CN201465804U - Capacitor packaging structure - Google Patents
Capacitor packaging structure Download PDFInfo
- Publication number
- CN201465804U CN201465804U CN2009201320904U CN200920132090U CN201465804U CN 201465804 U CN201465804 U CN 201465804U CN 2009201320904 U CN2009201320904 U CN 2009201320904U CN 200920132090 U CN200920132090 U CN 200920132090U CN 201465804 U CN201465804 U CN 201465804U
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- China
- Prior art keywords
- top shell
- package structure
- heat
- plastic tube
- resisting plastic
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Abstract
The utility model discloses a capacitor packaging structure, comprising a top case, a heat-resisting plastic ring and a bottom case, wherein the periphery of the top case is provided with a reinforced structure and is coated with the heat-resisting plastic ring; the bottom case is enclosed on the heat-resisting plastic ring from bottom, and a middle slot is formed between the top case and the bottom case. Thus, the capacitor packaging structure of the utility model has the advantages of high structural strength, high temperature resistance and low manufacturing cost. Preferably, the edge of the reinforced structure and the top case form an inversed buckled angle smaller than 90 degrees; the inversed buckled angle, the heat-resisting plastic ring and the bottom case are tightly buckled to ensure that the top case is free from separating from the heat-resisting plastic ring and the bottom case, thus further improving the structural strength.
Description
Technical field
The utility model relates to the electronic devices and components field, relates in particular to a kind of plug-in unit capacitor package structure.
Background technology
Capacitor is owing to have advantages such as volume is little, capacity is big, high temperature resistant, so it has been widely used in the circuit such as noise bypass, filter, integrating circuit, oscillating circuit.Fig. 1 shows existing capacitor package structure, and this capacitor package structure 20 comprises affixed successively top shell 21, middle pot shell 22 and drain pan 23, and raw materials such as electrolyte are housed in the space between described top shell 21 and the middle pot shell 22.Described top shell 21, middle pot shell 22 and drain pan 23 are generally the five metals material and make, and the three place of joining is provided with an insulated enclosure circle 24, are used to insulate and seal the electrolyte that contains.Because existing manufacturing process restriction, the insulated enclosure circles 24 in the general capacitor package structure 20 all can't be high temperature resistant, and it is heated yielding and then causes leakage, makes part scrap and damage other components and parts.And the assembly of existing capacitor package structure 20 is comparatively various, and it causes manufacturing cost higher.In addition, the top shell 21 of existing capacitor package structure 20 is a bending structure, and its structural strength is not high, comes off from drain pan 23 or insulated enclosure circle 24 easily.
In summary, the capacitor package structure of described prior art obviously exists inconvenience and defective, so be necessary to be improved on reality is used.
The utility model content
At above-mentioned defective, the purpose of this utility model is to provide a kind of capacitor package structure, and it has the structural strength height, and high temperature resistant, advantage of low manufacturing cost.
To achieve these goals, the utility model provides a kind of capacitor package structure, comprise top shell, heat-resisting plastic tube and drain pan, the periphery of described top shell has a reinforcement, and the periphery of described top shell is coated with described heat-resisting plastic tube, described drain pan oneself descend inclusion on described heat-resisting plastic tube, and form a medial launder between described top shell and drain pan.
According to capacitor package structure of the present utility model, form a back-off angle less than 90 degree between the edge of described reinforcement and the described top shell.
According to capacitor package structure of the present utility model, described reinforcement is close to the periphery of described top shell, and described reinforcement is by the peripheral edging moulding of described top shell.
According to capacitor package structure of the present utility model, peripheral integrated punching, forging and pressing or the car of described reinforcement and described top shell are made type.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube is provided with the inner bending structure, and the periphery of described top shell is contained in the inner bending structure of described heat-resisting plastic tube.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube inboard is provided with a bulge loop, and the back-off angle and the described bulge loop that form between the edge of described reinforcement and the described top shell lean.
According to capacitor package structure of the present utility model, described top shell and described heat-resisting plastic tube are gone into moulding in the described insulated enclosure circle by the integrated through injection molding moulding or by described top valve jacket.
