CN103849873A - Residual copper removal method and device - Google Patents
Residual copper removal method and device Download PDFInfo
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- CN103849873A CN103849873A CN201210504603.6A CN201210504603A CN103849873A CN 103849873 A CN103849873 A CN 103849873A CN 201210504603 A CN201210504603 A CN 201210504603A CN 103849873 A CN103849873 A CN 103849873A
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- residual copper
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Abstract
The invention provides a residual copper removal method including: acquiring location coordinates of a residual copper area on a circuit board; and according to the location coordinates of the residual copper area, spraying an etching liquid to the residual copper area to eroding residual copper on the residual copper area. The invention also provides a corresponding device. According to the method, the residual copper on the residual copper area can be fast and accurately eroded, the repair efficiency of residual copper defects on the circuit board can be improved, and the cost of production is reduced.
Description
Technical field
The present invention relates to the manufacture field of circuit card, especially relate to a kind of method and device of removing residual copper.
Background technology
As shown in Figure 1, at printed circuit board (Printed Circuit Board, PCB) in manufacturing processed,, computer-aided manufacturing (ComputerAided Manufacturing inhomogeneous owing to being electroplated, CAM) compensate the factor impacts such as unreasonable or circuit etching homogeneity is bad, often cause pcb board circuit 101 edges after etching to leave residual copper 102.In the time there is owing the residual copper of corrosion in solid matter line pattern region, by having influence on the signal transmission of circuit, even there is the short circuit phenomenon between circuit, cause the pcb board that leaves residual copper to scrap or to do over again.At present, be generally to paste dry film on the pcb board that leaves residual copper, utilize the mode of the exposure of the negative film film, the residual copper of etching to remove residual copper, to obtain qualified pcb board.But the method efficiency of the residual copper of this removal is low, and rework cost is high.
Summary of the invention
The invention provides a kind of method and device of removing residual copper, the method is according to the position coordinates in the residual copper region obtaining, spray etching solution to described residual copper region, thereby the residual copper in residual copper region described in can the etching off of fast accurate improves the efficiency of repairing the residual copper defect of circuit card.
The invention provides a kind of method of removing residual copper, it comprises:
The position coordinates in the residual copper region on acquisition cuicuit plate;
According to the position coordinates in described residual copper region, spray etching solution to described residual copper region, with the residual copper in residual copper region described in etching off.
Preferably, the described etching solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays etching solution to described residual copper region.
Preferably, the method for the residual copper of described removal also comprises:
After the residual copper in residual copper region described in etching off, suck the etching solution that is sprayed at described residual copper region with vacuum slot.
Preferably, the method for the residual copper of described removal also comprises:
After sucking with described vacuum slot the etching solution that is sprayed at described residual copper region, clean described residual copper region.
Preferably, the step in the described residual copper of described cleaning region comprises: spray scavenging solution to described residual copper region; After scavenging solution is sprayed in described residual copper region, suck the scavenging solution that is sprayed at described residual copper region with vacuum slot.
Preferably, the described scavenging solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays scavenging solution to described residual copper region.
The present invention also provides a kind of device of removing residual copper, it comprises controller and etching sprinker, described etching sprinker is provided with the first nozzle, the control signal output terminal of described controller connects the control signal input terminus of described etching sprinker, described controller is for the position coordinates in the residual copper region on acquisition cuicuit plate, according to the position coordinates in described residual copper region, to described etching sprinker input control signal, control described the first nozzle and spray etching solution to the residual copper region of circuit card.
Preferably, the device of the residual copper of described removal also comprises scavenging solution sprinker, described scavenging solution sprinker is provided with second nozzle, the control signal output terminal of described controller connects the control signal input terminus of described scavenging solution sprinker, described controller is used for according to the position coordinates in described residual copper region, to described scavenging solution sprinker input control signal, control described second nozzle and spray scavenging solution to the residual copper region of circuit card.
