CN201230407Y - Image developing electroplating apparatus for circuit board - Google Patents
Image developing electroplating apparatus for circuit board Download PDFInfo
- Publication number
- CN201230407Y CN201230407Y CNU2008201170122U CN200820117012U CN201230407Y CN 201230407 Y CN201230407 Y CN 201230407Y CN U2008201170122 U CNU2008201170122 U CN U2008201170122U CN 200820117012 U CN200820117012 U CN 200820117012U CN 201230407 Y CN201230407 Y CN 201230407Y
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- circuit board
- electroplating
- development
- positive pressure
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Abstract
The utility model relates to development electroplating equipment of a circuit board, which is applicable in the development and electroplating process of an exposed circuit board. The equipment comprises a development unit, a washing unit, a deoxidation unit and an electroplating unit; the washing unit is connected with the development unit; the deoxidation unit is connected with the washing unit; the electroplating unit is connected with the deoxidation unit; the exposed circuit board is subsequently processed by the development unit, the washing unit, the deoxidation unit and the electroplating unit, to complete development and electroplating. The development electroplating equipment of the circuit board is continuous, so that the exposed circuit board can have electroplating process on the electroplating unit after completing development process on the development unit; compared with the prior art in which the circuit board is transferred from the development process to the electroplating process manually, the development electroplating equipment of the circuit board can reduce the effect of external environment factors, thereby improving the yield of the processes of the circuit board.
Description
Technical field
The utility model relates to a kind of process apparatus, and particularly relevant for a kind of circuit board development electroplating device.
Background technology
With regard to prior art, the processing procedure of circuit board mainly is via steps such as exposure, development, plating.At first, circuit board after the exposure is sent into and carried out developing manufacture process in the developing apparatus, then, process by washing is removed the developer solution that is attached on the circuit board, then, process by oven dry is attached to the water stain removal on the circuit board on the circuit board to avoid dust, and avoids water stain residual and cause the oxidation on metal surface phenomenon.Afterwards, by artificial mode, the circuit board that oven dry is good is transported in the electroplating device from developing apparatus.
Circuit board finish developing manufacture process back before the electroplating process and circuit board is being transported to the process of electroplating device from developing apparatus, transport the risk that all the circuit board scratch can be arranged or wound no matter be in the mode of plate or interpolation frame frame repeatedly.In addition, also can be in the process of transporting because of the influence of external environment factor, and make that having the situation of adhering to dust or oxidation on the circuit board produces.Therefore, circuit board is after sending into electroplating device, and circuit board must come the cleaning circuit plate via the process of washing earlier, and the process of deoxidation is removed the problem of circuit board oxidation, afterwards, again the circuit board after the deoxidation is carried out electroplating process, with development and the electroplating process of finishing circuit board.
Because the processing procedure of circuit board is the equipment by a discontinuous formula, by artificial mode circuit board is transferred to electroplating device from developing apparatus, therefore in the process of transporting, increased the influence of many external environment factors, and reduce the process rate of circuit board, also and then increase the processing procedure cost of circuit board.
The utility model content
In order to solve prior art problems, the utility model provides a kind of circuit board development electroplating device, is suitable for the circuit board after the exposure is carried out the development and the electroplating process of a continous way.
The utility model proposes a kind of circuit board development electroplating device, it is suitable for the circuit board after the exposure is carried out the development and the electroplating process of a continous way.Circuit board development electroplating device comprises a developing cell, washing unit, a deoxidation unit and an electroplating unit; The washing unit connects developing cell; The deoxidation unit connects the washing unit; Electroplating unit connects the deoxidation unit; Circuit board after the exposure via developing cell, washing unit, deoxidation unit and electroplating unit, develops and plating and finish in regular turn.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises one first positive pressure devices, and first positive pressure devices connects developing cell, just is being depressed into developing cell in order to provide one.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises one second positive pressure devices, and second positive pressure devices connects the washing unit, just is being depressed into the washing unit in order to provide one.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises one the 3rd positive pressure devices, and the 3rd positive pressure devices connects the deoxidation unit, just is being depressed into the deoxidation unit in order to provide one.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises one the 4th positive pressure devices, and the 4th positive pressure devices connects electroplating unit, just is being depressed into electroplating unit in order to provide one.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises and inspects the unit, inspects the unit and is arranged between washing unit and the deoxidation unit.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device is wherein inspected the unit and is one and manually inspects the unit or an automated optical is inspected the unit.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises one the 5th positive pressure devices, and the 5th positive pressure devices connects inspects the unit, just is being depressed into and inspects the unit in order to provide one.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises a bypass supply unit, and the bypass supply unit connects inspects the unit.When inspecting circuit board is one bad during at goods, and the bypass supply unit can be isolated and badly do not entered the deoxidation unit at goods.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises an apparatus for temporary storage, and apparatus for temporary storage connects the bypass supply unit, and is bad at goods in order to store.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device also comprises a Destaticizing device, and Destaticizing device connects inspects the unit, in order to remove the static on the circuit board.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device, wherein Destaticizing device is the sub-wind apparatus that blows off.
