CN201488869U - Test board for micro electronic mechanical system chip for photoelectric device - Google Patents
Test board for micro electronic mechanical system chip for photoelectric device Download PDFInfo
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- CN201488869U CN201488869U CN2009201729850U CN200920172985U CN201488869U CN 201488869 U CN201488869 U CN 201488869U CN 2009201729850 U CN2009201729850 U CN 2009201729850U CN 200920172985 U CN200920172985 U CN 200920172985U CN 201488869 U CN201488869 U CN 201488869U
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Abstract
The utility model relates to a test board for a micro electronic mechanical system chip for a photoelectric device, which mainly comprises five parts of a beam collimator, an input optical fiber, an output optical fiber, a tray and a five-dimensional adjusting bracket. The input optical fiber and the output optical fiber are connected on the beam collimator which is fixed on a support frame; a chip to be tested is fixed on a base and then is placed on the tray; the tray is fixed on a fixed clamp block through a connecting rod a; the fixed clamp block is fixed on the five-dimensional adjusting bracket through a connecting rod b; the support frame and the five-dimensional adjusting bracket are fixed on a chassis; an optical signal enters the beam collimator through the input optical fiber, irradiates the chip to be tested, and then is reflected back to the output optical fiber through the beam collimator. The test board of the utility model has the characteristics of high efficiency, good reliability and low cost. Due to the adoption of the beam collimator and the five-dimensional adjusting bracket, the optical fiber can be reflected to the maximum so that the optical property and stability of the micro electronic mechanical system chip can be tested accurately.
Description
Technical field:
The utility model relates to a kind of photoelectric device chip testing platform in the optical communication technique field, chip belong to MEMS (micro electro mechanical system) (Micro Electro-mechanical System, MEMS).This test board can be tested the photoelectric properties and the stability of the MEMS chip that is used for optic communication device easily, selects the element of excellent properties, the waste of avoiding unacceptable product that follow-up assembling is caused.
Background technology
MEMS (micro electro mechanical system) (MEMS) technology is a kind of new manufacture, is widely used in the development of optical communication, and great marketable value is arranged.Utilize the optoelectronic device of MEMS fabrication techniques to have characteristics such as volume is little, in light weight, energy consumption is low, integrated degree height, thereby become the focus of research day by day.
Because the mirror size on the MEMS chip is very little, be difficult to chip is carried out optical property and stability test.Usually must be packaged into the overall optical electron device to MEMS chip and optical collimator, pass judgment on the performance of MEMS chip then by the performance of test light electronics device.It is defective generally to understand some chip, can cause optoelectronic device integral body not satisfy the requirement of photoelectric properties or stability.Because the nonreversibility of this technology, the sleeve pipe of related optical collimator of meeting and encapsulation usefulness is scrapped, and all is great waste to time and resource like this.So technical indicators such as the optical property of test chip and stability are very important before encapsulation.
The utility model content
The utility model has solved the technical matters that can't carry out optical property and stability test because the mirror reflects scope is little to chip, a kind of efficient height, good reliability, MEMS chip test platform that cost is low are provided, the technical indicator of test chip comprises minimum Insertion Loss (Insertionloss, IL), the stability when chip upper reflector spinfunction and rotation status.
The technical solution of the utility model is, a kind of optoelectronic device chip of micro-electro-mechanical system test board, mainly comprise the fine collimating apparatus of light beam, input optical fibre, output optical fibre, pallet and five times regualting frame five parts, wherein input optical fibre and output optical fibre are connected on the beam collimation device, the beam collimation device is fixed on the bracing frame, after being fixed on the base, chip to be measured is placed on the pallet, pallet is fixed on fixedly on the fixture block by connecting link a, fixedly fixture block is fixed on the five times regualting frame by connecting link b, and bracing frame and five times regualting frame are fixed on the chassis; Light signal enters the beam collimation device by input optical fibre, is radiated on the chip to be measured, again by beam collimation device reflected back output optical fibre.
Five adjusting knobs are arranged on the five times regualting frame,, can make maximum luminous energy reflected back output optical fibre, obtain the minimum Insertion Loss of chip to be measured by adjusting knob.
The utility model test board is efficient height, good reliability not only, and with low cost, owing to adopted beam collimation device and five times regualting frame, can make optical fiber farthest obtain reflection, and then test out the optical and stable of chip of micro-electro-mechanical system accurately.
Description of drawings
Fig. 1 is test philosophy figure of the present utility model
Fig. 2 is the test board auxiliary facility
Fig. 3 is a structural representation of the present utility model
Reference numeral: the 1. fixing fixture block of head 2. chip 3. output optical fibres 4. input optical fibres 5. beam collimation devices 6. bases 7. power leads 8. power supplys 9. light sources 10. light power meters 11. test boards 12. pallets 13. bracing frames 14. chassis, 15. adjusting knobs, 16. five times regualting frames, 17. connecting link a, 18. connecting link b 19. to be measured
Embodiment
Test philosophy figure as shown in Figure 1 comprises input optical fibre 4, output optical fibre 3, and beam collimation device 5 is formed with the base 6 that is connected head 1.Light signal enters beam collimation device 5 by input optical fibre 4, is radiated on the chip 2 to be measured, again by beam collimation device 5 reflected back output optical fibres 3.
