CN101509612A - High power LED module - Google Patents
High power LED module Download PDFInfo
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- CN101509612A CN101509612A CNA2009100380832A CN200910038083A CN101509612A CN 101509612 A CN101509612 A CN 101509612A CN A2009100380832 A CNA2009100380832 A CN A2009100380832A CN 200910038083 A CN200910038083 A CN 200910038083A CN 101509612 A CN101509612 A CN 101509612A
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- power led
- great power
- power leds
- shell
- light
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Abstract
The invention discloses a high-power LED module, and is characterized in that the high-power LED module comprises a frame shell (1) made of insulating material, the bottom of the inner ring of the shell (1) is provided with a radiating rib (2), at least two high-power LEDs (3) are arranged at the radiating rib (2), heat conductive insulating glue is filled between the high-power LEDs (3) and the radiating rib (2), and pins (4) of the high-power LEDs (3) are guided out of the lateral wall of the shell (1). Two or even more high-power LEDs are placed in the same shell, thereby saving PCB (printed circuit board) space for the design of a light source circuit board, simultaneously facilitating the arrangement of electronic components and also having good radiating effect. The high-power LEDs arranged in a scattered manner in the same module can realize mutual light distribution, thereby solving the problem of secondary light distribution of light apparatus; and differently colored high-power LEDs are arranged in the shell so that differently colored mixed light can be emitted at different periods by means of external circuit design. Moreover, a lamp cup can focus the light of the high-power LEDs, thereby enhancing directional property and concentricity of high-power LED light source with simple structure and low cost.
Description
Technical field
The invention belongs to the technical field of semiconductor devices, be specifically related to a kind of great power LED module that uses light emitting diode as light source.
Background technology
The same with conventional light source, semiconductor light-emitting-diode (LED) also can produce heat during operation, and how much it depends on whole luminous efficiency.Power up outside under the energy, the radiation recombination generation electroluminescent in electronics and hole, semiconductor medium and encapsulation medium that near the light that radiates the P-N knot also need pass through wafer (chip) itself just can arrive at external world's (air).Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, wafer exterior light are taken out efficient etc., have quite a few energy mainly to transform heat energy with the form of the lattice vibration of non-radiative compound generation.And the rising of chip temperature then can strengthen non-radiative compoundly, further slackens luminous efficiency.
How to solve the heat radiation of LED, the heat that PN junction is produced can distribute as soon as possible, not only can improve the luminous efficiency of product, has also improved reliability of products and life-span simultaneously; In view of LED to the having relatively high expectations of radiating condition, the limit value if the PN junction junction temperature is above standard will cause irrecoverable property light intensity attenuation.
Present LED is divided into low-power LED and power-type LED, and wherein input power belongs to low-power LED below tens of mW; And power-type LED is divided into two kinds of common power LED and W level power LEDs, and input power is a W level power LED more than or equal to the LED of 1W, and remaining is common power LED; With LED that must be wider is low-power LED and W level power LED (great power LED).
High-power LED lighting fixture on the market is that many great power LEDs are carried out the connection in series-parallel combination now.
If carry out the connection in series-parallel combination with great power LED, because great power LED is taked the heatsink transverse mode, be the heat that PN junction produces to be distributed by LED base fin, because the chip of great power LED adopts stack to pile up and places, so the heat that PN junction produced is by distributing that fin is concentrated, because heat flow rate per unit area is limited, so also is easy to cause heat build-up, the PN junction junction temperature can cause bad phenomenon such as great power LED light decay also just along with rising.
In addition, the concentration structure of existing high-powered LED lamp also exists cost to compare problem of higher.
Summary of the invention
The object of the present invention is to provide a kind of good heat dissipation, convenient, the simple great power LED module of concentration structure of layout.
For solving the problems of the technologies described above, the technical solution used in the present invention is: the great power LED module, comprise the frame shape housing of making by insulating materials, the inner ring bottom of housing is provided with fin, on fin, be provided with at least two great power LEDs, be filled with thermal conductive insulation glue between great power LED and the fin, the pin of great power LED extracts from the sidewall of housing.
Described fin is provided with house high power LED and forms the Lamp cup of great power LED optically focused reflecting surface.
Described Lamp cup is provided in a side of the circular-arc indentation on the fin.
