CN201438461U - 一种新型cmos图像传感器模组 - Google Patents

一种新型cmos图像传感器模组 Download PDF

Info

Publication number
CN201438461U
CN201438461U CN2009201515476U CN200920151547U CN201438461U CN 201438461 U CN201438461 U CN 201438461U CN 2009201515476 U CN2009201515476 U CN 2009201515476U CN 200920151547 U CN200920151547 U CN 200920151547U CN 201438461 U CN201438461 U CN 201438461U
Authority
CN
China
Prior art keywords
pcb substrate
sensor module
image sensor
chips
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009201515476U
Other languages
English (en)
Inventor
王国建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JACAL ELECTRONIC (WUXI) CO Ltd
Original Assignee
JACAL ELECTRONIC (WUXI) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JACAL ELECTRONIC (WUXI) CO Ltd filed Critical JACAL ELECTRONIC (WUXI) CO Ltd
Priority to CN2009201515476U priority Critical patent/CN201438461U/zh
Application granted granted Critical
Publication of CN201438461U publication Critical patent/CN201438461U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

本实用新型涉及一种新型CMOS图像传感器模组，包括PCB基板，所述PCB基板的两侧均设有芯片，两个芯片上均罩有盖板，其中右侧盖板的内部设有光学玻璃，所述PCB基板的两个侧面分布有若干个电阻和电容，PCB基板的边缘处设有四个相互对称的定位孔。本实用新型有益效果为：由于将芯片直接粘接在基板上，省去了原来的PCB板和引线框等材料，由于采用了专用盖板，使得返工维修更加方便，由于专用盖板与目前常规产品的外框相当，通用性也较强；制造周期短，成本低。

Description

一种新型CMOS图像传感器模组
技术领域
本实用新型涉及一种新型CMOS图像传感器模组。
背景技术
现有的CMOS图像传感器模组首先需要将DSP芯片和CMOS图像传感器芯片通过常规的集成电路封装工艺制作成单颗的IC，然后将已封装好的CMOS图像传感器和与其匹配的DSP(IC)通过表面贴装的方法与其他原器件一起贴到PCB上，形成CMOS图像传感器模组。此方案制作周期较长，涉及到的设备资源多，成本高。
实用新型内容
本实用新型的目的是提供一种新型CMOS图像传感器模组，大大缩短了生产周期，又可省去CMOS图像传感器的PCB板和DSP的引线框等物料，降低成本。
本实用新型的目的是通过以下技术方案来实现：
一种新型CMOS图像传感器模组，包括PCB基板，所述PCB基板的两侧均设有芯片，两个芯片上均罩有盖板，其中右侧盖板的内部设有光学玻璃，所述PCB基板的两个侧面分布有若干个电阻和电容，PCB基板的边缘处设有四个相互对称的定位孔。
本实用新型的有益效果为：由于将芯片直接粘接在基板上，省去了原来的PCB板和引线框等材料，于采用了专用盖板，使得返工维修更加方便，由于专用盖板与目前常规产品的外框相当，通用性也较强；制造周期短，成本底。
附图说明
下面根据附图对本实用新型作进一步详细说明。
图1是本实用新型实施例所述一种新型CMOS图像传感器模组的主视图；
图2是本实用新型实施例所述一种新型CMOS图像传感器模组的后视图；
图3是本实用新型实施例所述一种新型CMOS图像传感器模组的侧视图。
图中：
1、PCB基板；2、芯片；3、盖板；4、电阻；5、电容；6、定位孔；7、光学玻璃。
具体实施方式
如图1-3所示，本实用新型实施例所述的一种新型CMOS图像传感器模组，包括PCB基板1，所述PCB基板1的两侧均设有芯片2，两个芯片2上均罩有盖板3，便于返工和维修，其中右侧盖板3的内部设有光学玻璃7，所述PCB基板1的两个侧面分布有若干个电阻4和电容5，PCB基板1的边缘处设有四个相互对称的定位孔6。

Claims (1)

1.一种新型CMOS图像传感器模组，包括PCB基板(1)，其特征在于：所述PCB基板(1)的两侧均设有芯片(2)，两个芯片(2)上均罩有盖板(3)，其中右侧盖板(3)的内部设有光学玻璃(7)，所述PCB基板(1)的两个侧面分布有若干个电阻(4)和电容(5)，PCB基板(1)的边缘处设有四个相互对称的定位孔(6)。
CN2009201515476U 2009-04-29 2009-04-29 一种新型cmos图像传感器模组 Expired - Fee Related CN201438461U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201515476U CN201438461U (zh) 2009-04-29 2009-04-29 一种新型cmos图像传感器模组

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201515476U CN201438461U (zh) 2009-04-29 2009-04-29 一种新型cmos图像传感器模组

Publications (1)

Publication Number Publication Date
CN201438461U true CN201438461U (zh) 2010-04-14

Family

ID=42400432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201515476U Expired - Fee Related CN201438461U (zh) 2009-04-29 2009-04-29 一种新型cmos图像传感器模组

Country Status (1)

Country Link
CN (1) CN201438461U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110023721A (zh) * 2016-11-29 2019-07-16 森西欧有限公司 集成电路传感器封装及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110023721A (zh) * 2016-11-29 2019-07-16 森西欧有限公司 集成电路传感器封装及其制造方法
US11175162B2 (en) 2016-11-29 2021-11-16 Sencio B.V. Integrated circuit sensor package and method of manufacturing the same

Similar Documents

Publication Publication Date Title
CN107071238A (zh) 一种超薄高清摄像头模组及其制造工艺
WO2008133943A8 (en) Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
WO2010123199A3 (ko) 광전변환모듈
TW200634940A (en) Sensor semiconductor device and method for fabricating the same
CN203722705U (zh) 摄像模组及摄像装置
CN201226592Y (zh) 软性线路板封装的硅麦克风
CN105321973A (zh) 一种覆晶摄像头及其制作方法
CN104506759B (zh) 一种没有电路板的摄像头模组器件及其组装方法
CN201438461U (zh) 一种新型cmos图像传感器模组
TW200733030A (en) Light source driving device with light sensor module and electronic device using the same
CN206212140U (zh) 图像传感器模块
CN202977376U (zh) 传感器封装模块
CN208874642U (zh) 一种摄像头的模组
CN205122586U (zh) 影像传感器封装及具有该封装的摄像头模组
CN207542208U (zh) 一种电子元器件封装设备
CN204272252U (zh) 一种没有电路板的摄像头模组器件
TW201419741A (zh) 超薄微型橋堆整流器
CN204516746U (zh) 可插拔fpc的指纹传感器封装结构
CN108401393B (zh) 一种电路板固定装置
CN203933533U (zh) 一种可分离式光伏接线盒
US20110090660A1 (en) Printed circuit board
CN201590754U (zh) 贴片折弯式整流桥
CN202443423U (zh) 光学鼠标感测器模块
CN201149870Y (zh) 一种新型太阳能电池组件
CN201170806Y (zh) 一种新型结构的摄像头芯片尺寸模组

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100414

Termination date: 20170429

CF01 Termination of patent right due to non-payment of annual fee