CN201332540Y - PCB (printed circuit board) helpful for high-power element to radiate heat - Google Patents

PCB (printed circuit board) helpful for high-power element to radiate heat Download PDF

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Publication number
CN201332540Y
CN201332540Y CNU2008201302668U CN200820130266U CN201332540Y CN 201332540 Y CN201332540 Y CN 201332540Y CN U2008201302668 U CNU2008201302668 U CN U2008201302668U CN 200820130266 U CN200820130266 U CN 200820130266U CN 201332540 Y CN201332540 Y CN 201332540Y
Authority
CN
China
Prior art keywords
pcb board
pcb
cooling piece
power element
helpful
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201302668U
Other languages
Chinese (zh)
Inventor
吴茂东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taizhou Huineng photoelectric Co Ltd
Original Assignee
ZHEJIANG HABO ELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG HABO ELECTRONICS TECHNOLOGY Co Ltd filed Critical ZHEJIANG HABO ELECTRONICS TECHNOLOGY Co Ltd
Priority to CNU2008201302668U priority Critical patent/CN201332540Y/en
Application granted granted Critical
Publication of CN201332540Y publication Critical patent/CN201332540Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a PCB helpful for a high-power element to radiate heat, wherein, a slot for plug-in connection with the high-power element is arranged on the face of the PCB, and a refrigeration piece is arranged on the back of the PCB. The utility model aims to improve the heat radiating efficiency of the PCB.

Description

A kind of pcb board of being convenient to the high-power components heat radiation
Technical field
The utility model relates to a kind of pcb board, particularly a kind of pcb board of being convenient to the high-power components heat radiation.
Background technology
Often be provided with electronic component on the existing P CB plate, when electronic component is worked,, can have influence on the performance of pcb board itself if the heat of its generation does not leave as early as possible.At present, the main external surface area that increases pcb board of adopting to be increasing its area of dissipation, when the power ratio of electronic component hour, adopt the mode effect of external surface area heat radiation fine, when the power ratio of electronic component is big, adopt the mode of external surface area heat radiation just to be difficult to efficiently radiates heat.
The utility model content
The utility model provides a kind of pcb board of being convenient to the high-power components heat radiation, improves the radiating efficiency of pcb board.
The utility model provides a kind of pcb board of being convenient to high-power components heat radiation, the front of described pcb board be provided for the pegging graft slot of high-power components, and the back side of described pcb board is provided with cooling piece.
Further, between described cooling piece and the described pcb board heat-conducting glue is arranged.
Further, described cooling piece series connection adjustable resistance.
By cooling piece pcb board is dispelled the heat, can improve the radiating efficiency of pcb board.
Description of drawings
Figure 1 shows that the structural representation of the pcb board of being convenient to the high-power components heat radiation among the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is done and to be elaborated.
At first with reference to figure 1, the embodiment of the pcb board of being convenient to the high-power components heat radiation that the utility model provides shown in it.In Fig. 1, a kind of pcb board of being convenient to high-power components heat radiation, the front of pcb board 11 be provided for the pegging graft slot 12 of high-power components, the back side of pcb board is provided with cooling piece 13.Dispel the heat by 13 pairs of pcb boards 11 of cooling piece, can improve the radiating efficiency of pcb board.
Can be coated with last layer heat-conducting glue 14 at pcb board 11 back sides, directly cooling piece 13 is bonded on the pcb board 11.
Behind the cooling piece 13 logical upward power supplys, the cold junction of the heat transferred cooling piece 13 of pcb board 11, the transfer of heat of cold junction is to the hot junction, thus the realization heat radiation; The operating current of regulating cooling piece can be controlled the cooling rate of cooling piece, the adjustable resistance 15 of therefore cooling piece can being connected.
The above only is an embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.

Claims (3)

1, a kind of pcb board of being convenient to high-power components heat radiation is characterized in that, the front of described pcb board be provided for the pegging graft slot of high-power components, and the back side of described pcb board is provided with cooling piece.
2, pcb board according to claim 1 is characterized in that, between described cooling piece and the described pcb board heat-conducting glue is arranged.
3, pcb board according to claim 1 and 2 is characterized in that, described cooling piece series connection adjustable resistance.
CNU2008201302668U 2008-12-15 2008-12-15 PCB (printed circuit board) helpful for high-power element to radiate heat Expired - Fee Related CN201332540Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201302668U CN201332540Y (en) 2008-12-15 2008-12-15 PCB (printed circuit board) helpful for high-power element to radiate heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201302668U CN201332540Y (en) 2008-12-15 2008-12-15 PCB (printed circuit board) helpful for high-power element to radiate heat

Publications (1)

Publication Number Publication Date
CN201332540Y true CN201332540Y (en) 2009-10-21

Family

ID=41225925

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201302668U Expired - Fee Related CN201332540Y (en) 2008-12-15 2008-12-15 PCB (printed circuit board) helpful for high-power element to radiate heat

Country Status (1)

Country Link
CN (1) CN201332540Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106163100A (en) * 2016-09-09 2016-11-23 广西大学 A kind of air energy BGA welding stage heated base

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106163100A (en) * 2016-09-09 2016-11-23 广西大学 A kind of air energy BGA welding stage heated base
CN106163100B (en) * 2016-09-09 2018-09-21 广西大学 A kind of air energy BGA welding stage heated bases

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Zhejiang Baoyu CNC Machine Tools Co., Ltd.

Assignor: Zhejiang Habo Electronics Technology Co., Ltd.

Contract record no.: 2011330000032

Denomination of utility model: PCB (printed circuit board) helpful for high-power element to radiate heat

Granted publication date: 20091021

License type: Exclusive License

Record date: 20110124

ASS Succession or assignment of patent right

Owner name: LUO JIANHUA

Free format text: FORMER OWNER: ZHEJIANG HUBBLE ELECTRONIC SCIENCE AND TECHNOLOGY CO., LTD.

Effective date: 20110815

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 318056 TAIZHOU, ZHEJIANG PROVINCE TO: 318050 TAIZHOU, ZHEJIANG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20110815

Address after: 318050, Fenghuang West Road, Heng Jie Town, Luqiao District, Zhejiang, Taizhou

Patentee after: Luo Jianhua

Address before: 318056, Taizhou District, Zhejiang City, Luqiao Province side streets Tan Village

Patentee before: Zhejiang Habo Electronics Technology Co., Ltd.

ASS Succession or assignment of patent right

Owner name: TAIZHOU HUINENG OPTOELECTRONICS CO., LTD.

Free format text: FORMER OWNER: LUO JIANHUA

Effective date: 20110818

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110818

Address after: 318050, Zhejiang, Taizhou province Luqiao district after the town of Victoria Village

Patentee after: Taizhou Huineng photoelectric Co Ltd

Address before: 318050, Fenghuang West Road, Heng Jie Town, Luqiao District, Zhejiang, Taizhou

Patentee before: Luo Jianhua

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091021

Termination date: 20131215