CN106153094B - A kind of load plate and load plate system for photodetector batch testing - Google Patents
A kind of load plate and load plate system for photodetector batch testing Download PDFInfo
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- CN106153094B CN106153094B CN201610601770.0A CN201610601770A CN106153094B CN 106153094 B CN106153094 B CN 106153094B CN 201610601770 A CN201610601770 A CN 201610601770A CN 106153094 B CN106153094 B CN 106153094B
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- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 239000002184 metal Substances 0.000 claims abstract description 99
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000523 sample Substances 0.000 claims description 23
- 238000005259 measurement Methods 0.000 claims description 12
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 238000004458 analytical method Methods 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
Abstract
The invention discloses a kind of load plates and load plate system for photodetector batch testing, the batch testing load plate includes that the chip slot of multiple array distributions and stomata, aspirating hole, signal end metalline stake, signal end metal lead wire, the tactile slot of signal output, power end metalline stake, power end metal lead wire and power input touch slot.The chip slot, stomata and aspirating hole are to fixation photodetector to be measured；The signal end metalline stake, signal end metal lead wire and signal output touch slot to read the measuring signal of photodetector to be measured；The power end metalline stake, power end metal lead wire and power input touch slot to provide power supply for photodetector to be measured.The batch testing load plate is aided with signal output interface and power input interface, constitutes batch testing load plate system provided by the present invention.The present invention can be carried out at the same time test rapidly and efficiently to hundreds and thousands of a photodetectors；And the quick reading of multiple test volumes can be conveniently realized, and then quick Geostatistics analysis easily is carried out to test volume.
Description
Technical field
The present invention relates to microelectronics and photoelectron testing fields, can be used for detecting or testing simultaneously more particularly to one kind more
The batch testing load plate and load plate system of a photodetector.
Background technology
The detection or test of photodetector are related to the measurement of electrical quantities and optical quantities.The measurement of photodetector at present
Method is generally adopted by single product test load plate, and single detector to be measured is put into single product and tests load plate by tester
Upper fixation is then assembled in test system, carries out the optical quantities such as measurement and the spectral response of the electrical quantities such as Current Voltage successively
Measurement.Measurement efficiency is low, time-consuming and laborious by the way of individually test load plate, and waits for probing due to needing constantly to replace
It is measured while surveying device, therefore cannot achieve multiple detectors, is unfavorable for large scale test.Further, since using single test
Its test result relative distribution of the mode of load plate is unfavorable for carrying out the photodetector that same batch manufactures the statistical of system
Analysis.Thus, there is an urgent need to can facilitate large scale test and can facilitate the batch testing load to multiple test datas while acquisition
Disk.
Invention content
Present invention seek to address that the above technical problem, and one kind is provided and can be used for the test of photodetector rapid batch, and
It is greatly improved the batch testing load plate and load plate system of testing efficiency.To achieve the above object, the present invention provides following technology
Scheme：
A kind of load plate and load plate system for photodetector batch testing, which is characterized in that the batch testing carries
Disk is disposed with gas circuit layer and chip fixed bed from bottom to up, and the gas circuit layer and chip fixed bed are tightly connected；The gas
Road floor includes air cavity and aspirating hole, and the air cavity is connected by the aspirating hole with the external world；The chip fixed bed includes M rows N
Arrange regularly arranged chip slot and signal end metalline stake, power end metalline stake, stomata, signal end metal lead wire, power end metal
The value of lead, the tactile slot of signal output and the tactile slot of power input, the M and N are all higher than equal to 1；At the chip rooved face
Width is more than the width of its bottom, in order to being placed and taken out for photodetector to be measured；The chip slot passes through multiple stomatas
It is connected with the air cavity；The signal end metalline stake and power end metalline stake are located at opposite two of the chip trench bottom
End, and separated by the multiple stomata, and the upper surface of the two is concordant with the bottom faces of the chip slot；The signal is defeated
Go out tactile slot to be electrically connected one by one by the signal end metal lead wire and the signal end metalline stake, to by photoelectric sensing to be measured
The optical measurement amount or electrical measurement amount of device are read；Each row chip slot corresponds to M signal output and touches slot, and the test load plate is total
There is M × N number of signal output to touch slot；The corresponding M signal output of each row chip slot, which touches slot and corresponds to chip slot according to it, to exist
Sequence in the row equidistantly forms a line；The M × N number of signal output touches slot and is respectively positioned on the same of the chip fixed bed
On side, and it is regularly arranged；The power input touches slot and passes through the power end metal lead wire and power end metalline stake electricity
