Radiator
Technical field
The utility model relates to a kind of heat abstractor that is used for computer or other electronic equipment for the big chip configuration of caloric value, particularly a kind of radiator.
Background technology
Fast development along with modern electronic technology, the speed of service of various chips is doubled and redoubled, particularly the arithmetic speed of CPU (central processing unit) is more and more faster, its power consumption is also just increasing, while is along with the raising of the packaging density of electronic devices and components, the density of heat flow rate of equipment is also increasing sharply, for guaranteeing CPU energy operate as normal, must carry out the rational and effective heat radiation to it, especially under the situation that the volume of equipment is done littler and littler at present, cpu heat can conduct the heat of its generation rapidly to flowing to surrounding enviroment, realization is to the quick heat radiating of CPU, and the distance when still general requirement is installed between radiator and computer case or other large tracts of land obstacles is bigger.At present, traditional cpu heat major part is made up of fin and fan, and fan is vertically mounted on the top of fin, its mounting means as shown in Figure 1, the fan installed surface is perpendicular to the CPU radiating fin surface.Find in the reality use, when the height dimension of computer cabinet hour, traditional cpu heat can't install or install after wind covering of the fan and cabinet panel apart from too little, like this, the fan windage of radiator top will increase sharply, the radiating effect of cpu heat is had a greatly reduced quality, can't satisfy CPU heat radiation requirement.
The utility model content
Goal of the invention: technical problem to be solved in the utility model provides a kind of radiator at the deficiencies in the prior art.
Technical scheme: the utility model discloses a kind of radiator, comprise fin of being made up of substrate and fin and the fan that is installed in the fin upper surface, the upper surface of described fin is the inclined-plane that and substrate have angle.
In the utility model, preferably, the upper surface of described fin and the angle between the substrate are 10 °~45 °.In this scope, both can guarantee the heat-transfer effect of fin, can save sizable space again.
In the utility model, further preferably, the upper surface of described fin and the angle between the substrate are 15 °.Under the situation of 15 ° of angles, when guaranteeing installation dimension, increase its area of dissipation as far as possible; Simultaneously, aerofoil fan so just can reduce the reflection of radiator bottom surface to air quantity greatly perpendicular to the fin mounted on surface, increases the blast of heat radiation air quantity.
In the utility model, preferably, also comprise the screw be located on the radiator, be nested in spring and spacing shim on the screw; Described substrate is a quadrangle, and fin is the quadrangle of unfilled corner, is provided with through hole with the corresponding position of the unfilled corner of fin on substrate; Described screw passes through hole from the side that fin is provided with fin, and its medi-spring is positioned at fin and is provided with fin one side, and spacing shim is positioned at opposite side.The screw of band spring and spacing shim can guarantee the Elastic Contact between radiator and the CPU, prevents that the pretightning force that applies because of radiator from damaging CPU or chip itself when the equipment impact shock.
In the utility model, described fan bottom is provided with the E shape bearing that is fastened on the fin.The mid portion of E shape bearing slightly is shorter than both sides, makes both sides can be buckled in outside the adjacent fin, can guarantee the distance between two fins thus, so just can guarantee fan by screw can be firm be fixed on the fin.
Beneficial effect: the utility model is designed to tilting with the fin upper surface, so just can optimize the air-cooled air channel of radiator greatly.It is advantageous that, the first, even cabinet panel closely contacts with radiator fan, the fin of tilting can guarantee that also enough cold wind enters fin inside.The second because fin has the angle of inclination, like this, when meet in the bottom surface of cold wind and fin, can reduce to reflect air quantity greatly, and the reflection air quantity main path of air loss just, reflect air quantity reduce can guarantee enough heat radiation blast.Evidence, the heat radiation power of this radiator can reach 110W, can satisfy current CPU heat radiation requirement fully, and under fan and the less situation of cabinet distance, radiating effect is much larger than conventional fan especially.Through evidence, adopt EVEREST Ultimate 2007 thermometric softwares, utilize CPU load software SP2004 (stress prime 2004) that CPU is loaded, make CPU usage remain on 100%, when ambient temperature is 25 ℃, in identical test cabinet, traditional heat-dissipating device under fan and the cabinet housing different distance and this are used novel described radiator test effect figure as shown in Figure 6.Distance is under the situation of 100mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 47 ℃; Adopt radiator described in the utility model, the CPU working temperature is 46 ℃; At fan and cabinet housing distance is under the situation of 50mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 65 ℃; Adopt radiator described in the utility model, the CPU working temperature is 55 ℃; At fan and cabinet housing distance is under the situation of 20mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 77 ℃; Adopt radiator described in the utility model, the CPU working temperature is 60 ℃.At fan and cabinet housing distance is under the situation of 10mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 93 ℃, and the phenomenon of blank screen often occurs; Adopt radiator described in the utility model, the CPU working temperature is 69 ℃.This shows that in the little small size cabinet in space, the effect of radiator described in the utility model is just outstanding all the more.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is done further and to be specified.
Fig. 1 is a traditional heat-dissipating device structural representation.
Fig. 2 is the utility model side structure schematic diagram.
Fig. 3 is the utility model Facad structure schematic diagram,
Fig. 4 is the structural representation of bearing in the utility model.
Fig. 5 is an airflow direction schematic diagram in the utility model.
