CN201439182U - 化学机械研磨装置 - Google Patents
化学机械研磨装置 Download PDFInfo
- Publication number
- CN201439182U CN201439182U CN2009200750360U CN200920075036U CN201439182U CN 201439182 U CN201439182 U CN 201439182U CN 2009200750360 U CN2009200750360 U CN 2009200750360U CN 200920075036 U CN200920075036 U CN 200920075036U CN 201439182 U CN201439182 U CN 201439182U
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- grinding
- lapping liquid
- supply pipe
- liquid supply
- grinding pad
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009200750360U CN201439182U (zh) | 2009-07-21 | 2009-07-21 | 化学机械研磨装置 |
Applications Claiming Priority (1)
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CN2009200750360U CN201439182U (zh) | 2009-07-21 | 2009-07-21 | 化学机械研磨装置 |
Publications (1)
Publication Number | Publication Date |
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CN201439182U true CN201439182U (zh) | 2010-04-21 |
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Family Applications (1)
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CN2009200750360U Expired - Fee Related CN201439182U (zh) | 2009-07-21 | 2009-07-21 | 化学机械研磨装置 |
Country Status (1)
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CN (1) | CN201439182U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102335869A (zh) * | 2010-07-21 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置和方法 |
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2009
- 2009-07-21 CN CN2009200750360U patent/CN201439182U/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102335869A (zh) * | 2010-07-21 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | 化学机械研磨装置和方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121108 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100421 Termination date: 20180721 |
|
CF01 | Termination of patent right due to non-payment of annual fee |