Preferably, the diameter of described the first nozzle is 0.05～0.1 millimeter, and the diameter of described second nozzle is 0.05～0.1 millimeter.
Preferably, the device of the residual copper of described removal also comprises imbibition device, described imbibition device is provided with vacuum slot, the control signal output terminal of described controller connects the control signal input terminus of described imbibition device, described controller is used for according to the position coordinates in described residual copper region, to described imbibition device input control signal, suck the scavenging solution on residual copper region to control described vacuum slot.
The present invention has not only improved the remediation efficiency of circuit card, and does not need to use the material such as dry film, the film, has significantly reduced the cost of repairing.
Accompanying drawing explanation
Fig. 1 is the conspectus that leaves residual copper;
Fig. 2 is a kind of method flow schematic diagram of removing residual copper that the embodiment of the present invention 1 provides;
Fig. 3 is a kind of method flow schematic diagram of removing residual copper that the embodiment of the present invention 2 provides;
Fig. 4 is a kind of concrete implementation step schematic diagram of method of removing residual copper that the embodiment of the present invention 2 provides;
Fig. 5 is a kind of apparatus structure block diagram of removing residual copper that the embodiment of the present invention 3 provides;
Fig. 6 is a kind of apparatus structure block diagram of removing residual copper that the embodiment of the present invention 4 provides.
Embodiment
The present invention is described in detail below to enumerate embodiment.
Embodiment 1
As shown in Figure 2, the embodiment of the present invention provides a kind of method of removing residual copper, and it comprises:
201, the position coordinates in the residual copper region on acquisition cuicuit plate.
This step can utilize automatic light to detect AOI (Automatic Optic Inspection) device scan circuit card, obtains the position coordinates in the residual copper region on circuit card, and marks the residual copper region of owing corrosion.
202,, according to the position coordinates in described residual copper region, spray etching solution to described residual copper region, with the residual copper in residual copper region described in etching off.
This step, according to the position coordinates in described residual copper region, positions described residual copper region, can spray accurately etching solution to described residual copper region, to remove the residual copper in described residual copper region.Therefore, to remove the efficiency of residual copper high for the present embodiment.
Embodiment 2
As shown in Figure 3, the embodiment of the present invention provides a kind of method of removing residual copper, and it comprises:
301, the position coordinates in the residual copper region on acquisition cuicuit plate.
This step can utilize automatic light to detect AOI (Automatic Optic Inspection) device scan circuit card, obtains the position coordinates in the residual copper region on circuit card, and marks the residual copper region of owing corrosion.
302,, according to the position coordinates in described residual copper region, spray etching solution to described residual copper region, with the residual copper in residual copper region described in etching off.
Preferably, the described etching solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays etching solution to described residual copper region.
This step, according to the position coordinates in described residual copper region, positions described residual copper region, and uses the round nozzle of small-bore to spray etching solution to described residual copper region, has further improved the tolerance range of corroding residual copper, avoids corroding circuit.
303,, after the residual copper in residual copper region described in etching off, suck the etching solution that is sprayed at described residual copper region with vacuum slot.
Spray etching solution to described residual copper region, after the residual copper in residual copper region, suck the etching solution that is sprayed at described residual copper region with vacuum slot described in etching off, the etching solution of avoiding remaining on circuit card causes corrosion to circuit.
304,, after sucking with described vacuum slot the etching solution that is sprayed at described residual copper region, clean described residual copper region.
This step can be used clear water to clean the residual copper region of described circuit card, further removes the etching solution remaining on circuit card, prevents that circuit is corroded.
The step of preferably, cleaning described residual copper region comprises: spray scavenging solution to described residual copper region; After scavenging solution is sprayed in described residual copper region, suck the scavenging solution that is sprayed at described residual copper region with vacuum slot.Described scavenging solution can be clear water.Utilize vacuum slot to suck to be sprayed at the scavenging solution in described residual copper region, avoid scavenging solution to be infected with circuit, cause corrosion to circuit.
