CN110265388A - 基于蜂窝状排列的led面光源光引擎及其生产方法 - Google Patents

基于蜂窝状排列的led面光源光引擎及其生产方法 Download PDF

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CN110265388A
CN110265388A CN201910628831.6A CN201910628831A CN110265388A CN 110265388 A CN110265388 A CN 110265388A CN 201910628831 A CN201910628831 A CN 201910628831A CN 110265388 A CN110265388 A CN 110265388A
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lamp bead
led lamp
light source
led
light engine
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张现金
郑金顺
张培义
董海威
高爱梅
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WEIHAI KINGFULL ELECTRONICS CO Ltd
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WEIHAI KINGFULL ELECTRONICS CO Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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Abstract

本发明涉及一种基于蜂窝状排列的LED面光源光引擎及其生产方法，其解决了现有点阵式照明灯具和COB式照明灯具的技术问题，其设有基板，基板上设有绝缘层，绝缘层上设有导电铜箔，导电铜箔导线节点处设有LED灯珠，LED灯珠为倒装式LED灯珠，倒装式LED灯珠采用微功率类型，倒装式LED灯珠与导电铜箔构成蜂窝状结构排列连接。本发明可广泛应于LED面光源照明技术领域。

Description

基于蜂窝状排列的LED面光源光引擎及其生产方法
技术领域
本发明涉及照明技术领域，特别是涉及一种基于蜂窝状排列的LED面光源光引擎及其生产方法。
背景技术
随着LED照明灯具大规模广泛应用，LED光引擎设计、封装技术也逐步越来越成熟。LED光引擎已经过了点阵式和COB两代模式快速发展，这两种模式，目前在市场上都存在大量应用。
但随着LED照明灯具进入千家万户，点阵式和COB式LED照明灯具自身固有的缺点也暴露的越来越明显。点阵式照明灯具，眩光值比较大，在大部分应用场所，使用者都反映灯具看着非常不舒服；COB式照明灯具，由于自身产生的热量不能快速散发掉，导致COB式LED光引擎光衰比较严重，只能做小功率照明灯具。这两种照明产品固有的缺点已无法满足广大消费者对高舒适度和高照明效果越来越渴望的追求。
发明内容
本发明为了解决现有现有点阵式和COB式LED光引擎存在的固有缺陷的技术问题，提供一种眩光值低、使用寿命长、光效高且能满不同照明领域使用的基于蜂窝状排列的LED面光源光引擎。
本发明提供一种基于蜂窝状排列的LED面光源光引擎，其设有基板，基板上设有绝缘层，绝缘层上设有导电铜箔，导电铜箔导线节点处设有LED灯珠，LED灯珠为倒装式LED灯珠，倒装式LED灯珠采用微功率类型，倒装式LED灯珠与导电铜箔构成蜂窝状结构排列连接。
优选地，倒装式LED灯珠型号为620、1020和/或1430。
优选地，绝缘层、导电铜箔和倒装式LED灯珠上涂覆设有荧光层。
优选地，荧光层通过荧光粉与透明固定胶混合制成。
优选地，荧光层涂覆面积功率比≥0.6。
优选地，基板为铝基板，铝基板为纯铝板。
优选地，基板为柔性线路板。
优选地，柔性线路板，材质为聚酰亚胺薄膜、聚酯薄膜或聚四氟乙烯薄膜。
本发明还提供一种基于蜂窝状排列的LED面光源光引擎生产方法，包括如下步骤：
1)无铅锡膏涂覆到的LED灯珠焊盘上；
2)倒装式LED贴装到焊盘上；
3)通过回流焊，将LED灯珠焊接到铝基板上；
4)在铝基板发光区域的外延涂围坝胶；
5)将荧光粉均匀涂覆到围坝胶围成的区域内；
6)涂覆好荧光粉的铝基板放入到烤箱中烘烤。
优选地，烤箱温度150℃±2℃，烘烤时间2小时。
本发明的有益效果是：
1.本发明采用群量倒装式微功率LED灯珠，群量小电流、微功率倒装式LED灯珠，单颗LED工作电流不超过10mA，LED结温温升不超过40℃，光引擎光衰非常小，使用寿命长；
2.本发明LED灯珠采用蜂窝状布局结构，每颗LED灯珠的负极与其相连的多颗LED灯珠的正极都相连，每颗LED灯珠的正极与其相连的多颗LED灯珠的负极都相连，当其中一颗LED灯珠死灯时，不影响其它LED灯珠正常工作，提高了光引擎工作的可靠性，降低了LED灯珠死灯对光引擎的影响；
