CN201402743Y - Capacitor packaging structure - Google Patents
Capacitor packaging structure Download PDFInfo
- Publication number
- CN201402743Y CN201402743Y CN2009201356802U CN200920135680U CN201402743Y CN 201402743 Y CN201402743 Y CN 201402743Y CN 2009201356802 U CN2009201356802 U CN 2009201356802U CN 200920135680 U CN200920135680 U CN 200920135680U CN 201402743 Y CN201402743 Y CN 201402743Y
- Authority
- CN
- China
- Prior art keywords
- heat
- plastic tube
- top shell
- package structure
- resisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The utility model discloses a capacitor packaging structure which comprises a top shell, a heatproof plastic ring and a bottom shell, wherein the heatproof plastic ring is provided with an internal buckling structure, the periphery of the top shell is contained in the internal buckling structure of the heatproof plastic ring, the bottom shell is downwards sleeved on the outside of the heatproof plastic ring, the bottom shell and the edge-folds of the heatproof plastic ring are covered on the periphery of the top shell, and an intermediate groove is formed between the top shell and the bottom shell. Therefore, the capacitor packaging structure has the advantages of high temperature resistance and excellent sealing performance, is not easy to deform after being heated, further reduces the production cost of products and has low precision requirements as adopting few elements, and has simple production technology.
Description
Technical field
The utility model relates to the electronic devices and components field, relates in particular to a kind of capacitor package structure.
Background technology
Capacitor is owing to have advantages such as volume is little, capacity is big, high temperature resistant, so it has been widely used in the circuit such as noise bypass, filter, integrating circuit, oscillating circuit.Fig. 1 shows existing capacitor package structure, and this capacitor package structure 20 comprises affixed successively top shell 21, middle pot shell 22 and drain pan 23, and raw materials such as electrolyte are housed in the space between described top shell 21 and the middle pot shell 22.Described top shell 21, middle pot shell 22 and drain pan 23 are generally the five metals material and make, and the three place of joining is provided with an insulated enclosure circle 24, are used to insulate and seal the electrolyte that contains.Because existing manufacturing process restriction, the insulated enclosure circles 24 in the general capacitor package structure 20 all can't be high temperature resistant, and it is heated yielding and then causes leakage, makes part scrap and damage other components and parts.In addition, the assembly of existing capacitor package structure is comparatively various, and it causes manufacturing cost higher.
In summary, the capacitor package structure of described prior art obviously exists inconvenience and defective, so be necessary to be improved on reality is used.
The utility model content
At above-mentioned defective, the purpose of this utility model is to provide a kind of capacitor package structure, and it has high temperature resistant, good airproof performance, low cost of manufacture and the low advantage of required precision, and manufacturing process is simple.
To achieve these goals, the utility model provides a kind of capacitor package structure, comprise top shell, heat-resisting plastic tube and drain pan, described heat-resisting plastic tube is provided with the inner bending structure, the periphery of described top shell is contained in the inner bending structure of described heat-resisting plastic tube, this drain pan is from the outside that is enclosed within this heat-resisting plastic tube down, and this drain pan and heat-resisting plastic tube flanging are coated on the periphery of this top shell, and form a medial launder between this top shell and drain pan.
According to capacitor package structure of the present utility model, the external diameter of described top shell is a bit larger tham the internal diameter of described heat-resisting cushion rubber.
According to capacitor package structure of the present utility model, the periphery of described top shell is bending type, and the periphery of described top shell is inserted in the inner bending structure of described heat-resisting plastic tube.
According to capacitor package structure of the present utility model, described top shell is dish; And/or described drain pan is cup-shaped.
According to capacitor package structure of the present utility model, described top shell and/or drain pan are made by metal die.
According to capacitor package structure of the present utility model, the cross section of described heat-resisting plastic tube roughly is symmetrical dual U-shaped.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube and the contacted corner of described drain pan are circular-arc.
According to capacitor package structure of the present utility model, described capacitor is patch capacitor device or plug-in unit capacitor.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube is by heat-resisting synthetic engineering plastic punch forming.
According to capacitor package structure of the present utility model, described heat-resisting plastic tube is by heat-resisting synthetic engineering plastic injection mo(u)lding.