Preferably, the described scavenging solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays scavenging solution to described residual copper region.Use the round nozzle of small-bore to spray scavenging solution to described residual copper region, further improved the tolerance range of cleaning residual copper region, avoid the liquid after cleaning to be infected with circuit, cause corrosion to circuit.
In order better to understand the present embodiment, below in conjunction with Fig. 4, the present embodiment is described in further details.
The first step 401: the position of measuring residual copper region.Concrete, use AOI equipment Inspection goes out the residual copper region of circuit card, obtains the position coordinates in residual copper region.
Second step 402: the positional information transmission in residual copper region.Concrete, the position coordinates in the residual copper region that AOI equipment is obtained is transferred to reparation machine, and reparation machine obtains the position coordinates in the residual copper region of AOI device transmission.
The 3rd step 403: the position of confirming residual copper region.Concrete, reparation machine, according to the position coordinates in residual copper region, is confirmed residual copper region.
The 4th step 404: judge whether to repair.Concrete, behind confirmation residual copper region, judge whether to repair, if want, carry out the 5th step, if not, change a job, do not enter reparing process.
The 5th step 405: contrast is confirmed.Concrete, reparation machine obtains the image in the residual copper region of circuit card by CCD image sensor, the residual copper region of circuit card is reaffirmed.
The 6th step 406: spray etching solution.Concrete, the nozzle that sprays etching solution is moved to the top in residual copper region, go out to residual copper area spray the etching solution fluid column that diameter is about 1 millimeter with certain pressure, with the residual copper in the residual copper of etching region.
The 7th step 407: suck etching solution.Concrete, use vacuum slot to suck the etching solution being sprayed on residual copper region.
The 8th step 408: spray scavenging solution.Concrete, the nozzle that sprays clear water is moved to the top in residual copper region, go out to residual copper area spray the water column that diameter is about 0.1 millimeter with certain pressure, to clean residual copper region.
The 9th step 409: suck scavenging solution.Concrete, use vacuum slot to suck the clear water being sprayed on residual copper region.
The tenth step 410: by dry circuit card blowing.
Above-mentioned steps, according to the position coordinates in the residual copper region obtaining, is sprayed etching solution to described residual copper region, the residual copper in residual copper region described in etching off accurately, thus reach the residual copper of quick removal, improve the object of remediation efficiency and reduction rehabilitation cost.
Embodiment 3
As shown in Figure 5, the present embodiment provides a kind of device of removing residual copper, comprise controller 501 and etching sprinker 502, described etching sprinker 502 is provided with the first nozzle, the control signal output terminal of described controller 501 connects the control signal input terminus of described etching sprinker 502, described controller 501 is for the position coordinates in the residual copper region on acquisition cuicuit plate, according to the position coordinates in described residual copper region, to described etching sprinker 502 input control signals, control described the first nozzle and spray etching solution to the residual copper region of circuit card.
Described controller 501 can be for according to the position coordinates in described residual copper region, described the first nozzle is moved to the top in the residual copper region of described circuit card, control described the first nozzle and spray etching solution to the residual copper region of circuit card, with the residual copper in residual copper region described in etching off.
Embodiment 4
As shown in Figure 6, the present embodiment provides a kind of device of removing residual copper, comprise controller 601 and etching sprinker 602, described etching sprinker 602 is provided with the first nozzle, the control signal output terminal of described controller 601 connects the control signal input terminus of described etching sprinker 602, described controller 601 is for the position coordinates in the residual copper region on acquisition cuicuit plate, according to the position coordinates in described residual copper region, to described etching sprinker 602 input control signals, control described the first nozzle and spray etching solution to the residual copper region of circuit card.
