CN201213349Y - Heat Radiation device - Google Patents
Heat Radiation device Download PDFInfo
- Publication number
- CN201213349Y CN201213349Y CNU2008201047128U CN200820104712U CN201213349Y CN 201213349 Y CN201213349 Y CN 201213349Y CN U2008201047128 U CNU2008201047128 U CN U2008201047128U CN 200820104712 U CN200820104712 U CN 200820104712U CN 201213349 Y CN201213349 Y CN 201213349Y
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- heat
- radiating
- abstractor
- radiating substrate
- heat abstractor
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Abstract
The utility model relates to a radiating device which can be installed in an electronic device and be contacted with a heat generating unit in the electronic device. The radiating device at least comprises a seat body and a radiating baseplate, wherein the seat body is contacted with the heat generating unit and is connected with the heat generating unit by utilizing a connecting device; the radiating baseplate is arranged on the seat body; the radiating baseplate is provided with a body formed by mixing ceramic particles and a plurality of nanometer-level inorganic semiconductor particles; and a heat source generated by the heat generating unit can cause the radiating baseplate to generate a pyroelectric effect so as to radiate the heat source from the other side of the radiating baseplate and achieve the efficiency of effective radiating.
Description
Technical field
The relevant a kind of heat abstractor of the utility model aims to provide a kind of being installed in the electronic installation and with heat-generating units and contacts, with effective effect that the thermal source of heat-generating units is left, and heat abstractor simple in structure.
Background technology
In recent years, along with the continuous lifting of the design/manufacturing technology of integrated circuit, the also constantly doubly fast evolution of computer chip arithmetic speed and treatment efficiency.In general, the arithmetic speed of electronic chip is fast more, and treatment efficiency is high more, and the heat energy that electronic chip produced is also just high more.Yet the operating environment of high temperature but is the key factor that influences the electronic chip life cycle.Therefore, when constantly pursuing high-effect chip, how thinking provides electronic chip good heat dissipation environment, also is one of important topic of future generations computer system design.
In general, central processing unit (CPU) is a topmost heat energy source in the computer system, and is applied to the heat dissipation design of central processing unit at present, and majority is that the air cooling technology that adopts fan directly to blow reaches the effect that reduces the central processing unit chip temperature; But, also some system can adopt the Water Cooling Technology of cooling water circulation to carry out the heat radiation of central processing unit.So-called air cooling technology is meant and sees through fan directly carries out forced convertion to central processing unit cooling effect, as shown in Figure 1, usually such cooling technology cooperates a radiating fin 11 (fin), be arranged on this central processing unit 12, to absorb the heat energy of this central processing unit 12 in advance, follow, see through again by fan 13 this radiating fin 11 is produced the type of cooling of forced convertions, this radiating fin 11 is dispelled the heat, effectively to take away the heat energy that this central processing unit 12 is produced.Yet, if there is too much thermal source simultaneously, meeting is too crowded because of the member configuration of computer housing inside, causes the Flow Field Distribution inequality of computer housing inside in computer system, and when causing the casing internal temperature too high, the cooling effect of forced convertion just can significantly reduce.
In order effectively to overcome this problem, the Water Cooling Technology of another kind of cooling water circulation is also in gradually the heat dissipation design that is applied to central processing unit.So-called Water Cooling Technology aspect refers to see through a circulation conduit, the cooling fluid band of one low temperature is imported the heat sink (heat sink) that joins with this central processing unit, and (this heat sink can be radiating fin or other cooling body usually, to absorb the heat energy of this central processing unit), and after carrying out heat exchange by this cooling fluid and this heat sink, take away the thermal source on this heat sink.Because after carrying out heat exchange, the temperature of cooling fluid can become a high temperature cooling fluid, after this high temperature cool stream cognition flows directly to the computer housing outside, and see through fan-cooled mode and ambient temperature is carried out secondary heat exchange, so that the temperature of this high temperature cooling fluid is minimized, and the heat sink that joins with this central processing unit is injected in circulation again, so, takes the thermal source of central processing unit out of effect to reach.
Yet, the thermal source of central processing unit can be taken to the computer housing outside although utilize Water Cooling Technology, but when carrying out second time heat exchange by this cooling fluid, only just come cooling fluid is dispelled the heat by fan, and be held in general room temperature multidimensional under 20～28 ℃ the situation, the cooling effect of cooling fluid also is limited.
The utility model content
In view of this, the technical problem that the utility model solved is promptly improved at heat abstractor, contacts so that a kind of being installed in the electronic installation and with heat-generating units to be provided, and heat dissipation is preferable, and heat abstractor simple in structure.