Capacitor package structure of the present utility model is made of top shell, heat-resisting plastic tube and drain pan, and the periphery of described top shell is contained in the bending structure of heat-resisting plastic tube, and this drain pan and heat-resisting plastic tube flanging are coated on the periphery of this top shell.Under this structure, this capacitor package structure has high temperature resistant, the on-deformable advantage of being heated, and it is high temperature resistant to reach 265~290 ℃; Secondly, this capacitor package structure coats the top shell with drain pan and heat-resisting plastic tube punching press flanging together, and this heat-resisting plastic tube is squeezed and can produces strain and then fit tightly with drain pan, so better tightness, can not leak electrolyte; In addition, the employed part of this capacitor package structure is less, only needs these three parts of top shell, heat-resisting plastic tube and drain pan, saved existing in pot shell, can reduce cost of goods manufactured and required precision is low; And described heat-resisting plastic tube and top shell can directly fit together, and do not need the top shell is imbedded the heat-resisting plastic tube of package injection molding in the injection molding, so manufacturing process are more simple; Then, described heat-resisting plastic tube and the contacted corner of drain pan are circular-arc, form certain space between this circular-arc corner and the drain pan, and this space can be the effect that heat-resisting plastic tube provides the distortion buffering under extruding or heating status, so sealing is better.Be more preferably, heat-resisting plastic tube adopts heat-resisting synthetic engineering plastic punch forming, so not only can overcome the problem that the plastic cement thin-walled is difficult for injection mo(u)lding, also has production efficiency height, precision height, advantages such as cost is low, waste material is few, easy recovery.
Description of drawings
Fig. 1 is the generalized section of existing capacitor package structure;
Fig. 2 is the generalized section of capacitor package structure of the present utility model;
Fig. 3 is the generalized section of the heat-resisting plastic tube of capacitor package structure of the present utility model;
Fig. 4 is the three-dimensional structure diagram of the top shell of capacitor package structure of the present utility model;
Fig. 5 is the three-dimensional structure diagram of the drain pan of capacitor package structure of the present utility model;
Fig. 6 is the first packaging process generalized section of capacitor package structure of the present utility model;
Fig. 7 is the second packaging process generalized section of capacitor package structure of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 2 is the generalized section of capacitor package structure of the present utility model, and this capacitor package structure 10 comprises a top shell 11, a heat-resisting plastic tube 12 and a drain pan 13, and the utility model capacitor can be patch capacitor device or plug-in unit capacitor etc.Described heat-resisting plastic tube 12 is provided with the inner bending structure, and the periphery of described top shell 11 is contained in the inner bending structure of heat-resisting plastic tube 12.This drain pan 13 is from the outside that is enclosed within heat-resisting plastic tube 12 down, and this drain pan 13 and heat-resisting plastic tube 12 punching press flanging together are coated on the periphery of this top shell 11.And form a medial launder 14 between top shell 11 and the drain pan 13, be used to load the required electrolysis materials such as electrolyte of capacitor in this medial launder 14.Why the utility model allows drain pan 13 inclusions on heat-resisting plastic tube 12, be because this structure under high-temperature heating, the junction between heat-resisting plastic tube 12 and the drain pan 13 is difficult for deforming, thereby has guaranteed good thermal endurance and sealing.Be more preferably, described heat-resisting plastic tube 12 is circular-arc with drain pan 13 contacted corners 121, form certain space 122 between this circular-arc corner 121 and the drain pan 13, this space 122 can be the effect that heat-resisting plastic tube 12 provides the distortion buffering under extruding or heating status, so sealing is better.
As shown in Figure 3, the cross section of described heat-resisting plastic tube 12 roughly is symmetrical dual U-shaped (being U-shaped inner bending structure).This heat-resisting plastic tube 12 has high-fire resistance, can be by heat-resisting synthetic engineering plastic punch forming or injection mo(u)lding.The heat-resisting synthetic engineering plastic punch forming of heat-resisting plastic tube 12 preferred employings is because the plastic cement thin-walled often is difficult for injection mo(u)lding.
Described top shell 11 and/or drain pan 13 preferably are made of metal, and are more preferably both and are made by the stainless steel punch die.As shown in Figure 4, described top shell 11 preferably is dish, and the periphery of top shell 11 is bending type, and this bending type helps between top shell 11 and the heat-resisting plastic tube 12 better fixing, and the periphery of top shell 11 directly is inserted in the inner bending structure of heat-resisting plastic tube 12, can finish both assemblings.As shown in Figure 5, described drain pan 13 is preferably cup-shaped.Be pointed out that top of the present utility model shell 11 and drain pan 13 are not limited to them aspect size and dimension, it can be decided according to the actual requirements.
The manufacturing process of the utility model capacitor package structure contains part manufacturing and encapsulation two large divisions:
One, part manufacturing process example, the branch of its each step and out-of-order.