Gas phase connects, to provide power supply for photoelectric sensor to be measured；The power end metalline stake of each row passes through power end metal lead wire
It is interconnected on the tactile slot of the same power input for belonging to the row, M chip slot in each row chip slot shares an electricity
Slot is touched in source input, and the test load plate shares N number of power input and touches slot；N number of power input touches slot and is respectively positioned on the chip
On a fixed bed side opposite with side where the tactile slot of signal output；N number of power input touches slot and is located at same level
It arranges on face and equidistantly；The signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire,
Signal exports tactile slot and the tactile slot of power input is electrically isolated from each other, and mutually electricity is exhausted between chip fixed bed respectively
Edge；The load plate system includes batch testing load plate and signal output interface and power input interface；The signal output interface
It is equidistantly formed a line and is constituted successively by M signal output probe, is electrically insulated from each other between M signal output probe；The letter
Number output probe includes signal metal spring and signal metal contact pilotage；One end of the signal metal spring and signal metal contact pilotage
Electrical connection；One end that the signal metal spring does not connect with signal metal contact pilotage is connected with signal lead, in order to test
The output of signal；The signal metal contact pilotage of the M signal output probe can be inserted into the batch testing load plate and take up an official post simultaneously
The output of one column signal touches slot and exports tactile slot realization with signal and is electrically connected；Measure obtained electrical testing amount and optic test amount
Tactile slot, signal metal contact pilotage, signal metal spring and signal lead are exported through signal be input to computer or external analysis successively
Equipment；The power input interface include a power supply signal probe, the power supply signal probe include power Metal spring and
Power Metal contact pilotage, and one end of power Metal spring is electrically connected with power Metal contact pilotage；The power Metal spring not with
One end that power Metal contact pilotage connects is connected with power supply lead wire, in order to the input of power supply signal；The power supply signal probe
Power Metal contact pilotage is inserted into any one power input on the batch testing load plate and touches slot and touch slot realization with power input
Electrical connection；Power supply signal needed for photodetector is successively through power supply lead wire, power Metal spring, power Metal contact pilotage, electricity
Source input is touched slot and is input in batch testing load plate.
Further, it is equidistantly arranged between the M rows N row chip slot rows and row, equidistantly arranges between the column and the column
Row setting.The set-up mode is conducive to the manufacture of load plate.
Further, the M × N number of signal output touches the signal output that slot composition M rows N is arranged and touches slot array, and arranges and arrange
Between be equidistantly arranged.The set-up mode is conducive to read the rapid batch of measuring signal.
Further, the chip fixed bed is manufactured by electrically insulating material, the signal end metalline stake, power end metal
Stake, the metal material that slot is touched in the output of signal end metal lead wire, power end metal lead wire, signal and power input touches slot by easy conductive
Material manufacture.
Further, the signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire,
Slot is touched in signal output and power input is touched slot and manufactured by the metal material of easy conductive, and its periphery is by electrically insulating material packet
It wraps up in, for each other and with the electrically insulated from one another between chip fixed bed.
The invention has the beneficial effects that test can be carried out at the same time to hundreds and thousands of a photodetectors；It can be quick
The measurement for efficiently realizing the electrical quantities, optical quantities of multiple photodetectors, without constantly replacing detector to be measured；It can
The quick reading of multiple test volumes is realized with easily binding signal output probe, and then easily test volume is carried out rapidly
Statistical analysis.
Description of the drawings
With reference to embodiment and attached drawing, the present invention is described in detail, wherein：
Fig. 1 is the front view of carrying disc structure schematic diagram proposed by the invention.
Fig. 2 is the rearview of carrying disc structure schematic diagram proposed by the invention.
Fig. 3 is the cross-sectional view along AA ' in Fig. 1 (or Fig. 2).
Fig. 4 is the cross-sectional view along BB ' in Fig. 1 (or Fig. 2).
Fig. 5 is the vertical view in one single chip slot region.
Fig. 6 is the metal lead wire connection diagram corresponding to load plate either rank chip slot proposed by the invention.
Fig. 7 is the signal input output interface schematic diagram of load plate system proposed by the invention.
In figure, the meaning of each label is as follows：100- gas circuit layers；102- aspirating holes；103- air cavitys；200- chip fixed beds；
201- chip slots；Slot is touched in the output of 202- signals；203- power inputs touch slot；204- stomatas；205- signal end metalline stakes；206- electricity
Source metalline stake；207- signal end metal lead wires；208- power end metal lead wires；300- signal output interfaces；301- signals are defeated
Go out probe；302- signal metal springs；303- signal metal contact pilotages；304- signal leads；400- power input interfaces；401- electricity
Source signal probe；402- power Metal springs；403- power Metal contact pilotages；404- power supply lead wires.
