CN106096703B

CN106096703B - Gapless contact smart card chip module, smart card and manufacturing method thereof

Info

Publication number: CN106096703B
Application number: CN201610390638.XA
Authority: CN
Inventors: 高洪涛; 陆美华; 刘玉宝
Original assignee: Shanghai Inore Information Electronics Co ltd
Current assignee: Shanghai Inore Information Electronics Co., Ltd.
Priority date: 2016-06-03
Filing date: 2016-06-03
Publication date: 2020-08-14
Anticipated expiration: 2036-06-03
Also published as: CN106096703A

Abstract

The invention provides a gapless contact intelligent card chip module, an intelligent card and a manufacturing method thereof. The invention has the advantages that the contact is embedded into the dielectric layer, so that the contact is firmer and is not easy to fall off, the module is firmer and is not easy to deform, the problem of short circuit caused by the environment is reduced, and the pollution resistance is improved.

Description

Gapless contact smart card chip module, smart card and manufacturing method thereof

Technical Field

The invention relates to the field of smart cards, in particular to a gapless contact smart card chip module, a smart card and a manufacturing method thereof.

Background

With the continuous progress of the integrated circuit packaging technology, the integration level of the integrated circuit is gradually improved, the functions are more and more abundant, and the requirements for the application field of the product are more and more demanding, which requires that the integrated circuit packaging enterprises can develop a novel packaging form to match with new requirements. For example, in the field of smart card packaging, the demand of domestic and foreign markets for smart cards is very large, at present, the smart card industry is developing towards the line of technical innovation, new technologies are emerging continuously, new manufacturing technologies are increasing, many old manufacturing technologies are improving and strengthening continuously, and thus the requirements for improving the functions and performance of smart cards cannot be avoided.

Referring to fig. 1, in the conventional smart card, a card slot is directly formed in a card body 1 during manufacturing, and a chip module 2 is embedded in the card slot of the card body 1. Referring to fig. 2, a plurality of contacts 3 serving as media for the chip module 2 to contact with the outside are disposed on a surface of the chip module 2, the plurality of contacts 3 are directly disposed on the surface of the chip module 2, and no supporting or spacing structure exists between adjacent contacts 3, and when the chip module 2 is embedded in the card slot, referring to fig. 1, a gap 21 between adjacent contacts 3 still does not exist.

In the use process of the smart card, bending, kinking and the like often occur, and because no support or interval structure exists between adjacent contacts 3, the contact 3 is fixed from the side surface without a fixed structure on the side surface of the contact 3, so that the contact 3 is deformed or even falls off; meanwhile, pollutants and the like in the environment can directly enter the two adjacent contacts 3, so that the two adjacent contacts 3 are easy to be short-circuited, and the card fails.

Disclosure of Invention

The invention aims to solve the technical problem of providing a gapless contact intelligent card chip module, an intelligent card and a manufacturing method thereof, which can ensure that a contact is firmer, a module which is not easy to fall off is firmer and not easy to deform, can reduce the problem of short circuit caused by the environment, and can improve the pollution resistance.

In order to solve the above problems, the present invention provides a gapless contact smart card chip module, which includes a chip module body and a plurality of contacts, wherein the surface of the chip module body has a dielectric layer, the plurality of contacts are embedded in the dielectric layer, and two adjacent contacts are separated by the dielectric layer.

Further, the dielectric layer wraps the side of each of the contacts.

Further, the upper surface of the contact is flush with the upper surface of the dielectric layer.

The invention also provides an intelligent card, which comprises a card body and a chip module embedded in the card body, wherein the chip module comprises a chip module body and a plurality of contacts, the surface of the chip module body is provided with a dielectric layer, the plurality of contacts are embedded in the dielectric layer, and two adjacent contacts are isolated by the dielectric layer.

Further, the dielectric layer wraps the side of each of the contacts.

Further, the card body is provided with a clamping groove, and the chip module is arranged in the clamping groove.

