CN106096703A - Gapless contact smart card chip module, smart card and manufacture method thereof - Google Patents
Gapless contact smart card chip module, smart card and manufacture method thereof Download PDFInfo
- Publication number
- CN106096703A CN106096703A CN201610390638.XA CN201610390638A CN106096703A CN 106096703 A CN106096703 A CN 106096703A CN 201610390638 A CN201610390638 A CN 201610390638A CN 106096703 A CN106096703 A CN 106096703A
- Authority
- CN
- China
- Prior art keywords
- contact
- dielectric substance
- substance layer
- chip module
- smart card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000126 substance Substances 0.000 claims abstract description 56
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims 1
- 238000011109 contamination Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention provides a kind of gapless contact smart card chip module, smart card and preparation method thereof, described gapless contact smart card chip module includes chip module body and multiple contact, described chip module body surface has a dielectric substance layer, the plurality of contact embeds in described dielectric substance layer, and adjacent two contacts are isolated by described dielectric substance layer.It is an advantage of the current invention that described contact embeds in described dielectric substance layer so that contact is more firm, and difficult drop-off, module is more solid, is unlikely to deform, and decreases the short circuit problem caused because of environment, and improves contamination resistance.
Description
Technical field
The present invention relates to field of intelligent cards, particularly relate to a kind of gapless contact smart card chip module, smart card and
Manufacture method.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is the most increasingly
Abundant, and the requirement for product applications is harsher, and this just requires that integrated antenna package enterprise can develop
Novel packing forms coordinates new demand.Such as in Intelligent card package field, domestic and need that foreign market is to smart card
The amount of asking is the biggest, and at present, smart card industry just develops towards the route of technological innovation, and new technique continues to bring out, novel manufacture
Technology also gets more and more, and many old manufacturing technologies are also updated and strengthen, thus to the function of smart card and carrying of performance
Rise requirement the most inevitable.
Seeing Fig. 1, existing smart card directly makes draw-in groove in card body 1 when making, and is embedded in by chip module 2
In the draw-in groove of card body 1.Seeing Fig. 2, chip module 2 surface configuration has as chip module 2 many with the medium of external contact
Individual contact 3, the plurality of contact 3 is set directly at the surface of described chip module 2, and do not support between adjacent contacts 3 or
Spacer structure exists, and after described chip module 2 embeds in described draw-in groove, sees Fig. 1, and the gap 21 between adjacent contacts 3 depends on
So do not support or spacer structure.
Smart card in use, often has the situation such as bending, kinking to occur, and owing to not propping up between adjacent contacts 3
Support or spacer structure exist so that side, contact 3 does not has fixed structure to fix described contact 3 from side, and contact 3 can be caused to deform
Even come off；Meanwhile, the pollutant in environment etc. can enter two adjacent contacts 3 directly, makes to be prone between two adjacent contacts 3
Short circuit, causes card to lose efficacy.
Summary of the invention
The technical problem to be solved be to provide a kind of gapless contact smart card chip module, smart card and
Its manufacture method, it can make contact more firm, and difficult drop-off module is more solid, is unlikely to deform, and can reduce because environment is made
The short circuit problem become, and contamination resistance can be improved.
In order to solve the problems referred to above, the invention provides a kind of gapless contact smart card chip module, including chip dies
Block body and multiple contact, described chip module body surface has a dielectric substance layer, and the plurality of contact embeds described dielectric
In matter layer, adjacent two contacts are isolated by described dielectric substance layer.
Further, described dielectric substance layer wraps up the side of each described contact.
Further, the upper surface of described contact is concordant with the upper surface of described dielectric substance layer.
The present invention also provides for a kind of smart card, including card body and be embedded in the intrinsic chip module of described card, described
Chip module includes chip module body and multiple contact, and described chip module body surface has a dielectric substance layer, described many
Individual contact embeds in described dielectric substance layer, and adjacent two contacts are isolated by described dielectric substance layer.
Further, described dielectric substance layer wraps up the side of each described contact.
Further, the upper surface of described contact is concordant with the upper surface of described dielectric substance layer.
Further, described card body is provided with a draw-in groove, and described chip module is arranged in described draw-in groove.
The present invention also provides for the manufacture method of a kind of gapless contact smart card chip module, comprises the steps: to be formed
Multiple contacts；Forming dielectric substance layer, multiple contacts embed in described dielectric substance layer, adjacent two contacts by described dielectric substance layer every
From；Form chip module body on the surface of the most described contact of described dielectric layer, thus form described chip module.