Specific implementation mode
Attached drawing 1 is referred to attached drawing 6.To realize that the rapidly and efficiently measurement demand of photoelectric detector performance, the present invention provide
A kind of load plate and load plate system for photodetector batch testing, including batch testing load plate and signal output interface
(300) and power input interface (400)；The batch testing load plate is disposed with gas circuit layer (100) and chip from bottom to up
Fixed bed (200), the gas circuit layer (100) and chip fixed bed (200) are tightly connected；The gas circuit layer (100) includes air cavity
(103) it is connected with the external world by the aspirating hole (102) with aspirating hole (102), the air cavity (103)；The chip fixed bed
(200) include that (value of M and N are all higher than equal to 1 M rows N row, and in this embodiment, M and N take 3) regularly arranged chip slot
(201) and signal end metalline stake (205), power end metalline stake (206), stomata (204), signal end metal lead wire (207), electricity
Source metal lead wire (208), signal output touch slot (202) and power input touches slot (203)；At chip slot (201) surface
Width be more than its bottom width, in order to being placed and taken out for photodetector to be tested；The chip slot (201) passes through
Multiple stomatas (204) are connected with the air cavity (103)；The signal end metalline stake (205) and power end metalline stake (206) are respectively
The both ends opposite positioned at the chip slot (201) bottom, and separated by the multiple stomata (204), and the upper surface of the two
It is concordant with the bottom faces of the chip slot (201)；The signal output touches slot (202) and passes through the signal end metal lead wire
(207) it is electrically connected one by one with the signal end metalline stake (205), to by the optical measurement amount or electricity of photoelectric sensor to be measured
Measurement amount is learned to read；Each row chip slot corresponds to 3 signal outputs and touches slot (202), and the test load plate shares 3 × 3 signals
Slot (202) is touched in output；The corresponding 3 signals output of each row chip slot touches slot (202) and corresponds to chip slot (201) according to it
Sequence in the row equidistantly forms a line, and 3 × 3 signals output touches slot (202) and is respectively positioned on the chip fixed bed
(200) on the same side, and it is regularly arranged；The power input touches slot (203) and passes through the power end metal lead wire
(208) it is electrically connected with the power end metalline stake (206), to provide power supply for photoelectric sensor to be measured；And each row
Power end metalline stake (206) is interconnected to the tactile slot of the same power input for belonging to the row by power end metal lead wire (208)
(203) on, 3 chip slots in each row chip slot (201) share a power input and touch slot (203), the test
Load plate shares 3 power inputs and touches slot (203)；3 power inputs touch slot (203) and are respectively positioned on the chip fixed bed
(200) on a side opposite with side where the tactile slot (202) of signal output；3 power inputs are touched slot (203) and are located at
It arranges in same level and equidistantly；The signal end metalline stake (205), power end metalline stake (206), signal end metal draw
Line (207), power end metal lead wire (208), slot (202) is touched in signal output and power input touches slot (203) each other mutually
Electrical isolation, and the electrically insulated from one another between chip fixed bed (200) respectively；The signal output interface (300) is by 3 signals
Output probe (301) equidistantly forms a line compositions successively, and 3 signals are electrically insulated from each other between exporting probes (301)；The letter
Number output probe (301) includes signal metal spring (302) and signal metal contact pilotage (303)；The signal metal spring (302)
One end and signal metal contact pilotage (303) be electrically connected；The signal metal spring (302) not with signal metal contact pilotage (303)
The one end to connect is connected with signal lead (304), in order to the output of test signal；3 signals output probe (301)
Signal metal contact pilotage (303) can be inserted into simultaneously any column signal output on the batch testing load plate touch slot (202) and with letter
Number output touch slot (202) realize electrical connection；Obtained electrical testing amount and optic test amount is measured to touch through signal output successively
Slot (202), signal metal contact pilotage (303), signal metal spring (302) and signal lead (304) are input to computer or external
Analytical equipment；The power input interface (400) includes a power supply signal probe (401), the power supply signal probe (401)
Including power Metal spring (402) and power Metal contact pilotage (403), and one end of power Metal spring (402) and power Metal
Contact pilotage (403) is electrically connected；One end and power supply that the power Metal spring (402) does not connect with power Metal contact pilotage (403)
Lead (404) is connected, in order to the input of power supply signal；Power Metal contact pilotage (403) energy of the power supply signal probe (401)
Any one power input on the batch testing load plate is enough inserted into touch slot (203) and touch slot (203) realization electrically with power input
Connection；Power supply signal needed for photodetector is touched through power supply lead wire (404), power Metal spring (402), power Metal successively
Needle (403), power input are touched slot (203) and are input in batch testing load plate.