1) opening diel, be as shown in Figure 4 Saucer Top shell 11 with a stainless steel substrates punch forming, and the periphery of top shell 11 is bending type.
2) opening diel, is as shown in Figure 5 cup-shaped drain pan 13 with a stainless steel substrates punch forming.
3) adopt heat-resisting engineering plastic material extrusion molding plastic slice, on plastic slice, carry out again punching press form some as shown in Figure 3 double-U-shaped heat-resisting plastic tube 12, it compares the heat-resisting plastic tube 12 with injection mo(u)lding, and it has production efficiency height, precision height, cost is low, waste material is few, easily reclaim and because of save advantage such as cooling time without colloidal sol.
Two, packaging process example.
1) stainless steel top shell 11 is inserted in the heat-resisting plastic tube 12, as shown in Figure 6, the periphery of top shell 11 is contained in the dual U-shaped inner bending structure of heat-resisting plastic tube 12, preferably, the external diameter R of top shell 11 is a bit larger tham the internal diameter r of heat-resisting cushion rubber 12, the external diameter R of preferred top shell 11 is than the big 0.02mm to 0.04mm of internal diameter r of heat-resisting cushion rubber 12, and top shell 11 is inserted in the heat-resisting plastic tube 12 and has frictional force, difficult drop-off like this.Described heat-resisting plastic tube 12 and top shell 11 can directly fit together, and do not need top shell 11 imbedded that bound edge is injection molded into heat-resisting plastic tube 12 in the injection molding, so manufacturing process is more simple, does not need to drop into a large amount of injection moulding machines, and productivity ratio is higher.
2) electrolysis materials such as spongioplasm electrolysis material or electrolyte of in being inserted in the stainless steel top shell 11 of heat-resisting plastic tube 12, packing into.
3) stainless steel lower casing 13 is enclosed within from bottom to up heat-resisting plastic tube 12 the outside.
4) as shown in Figure 7, after packaging, top shell 11, heat-resisting plastic tube 12 and 13 3 parts of lower casing put into down in the fixed die 22, and with upper trimming die 21 punching presses, make drain pan 13 and heat-resisting plastic tube 12 be stamped behind the flanging inclusion on the periphery of top shell 11, can reach insulation and sealing effectiveness, thereby final molding is the capacitor package structure 10 shown in 2.
Though capacitor has little, the capacious advantage of volume, it is inserted in after wiring board (as pcb board) goes up, also will be through the reflow process of reflow stove, general reflow furnace temperature is between 265~275 ℃, about 20 seconds of time.The hot melt distortion takes place through regular meeting in existing capacitor package structure in reflow process, capacitor package structure of the present utility model then can be born this reflow furnace temperature fully, has therefore effectively guaranteed the manufacturing qualification rate of product.
In sum, capacitor package structure of the present utility model is made of top shell, heat-resisting plastic tube and drain pan, and the periphery of described top shell is contained in the bending structure of heat-resisting plastic tube, and this drain pan and heat-resisting plastic tube flanging are coated on the periphery of this top shell.Under this structure, this capacitor package structure has high temperature resistant, the on-deformable advantage of being heated, and it is high temperature resistant to reach 265~290 ℃; Secondly, this capacitor package structure coats the top shell with drain pan and heat-resisting plastic tube punching press flanging together, and this heat-resisting plastic tube is squeezed and can produces strain and then fit tightly with drain pan, so better tightness, can not leak electrolyte; In addition, the employed part of this capacitor package structure is less, only needs these three parts of top shell, heat-resisting plastic tube and drain pan, saved existing in pot shell, can reduce cost of goods manufactured and required precision is low; And described heat-resisting plastic tube and top shell can directly fit together, and do not need the top shell is imbedded the heat-resisting plastic tube of package injection molding in the injection molding, so manufacturing process are more simple; Then, described heat-resisting plastic tube and the contacted corner of drain pan are circular-arc, form certain space between this circular-arc corner and the drain pan, and this space can be the effect that heat-resisting plastic tube provides the distortion buffering under extruding or heating status, so sealing is better.Be more preferably, heat-resisting plastic tube adopts heat-resisting synthetic engineering plastic punch forming, so not only can overcome the problem that the plastic cement thin-walled is difficult for injection mo(u)lding, also has production efficiency height, precision height, advantages such as cost is low, waste material is few, easy recovery.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1, a kind of capacitor package structure, it is characterized in that, comprise top shell, heat-resisting plastic tube and drain pan, described heat-resisting plastic tube is provided with the inner bending structure, the periphery of described top shell is contained in the inner bending structure of described heat-resisting plastic tube, this drain pan is from the outside that is enclosed within this heat-resisting plastic tube down, and this drain pan and heat-resisting plastic tube flanging are coated on the periphery of this top shell, and form a medial launder between this top shell and drain pan.