Fig. 6 is radiator described in the utility model and traditional heat-dissipating device effect contrast figure.
Embodiment
As shown in Figure 1, traditional cpu heat major part is made up of fin and fan, and the fin upper surface is plane parallel to the ground, and fan is vertically mounted on the top of fin.
As shown in Figure 2, radiator described in the utility model comprises fin of being made up of substrate 9 and fin 71 and the fan 2 that is installed in fin 1 upper surface, and the upper surface of described fin 1 is the inclined-plane that and substrate 9 have angle.Angle between the upper surface of described fin 1 and the substrate 9 is 15 °.Angle between the upper surface of certain described fin 1 and the substrate 9 also can be in 10 °~45 ° scope.
As shown in Figures 2 and 3, described radiator also comprises the screw 6 be located on the radiator, is nested in spring 5 and spacing shim 4 on the screw 6; Described substrate 9 is a quadrangle, and fin 7 is the quadrangle of unfilled corner, is provided with through hole with the corresponding position of the unfilled corner of fin 7 on substrate 9; Described screw 6 is provided with fin one side from fin and passes through hole, and its medi-spring 5 is positioned at fin and is provided with fin one side, and spacing shim 4 is positioned at opposite side.
As Fig. 2 and shown in Figure 4, described fan bottom is provided with the E shape bearing 8 that is fastened on the fin 7.
More particularly, the part that can be used for the radiator of CPU has: fin 1, fan 2, fan mounting screw 3, spacing shim 4, spring 5, screw 6, fin 7, centre are shorter than the E shape bearing 8 of both sides.Fin 1 is the big k=330W/ (m ℃) of conductive coefficient k: the pure copper material that is only second to the conductive coefficient of silver in common metal shapes, one side of fin leaves the step of 40 * 40 * 3 (mm), this step surface is and the CPU contact surface that its surperficial fineness should reach more than 3.2.Fan 2 adopts aerofoil fan 2.The fin 7 on 45 band inclined-planes has been made in another side milling of fin, and the thick 0.4mm of the rib of fin, rib are apart from 1.8mm, and the rib height is X15 ° of 33 (mm), and the fin on 45 band inclined-planes constitutes 15 ° of inclined-planes of fin upper surface thus.Aerofoil fan 2 is a speed adjustable fan, adjusts the rotating speed of fan automatically according to cpu temperature; Aerofoil fan 2 is connected with fin 7 by fan mounting screw 3, and wherein bearing 8 is mainly used to guarantee the distance between fin and the fin.The installation of cpu heat is also very simple, and the first step is enclosed within spring 5 on the screw 6, in the installing hole with screw precession radiator, spacing shim 4 is sticked in the groove of radiator screw then again.Second step embedded fin with bearing 8, and the pitch-row between the assurance bearing and the pitch-row of aerofoil fan equate.The 3rd step was fixed on aerofoil fan 2 on the fin by fan mounting screw 3, owing to bearing 8 is arranged with fixed distance between two fins, can guarantee that thus screw can not become flexible because spacing of fins becomes big after being screwed into.When installing, aerofoil fan should note its directivity, should install that guarantee that fan is air blast in radiator, the air channel schematic diagram of its formation as shown in Figure 5 according to shown in Fig. 2.Coat at last an amount of heat-conducting silicone grease on the step of fin one side uniformly, assurance contacts with the face on CPU surface and gets final product.
In the radiator described in the utility model, the material of fin and fin can be changed according to different demands, the rib height of fin, rib is thick and rib apart from can carrying out suitable adjustment according to the size of heat radiation power.The shape of fin and substrate thereof does not limit yet.
Radiator described in the utility model not only can use in computer and dispel the heat as CPU, can also use in other computer communication terminal integrated systems, for other have the chip cooling of high heat dissipation capacity.
Fig. 6 is radiator and the radiating effect figure of casing under different distance, as shown in Figure 6, adopt EVEREST Ultimate 2007 thermometric softwares in the utility model, utilize CPU load software SP2004 (stressprime2004) that CPU is loaded, make CPU usage remain on 100%, when ambient temperature is 25 ℃, in identical test cabinet, traditional heat-dissipating device under fan and the cabinet housing different distance and this are used novel described radiator test effect figure as shown in Figure 6.Square chain-dotted line is a cpu temperature curve under the traditional heat-dissipating device among the figure, and triangulation point is scribed ss cpu temperature curve under the utility model radiator.Distance is under the situation of 100mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 47 ℃; Adopt radiator described in the utility model, the CPU working temperature is 46 ℃; At fan and cabinet housing distance is under the situation of 50mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 65 ℃; Adopt radiator described in the utility model, the CPU working temperature is 55 ℃; At fan and cabinet housing distance is under the situation of 20mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 77 ℃; Adopt radiator described in the utility model, the CPU working temperature is 60 ℃.At fan and cabinet housing distance is under the situation of 10mm, adopts the heat radiation of traditional heat-dissipating device, and the CPU working temperature is 93 ℃, and the phenomenon of blank screen often occurs; Adopt radiator described in the utility model, the CPU working temperature is 69 ℃.This shows that in the little small size cabinet in space, the effect of radiator described in the utility model is just outstanding all the more.
The utility model provides a kind of thinking and method of radiator; the method and the approach of this technical scheme of specific implementation are a lot; the above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.The all available prior art of each component part not clear and definite in the present embodiment is realized.