CN201335276Y

CN201335276Y - LED module illuminating lamp

Info

Publication number: CN201335276Y
Application number: CNU2008202058276U
Authority: CN
Inventors: 刘东芳
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-12-23
Filing date: 2008-12-23
Publication date: 2009-10-28
Anticipated expiration: 2018-12-23

Abstract

The utility model discloses an LED module illuminating lamp which comprises at least one module. Each module consists of a housing, a radiation fin, at least one LED chip, a lamp cup and pins, wherein the radiation fin is arranged at the bottom of the inner ring of the housing, the at least one LED chip is arranged on the top surface of the radiation fin, heat-transfer insulating rubber is placed between the LED chip and the radiation fin, each LED chip is provided with two pins as leads, the lamp cup is arranged in the recessed part of the radiation fin, and the LED chip is embedded inside the lamp cup. The LED chips inside the module are in a parallel connection and the modules are in a series connection. The housing is a hexagonal insulating member or of other polygonal shapes. The LED chip is a low-power LED chip (20 mA) or a large-power LED chip (350 mA). The LED chip adopts the dispersed arrangement and the longitudinal/transverse heat dissipation treatment, thereby increasing the heat dissipation area. Additionally, the LED in the dispersed arrangement inside the same module achieves the effect of mutual light-distribution; and by the arrangement of the LEDs of different colors inside the housing in a combination with the external circuit design, the mixed lights of different colors are achieved at different time periods.

Description

A kind of LED module illuminating lamp

Technical field

The utility model relates to a kind of LED illuminating lamp, relates in particular to a kind of hexagon module LED illuminating lamp.

Background technology

The same with conventional light source, semiconductor light-emitting-diode (LED) also can produce heat during operation, and how much it depends on whole luminous efficiency.Power up outside under the energy, the radiation recombination generation electroluminescent in electronics and hole, semiconductor medium and encapsulation medium that near the light that radiates the P-N knot also need pass through wafer (chip) itself just can arrive at external world's (air).Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, wafer exterior light are taken out efficient etc., have quite a few energy mainly to transform heat energy with the form of the lattice vibration of non-radiative compound generation.And the rising of chip temperature then can strengthen non-radiative compoundly, further slackens luminous efficiency.

LED lighting on the market is that many LED are carried out the connection in series-parallel combination now.

1): if carry out the connection in series-parallel combination with great power LED, because great power LED is taked the heatsink transverse mode, be the heat that PN junction produces to be distributed by LED base fin, because the chip of great power LED adopts stack to pile up and places, so the heat that PN junction produced is by distributing that fin is concentrated, because heat flow rate per unit area is limited, so also is easy to cause heat build-up, the PN junction junction temperature can cause bad phenomenon such as LED light decay also just along with rising.

2): if carry out the connection in series-parallel combination with the 20mA low-power LED, low-power LED is taked vertical radiating mode, be the heat that PN junction produces to be distributed by the LED pin, because the radiating surface of pin is little, heat dissipation capacity is limited in unit interval, LED can be in the heat build-up state like this, and the PN junction junction temperature equally also can cause bad phenomenon such as LED light decay also just along with rising.And the usage quantity of LED can roll up, and in limited space, also is a necessary considerable problem to the components and parts layout on the circuit board.

3): LED illuminating lamp on the market is LED to be connected or the connection in series-parallel combination now, if take to be connected in series, when a LED breaks down, will influence the operate as normal of whole illuminating lamp; If adopt connection in series-parallel to connect, when one or several LED breaks down, one group or several groups bad phenomenon such as do not work will appear.

The utility model content

At above deficiency, the utility model proposes a kind of LED module illuminating lamp, it comprises at least one module, each module comprises housing, fin, led chip and pin, and fin is located at the inner ring bottom of housing, is provided with at least 1 led chip on fin, be filled with thermal conductive insulation glue between led chip and the fin, corresponding 2 pins of each led chip are drawn, and the led chip in the module adopts parallel-connection structure, adopts cascaded structure between module.Housing is the hexagon insulating materials, and housing also can be other polygon, and led chip (3) adopts 20mA low-power LED chip or 350mA high-power LED chip.

Another kind of scheme of the present utility model is to be provided with Lamp cup between fin and led chip, and Lamp cup is arranged on the indentation of fin, and led chip places Lamp cup.