In an embodiment of the present utility model, above-mentioned circuit board development electroplating device, wherein the deoxidation unit comprises a pickling unit or an etching unit.
Based on above-mentioned, circuit board development electroplating device of the present utility model is the equipment of a continous way, therefore the circuit board after the exposure can be after developing cell finishes developing manufacture process, and then carry out electroplating process in electroplating unit, by manual type circuit board is transferred to electroplating process from developing manufacture process compared to prior art, circuit board development electroplating device of the present utility model can reduce the influence of external environment factor, and then promotes the yield of circuit board process.
Description of drawings
Fig. 1 is the schematic diagram of a kind of circuit board development electroplating device of an embodiment of the present utility model.
Fig. 2 is the schematic diagram of a kind of circuit board development electroplating device of another embodiment of the present utility model.
Fig. 3 is the schematic diagram of a kind of circuit board development electroplating device of another embodiment of the present utility model.
[primary clustering symbol description]
100A, 100B, 100C: circuit board development electroplating device
110: developing cell
112: the first positive pressure devices
120: the washing unit
122: the second positive pressure devices
130: the deoxidation unit
132: the three positive pressure devices
140: electroplating unit
142: the four positive pressure devices
150: inspect the unit
152: the five positive pressure devices
154: Destaticizing device
160: the bypass supply unit
170: apparatus for temporary storage
Embodiment
For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below:
Fig. 1 is the schematic diagram of a kind of circuit board development electroplating device of an embodiment of the present utility model.Please refer to Fig. 1, in the present embodiment, circuit board development electroplating device 100A be suitable for to one the exposure after circuit board develop and electroplating process, wherein circuit board for example be printed circuit board (PCB) (Printed Circuit Board, PCB).
Circuit board development electroplating device 100A comprises a developing cell 110, washing unit 120, a deoxidation unit 130 and an electroplating unit 140.Washing unit 120 connects developing cell 110, and deoxidation unit 130 connects washing unit 120.Electroplating unit 140 connects deoxidation unit 130, and wherein deoxidation unit 130 comprises a pickling unit or an etching unit.
Specifically, the circuit board after the exposure via developing cell 110, washing unit 120, deoxidation unit 130 and electroplating unit 140, develops and electroplating process and finish in regular turn.In other words, circuit board development electroplating device 100A 140 is the equipment of a continous way from developing cell 110 to electroplating unit, that is to say, from the developing manufacture process to the electroplating process, need not transport circuit board, can in circuit board develops electroplating device 100A, finish and develop and electroplating process via artificial mode.
In addition, in the present embodiment, circuit board development electroplating device 100A also comprises one first positive pressure devices 112, one second positive pressure devices 122, one the 3rd positive pressure devices 132 and one the 4th positive pressure devices 142.First positive pressure devices 112 connects developing cell 110, just is being depressed into developing cell 110 in order to provide one, enters in the developing cell 110 to avoid the external environment pollutant.
Second positive pressure devices 122 connects washing unit 120, just is being depressed into washing unit 120 in order to provide one, enters in the washing unit 120 to avoid the external environment pollutant.The 3rd positive pressure devices 132 connects deoxidation unit 130, just is being depressed into deoxidation unit 130 in order to provide one, enters in the deoxidation unit 130 to avoid the external environment pollutant.The 4th positive pressure devices 142 connects electroplating unit 140, just is being depressed into electroplating unit 140 in order to provide one, enters in the electroplating unit 140 to avoid the external environment pollutant.
In brief, the circuit board development electroplating device 100A of present embodiment is the equipment of a continous way, therefore the circuit board after the exposure can be after developing cell 110 finishes developing manufacture process, directly enter electroplating unit 140 and carry out electroplating process, by manual type circuit board is transferred to electroplating process from developing manufacture process compared to prior art, the circuit board development electroplating device 100A of present embodiment can reduce the influence of external environment factor, and then promotes the yield of circuit board process.
In addition, developing cell 110, washing unit 120, deoxidation unit 130 and electroplating unit 140 connect first positive pressure devices 112, second positive pressure devices 122, the 3rd positive pressure devices 132 and the 4th positive pressure devices 142 respectively so that malleation to be provided, make circuit board in the process of developing and electroplating, can avoid the external environment pollutant to enter, with the process rate of lifting circuit board, and then the processing procedure cost of reduction circuit board.