The test board auxiliary facility also comprises power supply 8, light source 9, light power meter 10, test board 11 as shown in Figure 2, and light power meter 10 is in order to calculate the quantity of the input optical fibre that reflects in the test board.
Structural representation as shown in Figure 3, the utility model is made up of beam collimation device 5, input optical fibre 4, output optical fibre 3, pallet 12 and five times regualting frame 16, input optical fibre 4 and output optical fibre 3 are connected on the beam collimation device 5, beam collimation device 5 is fixed on the bracing frame 13, after being fixed on the base 6, chip 2 to be measured is placed on the pallet 12, pallet 12 is fixed on fixedly on the fixture block 19 by connecting link a17, and fixedly fixture block 19 is fixed on the five times regualting frame 16 by connecting link b18.Light signal enters the beam collimation device by input optical fibre, is radiated on the chip to be measured, again by beam collimation device reflected back output optical fibre.By regulating the adjusting knob on the five times regualting frame, can make maximum luminous energy reflected back output optical fibre, obtain the minimum Insertion Loss of chip to be measured; After stopping to regulate five times regualting frame, chip to be measured connects power lead, by regulating the voltage of input chip to be measured, the catoptron of chip to be measured is rotated, thereby cause reflected back output optical fibre energy to reduce, confirm the spinfunction of the catoptron on the chip to be measured; Add certain voltage on chip to be measured by power lead, keep a period of time, observe the output energy variation of output optical fibre, confirm chip stability to be measured.
Claims (2)
1. optoelectronic device chip of micro-electro-mechanical system test board, mainly comprise the fine collimating apparatus of light beam, input optical fibre, output optical fibre, pallet and five times regualting frame five parts, it is characterized in that: input optical fibre and output optical fibre are connected on the beam collimation device, the beam collimation device is fixed on the bracing frame, after being fixed on the base, chip to be measured is placed on the pallet, pallet is fixed on fixedly on the fixture block by connecting link a, fixedly fixture block is fixed on the five times regualting frame by connecting link b, and bracing frame and five times regualting frame are fixed on the chassis; Light signal enters the beam collimation device by input optical fibre, is radiated on the chip to be measured, again by beam collimation device reflected back output optical fibre.
2. chip testing platform according to claim 1 is characterized in that: five adjusting knobs are arranged on the five times regualting frame, by adjusting knob, can make maximum luminous energy reflected back output optical fibre, obtain the minimum Insertion Loss of chip to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201729850U CN201488869U (en) | 2009-08-21 | 2009-08-21 | Test board for micro electronic mechanical system chip for photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201729850U CN201488869U (en) | 2009-08-21 | 2009-08-21 | Test board for micro electronic mechanical system chip for photoelectric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201488869U true CN201488869U (en) | 2010-05-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201729850U Expired - Fee Related CN201488869U (en) | 2009-08-21 | 2009-08-21 | Test board for micro electronic mechanical system chip for photoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201488869U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101949845A (en) * | 2010-08-20 | 2011-01-19 | 浙江大学 | Miniaturized low-cost photoluminescence scanning measurement device |
| CN106153094A (en) * | 2016-07-27 | 2016-11-23 | 武汉京邦科技有限公司 | A kind of load plate for photodetector batch testing and load plate system |
| CN106353074A (en) * | 2016-09-29 | 2017-01-25 | 上海汇珏网络通信设备有限公司 | Optical index testing system for automatic insertion type shunt |
| CN109884505A (en) * | 2019-03-14 | 2019-06-14 | 中国科学院半导体研究所 | A kind of configurable structure for photoelectronic chip detection |
-
2009
- 2009-08-21 CN CN2009201729850U patent/CN201488869U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101949845A (en) * | 2010-08-20 | 2011-01-19 | 浙江大学 | Miniaturized low-cost photoluminescence scanning measurement device |
| CN106153094A (en) * | 2016-07-27 | 2016-11-23 | 武汉京邦科技有限公司 | A kind of load plate for photodetector batch testing and load plate system |
| CN106153094B (en) * | 2016-07-27 | 2018-08-07 | 武汉京邦科技有限公司 | A kind of load plate and load plate system for photodetector batch testing |
| CN106353074A (en) * | 2016-09-29 | 2017-01-25 | 上海汇珏网络通信设备有限公司 | Optical index testing system for automatic insertion type shunt |
| CN109884505A (en) * | 2019-03-14 | 2019-06-14 | 中国科学院半导体研究所 | A kind of configurable structure for photoelectronic chip detection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20160821 |