Further, the method forming chip module body comprises the steps: in the most described contact of described dielectric substance layer
Lower surface formed via, described via runs through described dielectric substance layer, and corresponding each contact；Chip is fixed on described dielectric
The lower surface of the most described contact of matter layer；Use lead-in wire through described via by the weld pad of described chip and described each contact pair
Should electrically connect；Use chip and lead-in wire described in plastic-sealed body plastic packaging.
Further, the upper surface of described contact is concordant with the upper surface of described dielectric substance layer.
It is an advantage of the current invention that described contact embeds in described dielectric substance layer so that contact is more firm, difficult drop-off,
Module is more solid, is unlikely to deform, and decreases the short circuit problem caused because of environment, and improves contamination resistance.
Accompanying drawing explanation
Fig. 1 and Fig. 2 is the structural representation of existing intelligent card chip and chip module；
Fig. 3 and Fig. 4 is the structural representation of gapless contact of the present invention smart card chip module；
Fig. 5 is the step schematic diagram of the manufacture method of gapless contact of the present invention smart card chip module；
Fig. 6 A～Fig. 6 C is the process chart of the manufacture method of gapless contact of the present invention smart card chip module；
Fig. 7 is the floor map of contact distribution；
Fig. 8 A～Fig. 8 F is the process chart of the manufacture method of described smart card.
Detailed description of the invention
Gapless contact smart card chip module, smart card and the manufacture method the thereof below in conjunction with the accompanying drawings present invention provided
Detailed description of the invention elaborate.
See Fig. 3 and Fig. 4, gapless contact of the present invention smart card chip module include chip module body 31 and multiple touch
Point 3, described contact 3 uses metal material to make, such as copper.The structure of described chip module body 31 and contact 3 is this area
Existing structure, those skilled in the art can obtain from the prior art.
The surface of described chip module body 31 has a dielectric substance layer 33, and it is described that described dielectric substance layer 33 can be used for protection
Chip module body 31 fixing described contact 3.The plurality of contact 3 embeds in described dielectric substance layer 33, the most each described tactile
Point 3 is fixed by described dielectric substance layer 33, thus bend at smart card, the deformation such as kinking time, described dielectric substance layer 33 can be prevented
Only contact 3 deforms and comes off.Adjacent two contacts 3 are isolated by described dielectric substance layer 33, have Jie between two the most adjacent contacts 3
Electricity matter layer 33, can prevent the pollutant in environment from entering between adjacent two contacts 3, cause short circuit.Cause smart card disabled.Preferably
Ground, described dielectric substance layer 33 wraps up the side of each described contact 3, the upper surface of described contact 3 and described dielectric substance layer 33
Upper surface is concordant.The most preferably to fix and to protect described contact 3.Those skilled in the art can obtain from the prior art
The material of described dielectric substance layer 33, such as, the macromolecular material such as epoxy resin.
The present invention also provides for the manufacture method of a kind of gapless contact smart card chip module, sees Fig. 5, described making side
Method comprises the steps: step S50, forms multiple contact；Step S42, pressing dielectric substance layer, multiple contacts embed described dielectric
In matter layer, adjacent two contacts are isolated by described dielectric substance layer；Step S44, on the surface of the most described contact of described dielectric layer
Form chip module body, thus form described chip module.
Fig. 6 A～Fig. 6 C is the process chart of the manufacture method of gapless contact of the present invention smart card chip module.
See step S540 and Fig. 6 A, form multiple contact 3.In this embodiment, the multiple contact of described formation 3
Method be copper strips etching, Fig. 7 show the floor map of described contact 3 distribution, forms the method for described contact 3 and described
The arrangement of contact 3 is prior art, and those skilled in the art can obtain from the prior art.
Seeing step S52 and Fig. 6 B, form dielectric substance layer 33, multiple contacts 3 embed in described dielectric substance layer 33, and adjacent two
Contact 3 is isolated by described dielectric substance layer 33.In this embodiment, the method forming described dielectric substance layer 33 can be pressure
Closing, pressing dielectric medium forms dielectric substance layer 33, by the method for described pressing, described dielectric medium can be made to wrap up each described contact
3, thus be effectively prevented described contact 3 and come off.
See step S54 and Fig. 6 C, form chip module body on the surface of the described the most described contact of dielectric layer 33 3
31, thus form described chip module 5.
The present invention provides a kind of method forming described chip module body 31, and certainly, those skilled in the art also can adopt
Forming described chip module body 31 by the method for prior art, this is not defined by the present invention.
