CN201477620U - IC card packaging part - Google Patents
IC card packaging part Download PDFInfo
- Publication number
- CN201477620U CN201477620U CN 200920144132 CN200920144132U CN201477620U CN 201477620 U CN201477620 U CN 201477620U CN 200920144132 CN200920144132 CN 200920144132 CN 200920144132 U CN200920144132 U CN 200920144132U CN 201477620 U CN201477620 U CN 201477620U
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- CN
- China
- Prior art keywords
- card
- gold
- card body
- row
- plated
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- Expired - Fee Related
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Abstract
The utility model relates to an IC card packaging part, which comprises a card body and a plastic package body. A lower left corner of the card body is provided with a bevel angle. Two opposite right angles on the front surface of the card body are provided with center holes. The back of the card body is provided with two rows of gold-plated convex contact points. Each row consists of four gold-plated convex contact points. The gold-plated convex contact points are surrounded by the plastic package body. The gold-plated convex contact points are higher by 0.07 to 0.10mm than the plastic package body. A base material of the IC card body is a copper alloy lead frame. The lead frame adopts a multi-row matrix mode. The material has a thickness between 0.127mm and 0.15mm. The utility model has small thickness of the card body, low cost and simple, convenient and reasonable structure, adopts the environment-friendly packaging, avoids plating, is favorable for environmental protection and the health of the user, and uses the lead frame adopting the multi-row matrix mode, wherein the material has the thickness between 0.127mm and 0.15mm and is thinner by 0.023 to 0.06mm than the common copper-coated PCB; the production efficiency of the material is higher than that of the copper-coated PCB; and the packaging field is also higher.
Description
Technical field
The utility model relates to electronic information Element of automatic control manufacturing technology field, refers more particularly to the integrated circuit package of a kind of IC-card chip, specifically a kind of IC-card packaging part.
Background technology
((Integrated circuik Corde) is called for short IC-card is a new technology importing China in recent years into to novel integrated circuit card.It is that the integrated circuit (IC) chip with functions such as storage, computings is compressed on the plastic sheet, makes it become the carrier of the carrier data of energy storage, reprinting, transmission, deal with data.IC-card is by the integrated circuit canned data in the card, and magnetic card is by the magnetic force recorded information in blocking.The cost of IC-card is generally than magnetic card height, but capacity is big, and volume is little, and is in light weight, and antijamming capability is strong, be easy to carry, but one card for multiple uses is easy to use, and confidentiality is better, long service life.The general employing of IC-card covered copper pcb board material, material thickness 0.21mm, and IC-card body thickness 0.85mm, relative material and cost of manufacture are all higher, and quantity is few on every substrate, and production efficiency is low relatively, and there is the hidden danger of coming off the protruding contact of copper of covering on the pcb board.
The utility model content
The utility model will solve in the past Contact Type Ic Card exactly and have problems such as material cost height, production efficiency be low; a kind of employing environmental protection encapsulation is provided; and exempt and electroplating, help the IC-card packaging part of the healthy a kind of contact cheaply of environmental protection and user.
A kind of IC-card packaging part comprises card body, plastic-sealed body, it is characterized in that:
Establish an oblique angle in the card body lower left corner;
Positive two the relative right angles of described card body are provided with centre hole;
The described card body back side is provided with the gold-plated protruding contact of two rows, and each is made up of every row 4 gold-plated protruding contacts, is surrounded by plastic-sealed body between the described gold-plated protruding contact, and gold-plated protruding contact exceeds plastic-sealed body 0.07mm～0.10mm;
Described IC-card body sill is a copper alloy lead wire frame, and lead frame adopts many row's matrix forms, material thickness 0.127mm～0.15mm.
Above-mentioned oblique angle is 3 * 3mm; The line-spacing of the gold-plated protruding contact of two rows, the IC-card back side is 7.62 ± 0.50mmBSC, and the spacing between four gold-plated protruding contacts of every row is 2.54 ± 0.20mmBSC.
First kind of embodiment of the present utility model is to have 2 grooves on the limit of top, described oblique angle Width, and all the other every limit has 4 grooves.
Described groove is the groove of 1/4 circle.
The four edges that second kind of embodiment of the present utility model is described card body is straight line.
The utility model IC-card body thickness is little; price is low; employing environmental protection encapsulation, structure is simple and direct rationally, exempts and electroplating; help environmental protection and the user is healthy; and use many row's matrix frames, material thickness 0.127mm～0.15mm is than the common thin 0.023mm～0.06mm of copper pcb board that covers; the production efficiency ratio covers copper pcb board height, and the encapsulation yield is also high.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the structure synoptic diagram;
Fig. 3 is second kind of embodiment synoptic diagram of the utility model;
Fig. 4 is second kind of embodiment schematic rear view.