The invention also provides a manufacturing method of the gapless contact intelligent card chip module, which comprises the following steps: forming a plurality of contacts; forming a dielectric layer, embedding a plurality of contacts in the dielectric layer, and isolating two adjacent contacts by the dielectric layer; and forming a chip module body on the surface of the dielectric layer, which faces away from the contact, so as to form the chip module.

Further, the method of forming the chip module body includes the steps of: forming a via hole on the lower surface of the dielectric layer opposite to the contact, wherein the via hole penetrates through the dielectric layer and corresponds to each contact; fixing a chip on the lower surface of the dielectric layer, which faces away from the contact; a lead penetrates through the through hole to correspondingly and electrically connect the welding pad of the chip with each contact; and plastically packaging the chip and the lead by using a plastic package body.

The invention has the advantages that the contact is embedded into the dielectric layer, so that the contact is firmer and is not easy to fall off, the module is firmer and is not easy to deform, the problem of short circuit caused by the environment is reduced, and the pollution resistance is improved.

Drawings

FIGS. 1 and 2 are schematic structural diagrams of a conventional smart card chip and a chip module;

FIGS. 3 and 4 are schematic structural views of a gapless contact smart card chip module according to the present invention;

FIG. 5 is a schematic illustration of the steps of the method of making a gapless contact smart card chip module of the present invention;

FIGS. 6A-6C are process flow diagrams of a method of making a gapless contact smart card chip module in accordance with the present invention;

FIG. 7 is a schematic plan view of a contact distribution;

fig. 8A to 8F are process flow diagrams of the manufacturing method of the smart card.

Detailed Description

The following describes in detail specific embodiments of the gapless contact smart card chip module, the smart card and the method for manufacturing the same according to the present invention with reference to the accompanying drawings.

Referring to fig. 3 and 4, the gapless contact smart card chip module of the present invention includes a chip module body 31 and a plurality of contacts 3, wherein the contacts 3 are made of a metal material, such as copper. The structure of the chip module body 31 and the contacts 3 is a structure existing in the field, and those skilled in the art can obtain the structure from the prior art.

The surface of the chip module body 31 has a dielectric layer 33, and the dielectric layer 33 can be used for protecting the chip module body 31 and fixing the contacts 3. The plurality of contacts 3 are embedded in the dielectric layer 33, that is, each contact 3 is fixed by the dielectric layer 33, so that the dielectric layer 33 can prevent the contact 3 from being deformed and falling off when the smart card is deformed by bending, kinking and the like. Two adjacent contacts 3 are separated by the dielectric layer 33, that is, the dielectric layer 33 is arranged between two adjacent contacts 3, so that pollutants in the environment can be prevented from entering between two adjacent contacts 3 to cause short circuit. Resulting in the failure of the smart card. Preferably, the dielectric layer 33 wraps the side surface of each contact 3, and the upper surface of each contact 3 is flush with the upper surface of the dielectric layer 33. To further better secure and protect the contacts 3. The material of the dielectric layer 33, such as a polymer material such as epoxy resin, can be obtained by those skilled in the art.

The invention also provides a manufacturing method of the gapless contact intelligent card chip module, and referring to fig. 5, the manufacturing method comprises the following steps: step S50, forming a plurality of contacts; step S42, pressing the dielectric layer, embedding a plurality of contacts into the dielectric layer, and isolating two adjacent contacts by the dielectric layer; step S44, forming a chip module body on the surface of the dielectric layer opposite to the contact, thereby forming the chip module.

Fig. 6A-6C are process flow diagrams of methods of fabricating gapless contact smart card chip modules in accordance with the present invention.

Referring to step S540 and fig. 6A, a plurality of contacts 3 are formed. In this embodiment, the method for forming the plurality of contacts 3 is copper strip etching, fig. 7 is a schematic plan view of the distribution of the contacts 3, and the method for forming the contacts 3 and the arrangement of the contacts 3 are known in the art and can be obtained by those skilled in the art.

Referring to step S52 and fig. 6B, a dielectric layer 33 is formed, a plurality of contacts 3 are embedded in the dielectric layer 33, and two adjacent contacts 3 are separated by the dielectric layer 33. In this embodiment, the dielectric layer 33 may be formed by pressing, and the dielectric layer 33 is formed by pressing the dielectric, so that the dielectric can wrap each contact 3 by the pressing, thereby effectively preventing the contact 3 from falling off.

