CN105472862A - Wireless charging circuit board and manufacturing method thereof - Google Patents
Wireless charging circuit board and manufacturing method thereof Download PDFInfo
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- CN105472862A CN105472862A CN201410460208.1A CN201410460208A CN105472862A CN 105472862 A CN105472862 A CN 105472862A CN 201410460208 A CN201410460208 A CN 201410460208A CN 105472862 A CN105472862 A CN 105472862A
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- splicing ear
- induction line
- wireless charging
- district
- charging circuit
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- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to a wireless charging circuit board which comprises a first connection terminal, a second connection terminal, a connection line, an induction line, resin and an upper surface, wherein the induction line surrounds the first connection terminal and coiled into a spiral shape, and the second connection terminal is placed at the outer side of the induction coil. The induction line comprises a first induction line area and a second induction line area, the first induction line area corresponds to a portion, between the first connection terminal and the second connection terminal, of the induction line, the sides, orientated to the upper surface, of the first connection terminal, the second connection terminal and the induction line are leveled, and the first induction line area is thinner than the second induction line area. The connection line is placed at the side, far from the upper surface, of the first induction line area and is thus in bridge connection with the first connection terminal and the second connection terminal across the first induction line area. The resin fills gaps among the first connection terminal, the second connection terminal and the connection line as well as gaps in the induction line itself. The invention also relates to a manufacturing method of the wireless charging circuit board.
Description
Technical field
The present invention, about wireless charging field, particularly relates to a kind of wireless charging circuit plate and preparation method thereof.
Background technology
In prior art, when making wireless charging circuit plate, usually etch Double-side line by double-side thick copper plate to be made or to be bondd by conducting resinl after etching circuit by the thick copper coin of two panels one side and form, the wireless charging circuit plate thickness formed by above manufacture method is all thicker, and is difficult to the miniaturization realizing line-spacing between circuit.
Summary of the invention
In view of this, the manufacture method of wireless charging circuit plate and a kind of wireless charging circuit plate providing a kind of thickness less is necessary.
A kind of wireless charging circuit plate, comprises the first splicing ear, the second splicing ear, connection line, induction line and resin.This wireless charging circuit plate has a upper surface.This induction line to spiral curl around this first splicing ear, and this second splicing ear is positioned at outside this induction line.This induction line comprises the first induction line district and the second induction line district.This first induction line district is the part of this induction line between this first splicing ear and this second splicing ear, and the remainder of this induction line is the second induction line district.This first splicing ear, this second splicing ear and this induction line flush towards the side of this upper surface, and the thickness in this second induction line district of the Thickness Ratio in this first induction line district is little.This connection line is positioned at the side that this first induction line district deviates from this upper surface.This connection line strides across this first induction line district with this first splicing ear of bridge joint and this second splicing ear.This resin filling in this first splicing ear, this second splicing ear and the gap between this connection line and this induction line and be filled in this induction line spiral curl time the gap that self formed in.
A manufacture method for wireless charging circuit plate, comprising:
There is provided a copper coin, this copper coin comprises first surface and the second surface opposing with this first surface;
Etch the first surface of this copper coin to form the raised design corresponding with one first splicing ear, one second splicing ear and an induction line, to should the first splicing ear, to should the second splicing ear and to should the raised design of induction line to should the side of first surface flush, to should the raised design of induction line around to should the raised design of the first splicing ear to spiral curl, to should the raised design of the second splicing ear be positioned at should the outside of raised design of induction line;
At the side potting resin of the first surface of this copper coin;
Etch the second surface of this copper coin to form this separate first splicing ear, this second splicing ear and this induction line, this induction line comprises the first induction line district and the second induction line district, this the first induction line district is the part of this induction line between this first splicing ear and this second splicing ear, the remainder of this induction line is the second induction line district, and the thickness in this second induction line district of the Thickness Ratio in this first induction line district is little;
To the side of second surface of copper coin should forming a connection line and make this connection line stride across this first induction line district with this first splicing ear of bridge joint and this second splicing ear, this connection line and this induction line insulate; And
To should the side potting resin of second surface of copper coin to form this wireless charging circuit plate.
The manufacture method of this wireless charging circuit plate provided by the invention and this wireless charging circuit plate utilizes a copper coin to form this first splicing ear through opposing two surperficial etchings, this second splicing ear, this the first induction line district and this second induction line district, this first splicing ear, this second splicing ear and this induction line flush towards the side of this upper surface, and the thickness in this first induction line district is less than the thickness in this second induction line district, and this first induction line district is positioned between this first splicing ear and this second splicing ear, so, the side that just can deviate from this upper surface in this first induction line district arranges this connection line, make to stride across this first induction line district and connect the increase thickness that this connection line of this first splicing ear and this second splicing ear can not be too much.Therefore, the thickness of this wireless charging circuit plate provided by the invention is less.