Advantage of the present utility model:

1) LED takes distributed layout and vertical, horizontal radiating treatment, and area of dissipation increases, and can effectively solve the drawback of the heat radiation difficulty of small-power and great power LED existence;

2) LED that distributing is arranged in the same module can realize mutual luminous intensity distribution, has solved the difficult problem of light fixture secondary light-distribution;

3) LED of discharging different colours in housing, by the external circuit design, the different periods can be sent the mixed light of different colours again;

4) according to the external circuit design, can take the connection in series-parallel connected mode flexibly to LED in the module;

5) Lamp cup can carry out optically focused to LED, strengthens the directionality and the centrality of led light source, and it is simple in structure, and cost is low.

Description of drawings

Fig. 1 is led chip modular structure figure;

Fig. 2 is a led chip module internal structure chart;

Fig. 3 is a led chip module internal circuit diagram;

Fig. 4 is at least 2 circuit diagrams between the led chip module.

The specific embodiment

Below in conjunction with accompanying drawing the utility model is introduced.

The LED module illuminating lamp that the utility model relates to comprises at least one module, each module comprises housing (1), fin (2), led chip (3) and pin (4), fin (2) is located at the inner ring bottom of housing (1), on fin, be provided with at least 1 led chip, be filled with thermal conductive insulation glue between led chip (3) and the fin (2), corresponding 2 pins of each led chip are drawn.Housing (1) is hexagon or other polygon insulating materials, and led chip (3) adopts 20mA low-power LED chip or 350mA high-power LED chip, and the led chip in the module adopts parallel-connection structure, adopts cascaded structure between module.

Another kind of scheme of the present utility model can also be provided with Lamp cup (5) between fin (2) and led chip (3), Lamp cup is arranged on the indentation of fin, and led chip (3) places Lamp cup (5), (as depicted in figs. 1 and 2).

Be that example describes with hexagon LED module illuminating lamp below,

Hexagon LED module comprises the frame shape housing of being made by insulating materials, the inner ring bottom of housing is provided with fin, is provided with 6n LED on fin, and n is a natural number, be filled with thermal conductive insulation glue between LED and the fin, the pin of LED extracts from the sidewall of housing; Fin is provided with ccontaining LED and forms the Lamp cup of LED optically focused reflecting surface, and Lamp cup is arranged on the circular-arc indentation on the fin.This LED module is that a kind of good heat dissipation, layout are convenient, the simple single-chip LED combination of concentration structure.6 even more a plurality of 20mA low-power LED chip or 350mA high-power LED plane formula dispersed combination in same housing.In housing, use no matter be 20mA low-power LED chip, or 350mA great power LED, because what the LED module was taked is the vertical, horizontal radiating treatment, area of dissipation increases, can effectively solve the drawback of the heat radiation difficulty of small-power and great power LED existence, thereby the raising light efficiency, the service life of prolongation LED.

LED module lighting lamp circuit adopts the matrix form layout, and promptly LED adopts parallel-connection structure in the module, and membrane module adopts cascaded structure, as shown in Figure 3 and Figure 4.When one of them or several LED break down, the illumination that can not influence whole light fixture is used; Can reduce light fixture maintenance frequency and cost, prolong the service life of light fixture.

Claims

1, a kind of LED module illuminating lamp, it is characterized in that, it comprises at least one module, each module comprises housing (1), fin (2), led chip (3) and pin (4), and fin (2) is located at the inner ring bottom of housing (1), is provided with at least 1 led chip on fin, be filled with thermal conductive insulation glue between led chip (3) and the fin (2), corresponding 2 pins of each led chip are drawn, and the led chip in the module adopts parallel-connection structure, adopts cascaded structure between module.

2, LED module illuminating lamp according to claim 1 is characterized in that, is provided with Lamp cup (5) between described fin (2) and the led chip (3), and Lamp cup is arranged on the indentation of fin, and led chip (3) places Lamp cup (5).

3, LED module illuminating lamp according to claim 1 is characterized in that, described housing (1) is the hexagon insulating materials.

4, LED module illuminating lamp according to claim 1 is characterized in that, described led chip (3) adopts 20mA low-power LED chip or 350mA high-power LED chip.