Referring to step S54 and fig. 6C, a chip module body 31 is formed on a surface of the dielectric layer 33 facing away from the contact 3, thereby forming the chip module 5.

The present invention provides a method for forming the chip module body 31, but a person skilled in the art may also form the chip module body 31 by using the methods in the prior art, and the present invention is not limited thereto.

In the present embodiment, the method of forming the chip module body 31 includes the steps of:

referring to fig. 8A, a via 331 is formed on a lower surface of the dielectric layer 33 opposite to the contact 3, and the via 331 penetrates through the dielectric layer 33 and corresponds to each contact 3.

Referring to fig. 8B, a chip 332 is fixed to the lower surface of the dielectric layer 33 facing away from the contact 3. The method for fixing the chip 332 can be obtained by the skilled person from the prior art.

Referring to fig. 8C, a lead 333 is used to penetrate through the via 331 to electrically connect the pad of the chip 332 and each contact 3 correspondingly. The method of bonding the wire 333 is well within the skill of the art.

Referring to fig. 8D, the chip 332 and the leads 333 are plastic-packaged by using a plastic package body 334 to form the chip module body 31. The person skilled in the art can derive said plastic encapsulation method from the prior art.

Further, in order to embed the chip module 5 into the card body 4 of the smart card, referring to fig. 8E, a card slot 41 is provided in the card body 4, referring to fig. 8F, and the chip module 5 is embedded into the card slot 41. Preferably, the upper surface of the contact 3 is flush with the upper surface of the card body 4 to prevent the contact 3 from being damaged while ensuring the contact performance of the contact 3.

Referring to fig. 8F, the smart card of the present invention includes a card body 4 and a chip module 5 embedded in the card body 4, wherein the structure of the chip module 5 is the same as that of the above chip module. The card body 4 is provided with a card slot 41 (see fig. 8E), and the chip module 5 is disposed in the card slot 41.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A gapless contact smart card chip module comprises a chip module body and a plurality of contacts, and is characterized in that the surface of the chip module body is provided with a dielectric layer, the contacts are embedded in the dielectric layer, two adjacent contacts are isolated by the dielectric layer, the dielectric layer wraps the side surface of each contact, the upper surfaces of the contacts are flush with the upper surface of the dielectric layer, and the manufacturing method of the gapless contact smart card chip module comprises the following steps:

forming a plurality of contacts;

forming a dielectric layer, embedding a plurality of contacts in the dielectric layer, and isolating two adjacent contacts by the dielectric layer;

forming a chip module body on a surface of the dielectric layer opposite to the contact, thereby forming the chip module, wherein the method for forming the chip module body comprises the following steps:

forming a via hole on the lower surface of the dielectric layer opposite to the contact, wherein the via hole penetrates through the dielectric layer and corresponds to each contact;

the upper surface of the contact is flush with the upper surface of the dielectric layer;

fixing a chip on the lower surface of the dielectric layer, which faces away from the contact;

a lead penetrates through the through hole to correspondingly and electrically connect the welding pad of the chip with each contact;

and plastically packaging the chip and the lead by using a plastic package body.

2. A smart card comprises a card body and a chip module embedded in the card body, and is characterized in that the chip module comprises a chip module body and a plurality of contacts, the surface of the chip module body is provided with a dielectric layer, the contacts are embedded in the dielectric layer, two adjacent contacts are isolated by the dielectric layer, the dielectric layer wraps the side surface of each contact, and the upper surfaces of the contacts are flush with the upper surface of the dielectric layer; moreover, the manufacturing method of the gapless contact intelligent card chip module comprises the following steps:

forming a plurality of contacts;

3. The smart card of claim 2, wherein the card body is provided with a card slot, and the chip module is disposed in the card slot.

4. A method for manufacturing a gapless contact smart card chip module is characterized by comprising the following steps:

forming a plurality of contacts;