Accompanying drawing explanation
The schematic top plan view of the wireless charging circuit plate that Fig. 1 provides for embodiment of the present invention.
Fig. 2 is the generalized section of wireless charging circuit plate II-II along the line in Fig. 1.
Fig. 3 is the generalized section of wireless charging circuit plate III-III along the line in Fig. 1.
The schematic diagram of the wireless charging circuit board manufacturing method that Fig. 4 ~ Fig. 8 provides for embodiment of the present invention.
Main element symbol description
| Wireless charging circuit plate | 100 |
| Upper surface | 101 |
| First splicing ear | 10 |
| Second splicing ear | 20 |
| Induction line | 30 |
| Connection line | 40 |
| Resin | 50 |
| Conductive rubber | 60 |
| First protective layer | 70 |
| Second protective layer | 75 |
| First induction line district | 32 |
| Second induction line district | 34 |
| Copper coin | 80 |
| First surface | 82 |
| Second surface | 84 |
| Groove | 39 |
| First raised design | 13 |
| Second raised design | 23 |
| 3rd raised design | 33 |
| First elevated regions | 332 |
| Second elevated regions | 334 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
To be described in further detail embodiment of the present invention below in conjunction with accompanying drawing.
Referring to Fig. 1 ~ Fig. 3, is the schematic top plan view of a kind of wireless charging circuit plate 100 that embodiment of the present invention provides.This wireless charging circuit plate 100 comprises the first splicing ear 10, second splicing ear 20, induction line 30, connection line 40 and resin 50.In present embodiment, this wireless charging circuit plate 100 also comprises conductive rubber 60, first protective layer 70 and the second protective layer 75.This wireless charging circuit plate 100 also has a upper surface 101.In present embodiment, this upper surface 101 is the surface of this resin 50.
Refer to Fig. 1, this induction line 30 to spiral curl around this first splicing ear 10, and this second splicing ear 20 is positioned at the outside of this induction line 30.This induction line 30 insulate with this first splicing ear 10 and this second splicing ear 20.This first splicing ear 10, this second splicing ear 20 and this induction line 30 flush towards the side of this upper surface 101.
Incorporated by reference to Fig. 3, this induction line 30 comprises the first induction line district 32 and the second induction line district 34.This first induction line district 32 is the part of this induction line 30 between this first splicing ear 10 and this second splicing ear 20, and the remainder of this induction line 30 is this second induction line district 34.The thickness in this first induction line district 32 is less than the thickness in this second induction line district 34.In present embodiment, this the first induction line district 32 is identical with the thickness of this first splicing ear 10 and this second splicing ear 20, and namely this first induction line district 32, this first splicing ear 10 and this second splicing ear 20 deviate from the side that the side of this upper surface 101 and this second induction line district 34 deviate from this upper surface 101 and have difference in height.
This connection line 40 is positioned at the side that this first induction line district 32 deviates from this upper surface 101.This connection line 40 strides across this electrical this first splicing ear 10 of bridge joint in the first induction line district 32 and this second splicing ear 20.In present embodiment, this connection line 40 extends to the side being positioned at this first splicing ear 10 and this second splicing ear 20 and deviating from this upper surface 101 further.In addition, in present embodiment, wireless charging circuit plate 100 arranges conductive rubber 60 between this first splicing ear 10 and this connection line 40 and between this second splicing ear 20 and this connection line 40, because the thickness in this first induction line district 32 is identical with the thickness of this first splicing ear 10 and this second splicing ear 20, and this first induction line district 32 is between this first splicing ear 10 and this second splicing ear 20, so this connection line 40 can insulate with this induction line 30.Be understandable that, in other embodiments, if the thickness of this first splicing ear 10 and this second splicing ear 20 is greater than the thickness in this first induction line district 32, this conductive rubber 60 also can not be set, and this connection line 40 is directly connected with the side that this first splicing ear 10 and this second splicing ear 20 deviate from this upper surface 101 or makes this connection line 40 directly connect this first splicing ear 10 and these opposed facing both sides of the second splicing ear 20, and the side without the need to making this connection line extend to be positioned at this first splicing ear 10 and this second splicing ear 20 to deviate from this upper surface 101.