The device of the residual copper of described removal also comprises scavenging solution sprinker 603, described scavenging solution sprinker 603 is provided with second nozzle, the control signal output terminal of described controller 601 connects the control signal input terminus of described scavenging solution sprinker 603, described controller 601 is for according to the position coordinates in described residual copper region, to described scavenging solution sprinker 603 input control signals, control described second nozzle and spray scavenging solution to the residual copper region of circuit card.
Described controller 601 can be for according to the position coordinates in described residual copper region, described the first nozzle is moved to the top in the residual copper region of described circuit card, control described the first nozzle and spray etching solution to the residual copper region of circuit card, with the residual copper in residual copper region described in etching off.
Described controller 601 can be for according to the position coordinates in described residual copper region, described second nozzle is moved to the top in the residual copper region of described circuit card, control described second nozzle and spray scavenging solution to the residual copper region of circuit card, so that residual copper region is cleaned.Described scavenging solution can be clear water.
Preferably, the diameter of described the first nozzle is 0.05～0.1 millimeter, and the diameter of described second nozzle is 0.05～0.1 millimeter.By described the first nozzle, etching solution can be arrived to residual copper region with certain pressure injection, the etching solution ejecting forms the fluid column of approximately 0.1 millimeter.Because the fluid column of the etching solution ejecting is little, can be injected in accurately on the residual copper in residual copper region, avoid spray regime excessive, make the corrosion of paired transmission line.Same, by described second nozzle, scavenging solution can be arrived to residual copper region with certain pressure injection, the scavenging solution ejecting forms the fluid column of approximately 0.1 millimeter.
Preferably, the device of the residual copper of described removal also comprises imbibition device 604, described imbibition device 604 is provided with vacuum slot, the control signal output terminal of described controller 601 connects the control signal input terminus of described imbibition device 604, described controller 601 is for according to the position coordinates in described residual copper region, to described imbibition device 604 input control signals, suck the scavenging solution on residual copper region to control described vacuum slot.
Preferably, the device of the residual copper of described removal also comprises automated optical inspection 605, the signal output part of described automated optical inspection 605 connects the signal input part of described controller 601, described automated optical inspection 605 is for detection of the residual copper region of described circuit card, obtain the position coordinates in described residual copper region, and the position coordinates in described residual copper region is transferred to described controller 601.
Preferably, the device of the residual copper of described removal also comprises CCD image sensor 606, the control signal output terminal of described controller 601 connects the control signal input terminus of described CCD606, described controller 601 is for according to the position coordinates in described residual copper region, control the image that described CCD606 gathers described residual copper region, so that described residual copper region is confirmed.
Preferably, the device of the residual copper of described removal also comprises hair dryer 607, and described hair dryer 607 is for drying up the circuit card after cleaning.The control signal output terminal of described controller 601 can connect the control signal input terminus of described hair dryer 607, and described controller 601, for according to the position coordinates in described residual copper region, is controlled described hair dryer 607 described residual copper region is dried up.
Preferably, the device of the residual copper of described removal also comprises dryer 608, and described dryer 608 is for being dried the circuit card after cleaning.The control signal output terminal of described controller 601 can connect the control signal input terminus of described dryer 608, controls described dryer 608 described residual copper region is dried.
By embodiment, a kind of method and device of removing residual copper of the present invention is described in detail above, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (10)
1. a method of removing residual copper, is characterized in that, comprising:
The position coordinates in the residual copper region on acquisition cuicuit plate;
According to the position coordinates in described residual copper region, spray etching solution to described residual copper region, with the residual copper in residual copper region described in etching off.
2. the method for the residual copper of removal according to claim 1, is characterized in that, the described etching solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays etching solution to described residual copper region.
3. the method for the residual copper of removal according to claim 1 and 2, is characterized in that, also comprises:
After the residual copper in residual copper region described in etching off, suck the etching solution that is sprayed at described residual copper region with vacuum slot.
4. the method for the residual copper of removal according to claim 3, is characterized in that, also comprises:
After sucking with described vacuum slot the etching solution that is sprayed at described residual copper region, clean described residual copper region.