Owing to adopted above-mentioned structure, the present invention has following beneficial effect:
1), two even more a plurality of high-power LED chip plane formula dispersed combination in same housing, the PCB space is saved in design for the circuit of light sources plate, makes things convenient for the layout of electronic component simultaneously;
2), great power LED takes distributed layout in same housing, take the vertical, horizontal radiating treatment, area of dissipation increases, can effectively solve the drawback of the heat radiation difficulty of single great power LED existence, junction temperature when having effectively reduced great power LED work can make the PN junction junction temperature of great power LED be controlled at below 80 ℃; Avoid causing the irreversibility light decay;
3), distributing is arranged in the same module great power LED can realize mutual luminous intensity distribution, solved the difficult problem of light fixture secondary light-distribution;
4): the great power LED of discharging different colours in housing, by the external circuit design, the different periods can be sent the mixed light of different colours again;
5), according to external circuit design, can take the connection in series-parallel connected mode flexibly to great power LED in the module;
6), Lamp cup can carry out optically focused to great power LED, strengthens the directionality and the centrality of high-power LED light source, it is simple in structure, cost is low.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail, but does not constitute any limitation of the invention.
Fig. 1 is the stereogram of great power LED module;
Fig. 2 is the phantom of Fig. 1.
The specific embodiment
As depicted in figs. 1 and 2, great power LED module of the present invention comprises housing 1, housing 1 is made by insulating materials, be shaped as rectangle frame shape, housing 1 also can be made other different shapes according to actual needs, as square, rhombus, pentagon, circle, ellipse etc.The inner ring bottom of housing 1 is provided with fin 2, and fin 2 can be made by the good material of heat conduction such as metal.On fin 2, be provided with at least two great power LEDs 3, be filled with thermal conductive insulation glue between great power LED 3 and the fin 2, the heat that produces during great power LED 3 energisings can directly be delivered on the fin by thermal conductive insulation glue fast, distributes through fin again.Also be provided with house high power LED3 and form the Lamp cup 5 of great power LED 3 optically focused reflectings surface on fin 2, described Lamp cup 5 can be formed by the circular-arc groove that is located on the fin 2, and it is more easily made, and cost is low.Select 10 Lamp cups 5 among the figure for use, also can be other numbers certainly.Great power LED 3 is separately positioned in each Lamp cup 5, and thermal conductive insulation glue is filled between great power LED 3 and the Lamp cup 5, and the shape of thermal conductive insulation glue and great power LED 3 is not clearly drawn in the drawings.10 great power LEDs 3 have 20 pins, and pin 4 extracts from the sidewall of housing 1, and the power supply that is used for great power LED 3 connects.
Claims (3)
1. great power LED module, it is characterized in that: comprise the frame shape housing of making by insulating materials (1), the inner ring bottom of housing (1) is provided with fin (2), on fin (2), be provided with at least two great power LEDs (3), be filled with thermal conductive insulation glue between great power LED (3) and the fin (2), the pin (4) of great power LED (3) extracts from the sidewall of housing (1).
2. according to the described great power LED module of claim 1, it is characterized in that: described fin (2) is provided with house high power LED (3) and forms the Lamp cup (5) of great power LED (3) optically focused reflecting surface.
3. according to claim 1 or 2 described great power LED modules, it is characterized in that: described Lamp cup (5) is provided in a side of the circular-arc indentation on the fin (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100380832A CN101509612A (en) | 2009-03-20 | 2009-03-20 | High power LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100380832A CN101509612A (en) | 2009-03-20 | 2009-03-20 | High power LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101509612A true CN101509612A (en) | 2009-08-19 |
Family
ID=41002098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100380832A Pending CN101509612A (en) | 2009-03-20 | 2009-03-20 | High power LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101509612A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103277760A (en) * | 2013-06-06 | 2013-09-04 | 东莞博用电子科技有限公司 | LED distributing method applied in LED sectional driving circuit |
| CN108250593A (en) * | 2018-02-08 | 2018-07-06 | 河南工业大学 | A kind of manufacturing method of the insulation system of power electronic devices |
-
2009
- 2009-03-20 CN CNA2009100380832A patent/CN101509612A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103277760A (en) * | 2013-06-06 | 2013-09-04 | 东莞博用电子科技有限公司 | LED distributing method applied in LED sectional driving circuit |
| CN103277760B (en) * | 2013-06-06 | 2015-08-19 | 深圳博用科技有限公司 | Be applied in the LED layout method in LED drive part by part circuit |
| CN108250593A (en) * | 2018-02-08 | 2018-07-06 | 河南工业大学 | A kind of manufacturing method of the insulation system of power electronic devices |
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Open date: 20090819 |