Refer to Fig. 3, in present embodiment, this induction line 30 in this first splicing ear 10, this second splicing ear 20 and this first induction line district 32 is along being trapezoidal perpendicular to the cross section on this upper surface 101 direction, and this induction line 30 in this second induction line district 34 is along being the trapezoidal and inverted trapezoidal that base is connected perpendicular to the cross section on this upper surface 101 direction.
This resin 50 be filled in this first splicing ear 10, this second splicing ear 20 and the gap between this connection line 40 and this induction line 30 and be filled in this induction line 30 spiral curl time the gap that self formed in.Insulated by this resin 50 between this induction line 30 and this first splicing ear 10 and this second splicing ear 20, also insulated by this resin 50 between this induction line 30 and this connection line 40.
This first protective layer 70 and this second protective layer 75 lay respectively at the both sides of this wireless charging circuit plate 100 and cover this resin 50.Particularly, this first protective layer 70 covers this upper surface 101, and this second protective layer 75 covers this resin 50 surface opposing with this upper surface 101.
Refer to Fig. 4 ~ Fig. 8 and composition graphs 3, the method for the above-mentioned wireless charging circuit plate 100 of the making that embodiment of the present invention provides mainly comprises the steps.
Refer to Fig. 4, the first step, provide a copper coin 80, this copper coin 80 comprises a first surface 82 and a second surface 84.This first surface 82 is positioned at the opposing both sides of this copper coin 80 with this second surface 84.
Refer to Fig. 5, second step, etch the first surface 82 of this copper coin 80, to form first raised design 13 corresponding with this first splicing ear, second raised design 23 corresponding with this second splicing ear and three raised design 33 corresponding with this induction line.This copper coin 80 in the side of this first surface 82 to the first raised design 13, this second raised design 23 and the 3rd raised design 33 being formed with groove 39.This first raised design 13, this second raised design 23 and the 3rd raised design 33 are to should the side of first surface 82 flush.3rd raised design 33 to spiral curl around this first raised design 13, and this second raised design 23 is positioned at the outside of the 3rd raised design 33 of the curl that spirals.3rd raised design 33 comprises the first elevated regions 332 and the second elevated regions 334.This first elevated regions 332 is the part of the 3rd raised design 33 between this first raised design 13 and this second raised design 23, and the remainder of the 3rd raised design 33 is this second elevated regions 334.In present embodiment, this second raised design 23 of this first raised design 13 and the 3rd raised design 33 are along being trapezoidal perpendicular to the cross section on this first surface 82 direction.
Refer to Fig. 6,3rd step, at the side potting resin 50 of the first surface 82 of this copper coin 80, this resin 50 to be filled in the groove 39 that formed when forming this first raised design 13, this second raised design 23 and the 3rd raised design 33 and to make this resin 50 cover the side of this copper coin 80 first surface 82.This resin 50 is to the side of first surface 82 having this upper surface 101.In present embodiment, also form this first protective layer 70 in the side of this first surface 82 of this copper coin 80 further.This first protective layer 70 covers this resin 50 in the side of this first surface 82, namely covers this upper surface 101.
Refer to Fig. 7,4th step, the groove 39 formed when the second surface 84 etching this copper coin 80 is to run through and to form this first raised design 13, this second raised design 23 and the 3rd raised design 33, to form this separate first splicing ear 10, this second splicing ear 20 and this induction line 30.The side of this copper coin 80 second surface 84 is to being partially etched on the direction perpendicular to this second surface 84 by the first elevated regions 332.In present embodiment, the side of this copper coin 80 second surface 84 is to should the first raised design 13 and this second raised design 23 also be partially etched on the direction perpendicular to this second surface 84.This first elevated regions 332 correspondence forms this first induction line district 32 of this induction line 30, and this second elevated regions 334 correspondence forms this second induction line district 34 of this induction line 30.The thickness in this first induction line district 32 is less than the thickness in this second induction line district 34.In present embodiment, the thickness in this first induction line district 32 is identical with the thickness of this first splicing ear 10 and this second splicing ear 20.Particularly, this induction line 30, this first splicing ear 10 and this second splicing ear 20 to should the side of first surface 82 flush, and this first induction line district 32, this first splicing ear 10 and this second splicing ear 20 to should the side of second surface 84 and this second induction line district 34 to the side of second surface 84 having difference in height.In present embodiment, this induction line 30 in this first splicing ear 10, this second splicing ear 20 and this first induction line district 32 is along being trapezoidal perpendicular to the cross section on this first surface 82 direction, and this induction line 30 in this second induction line district 34 is along being the trapezoidal and inverted trapezoidal that base is connected perpendicular to the cross section on this first surface 82 direction.