Fig. 2 is the schematic diagram of a kind of circuit board development electroplating device of another embodiment of the present utility model.Please also refer to Fig. 2 and Fig. 1, in the present embodiment, the circuit board development electroplating device 100B of Fig. 2 is similar to the circuit board development electroplating device 100A of Fig. 1, and both differences are: the circuit board development electroplating device 100B of Fig. 2 also comprises and inspects unit 150, one the 5th positive pressure devices 152 and a Destaticizing device 154.
Specifically, in the present embodiment, inspect unit 150 and for example be one and manually inspect the unit or an automated optical is inspected (AOI) unit.Inspect unit 150 and be arranged between washing unit 120 and the deoxidation unit 130, have or not any shortcoming for the patterning photoresist layer in order to inspect developing cell 110.
In the patterning manufacturing process of photoresist layer, photoresist layer may be because of many processing procedure problems (for example have scratch for light shield itself or have the dirty point or the developing trough of developing apparatus not to clean up etc.), make photoresist layer after via light shield exposure, development, produce many shortcomings, these shortcomings for example be breach (not illustrating) and salient point (not illustrating).Therefore, when the photoresist layer on the circuit board has shortcoming, can utilize and inspect the circuit boards that unit 150 will have shortcoming.
In addition, in the present embodiment, the 5th positive pressure devices 152 connects inspects unit 150, just is being depressed into and inspects unit 150 in order to provide one, inspects in the unit 150 to avoid the external environment pollutant to enter.Destaticizing device 154 connects inspects unit 150, in order to remove the static on the circuit board, is attached on the circuit board to avoid dust, and wherein Destaticizing device 154 can be the sub-wind apparatus that blows off.
In brief, the circuit board development electroplating device 100B of present embodiment is the equipment of a continous way, therefore the circuit board after the exposure can be after developing cell 110 finishes developing manufacture process, directly enter electroplating unit 140 and carry out electroplating process, by manual type circuit board is transferred to electroplating process from developing manufacture process compared to prior art, the circuit board development electroplating device 100B of present embodiment can reduce the influence of external environment factor, and then promotes the yield of circuit board process.
In addition, developing cell 110, washing unit 120, deoxidation unit 130, electroplating unit 140 and inspect unit 150 and connect first positive pressure devices 112, second positive pressure devices 122, the 3rd positive pressure devices 132, the 4th positive pressure devices 142 and the 5th positive pressure devices 152 respectively so that malleation to be provided, make circuit board in the process of developing and electroplating, can avoid the external environment pollutant to enter, with the process rate of lifting circuit board, and then the processing procedure cost of reduction circuit board.
Fig. 3 is the schematic diagram of a kind of circuit board development electroplating device of another embodiment of the present utility model.Please also refer to Fig. 3 and Fig. 2, in the present embodiment, the circuit board development electroplating device 100C of Fig. 3 is similar to the circuit board development electroplating device 100B of Fig. 2, and both differences are: the circuit board development electroplating device 100C of Fig. 3 also comprises a bypass supply unit 160 and an apparatus for temporary storage 170.
Specifically, in the present embodiment, bypass supply unit 160 connects inspects unit 150.To inspect circuit board be one bad during at goods when inspecting unit 150, and bypass supply unit 160 can be isolated and badly do not entered deoxidation unit 130 at goods.In addition, apparatus for temporary storage 170 connects bypass supply unit 160, and is bad at goods in order to store.
Specifically, bad after goods are isolated from inspect unit 150, can unify to be collected in the apparatus for temporary storage 170, handle at unified heavy industry when arriving some to wait for.Thus, can avoid shortcoming because of photoresist layer to cause circuit board to enter electroplating process in the electroplating unit 140 after, scrapping property problem such as produce short circuit, open circuit.
In brief, the circuit board development electroplating device 100C of present embodiment is the equipment of a continous way, therefore the circuit board after the exposure can be after developing cell 110 finishes developing manufacture process, directly enter electroplating unit 140 and carry out electroplating process, by manual type circuit board is transferred to electroplating process from developing manufacture process compared to prior art, the circuit board development electroplating device 100C of present embodiment can reduce the influence of external environment factor, and then promotes the yield of circuit board process.
In addition, developing cell 110, washing unit 120, deoxidation unit 130, electroplating unit 140 and inspect unit 150 and connect first positive pressure devices 112, second positive pressure devices 122, the 3rd positive pressure devices 132, the 4th positive pressure devices 142 and the 5th positive pressure devices 152 respectively so that malleation to be provided, make circuit board in the process of developing and electroplating, can avoid the external environment pollutant to enter, with the process rate of lifting circuit board, and then the processing procedure cost of reduction circuit board.