2, capacitor package structure according to claim 1 is characterized in that, the external diameter of described top shell is a bit larger tham the internal diameter of described heat-resisting cushion rubber.
3, capacitor package structure according to claim 1 is characterized in that, the periphery of described top shell is bending type, and the periphery of described top shell is inserted in the inner bending structure of described heat-resisting plastic tube.
4, capacitor package structure according to claim 1 is characterized in that, described top shell is dish; And/or described drain pan is cup-shaped.
5, capacitor package structure according to claim 1 is characterized in that, described top shell and/or drain pan are made by metal die.
6, capacitor package structure according to claim 1 is characterized in that, the cross section of described heat-resisting plastic tube roughly is symmetrical dual U-shaped.
7, capacitor package structure according to claim 1 is characterized in that, described heat-resisting plastic tube and the contacted corner of described drain pan are circular-arc.
8, capacitor package structure according to claim 1 is characterized in that, described capacitor is patch capacitor device or plug-in unit capacitor.
According to each described capacitor package structure of claim 1~8, it is characterized in that 9, described heat-resisting plastic tube is by heat-resisting synthetic engineering plastic punch forming.
According to each described capacitor package structure of claim 1~8, it is characterized in that 10, described heat-resisting plastic tube is by heat-resisting synthetic engineering plastic injection mo(u)lding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201356802U CN201402743Y (en) | 2009-03-17 | 2009-03-17 | Capacitor packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009201356802U CN201402743Y (en) | 2009-03-17 | 2009-03-17 | Capacitor packaging structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201402743Y true CN201402743Y (en) | 2010-02-10 |
Family
ID=41662543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009201356802U Expired - Fee Related CN201402743Y (en) | 2009-03-17 | 2009-03-17 | Capacitor packaging structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201402743Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108067555A (en) * | 2016-11-08 | 2018-05-25 | 富鼎电子科技(嘉善)有限公司 | The forming method of metalwork |
-
2009
- 2009-03-17 CN CN2009201356802U patent/CN201402743Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108067555A (en) * | 2016-11-08 | 2018-05-25 | 富鼎电子科技(嘉善)有限公司 | The forming method of metalwork |
CN108067555B (en) * | 2016-11-08 | 2020-03-17 | 富鼎电子科技(嘉善)有限公司 | Metal part forming method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201715908U (en) | Integral sintered flat heat pipe | |
US7895747B2 (en) | Method for manufacturing a heat pipe with a planished end surface | |
CN101526319B (en) | Heat-conducting plate with wick supporting structures and method for manufacturing same | |
CN203432427U (en) | Vapor chamber structure | |
CN107588672A (en) | A kind of equalizing plate structure and its manufacture method | |
CN203704739U (en) | Heterogeneouscombined typeheat-conducting device | |
CN101839663A (en) | Sintered flat plate heat pipe and manufacturing method thereof | |
CN201402743Y (en) | Capacitor packaging structure | |
CN104952808A (en) | Presetting gold-tin cover plate and manufacturing method thereof | |
CN201465804U (en) | Capacitor packaging structure | |
US8505183B2 (en) | Method for sealing edges of vapor chamber | |
CN201402742Y (en) | Capacitor packaging structure | |
CN107560475A (en) | Temperature-uniforming plate and its manufacture method | |
CN2938719Y (en) | Temp. evenness plate structure | |
CN201787842U (en) | Soaking plate | |
CN105716459A (en) | Opening sealing method for heat transfer unit | |
CN102573327B (en) | The manufacture method of a kind of special power electronic circuit board for power supply and power model | |
CN201352500Y (en) | Chip capacitor packaging structure | |
US20110192576A1 (en) | Vapor chamber and edge-sealing structure thereof | |
CN201364818Y (en) | Plug-in capacitor encapsulating structure | |
CN110535248B (en) | Mobile terminal, wireless charging module and preparation method thereof | |
CN101854777A (en) | Fabricating methods for special power electronic circuit board for power supply and power module | |
CN202134580U (en) | Lithium ion battery and packaging foil of lithium ion battery | |
CN202941084U (en) | Hollow-type uniform temperature plate | |
CN204994167U (en) | Bering device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20130317 |