According to capacitor package structure of the present utility model, in the medial launder between described top shell and the drain pan electrolysis material is housed.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube and the contacted corner of described drain pan are circular-arc.
According to capacitor package structure of the present utility model, described capacitor is patch capacitor device or plug-in unit capacitor.
A kind of capacitor package structure of the utility model comprises top shell, heat-resisting plastic tube and drain pan, by setting up a reinforcement at the periphery of described top shell, has replaced the bending structure of existing top shell periphery, increases its structural strength.Under this structure, this capacitor package structure has high temperature resistant, the on-deformable advantage of being heated, and it is high temperature resistant to reach 265～290 ℃; In addition, the employed part of this capacitor package structure is less, only needs these three parts of top shell, heat-resisting plastic tube and drain pan, has saved existing middle pot shell, and it is low to reduce cost of goods manufactured.Whereby, the utlity model has the structural strength height, and advantage such as high temperature resistant, low cost of manufacture.Preferably, form a back-off angle less than 90 degree between the edge of described reinforcement and the described top shell, closely interlock by described back-off angle and heat-resisting plastic tube and drain pan, can not cause top shell and heat-resisting plastic tube and drain pan to come off, further improved its structural strength.
Description of drawings
Fig. 1 is the generalized section of existing capacitor package structure;
Fig. 2 is the generalized section of a kind of embodiment of capacitor package structure of the present utility model;
Fig. 3 is the generalized section of another embodiment of capacitor package structure of the present utility model;
Fig. 4 is the three-dimensional structure diagram of the top shell of capacitor package structure of the present utility model;
Fig. 5 is the generalized section of the top shell of capacitor package structure of the present utility model;
Fig. 6 is the generalized section of the drain pan of capacitor package structure of the present utility model;
Fig. 7 is the generalized section of a kind of embodiment of heat-resisting plastic tube of capacitor package structure of the present utility model;
Fig. 8 is the generalized section of heat-resisting another embodiment of plastic tube of capacitor package structure of the present utility model;
Fig. 9 is the generalized section of a kind of embodiment of first packaging process of capacitor package structure of the present utility model;
Figure 10 is the generalized section of a kind of embodiment of second packaging process of capacitor package structure of the present utility model;
Figure 11 is the generalized section of first another embodiment of packaging process of capacitor package structure of the present utility model;
Figure 12 is the generalized section of second another embodiment of packaging process of capacitor package structure of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 2 and Fig. 3 are the generalized sections of capacitor package structure of the present utility model, this capacitor package structure 10 comprises a top shell 11, a heat-resisting plastic tube 12 and a drain pan 13, and the utility model capacitor can be patch capacitor device or plug-in unit capacitor etc.The periphery of top shell 11 has a reinforcement 111, and the periphery of top shell 11 is coated with heat-resisting plastic tube 12, drain pan 13 certainly following inclusions are on heat-resisting plastic tube 12, and between top shell 11 and drain pan 13, form a medial launder 14, be used to load the required electrolysis materials such as electrolyte of capacitor in this medial launder 14.Heat-resisting plastic tube 12 is provided with the inner bending structure, and the periphery of top shell 11 is contained in the inner bending structure of heat-resisting plastic tube 12.
By setting up reinforcement 111 at the periphery of top shell 11, replaced the bending structure of existing top shell 11 peripheries, increase its structural strength.Why the utility model allows drain pan 13 inclusions on heat-resisting plastic tube 12, be because this structure under high-temperature heating, the junction between heat-resisting plastic tube 12 and the drain pan 13 is difficult for deforming, thereby has guaranteed good thermal endurance and sealing.In addition, the capacitor package structure 10 employed parts that the utility model provides are less, only need top shell 11, heat-resisting plastic tube 12 and drain pan 13 these three parts, saved existing middle pot shell, and it is low to reduce cost of goods manufactured.Preferably, form a back-off angle less than 90 degree between the edge 112 of reinforcement 111 and the top shell 11.Closely interlock by back-off angle and heat-resisting plastic tube 12 and drain pan 13, can not cause top shell 11 and heat-resisting plastic tube 12 and drain pan 13 to come off, further improved its structural strength.