In this embodiment, the method forming described chip module body 31 comprises the steps:
Seeing Fig. 8 A, the lower surface in the described the most described contact of dielectric substance layer 33 3 forms via 331, described via 331
Run through described dielectric substance layer 33, and corresponding each contact 3.
See Fig. 8 B, chip 332 is fixed on the lower surface of the described the most described contact of dielectric substance layer 33 3.This area skill
Art personnel can obtain the fixing method of described chip 332 from the prior art.
See Fig. 8 C, use lead-in wire 333 to pass described via 331, by the weld pad of described chip 332 and described each contact
3 corresponding electrical connections.Those skilled in the art can obtain the method for described lead-in wire 333 welding from the prior art.
See Fig. 8 D, use chip 332 described in plastic-sealed body 334 plastic packaging and lead-in wire 333, form described chip module body
31.The method that those skilled in the art can obtain described plastic packaging from the prior art.
Further, in order to be embedded by described chip module 5 in the card body 4 of described smart card, Fig. 8 E is seen, at described card
Arranging a draw-in groove 41 in body 4, see Fig. 8 F, described chip module 5 embeds in described draw-in groove 41.Preferably, described contact 3
Upper surface is concordant with the upper surface of described card body 4, to avoid described contact while ensureing the contact performance of described contact 3
3 suffer damage.
Seeing Fig. 8 F, a kind of smart card of the present invention includes card body 4 and is embedded in the chip module 5 in described card body 4,
The structure of described chip module 5 is identical with the structure of chip module above.Described card body 4 is provided with a draw-in groove 41 and (sees
Fig. 8 E), described chip module 5 is arranged in described draw-in groove 41.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a gapless contact smart card chip module, including chip module body and multiple contact, it is characterised in that described
Chip module body surface has a dielectric substance layer, and the plurality of contact embeds in described dielectric substance layer, and adjacent two contacts are by institute
State dielectric substance layer isolation.
Gapless contact the most according to claim 1 smart card chip module, it is characterised in that described dielectric substance layer wraps up
The side of each described contact.
Gapless contact the most according to claim 1 smart card chip module, it is characterised in that the upper surface of described contact
Concordant with the upper surface of described dielectric substance layer.
4. a smart card, including card body and be embedded in the intrinsic chip module of described card, it is characterised in that described chip
Module includes that chip module body and multiple contact, described chip module body surface have a dielectric substance layer, the plurality of tactile
Point embeds in described dielectric substance layer, and adjacent two contacts are isolated by described dielectric substance layer.
Smart card the most according to claim 4, it is characterised in that described dielectric substance layer wraps up the side of each described contact
Face.
Smart card the most according to claim 4, it is characterised in that the upper surface of described contact is upper with described dielectric substance layer
Flush.
Smart card the most according to claim 4, it is characterised in that described card body is provided with a draw-in groove, described chip dies
Block is arranged in described draw-in groove.
8. the manufacture method of a gapless contact smart card chip module, it is characterised in that comprise the steps:
Form multiple contact；
Forming dielectric substance layer, multiple contacts embed in described dielectric substance layer, and adjacent two contacts are isolated by described dielectric substance layer；
Form chip module body on the surface of the most described contact of described dielectric layer, thus form described chip module.
Manufacture method the most according to claim 8, it is characterised in that the method forming chip module body includes walking as follows
Rapid:
Lower surface in the most described contact of described dielectric substance layer forms via, and described via runs through described dielectric substance layer, and right
Should each contact；
Chip is fixed on the lower surface of the most described contact of described dielectric substance layer；
Use lead-in wire through described via by corresponding with described each contact for the weld pad of described chip electrical connection；
Use chip and lead-in wire described in plastic-sealed body plastic packaging.