Take off purpose on reaching, heat abstractor of the present utility model can be in order to be installed in the electronic installation, and contact with heat-generating units in the electronic installation, this heat abstractor includes at least: pedestal and heat-radiating substrate, this pedestal contacts this heat-generating units, and utilize jockey to be connected with heat-generating units, this heat-radiating substrate is located on this pedestal, this heat-radiating substrate is provided with by ceramic particle and the plural number body of meter level inorganic semiconductor mix particles how, the thermal source that this heat-generating units produced, make this heat-radiating substrate produce thermoelectric effect, and the in addition side of thermal source from heat-radiating substrate left, effectively reach the effect of heat radiation.
And the utility model has compared to habit and has following advantage:
1, habit has radiating mode by heat exchange pattern, and the utility model makes yin, yang atomic collision, coupling allow energy disappear by thermoelectric effect, and then causes cooling effect, and its heat radiation is really preferable.
2, the utility model utilizes single heat-radiating substrate to replace and practises the radiator structure (including radiating fin, fan, heat pipe etc.) that has, and its cost simple in structure is lower, and does not need numerous and diverse package assembly promptly plastic.
Description of drawings
Fig. 1 is for practising the structural perspective that heat abstractor is arranged;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of heat abstractor first embodiment in the utility model;
Fig. 3 is the structural representation of heat abstractor in the electronic installation in the utility model;
Fig. 4 is the structural perspective of heat abstractor second embodiment in the utility model;
Fig. 5 is the structural representation of heat abstractor the 3rd embodiment in the utility model;
Fig. 6 is the structural representation of heat abstractor the 4th embodiment in the utility model;
Fig. 7 is the structural perspective of heat abstractor the 5th embodiment in the utility model;
Fig. 8 is the structural perspective of heat abstractor the 6th embodiment in the utility model.
[figure number explanation]
Radiating fin 11 central processing units 12
Heat-radiating substrate 23 bodies 231
Wavy heat radiation lamellar body 232 radiating fins 233
Stick together heat-conducting layer 24 heat-conducting layers 25
Radiating subassembly 26 electronic installations 30
Heat-generating units 31 substrates 32
Embodiment
Characteristics of the present utility model can be consulted the detailed description of the graphic and embodiment of this case and obtained to be well understood to.
Heat-radiating substrate 23 contacts this heat-generating units 31, and utilizes jockey to be connected with heat-generating units 31, and this heat-radiating substrate 23 is provided with by ceramic particle and the plural number body of meter level inorganic semiconductor mix particles how.
Among the embodiment as shown in the figure, this jockey can be at least one fixture 22 (can be screw), and this heat-generating units 31 is located on the substrate 32, utilizes fixture 22 to interconnect heat-radiating substrate 23 and substrate 32 fixing.
The thermal source that is sent when heat-generating units 31 work, when making this thermal source conduct to heat-radiating substrate 23, make this heat-radiating substrate 23 produce thermoelectric effect, wherein the temperature difference of this heat-radiating substrate 23 intrinsic N, P type semiconductor produces thermo-electromotive force, change current direction, and the in addition side of thermal source from heat-radiating substrate 23 left, effectively reach the effect of heat radiation, and the thermal source of heat-generating units 31 cooled off, with task performance and the efficient of guaranteeing heat-generating units 31.
In addition, this heat-radiating substrate can be tabular, as shown in Figure 2, and the thickness of visual required this heat-radiating substrate of adjustment, or adjust plural number how the composition of meter level inorganic semiconductor particle to form different colours, and this heat-radiating substrate can also be difformity, and among second embodiment as shown in Figure 4, this heat-radiating substrate 23 can have flat body 231, and this body 231 is extended with plural wavy heat radiation lamellar body 232 away from heat-generating units 31 1 sides, in addition among the 3rd embodiment as shown in Figure 5, this heat-radiating substrate 23 can have flat body 231, and this body 231 is extended with plurality of radiating fins 233 away from heat-generating units 31 1 sides, can more increase the usefulness of heat radiation by the wavy heat radiation lamellar body 232 of plural number or plurality of radiating fins 233; Certainly, also can be provided with heat-conducting layer 25 with respect to these heat-generating units 31 1 sides, make the thermal source of this heat-generating units 31 be able to reach the effect of soaking, further thermal source be left again by this heat-radiating substrate 23 by this heat-conducting layer 25 in heat-radiating substrate 23.