5. the method for the residual copper of removal according to claim 4, is characterized in that, the step in the described residual copper of described cleaning region comprises: spray scavenging solution to described residual copper region; After scavenging solution is sprayed in described residual copper region, suck the scavenging solution that is sprayed at described residual copper region with vacuum slot.
6. the method for the residual copper of removal according to claim 5, is characterized in that, the described scavenging solution that sprays to described residual copper region is specially: use diameter is that the nozzle of 0.05～0.1 millimeter sprays scavenging solution to described residual copper region.
7. remove the device of residual copper for one kind, it is characterized in that, comprise controller and etching sprinker, described etching sprinker is provided with the first nozzle, the control signal output terminal of described controller connects the control signal input terminus of described etching sprinker, and described controller is for the position coordinates in the residual copper region on acquisition cuicuit plate, according to the position coordinates in described residual copper region, to described etching sprinker input control signal, control described the first nozzle and spray etching solution to the residual copper region of circuit card.
8. according to the device of the residual copper of described removal claimed in claim 7, it is characterized in that, also comprise scavenging solution sprinker, described scavenging solution sprinker is provided with second nozzle, the control signal output terminal of described controller connects the control signal input terminus of described scavenging solution sprinker, described controller, for according to the position coordinates in described residual copper region, to described scavenging solution sprinker input control signal, is controlled described second nozzle and is sprayed scavenging solution to the residual copper region of circuit card.
9. according to the device of the residual copper of described removal claimed in claim 8, it is characterized in that, the diameter of described the first nozzle is 0.05～0.1 millimeter, and the diameter of described second nozzle is 0.05～0.1 millimeter.
10. according to the device of the residual copper of removal described in described claim 7,8 or 9, it is characterized in that, also comprise imbibition device, described imbibition device is provided with vacuum slot, the control signal output terminal of described controller connects the control signal input terminus of described imbibition device, described controller, for according to the position coordinates in described residual copper region, to described imbibition device input control signal, sucks the scavenging solution on residual copper region to control described vacuum slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210504603.6A CN103849873A (en) | 2012-11-30 | 2012-11-30 | Residual copper removal method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210504603.6A CN103849873A (en) | 2012-11-30 | 2012-11-30 | Residual copper removal method and device |
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| CN103849873A true CN103849873A (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210504603.6A Pending CN103849873A (en) | 2012-11-30 | 2012-11-30 | Residual copper removal method and device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519672A (en) * | 2014-12-19 | 2015-04-15 | 胜华电子（惠阳）有限公司 | Repair method for PCB (printed circuit board) circuits |
| US12004307B2 (en) | 2021-06-09 | 2024-06-04 | International Business Machines Corporation | Short or near short etch rework |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101502822A (en) * | 2008-02-04 | 2009-08-12 | 联华电子股份有限公司 | Calibrating equipment of nozzle and calibration method of nozzle |
| CN101985752A (en) * | 2009-07-28 | 2011-03-16 | 富葵精密组件(深圳)有限公司 | Spray etching device |
-
2012
- 2012-11-30 CN CN201210504603.6A patent/CN103849873A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101502822A (en) * | 2008-02-04 | 2009-08-12 | 联华电子股份有限公司 | Calibrating equipment of nozzle and calibration method of nozzle |
| CN101985752A (en) * | 2009-07-28 | 2011-03-16 | 富葵精密组件(深圳)有限公司 | Spray etching device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104519672A (en) * | 2014-12-19 | 2015-04-15 | 胜华电子（惠阳）有限公司 | Repair method for PCB (printed circuit board) circuits |
| CN104519672B (en) * | 2014-12-19 | 2017-07-18 | 胜华电子（惠阳）有限公司 | A kind of method for repairing and mending of pcb board circuit |
| US12004307B2 (en) | 2021-06-09 | 2024-06-04 | International Business Machines Corporation | Short or near short etch rework |
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Application publication date: 20140611 |