Be more preferably, described heat-resisting plastic tube 12 is circular-arc with drain pan 13 contacted corners 121, form a space 122 between this circular-arc corner 121 and the drain pan 13, this space 122 can be the effect that heat-resisting plastic tube 12 provides the distortion buffering under extruding or heating status, so sealing is better.
Comparison diagram 2 and Fig. 3, in Fig. 2, reinforcement 111 is close to the periphery of top shell 11, and reinforcement 111 is by the peripheral edging moulding of top shell 11; In Fig. 3, reinforcement 111 is made type with peripheral integrated punching, forging and pressing or the car of top shell 11.Simultaneously, top shell 11 and reinforcement 111 can also adopt the stainless steel round bar car to make type.In production application, can be according to equipment and the optional wherein a kind of method of material situation.
The manufacturing process of the utility model capacitor package structure 10 contains part manufacturing and encapsulation two large divisions:
One, part manufacturing process example, the branch of its each step and out-of-order.
1) opening diel, be as shown in Figure 5 top shell 11 with a stainless steel substrates punch forming, and the periphery of top shell 11 has a reinforcement 111.
2) opening diel, is as shown in Figure 6 cup-shaped drain pan 13 with a stainless steel substrates punch forming.
3) adopt heat-resisting engineering plastic material extrusion molding plastic slice, on plastic slice, carry out punching press again and form some double-U-shaped heat-resisting plastic tubes 12 as shown in Figure 7, it compares the heat-resisting plastic tube 12 with injection mo(u)lding, and it has production efficiency height, precision height, cost is low, waste material is few, easily reclaim and because of save advantage such as cooling time without colloidal sol.
Preferably, heat-resisting plastic tube 12 inboards can be provided with as shown in Figure 8 a bulge loop 123, behind encapsulated moulding, the back-off angle and the bulge loop 123 that form between the edge 112 of reinforcement 111 and the top shell 11 lean, make to combine closelyr between top shell 11 and the heat-resisting plastic tube 12, improve its sealing.
Two, packaging process example.
1) stainless steel top shell 11 is inserted in the heat-resisting plastic tube 12, as shown in Figure 9, the periphery of top shell 11 is contained in the bending structure of heat-resisting plastic tube 12, preferably, the external diameter R of top shell 11 is a bit larger tham the internal diameter r of heat-resisting cushion rubber 12, the external diameter R of preferred top shell 11 is than the big 0.02mm to 0.04mm of internal diameter r of heat-resisting cushion rubber 12, and top shell 11 is inserted in the heat-resisting plastic tube 12 and has frictional force, difficult drop-off like this.
2) electrolysis materials such as spongioplasm electrolysis material or electrolyte of in stainless steel top shell 11, packing into.
3) stainless steel drain pan 13 is enclosed within from bottom to up heat-resisting plastic tube 12 the outside.
4) top shell 11, heat-resisting plastic tube 12 and 13 3 parts of drain pan are packaged back formation structure as schematically shown in Figure 10, carry out punching press then, make drain pan 13 and heat-resisting plastic tube 12 be stamped behind the flanging inclusion on the periphery of top shell 11, can reach insulation and sealing effectiveness, thereby final molding be as 2 or capacitor package structure 10 shown in Figure 3.
According to another embodiment of packaging process, in encapsulation process, also heat-resisting plastic tube 12 and top shell 11 also can be able to be passed through integrated through injection molding moulding formation structure as shown in figure 11, and not need top shell 11 is inserted in the heat-resisting plastic tube 12; Then drain pan 13 is inserted on the heat-resisting plastic tube 12, forms structure as shown in figure 12; Last punch forming forms as Fig. 2 or capacitor package structure 10. shown in Figure 3
Though capacitor has little, the capacious advantage of volume, it is inserted in after wiring board (as pcb board) goes up, also will be through the reflow process of reflow stove, general reflow furnace temperature is between 265～275 ℃, about 20 seconds of time.The hot melt distortion takes place through regular meeting in existing capacitor package structure in reflow process; capacitor package structure 10 of the present utility model then can be born this reflow furnace temperature fully; it is high temperature resistant to reach 265～290 ℃, has therefore effectively guaranteed the manufacturing qualification rate of product.