Moreover, be illustrated in figure 6 as the 4th embodiment of heat abstractor 20, this heat abstractor 20 further is provided with pedestal 21, this cooling base 23 is located on the pedestal 21, and contact with this heat-generating units 31 by this pedestal 21, the area of this pedestal 21 is greater than heat-radiating substrate 23, and is provided with between this pedestal 21 and the heat-radiating substrate 23 and sticks together heat-conducting layer 24, that this pedestal 21 and heat-radiating substrate 23 are pasted mutually is fixing to stick together heat-conducting layer 24 by this, and wherein this sticks together heat-conducting layer 24 and can be heat-conducting glue.
Moreover, this heat abstractor 20 can include a plurality of heat-radiating substrates 23, as shown in Figure 7, and these heat-radiating substrate 23 tops further are provided with radiating subassembly 26, this radiating subassembly 26 can as shown be radiating fin, and perhaps this radiating subassembly 26 can be fan, as shown in Figure 8, also or be the combination of radiating fin or fan, can further increase heat dissipation.
And the utility model has compared to habit and has following advantage:
1, habit has radiating mode by heat exchange pattern, and the utility model makes yin, yang atomic collision, coupling allow energy disappear by thermoelectric effect, and then causes cooling effect, and its heat radiation is really preferable.
2, the utility model utilizes single heat-radiating substrate to replace and practises the radiator structure (including radiating fin, fan, heat pipe etc.) that has, and its cost simple in structure is lower, and does not need numerous and diverse package assembly promptly plastic.
In sum, the utility model provides electronic building brick one preferable feasible heat abstractor, so offer the application of novel patent in accordance with the law; Moreover technology contents of the present utility model and technical characterstic the sixth of the twelve Earthly Branches disclose as above, yet the personage who is familiar with this technology still may do various replacement and the modifications that do not deviate from this case utility model spirit based on announcement of the present utility model.Therefore, protection range of the present utility model should be not limited to those disclosed embodiments, and should comprise various do not deviate from replacement of the present utility model and modifications, and is contained by following claim.
Claims (9)
1, a kind of heat abstractor, this heat abstractor is characterized in that in order to the contact heating unit this heat abstractor includes at least:
Heat-radiating substrate contacts this heat-generating units, and utilizes jockey to be connected with heat-generating units, and this heat-radiating substrate is provided with by ceramic particle and the plural number body of meter level inorganic semiconductor mix particles how.
2, heat abstractor as claimed in claim 1 is characterized in that, this heat abstractor further is provided with pedestal, and this cooling base is located on the pedestal, and contacts with this heat-generating units by this pedestal.
3, heat abstractor as claimed in claim 2 is characterized in that, is provided with between this pedestal and the heat-radiating substrate and sticks together heat-conducting layer.
4, heat abstractor as claimed in claim 1 is characterized in that, this jockey is at least one fixture, and this heat-generating units is located on the substrate, utilizes fixture to interconnect heat-radiating substrate and substrate fixing.
5, heat abstractor as claimed in claim 1 is characterized in that, this heat-radiating substrate is a tabular.
6, heat abstractor as claimed in claim 1 is characterized in that, this heat-radiating substrate can have flat body, and this body is extended with plurality of radiating fins or wavy heat radiation lamellar body away from pedestal one side.
7, heat abstractor as claimed in claim 1 is characterized in that, this heat-radiating substrate is provided with heat-conducting layer with respect to this heat-generating units one side.
8, heat abstractor as claimed in claim 1 is characterized in that, this heat-radiating substrate top further is provided with radiating subassembly.
9, heat abstractor as claimed in claim 8 is characterized in that, this radiating subassembly can be radiating fin or fan or its combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201047128U CN201213349Y (en) | 2008-04-09 | 2008-04-09 | Heat Radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201047128U CN201213349Y (en) | 2008-04-09 | 2008-04-09 | Heat Radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201213349Y true CN201213349Y (en) | 2009-03-25 |
Family
ID=40497530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201047128U Expired - Fee Related CN201213349Y (en) | 2008-04-09 | 2008-04-09 | Heat Radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201213349Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103563501A (en) * | 2011-06-01 | 2014-02-05 | 丰田自动车株式会社 | Radiator structure |
-
2008
- 2008-04-09 CN CNU2008201047128U patent/CN201213349Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103563501A (en) * | 2011-06-01 | 2014-02-05 | 丰田自动车株式会社 | Radiator structure |
| CN103563501B (en) * | 2011-06-01 | 2016-01-20 | 丰田自动车株式会社 | Radiator structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090325 Termination date: 20100409 |