CN201289865Y - 贴片发光二极管 - Google Patents
贴片发光二极管 Download PDFInfo
- Publication number
- CN201289865Y CN201289865Y CN 200820214162 CN200820214162U CN201289865Y CN 201289865 Y CN201289865 Y CN 201289865Y CN 200820214162 CN200820214162 CN 200820214162 CN 200820214162 U CN200820214162 U CN 200820214162U CN 201289865 Y CN201289865 Y CN 201289865Y
- Authority
- CN
- China
- Prior art keywords
- chip
- emitting diode
- patch light
- light
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820214162 CN201289865Y (zh) | 2008-12-02 | 2008-12-02 | 贴片发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820214162 CN201289865Y (zh) | 2008-12-02 | 2008-12-02 | 贴片发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201289865Y true CN201289865Y (zh) | 2009-08-12 |
Family
ID=40981547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820214162 Expired - Lifetime CN201289865Y (zh) | 2008-12-02 | 2008-12-02 | 贴片发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201289865Y (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117880A (zh) * | 2011-01-24 | 2011-07-06 | 佛山市蓝箭电子有限公司 | 一种表面贴装式led封装体及其制造方法 |
CN102456683A (zh) * | 2010-10-22 | 2012-05-16 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN104681517A (zh) * | 2013-12-03 | 2015-06-03 | 上海北京大学微电子研究院 | 一种适合于led照明应用的多芯片qfn封装 |
-
2008
- 2008-12-02 CN CN 200820214162 patent/CN201289865Y/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102456683A (zh) * | 2010-10-22 | 2012-05-16 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
CN102117880A (zh) * | 2011-01-24 | 2011-07-06 | 佛山市蓝箭电子有限公司 | 一种表面贴装式led封装体及其制造方法 |
CN102117880B (zh) * | 2011-01-24 | 2013-06-05 | 佛山市蓝箭电子股份有限公司 | 一种表面贴装式led封装体及其制造方法 |
CN104681517A (zh) * | 2013-12-03 | 2015-06-03 | 上海北京大学微电子研究院 | 一种适合于led照明应用的多芯片qfn封装 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JUFEI OPTOELECTRONICS CO., LTD Free format text: FORMER NAME: SHENZHEN CITY JUFEI OPTO-ELECTRICAL CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Dongfang Industrial City, 83 Dabao Road, Guangdong, Shenzhen, Baoan District Province, China: 518133 Patentee after: Shenzhen City Jufei Optoelectronic Co., Ltd. Address before: Building 2, building three, Dongfang Ming Industrial City, 83 Dabao Road, 33 District, Guangdong, Shenzhen Province, Baoan District, China: 518000 Patentee before: Shenzhen Jufei Optoelectronic Co., Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 518109 Guangdong city of Shenzhen province Baoan District Dalang Street Community creative Peak Road No. 65 building 1-4 layer Patentee after: Shenzhen City Jufei Optoelectronic Co., Ltd. Address before: 518133 Dongfang Ming Industrial City, 83 Dabao Road, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen City Jufei Optoelectronic Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20090812 |
|
CX01 | Expiry of patent term |