For convenience of the manufacture of load plate, equidistantly it is arranged between 3 row, 3 row chip slot (201) row and row, arranges and arrange
Between be equidistantly arranged.Further, for ease of being read to the rapid batch of measuring signal, 3 × 3 signals output
It touches slot (202) and constitutes the tactile slot array of signal output of 3 rows 3 row, and be equidistantly arranged between the column and the column.
To ensure that short circuit will not occur for photodetector in test, necessary electric isolution is necessary.Adoptable side
Case is that the chip fixed bed (200) is manufactured by electrically insulating material, the signal end metalline stake (205), power end metalline stake
(206), slot (202) and the tactile slot of power input are touched in signal end metal lead wire (207), power end metal lead wire (208), signal output
(203) it is manufactured by the metal material of easy conductive；Alternatively, the signal end metalline stake (205), power end metalline stake (206), letter
Number end metal lead wire (207), power end metal lead wire (208), signal output touch slot (202) and power input and touch slot (203)
It is manufactured by the metal material of easy conductive, and its periphery is wrapped up by electrically insulating material, for fixing each other and with chip
Electrically insulated from one another between layer (200).
Above-described embodiment is for ease of those skilled in the art it will be appreciated that and being described using the present invention
's.Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein
General Principle is applied in other embodiment without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments,
Those skilled in the art's announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be in this hairs
Within bright protection domain.
Claims (5)
1. a kind of load plate and load plate system for photodetector batch testing, which is characterized in that the load plate is from bottom to up
It is disposed with gas circuit layer and chip fixed bed, the gas circuit layer and chip fixed bed are tightly connected；The gas circuit layer includes gas
Chamber and aspirating hole, the air cavity are connected by the aspirating hole with the external world；The chip fixed bed includes that M rows N row are regularly arranged
Chip slot and signal end metalline stake, power end metalline stake, stomata, signal end metal lead wire, power end metal lead wire, signal
The value of the tactile slot of output and the tactile slot of power input, the M and N are all higher than equal to 1；Width at the chip rooved face is more than it
The width of bottom, in order to being placed and taken out for photodetector to be measured；The chip slot passes through multiple stomatas and the air cavity
It is connected；The signal end metalline stake and power end metalline stake are located at the opposite both ends of the chip trench bottom, and described
Multiple stomatas separate, and the upper surface of the two is concordant with the bottom faces of the chip slot；The signal output is touched slot and is passed through
The signal end metal lead wire is electrically connected one by one with the signal end metalline stake, to survey the optics of photoelectric sensor to be measured
Amount amount or electrical measurement amount are read；Each row chip slot corresponds to M signal output and touches slot, and the test load plate shares M × N number of letter
Number output touch slot；Slot is touched in the corresponding M signal output of each row chip slot, and according to it to correspond to chip slot suitable in the row
Sequence equidistantly forms a line；The M × N number of signal output is touched slot and is respectively positioned on the same side of the chip fixed bed, and
It is regularly arranged；The power input touches slot and is electrically connected by the power end metal lead wire and the power end metalline stake, uses
To provide power supply for photoelectric sensor to be measured；The power end metalline stake of each row, which is interconnected to by power end metal lead wire, to be belonged to
The same power input of the row is touched on slot, and M chip slot in each row chip slot shares a power input and touch slot,
The test load plate shares N number of power input and touches slot；N number of power input touches slot and is respectively positioned on the chip fixed bed and signal
On an opposite side of side where slot is touched in output；N number of power input is touched slot and is located in same level and equidistant
Arrangement；Slot is touched in the signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire, signal output
It is electrically isolated from each other that slot is touched with power input, and the electrically insulated from one another between chip fixed bed respectively；The load plate
System includes the batch testing load plate and signal output interface and power input interface；The signal output interface is believed by M
Number output probe equidistantly forms a line composition successively, is electrically insulated from each other between M signal output probe；The signal output is visited
Needle includes signal metal spring and signal metal contact pilotage；One end of the signal metal spring electrically connects with signal metal contact pilotage
It connects；One end that the signal metal spring does not connect with signal metal contact pilotage is connected with signal lead, in order to test signal
Output；The signal metal contact pilotage of the M signal output probe can be inserted into either rank on the batch testing load plate simultaneously to be believed
Number output touch slot and with signal export touch slot realize be electrically connected；It measures obtained electrical testing amount and optic test amount passes through successively
Signal output touches slot, signal metal contact pilotage, signal metal spring and signal lead and is input to computer or external analytical equipment；Institute
It includes a power supply signal probe to state power input interface, and the power supply signal probe includes power Metal spring and power Metal
Contact pilotage, and one end of power Metal spring is electrically connected with power Metal contact pilotage；The power Metal spring not with power Metal
One end that contact pilotage connects is connected with power supply lead wire, in order to the input of power supply signal；The power Metal of the power supply signal probe
Contact pilotage is inserted into any one power input on the batch testing load plate and touches slot and touch slot realization electrical connection with power input；
Power supply signal needed for photodetector touches slot through power supply lead wire, power Metal spring, power Metal contact pilotage, power input successively
It is input in batch testing load plate.