Refer to Fig. 8, the 5th step, at this first splicing ear 10 and this second splicing ear 20 to the side of copper coin second surface 84 being coated with this conductive rubber 60, and between this first splicing ear 10 and this second splicing ear 20 potting resin 50.
6th step, to the side of second surface 84 of copper coin 80 forming this connection line 40, make this connection line 40 stride across this first induction line district 32 this first splicing ear 10 of bridge joint and this second splicing ear 20, this conductive rubber 60 is electrically connected at this first splicing ear 10 and this connection line 40 and between this first splicing ear 10 and this connection line 40.
Be understandable that, when etching the second surface 84 of this copper coin 80, if make the thickness of this first splicing ear 10 and this second splicing ear 20 be greater than the thickness in this first induction line district 32, so also can not at this first splicing ear 10 and this second splicing ear 20 to should the side applying conductive colloid of copper coin second surface 84, and between this first splicing ear 10 and this second splicing ear 20, form this connection line 40 after potting resin 50 and this connection line 40 is directly connected with this first splicing ear 10 and this second splicing ear 20 or makes this connection line 40 directly connect this first splicing ear 10 and these opposed facing both sides of the second splicing ear 20.
7th step, incorporated by reference to Fig. 3, to should the side potting resin 50 of this second surface 84 of copper coin 80, and to the side of this second surface 84 of copper coin 80 forming this second protective layer 75.This second protective layer 75 covers this resin 50 in the side of this second surface 84.
This wireless charging circuit plate 100 that embodiment of the present invention provides and the method making this wireless charging circuit plate 100 utilize this copper coin 80 to form this first splicing ear 10 through opposing two surperficial etchings, this second splicing ear 20, this the first induction line district 32 and this second induction line district 34, this first splicing ear 10, this second splicing ear 20 and this induction line 30 flush towards the side (or to should the side of first surface 82) of this upper surface 101, and make the thickness in this first induction line district 32 be less than the thickness in this second induction line district 34, so, the side (or to should the side of second surface 84) that just can deviate from this upper surface 101 in the first induction line district 32 arranges this connection line 40, make to stride across this first induction line district 32 and connect the increase thickness that this connection line 40 of this first splicing ear 10 and this second splicing ear 20 can not be too much.Therefore, the thickness of this wireless charging circuit plate 100 that provides of embodiment of the present invention is less.
Although the present invention discloses embodiment; but it is also not used to limit the present invention; any those skilled in the art; equivalent structure done under the prerequisite not departing from the spirit and scope of the present invention or the displacement of step; or the equivalent variations to do according to scope of patent protection of the present invention and modification, all still should belong to the category that this patent is contained.
Claims (10)
1. a wireless charging circuit plate, comprise the first splicing ear, second splicing ear, connection line, induction line and resin, this wireless charging circuit plate has a upper surface, this induction line to spiral curl around this first splicing ear, this second splicing ear is positioned at outside this induction line, this induction line comprises the first induction line district and the second induction line district, this the first induction line district is the part of this induction line between this first splicing ear and this second splicing ear, the remainder of this induction line is the second induction line district, this first splicing ear, this second splicing ear and this induction line flush towards the side of this upper surface, the thickness in this second induction line district of the Thickness Ratio in this first induction line district is little, this connection line is positioned at the side that this first induction line district deviates from this upper surface, this connection line strides across this first induction line district with this first splicing ear of bridge joint and this second splicing ear, this resin filling is in this first splicing ear, this second splicing ear and the gap between this connection line and this induction line and be filled in this induction line spiral curl time the gap that self formed in.
2. wireless charging circuit plate as claimed in claim 1, it is characterized in that, the thickness in this first induction line district is identical with the thickness of this first splicing ear and this second splicing ear, and this connection line extends to the side being positioned at this first splicing ear and this second splicing ear and deviating from this upper surface further.
3. wireless charging circuit plate as claimed in claim 2, it is characterized in that, this wireless charging circuit plate is also included in conductive rubber, and this conductive rubber connects this first splicing ear and this connection line and this second splicing ear and this connection line.
4. wireless charging circuit plate as claimed in claim 1, it is characterized in that, this wireless charging circuit plate also comprises protective layer, and this protective layer is positioned at the both sides of this wireless charging circuit plate and covers this resin.
5. wireless charging circuit plate as claimed in claim 1, it is characterized in that, this first splicing ear, this second splicing ear and this induction line are trapezoidal in the cross section in this first induction line district, and this induction line is the trapezoidal and inverted trapezoidal that base is connected in the cross section in this second induction line district.