3.本发明通过采用巨量荧光粉大面积涂覆技术，不仅使光引擎光效高达200LM/W以上，而且能降低LED驱动功率，提高光源节电效率，同时也降低了光引擎光率率。
附图说明
图1是本发明的结构爆炸示意图；
图2是本发明的结构截面图；
图3是本发明的灯珠蜂窝状结构示意图；
图4是本发明的灯珠连接关系原理图；
图5是本发明的生产流程示意图。
附图符号说明：
1.铝基板；2.绝缘层；3.导电铜箔；4.LED灯珠；5.荧光层。
具体实施方式
下面结合附图和实施例对可本发明做进一步说明，以使本发明所属技术领域的技术人员能够容易实施本发明。
如图1-2所示，是本发明的结构示意图，本发明提供一种基于蜂窝状排列的LED面光源光引擎，由LED灯珠4、铝基板1、荧光层5、绝缘层2和导电铜箔3组成。铝基板1是光引擎的物理载体，位于最底层，能有效快速散去LED灯珠4工作时产生的热量；铝基板1可选用厚度为0.5mm、1.0mm、1.2mm、1.6mm、2.0mm，导热系数为1.0、2.0、3.0的纯铝板；铝基板1也可换为柔性线路板，柔性线路板可选用聚酰亚胺薄膜或聚酯薄膜或聚四氟乙烯薄膜。绝缘层2涂覆在铝基板1上，绝缘层2由陶瓷环氧树脂材料制成，导电铜箔3是光引擎的导电载体，导电铜箔3涂覆在绝缘层2上，LED灯珠4焊接在导电铜箔3导线节点处，荧光层5涂覆在绝缘层2、导电铜箔3和LED灯珠4上。
LED灯珠4采用群量小电流、微功率倒装式LED灯珠进行封装，LED灯珠4型号为620、1020和/或1430，单颗LED灯珠工作电流范围为5mA-10mA。相比传统的COB光源引擎，单颗LED灯珠功率在1W左右，流经单颗LED灯珠都是超过300mA以上的电流，温升可超过100℃，光引擎光衰严重，本发明LED结温温升不超过40℃，光引擎光衰非常小，使用寿命长，节能环保。
荧光层5采用巨量荧光粉大面积涂覆模式，荧光粉涂覆面积功率比≥0.6，由荧光粉和固定胶充分均匀混合制成。将红绿荧光粉与高透明硅胶充分混合后，大面积涂覆均匀涂覆在绝缘层2、倒装式LED灯珠4和导电铜箔3表面，大面积涂覆提高光引擎光效和散热效率，荧光粉工作时表面温升不超过40℃，提高荧光粉使用寿命，降低光源眩光值。
LED面光源光引擎在同等功率下，点光源、COB光源、面光源各项性能指标对比如表所示：
由上表可以看出，LED面光源光引擎荧光粉涂覆面积是点光源4倍，是COB光源的2倍；LED面光源光引擎芯片电流密度远远小于传统LED光源。荧光粉是光源发光关键因素之一，提高荧光粉涂覆面积可大大提高光源发光效率，在同等发光光通量条件下，荧光粉面积增加，可大大降低LED灯珠使用功率。
如图3所示，是本发明的LED灯珠蜂窝状结构示意图，LED1、LED2、LED3、LED4的正极都并联在一起，LED1、LED2、LED3、LED4的负极都并联在一起，同时也与LED5、LED6、LED7、LED8的正极并联在一起，以此类推，所有LED灯珠4通过蜂窝状结构通过导电铜箔3都级联在一起。当其中一颗LED灯珠发生故障时，并不影响其他LED灯珠正常工作，也不影响整个光引擎可视效果。
由图4所示，是本发明的LED灯珠连接关系原理图，倒装式LED灯珠4可以根据用户需求进行串联和并联。LED灯珠4正负串接可提高光源引擎工作电压，单颗LED灯珠工作电压范围为直流2.7V-3.2V，增加光源引擎工作电压是按照单颗LED工作电压的整数倍增加。LED灯珠正负并接，可提高光源引擎工作电流，单颗LED灯珠工作电流范围为5mA-10mA，增加光源引擎工作电流是按照单颗LED工作电流的整数倍增加。
由图5所示，是本发明的生产流程示意图，其步骤如下：铝基板1外观检查主要检查焊盘表面是否清洁、焊盘是否残缺、铝基板1是否平整、是否少焊盘等。铝基板1刷锡膏，就是通过丝网印刷机把无铅锡膏涂覆到铝基板1上的LED灯珠焊盘上。倒装式LED灯珠4固晶，就是通过固晶机把倒装式LED灯珠4贴装到焊盘上，正负极不能贴反。铝基板1焊接，就是通过回流焊，把LED灯珠4焊接到铝基板1上，使LED灯珠4与导电铜箔3真正建立了电气连接关系。铝基板1一次通电检查，主要是检查每颗LED灯珠4都是否能点亮，如果发现有某些LED灯珠4不亮，就要把光源板拿到维修处检查，检查是LED灯珠4贴装不合格还是LED灯珠4自身不良。铝基板1涂围坝胶(围坝胶是一种透明的双组份硅胶)，在发光区域的外延涂一层围坝胶，围坝胶流动性差，主要作用是围挡流动性好的荧光粉混合液。铝基板1涂荧光粉，红绿荧光粉与导热透明胶充分混合后，通过涂胶机把荧光粉均匀涂覆到围坝胶围成的区域内。铝基板1烘烤，就是把涂覆好荧光粉的铝基板放入到烤箱中，烤箱内温度设定在150℃±2℃，要烘烤2个小时。铝基板二次通电检查，就是检查烘烤好的光源板，通电后发光均匀度、色温、光效是否符合设计技术指标。
以上所述仅对本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡是在本发明的权利要求限定范围内，所做的任何修改、等同替换、改进等，均应在本发明的保护范围之内。