In addition, bypass supply unit 160 and apparatus for temporary storage 170 can will inspect that unit 150 inspects out badly isolates and stores at goods, after can avoiding circuit board to enter the electroplating process of electroplating unit 140, the short circuit that produces, scrapping property problem such as open circuit are to promote the process rate of circuit board.
In sum, circuit board development electroplating device of the present utility model is the equipment of a continous way, therefore after the circuit board after the exposure can finish developing manufacture process from developing cell, need not enter electroplating unit by the mode of manually passing on and carry out electroplating process, with development and the electroplating process of finishing circuit board.Therefore, circuit board development electroplating device of the present utility model can reduce the influence of external environment factor, and then promotes the yield of circuit board process.
Though the utility model discloses as above with embodiment; yet it is not in order to limit the utility model; have in the technical field under any and know the knowledgeable usually; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, so protection range of the present utility model should be by being as the criterion that the claim scope is defined.
Claims (13)
1. a circuit board development electroplating device develops and electroplating process to the circuit board after the exposure, it is characterized in that this circuit board development electroplating device comprises:
One developing cell;
One washing unit connects this developing cell;
One deoxidation unit connects this washing unit; And
One electroplating unit connects this deoxidation unit,
Wherein the circuit board after this exposure is finished via this developing cell, this washing unit, this deoxidation unit and this electroplating unit in regular turn and is developed and plating.
2. circuit board development electroplating device as claimed in claim 1 is characterized in that, also comprises one first positive pressure devices, and this first positive pressure devices connects this developing cell, just is being depressed into this developing cell in order to provide one.
3. circuit board development electroplating device as claimed in claim 1 is characterized in that, also comprises one second positive pressure devices, and this second positive pressure devices connects this washing unit, just is being depressed into this washing unit in order to provide one.
4. circuit board development electroplating device as claimed in claim 1 is characterized in that, also comprises one the 3rd positive pressure devices, and the 3rd positive pressure devices connects this deoxidation unit, just is being depressed into this deoxidation unit in order to provide one.
5. circuit board development electroplating device as claimed in claim 1 is characterized in that, also comprises one the 4th positive pressure devices, and the 4th positive pressure devices connects this electroplating unit, just is being depressed into this electroplating unit in order to provide one.
6. circuit board development electroplating device as claimed in claim 1 is characterized in that, also comprises and inspects the unit, is arranged between this washing unit and this deoxidation unit.
7. circuit board development electroplating device as claimed in claim 6 is characterized in that, this inspects the unit is one manually to inspect the unit or an automated optical is inspected the unit.
8. circuit board development electroplating device as claimed in claim 6, it is characterized in that, also comprise a bypass supply unit, this bypass supply unit connects this and inspects the unit, when inspecting circuit board is one bad during at goods, and this bypass supply unit can be isolated and badly do not entered this deoxidation unit at goods.
9. circuit board development electroplating device as claimed in claim 8 is characterized in that, also comprises an apparatus for temporary storage, and this apparatus for temporary storage connects this bypass supply unit, and is bad at goods in order to store this.
10. circuit board development electroplating device as claimed in claim 6 is characterized in that, also comprises one the 5th positive pressure devices, and the 5th positive pressure devices connects this and inspects the unit, just is being depressed into this and inspects the unit in order to provide one.
11. circuit board development electroplating device as claimed in claim 6 is characterized in that, also comprises a Destaticizing device, this Destaticizing device connects this and inspects the unit, in order to remove the static on this circuit board.
12. circuit board development electroplating device as claimed in claim 11 is characterized in that this Destaticizing device is the sub-wind apparatus that blows off.
13. circuit board development electroplating device as claimed in claim 1 is characterized in that, this deoxidation unit comprises a pickling unit or an etching unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201170122U CN201230407Y (en) | 2008-06-13 | 2008-06-13 | Image developing electroplating apparatus for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201170122U CN201230407Y (en) | 2008-06-13 | 2008-06-13 | Image developing electroplating apparatus for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201230407Y true CN201230407Y (en) | 2009-04-29 |
Family
ID=40635346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201170122U Expired - Fee Related CN201230407Y (en) | 2008-06-13 | 2008-06-13 | Image developing electroplating apparatus for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201230407Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491715A (en) * | 2012-06-13 | 2014-01-01 | 健鼎（无锡）电子有限公司 | Circuit-board developing, electroplating and etching device |
-
2008
- 2008-06-13 CN CNU2008201170122U patent/CN201230407Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491715A (en) * | 2012-06-13 | 2014-01-01 | 健鼎（无锡）电子有限公司 | Circuit-board developing, electroplating and etching device |
| CN103491715B (en) * | 2012-06-13 | 2016-04-06 | 健鼎（无锡）电子有限公司 | Circuit board development plating etching machines |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20120613 |