Embodiment
The utility model IC-card profile is generally 25mm * 15mm * 0.75mm, as required the adjustable size size.IC-card body sill is a copper alloy lead wire frame, and lead frame adopts many row's matrix forms, material thickness 0.127mm～0.15mm.In the card body lower left corner one oblique angle 1 is arranged, the card body has centre hole 3 on positive two relative right angles; The front remainder is a plastic-sealed body 4.It is gold-plated protruding contacts 5 of 7.62BS that there are two seniority among brothers and sisters distances at the IC-card back side, every row has the gold-plated protruding contact 5 of four of spacing 2.54mmBSC, isolated by plastic-sealed body 4 between the gold-plated protruding contact 5, back side remainder is a plastic-sealed body 4, and gold-plated protruding contact 5 is than plastic-sealed body 4 high 0.07mm～0.11mm.
First kind of embodiment of the present utility model is the groove 2 that has 2 1/4 circles on the minor face of the Width that links to each other with oblique angle 1, and all the other every limits have the groove 2 of 4 1/4 circles, and more this embodiment adopts the punching press type to arrange NiPdAu (NiPdAu) and electroplate framework.
As shown in Figure 3, second kind of embodiment of the present utility model will block the body four edges exactly and all be designed to straight flange, not have groove design, and all the other are with first kind of embodiment, and this embodiment adopts etch pattern matrix form NiPdAu (NiPdAu) to electroplate framework.
The utility model IC-card adopts CEL9220 and the encapsulation of similar environmental protection plastic packaging material.
Claims (7)
1. an IC-card packaging part comprises card body, plastic-sealed body, it is characterized in that:
Establish an oblique angle (1) in the card body lower left corner;
Positive two the relative right angles of described card body are provided with centre hole (3);
The described card body back side is provided with two row gold-plated protruding contacts (5), and every row has 4 gold-plated protruding contacts (5) to form, and is surrounded by plastic-sealed body (4) between the described gold-plated protruding contact (5), and gold-plated protruding contact (5) exceeds plastic-sealed body (4) 0.07mm～0.10mm;
Described IC-card structure base board material is a NiPdAu electroplate lead wire framework, and lead frame adopts many row's matrix forms, material thickness 0.127mm～0.15mm.
2. a kind of IC-card packaging part according to claim 1 is characterized in that described oblique angle (1) is 3 * 3mm, and the line-spacing of the two gold-plated protruding contacts of row (5), the IC-card back side is 7.62 ± 0.50mm BSC; Spacing between four gold-plated protruding contacts of every row (5) is 2.54 ± 0.20mmBSC.
3. a kind of IC-card packaging part according to claim 1 is characterized in that having 2 grooves (2) on the limit of described oblique angle (1) top Width, and all the other every limit has 4 grooves (2).
4. a kind of IC-card packaging part according to claim 3 is characterized in that described groove (2) is 1/4 circular groove.
5. according to claim 1 or 3 described a kind of IC-card packaging parts, the many rows matrix frame that it is characterized in that described IC-card body is many row punchings type NiPdAu electroplate lead wire framework.
6. a kind of IC-card packaging part according to claim 1 is characterized in that the four edges of described card body is straight line.
7. according to claim 1 or 6 described a kind of IC-card packaging parts, the many rows matrix frame that it is characterized in that described card body is an etching haplotype NiPdAu electroplate lead wire framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920144132 CN201477620U (en) | 2009-05-18 | 2009-05-18 | IC card packaging part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920144132 CN201477620U (en) | 2009-05-18 | 2009-05-18 | IC card packaging part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201477620U true CN201477620U (en) | 2010-05-19 |
Family
ID=42413875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920144132 Expired - Fee Related CN201477620U (en) | 2009-05-18 | 2009-05-18 | IC card packaging part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201477620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106096703A (en) * | 2016-06-03 | 2016-11-09 | 上海伊诺尔信息技术有限公司 | Gapless contact smart card chip module, smart card and manufacture method thereof |
-
2009
- 2009-05-18 CN CN 200920144132 patent/CN201477620U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106096703A (en) * | 2016-06-03 | 2016-11-09 | 上海伊诺尔信息技术有限公司 | Gapless contact smart card chip module, smart card and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20160518 |