Claims (10)

1.一种基于蜂窝状排列的LED面光源光引擎，其设有基板，所述基板上设有绝缘层，所述绝缘层上设有导电铜箔，所述导电铜箔导线节点处设有LED灯珠，其特征是，所述LED灯珠为倒装式LED灯珠，所述倒装式LED灯珠采用微功率类型，所述倒装式LED灯珠与所述导电铜箔构成蜂窝状结构排列连接。
2.根据权利要求1所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述倒装式LED灯珠型号为620、1020和/或1430。
3.根据权利要求1或2所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述绝缘层、导电铜箔和倒装式LED灯珠上涂覆设有荧光层。
4.根据权利要求3所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述荧光层通过荧光粉与透明固定胶混合制成。
5.根据权利要求4所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述荧光层涂覆面积功率比≥0.6。
6.根据权利要求1所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述基板为铝基板，所述铝基板为纯铝板。
7.根据权利要求1所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述基板为柔性线路板。
8.根据权利要求7所述的基于蜂窝状排列的LED面光源光引擎，其特征在于，所述柔性线路板，材质为聚酰亚胺薄膜、聚酯薄膜或聚四氟乙烯薄膜。
9.一种基于蜂窝状排列的LED面光源光引擎生产方法,其特征是，包括如下步骤：
1)无铅锡膏涂覆到LED灯珠焊盘上；
2)倒装式LED贴装到焊盘上；
3)通过回流焊，将LED灯珠焊接到铝基板上；
4)在铝基板发光区域的外延涂围坝胶；
5)将荧光粉均匀涂覆到围坝胶围成的区域内；
6)涂覆好荧光粉的铝基板放入到烤箱中烘烤。
10.根据权利要求9所述的基于蜂窝状排列的LED面光源光引擎生产方法，其特征在于，所述烤箱温度150℃±2℃，烘烤时间2小时。
CN201910628831.6A 2019-07-12 2019-07-12 基于蜂窝状排列的led面光源光引擎及其生产方法 Pending CN110265388A (zh)

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