6. a manufacture method for wireless charging circuit plate, comprising:
There is provided a copper coin, this copper coin comprises first surface and the second surface opposing with this first surface;
Etch the first surface of this copper coin to form the raised design corresponding with one first splicing ear, one second splicing ear and an induction line, to should the first splicing ear, to should the second splicing ear and to should the raised design of induction line to should the side of first surface flush, to should the raised design of induction line around to should the raised design of the first splicing ear to spiral curl, to should the raised design of the second splicing ear be positioned at should the outside of raised design of induction line;
At the side potting resin of the first surface of this copper coin;
Etch the second surface of this copper coin to form this separate first splicing ear, this second splicing ear and this induction line, this induction line comprises the first induction line district and the second induction line district, this the first induction line district is the part of this induction line between this first splicing ear and this second splicing ear, the remainder of this induction line is the second induction line district, and the thickness in this second induction line district of the Thickness Ratio in this first induction line district is little;
To the side of second surface of copper coin should forming a connection line and make this connection line stride across this first induction line district with this first splicing ear of bridge joint and this second splicing ear, this connection line and this induction line insulate; And
To should the side potting resin of second surface of copper coin to form this wireless charging circuit plate.
7. the manufacture method of wireless charging circuit plate as claimed in claim 6, it is characterized in that, the thickness in this first induction line district is identical with the thickness of this first splicing ear and this second splicing ear, and this connection line extends to further and is positioned at this first splicing ear and this second splicing ear side towards this second surface.
8. the manufacture method of wireless charging circuit plate as claimed in claim 7, it is characterized in that, after the second surface of this copper coin of etching forms the first separate splicing ear, the second splicing ear and induction line, be also included in this first splicing ear and this second splicing ear to should the side applying conductive colloid of copper coin second surface, this conductive rubber connects this first splicing ear and this connection line and this second splicing ear and this connection line.
9. the manufacture method of wireless charging circuit plate as claimed in claim 6, is characterized in that, also comprises formation protective layer and cover this resin after the side potting resin of the side potting resin at the first surface of this copper coin and the second surface at this copper coin.
10. the manufacture method of wireless charging circuit plate as claimed in claim 6, it is characterized in that, after the second surface etching this copper coin forms this separate first splicing ear, this second splicing ear and this induction line, this first splicing ear, this second splicing ear and this induction line are trapezoidal in the cross section in this first induction line district, and this induction line is the trapezoidal and inverted trapezoidal that base is connected in the cross section in this second induction line district.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410460208.1A CN105472862B (en) | 2014-09-11 | 2014-09-11 | The production method of wireless charging circuit plate and wireless charging circuit plate |
| TW103132879A TWI586227B (en) | 2014-09-11 | 2014-09-23 | Wireless charging circuit board and method for manufacturing wireless charging circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410460208.1A CN105472862B (en) | 2014-09-11 | 2014-09-11 | The production method of wireless charging circuit plate and wireless charging circuit plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105472862A true CN105472862A (en) | 2016-04-06 |
| CN105472862B CN105472862B (en) | 2018-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410460208.1A Active CN105472862B (en) | 2014-09-11 | 2014-09-11 | The production method of wireless charging circuit plate and wireless charging circuit plate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105472862B (en) |
| TW (1) | TWI586227B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN113692134A (en) * | 2021-08-27 | 2021-11-23 | 江门市华锐铝基板股份公司 | Etching method for thick copper wire spacing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09286188A (en) * | 1996-04-23 | 1997-11-04 | Matsushita Electric Works Ltd | Noncontact type ic card |
| JP5078340B2 (en) * | 2006-07-26 | 2012-11-21 | 京セラ株式会社 | Coil built-in board |
| US8133764B2 (en) * | 2007-02-14 | 2012-03-13 | Npx B.V. | Embedded inductor and method of producing thereof |
| TWM466414U (en) * | 2013-05-20 | 2013-11-21 | Unimicron Technology Corp | Wiring board |
| CN203339744U (en) * | 2013-05-31 | 2013-12-11 | 欣兴电子股份有限公司 | Circuit board |
-
2014
- 2014-09-11 CN CN201410460208.1A patent/CN105472862B/en active Active
- 2014-09-23 TW TW103132879A patent/TWI586227B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111405773A (en) * | 2020-03-19 | 2020-07-10 | 盐城维信电子有限公司 | Circuit board and manufacturing method thereof |
| CN113692134A (en) * | 2021-08-27 | 2021-11-23 | 江门市华锐铝基板股份公司 | Etching method for thick copper wire spacing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105472862B (en) | 2018-06-08 |
| TWI586227B (en) | 2017-06-01 |
| TW201611666A (en) | 2016-03-16 |
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Effective date of registration: 20170630 Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei, China Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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