Manufacture method the most according to claim 8, it is characterised in that the upper surface of described contact and described dielectric substance layer
Upper surface concordant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390638.XA CN106096703B (en) | 2016-06-03 | 2016-06-03 | Gapless contact smart card chip module, smart card and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610390638.XA CN106096703B (en) | 2016-06-03 | 2016-06-03 | Gapless contact smart card chip module, smart card and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106096703A true CN106096703A (en) | 2016-11-09 |
| CN106096703B CN106096703B (en) | 2020-08-14 |
Family
ID=57447578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610390638.XA Active CN106096703B (en) | 2016-06-03 | 2016-06-03 | Gapless contact smart card chip module, smart card and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN106096703B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106650903A (en) * | 2017-01-20 | 2017-05-10 | 上海伊诺尔信息技术有限公司 | All-aluminum intelligent card module and manufacturing method thereof |
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|---|---|---|---|---|
| CN2238456Y (en) * | 1995-07-25 | 1996-10-23 | 许维克 | IS07816 standard plane contact key IC card |
| FR2744269A1 (en) * | 1996-01-30 | 1997-08-01 | Solaic Sa | Smart card and its method of fabrication |
| EP0810547A1 (en) * | 1996-05-24 | 1997-12-03 | Giesecke & Devrient GmbH | Method for manufacturing a datacarrier in cardform |
| DE19701163A1 (en) * | 1997-01-15 | 1998-07-16 | Siemens Ag | Electrical circuit with contact track layer especially for chip card |
| US6288905B1 (en) * | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
| US20010031581A1 (en) * | 1999-05-05 | 2001-10-18 | Thomas & Betts International, Inc. | Smart card reader for elevated placement relative to a printed circuit board |
| CN101467503A (en) * | 2006-06-08 | 2009-06-24 | 皇家飞利浦电子股份有限公司 | Submount for electronic components |
| CN201477620U (en) * | 2009-05-18 | 2010-05-19 | 天水华天科技股份有限公司 | IC card packaging part |
| CN201576299U (en) * | 2009-06-15 | 2010-09-08 | 中国人民解放军第二军医大学 | Large-capacity medical information card |
| CN201689452U (en) * | 2010-06-02 | 2010-12-29 | 北京握奇数据系统有限公司 | Telecommunication smart card with antenna |
| JP2014089566A (en) * | 2012-10-30 | 2014-05-15 | Misawa Homes Co Ltd | Water content meter, and building with built-in water content meter |
| CN104881701A (en) * | 2015-06-11 | 2015-09-02 | 飞天诚信科技股份有限公司 | Intelligent card and manufacturing method thereof |
-
2016
- 2016-06-03 CN CN201610390638.XA patent/CN106096703B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2238456Y (en) * | 1995-07-25 | 1996-10-23 | 许维克 | IS07816 standard plane contact key IC card |
| FR2744269A1 (en) * | 1996-01-30 | 1997-08-01 | Solaic Sa | Smart card and its method of fabrication |
| EP0810547A1 (en) * | 1996-05-24 | 1997-12-03 | Giesecke & Devrient GmbH | Method for manufacturing a datacarrier in cardform |
| DE19701163A1 (en) * | 1997-01-15 | 1998-07-16 | Siemens Ag | Electrical circuit with contact track layer especially for chip card |
| US6288905B1 (en) * | 1999-04-15 | 2001-09-11 | Amerasia International Technology Inc. | Contact module, as for a smart card, and method for making same |
| US20010031581A1 (en) * | 1999-05-05 | 2001-10-18 | Thomas & Betts International, Inc. | Smart card reader for elevated placement relative to a printed circuit board |
| CN101467503A (en) * | 2006-06-08 | 2009-06-24 | 皇家飞利浦电子股份有限公司 | Submount for electronic components |
| CN201477620U (en) * | 2009-05-18 | 2010-05-19 | 天水华天科技股份有限公司 | IC card packaging part |
| CN201576299U (en) * | 2009-06-15 | 2010-09-08 | 中国人民解放军第二军医大学 | Large-capacity medical information card |
| CN201689452U (en) * | 2010-06-02 | 2010-12-29 | 北京握奇数据系统有限公司 | Telecommunication smart card with antenna |
| JP2014089566A (en) * | 2012-10-30 | 2014-05-15 | Misawa Homes Co Ltd | Water content meter, and building with built-in water content meter |
| CN104881701A (en) * | 2015-06-11 | 2015-09-02 | 飞天诚信科技股份有限公司 | Intelligent card and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106650903A (en) * | 2017-01-20 | 2017-05-10 | 上海伊诺尔信息技术有限公司 | All-aluminum intelligent card module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106096703B (en) | 2020-08-14 |
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Effective date of registration: 20200327 Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Applicant after: Shanghai Inore Information Electronics Co.,Ltd. Address before: 201100 Shanghai city Minhang District Su Zhaolu No. 1628 Building 2 room 1001 Applicant before: SHANGHAI ETERNAL INFORMATION TECHNOLOGY Co.,Ltd. |
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Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Lianxin (Shanghai) Microelectronics Technology Co.,Ltd. Country or region after: China Address before: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee before: Shanghai Inore Information Electronics Co.,Ltd. Country or region before: China |