the base from leaking. During oil injection, the MEMS high-precision oil seal pressure sensor is integrally inverted, then silicone oil is injected through the oil filling hole 9, the oil filling hole 9 is sealed by the sealing plug 10 after the MEMS high-precision oil seal pressure sensor is fully filled, then the pressure signal acquisition processing element 7 is fixedly arranged in an inner cavity below the bottom surface of the base, and the pressure signal acquisition processing element 7 is connected with the lead 6.
In another embodiment, referring to fig. 1, the base 1 has eight lead holes 11 on the bottom surface of the inner cavity, and the lead holes 11 extend into the insulating ceramic 2. One lead 6 is mounted in each of the lead holes 11. Wherein: the upper end of the lead 6 is positioned in the lead hole 11, and the lead 6 and the lead hole 11 are fixedly connected through insulating resin sealing.
In another embodiment, referring to fig. 1 and 2, the insulating ceramic 2 has a groove 14 communicating with the lead hole 11 on the upper inner wall thereof, one end of the lead is connected to the lead 6, and the other end of the lead is connected to the pressure sensor chip 4 after passing through the groove 14.
In another embodiment, the outer wall of the base 1 described with reference to fig. 1 is covered with a sealing ring 12 for later packaging and fixing the sensor.
When external pressure acts on the corrugated diaphragm 5, the corrugated diaphragm 5 can generate deformation to extrude silicon oil in the base inner cavity below the corrugated diaphragm, the silicon oil has incompressibility as a medium for transmitting pressure, the pressure can be transmitted to the pressure sensor chip 4, the silicon sensitive layer of the pressure sensor chip 4 is stressed and deformed, the resonator inside the chip 3 is deformed, and therefore the vibration frequency of the resonator is changed, the circuit designed by the upper pressure signal acquisition and processing element 7 detects and amplifies a signal and carries out temperature compensation on the signal, an accurate pressure value is obtained, and the pressure value is output to an upper computer.
Further, in a preferred embodiment, with continued reference to fig. 4, the detection principle for the pressure signal acquisition processing element 7 is shown in fig. 4. Since the resonator and the I-V conversion circuit have a phase difference of 150 °, a gain phase shift circuit is added after the I-V conversion circuit to compensate for the phase difference (refer to fig. 5). Because the vibration amplitude of the resonator in the pressure sensor chip 4 is small and the detection signal is weak, a signal amplification link is required to meet the gain condition. Once the resonator starts oscillation, the driving voltage is easily too large due to the positive feedback of the loop, and an amplitude stabilizing circuit with an Automatic Gain Control (AGC) function is added to realize amplitude control of the resonator (refer to fig. 5). The signal is output by three routes: firstly, the vibration is transmitted to the drive end of the resonator after attenuation and buffering, and the vibration of the resonator is maintained. Secondly, the attenuation multiple is controlled through AGC gain control; and thirdly, outputting a frequency signal after band-pass filtering for detecting the resonant frequency.
Finally, it should be understood that any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (10)
1. The utility model provides a MEMS high accuracy oil blanket pressure sensor which characterized in that includes:
the base is a structure which is provided with a chamber and an upper port of which is opened;
the insulating ceramic is of an annular structure and is fixed on the bottom surface of the cavity;
the insulator is fixed on the bottom surface of the base in the insulating ceramic;
the pressure sensor chip is fixed on the insulator;
the corrugated diaphragm is fixed in an upper port of the cavity of the base in a sealing manner, and the insulating ceramic, the insulator and the pressure sensor chip are all positioned below the corrugated diaphragm;
silicone oil is filled in the base cavity below the corrugated diaphragm;
the lead is connected with the pressure sensor chip through a wire; and
and the pressure signal acquisition and processing element is connected with the lead.
2. A MEMS high-precision oil-sealed pressure sensor as claimed in claim 1, further comprising a diaphragm fixing member, wherein the diaphragm fixing member fixes the compression of the corrugated diaphragm on the upper end face of the chamber of the base.
3. A MEMS high precision oil-sealed pressure sensor as claimed in claim 2, wherein said diaphragm mount comprises an annular pressure plate and a fastener; wherein: the edge of the corrugated diaphragm is pressed on the end face of the upper port of the cavity of the base by the annular pressing sheet, and the annular pressing sheet is tightly connected on the end face of the upper port of the cavity of the base by the fastening piece.
4. A MEMS high precision oil-sealed pressure sensor as claimed in claim 3, wherein the edge of the corrugated diaphragm is planar.