2. a kind of load plate and load plate system, feature for photodetector batch testing according to claim 1 exists
It is equidistantly arranged between, M rows N row chip slot rows and row, is equidistantly arranged between the column and the column.
3. a kind of load plate and load plate system, feature for photodetector batch testing according to claim 1 exists
In slot array is touched in the signal output that slot composition M rows N row are touched in the M × N number of signal output, and equidistantly arranges between the column and the column
Setting.
4. a kind of load plate and load plate system, feature for photodetector batch testing according to claim 1 exists
It is manufactured by electrically insulating material in the chip fixed bed, the signal end metalline stake, power end metalline stake, signal end metal draw
Line, power end metal lead wire, slot is touched in signal output and power input is touched slot and manufactured by the metal material of easy conductive.
5. a kind of load plate and load plate system, feature for photodetector batch testing according to claim 1 exists
In, the signal end metalline stake, power end metalline stake, signal end metal lead wire, power end metal lead wire, signal output touch slot and
Power input is touched slot and is manufactured by the metal material of easy conductive, and its periphery is wrapped up by electrically insulating material, between being used for
And with the electrically insulated from one another between chip fixed bed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610601770.0A CN106153094B (en) | 2016-07-27 | 2016-07-27 | A kind of load plate and load plate system for photodetector batch testing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610601770.0A CN106153094B (en) | 2016-07-27 | 2016-07-27 | A kind of load plate and load plate system for photodetector batch testing |
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| CN106153094A CN106153094A (en) | 2016-11-23 |
| CN106153094B true CN106153094B (en) | 2018-08-07 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109631974B (en) * | 2018-12-25 | 2021-01-08 | 西南技术物理研究所 | Quadrant class photoelectric detector circular telegram vibration test frock |
| CN110095143B (en) * | 2019-06-04 | 2020-02-18 | 哈尔滨理工大学 | Reliability detection equipment of groove type photoelectric sensor |
| CN113576502B (en) * | 2021-07-12 | 2024-03-19 | 上海奕瑞光电子科技股份有限公司 | Test fixture, test device and test method for batch test of detectors |
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| CN105371886A (en) * | 2015-10-28 | 2016-03-02 | 长春理工大学 | Embedded photoelectric and spectral feature integrated tester for photoelectric sensor |
| CN205898177U (en) * | 2016-07-27 | 2017-01-18 | 武汉京邦科技有限公司 | A carry dish and carry dish system for photoelectric detector tests in batches |
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| DE3123184A1 (en) * | 1980-06-13 | 1982-04-08 | Kabushiki Kaisha Toyota Chuo Kenkyusho, Nagakute, Aichi | METHOD AND DEVICE FOR DETECTING EXTERNAL ERRORS ON A ROUND COMPONENT |
| CN201488869U (en) * | 2009-08-21 | 2010-05-26 | 北京波联汇成科技有限公司 | Test board for micro electronic mechanical system chip for photoelectric device |
| CN204286680U (en) * | 2014-09-17 | 2015-04-22 | 北京必创科技有限公司 | A kind of pressure transducer batch debugging device |
| CN204976418U (en) * | 2015-07-29 | 2016-01-20 | 龙微科技无锡有限公司 | Pressure sensor is test fixture in batches |
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| CN205898177U (en) * | 2016-07-27 | 2017-01-18 | 武汉京邦科技有限公司 | A carry dish and carry dish system for photoelectric detector tests in batches |
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| CN106153094A (en) | 2016-11-23 |
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