In sum, a kind of capacitor package structure of the utility model comprises top shell, heat-resisting plastic tube and drain pan, by setting up a reinforcement at the periphery of described top shell, has replaced the bending structure of existing top shell periphery, increases its structural strength.Under this structure, this capacitor package structure has high temperature resistant, the on-deformable advantage of being heated, and it is high temperature resistant to reach 265～290 ℃; In addition, the employed part of this capacitor package structure is less, only needs these three parts of top shell, heat-resisting plastic tube and drain pan, has saved existing middle pot shell, and it is low to reduce cost of goods manufactured.Whereby, the utlity model has the structural strength height, and advantage such as high temperature resistant, low cost of manufacture.Preferably, form a back-off angle less than 90 degree between the edge of described reinforcement and the described top shell, closely interlock by described back-off angle and heat-resisting plastic tube and drain pan, can not cause top shell and heat-resisting plastic tube and drain pan to come off, further improved its structural strength.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1. capacitor package structure, it is characterized in that, comprise top shell, heat-resisting plastic tube and drain pan, the periphery of described top shell has a reinforcement, and the periphery of described top shell is coated with described heat-resisting plastic tube, described drain pan oneself descend inclusion on described heat-resisting plastic tube, and form a medial launder between described top shell and drain pan.
2. capacitor package structure according to claim 1 is characterized in that, forms a back-off angle less than 90 degree between the edge of described reinforcement and the described top shell.
3. capacitor package structure according to claim 1 is characterized in that described reinforcement is close to the periphery of described top shell, and described reinforcement is by the peripheral edging moulding of described top shell.
4. capacitor package structure according to claim 1 is characterized in that, peripheral integrated punching, forging and pressing or the car of described reinforcement and described top shell are made type.
5. capacitor package structure according to claim 1 is characterized in that, described heat-resisting plastic tube is provided with the inner bending structure, and the periphery of described top shell is contained in the inner bending structure of described heat-resisting plastic tube.
6. capacitor package structure according to claim 5 is characterized in that, described heat-resisting plastic tube inboard is provided with a bulge loop, and the back-off angle and the described bulge loop that form between the edge of described reinforcement and the described top shell lean.
7. capacitor package structure according to claim 5 is characterized in that, described top shell and described heat-resisting plastic tube are gone into moulding in the described insulated enclosure circle by the integrated through injection molding moulding or by described top valve jacket.
8. capacitor package structure according to claim 1 is characterized in that, in the medial launder between described top shell and the drain pan electrolysis material is housed.
9. capacitor package structure according to claim 1 is characterized in that, described heat-resisting plastic tube and the contacted corner of described drain pan are circular-arc.
10. according to each described capacitor package structure of claim 1～9, it is characterized in that described capacitor is patch capacitor device or plug-in unit capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201320904U CN201465804U (en) | 2009-05-26 | 2009-05-26 | Capacitor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201320904U CN201465804U (en) | 2009-05-26 | 2009-05-26 | Capacitor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201465804U true CN201465804U (en) | 2010-05-12 |
Family
ID=42393152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201320904U Expired - Fee Related CN201465804U (en) | 2009-05-26 | 2009-05-26 | Capacitor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201465804U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156782A (en) * | 2018-01-15 | 2018-06-12 | 维沃移动通信有限公司 | A kind of through-hole sealing structure and electronic equipment |
-
2009
- 2009-05-26 CN CN2009201320904U patent/CN201465804U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156782A (en) * | 2018-01-15 | 2018-06-12 | 维沃移动通信有限公司 | A kind of through-hole sealing structure and electronic equipment |
| CN108156782B (en) * | 2018-01-15 | 2019-12-20 | 维沃移动通信有限公司 | Through hole sealing structure and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20130526 |