5. The MEMS high-precision oil-sealed pressure sensor as claimed in claim 1, wherein the corrugation of the corrugated diaphragm is a sine wave; alternatively, the number of the ripples is an integral multiple of 0.5.
6. The MEMS high-precision oil seal pressure sensor as recited in claim 1, wherein the cavity bottom surface of the base is provided with an oil filling hole, and the oil filling hole is communicated with the inner cavity of the base after passing through insulating ceramics; and a sealing plug is arranged in the oil filling hole.
7. A MEMS high-precision oil-sealed pressure sensor as claimed in claim 1, wherein the base has a lead hole on the bottom surface of the cavity, the lead hole extends into the insulating ceramic, the upper end of the lead is located in the lead hole, and the lead hole are sealed and fixed.
8. A MEMS high-precision oil-sealed pressure sensor as claimed in claim 7, wherein the upper inner wall of the insulating ceramic is provided with a groove communicated with the lead hole, one end of the lead is connected with the lead, and the other end of the lead is connected with the pressure sensor chip after passing through the groove.
9. A MEMS high-precision oil-sealed pressure sensor as claimed in any one of claims 7 to 8, wherein the pressure signal acquisition processing element is fixed in the bottom lower chamber of the base, the lower end of the lead hole is located in the bottom lower chamber of the base, and the lower end of the lead hole is connected with the pressure signal acquisition processing element.
10. A MEMS high precision oil-sealed pressure sensor as claimed in any of claims 1-8, wherein the outer wall of the base is sleeved with a sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220347422.6U CN216815825U (en) | 2022-02-21 | 2022-02-21 | MEMS high-precision oil seal pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220347422.6U CN216815825U (en) | 2022-02-21 | 2022-02-21 | MEMS high-precision oil seal pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216815825U true CN216815825U (en) | 2022-06-24 |
Family
ID=82042079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220347422.6U Active CN216815825U (en) | 2022-02-21 | 2022-02-21 | MEMS high-precision oil seal pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216815825U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115406577A (en) * | 2022-08-26 | 2022-11-29 | 南京高华科技股份有限公司 | MEMS pressure sensor packaging structure and preparation method thereof |
-
2022
- 2022-02-21 CN CN202220347422.6U patent/CN216815825U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115406577A (en) * | 2022-08-26 | 2022-11-29 | 南京高华科技股份有限公司 | MEMS pressure sensor packaging structure and preparation method thereof |
| CN115406577B (en) * | 2022-08-26 | 2024-05-14 | 南京高华科技股份有限公司 | MEMS pressure sensor packaging structure and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8091431B2 (en) | Pressure sensor | |
| CN100454455C (en) | Micro-electromechanical sensor | |
| US6425290B2 (en) | Oil-less differential pressure sensor | |
| CN101634598B (en) | Pressure sensor | |
| US7942062B2 (en) | Pressure sensor and method for manufacturing the same | |
| US8015881B2 (en) | Pressure sensor | |
| EP2580565B1 (en) | Differential pressure sensor with line pressure measurement | |
| US7062974B2 (en) | Pressure transmitter | |
| CN101620018B (en) | Surface acoustic wave pressure sensor | |
| CN2938053Y (en) | Silicon pressure sensor | |
| CN216815825U (en) | MEMS high-precision oil seal pressure sensor | |
| WO1985002677A1 (en) | Pressure transducer | |
| CN102331323A (en) | Hermetically sealed pressure sensing device | |
| JPH04502508A (en) | multi-coefficient pressure sensor | |
| CN201497610U (en) | Surface acoustic wave pressure sensor | |
| CN202204625U (en) | Quartz pressure resonant element for beam film structure | |
| EP3249372B1 (en) | Optimized epoxy die attach geometry for mems die | |
| CN110595672A (en) | Novel high-accuracy differential pressure transmitter | |
| WO2017003692A1 (en) | Pressure sensor device with a mems piezoresistive element attached to an in-circuit ceramic board | |
| RU2690699C1 (en) | Frequency resonant differential pressure sensor and frequency resonance differential pressure sensor | |
| US6951136B2 (en) | Semiconductor pressure sensor device to detect micro pressure | |
| WO2024041638A1 (en) | Differential-capacitance-type mems pressure sensor and manufacturing method therefor | |
| US6626044B1 (en) | Freeze resistant sensor | |
| CN113353883A (en) | MEMS pressure sensor based on phase detection principle and preparation method | |
| CN220932234U (en) | High temperature resistant force transducer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |