CN101118883A - High efficiency LED heat radiating module - Google Patents
High efficiency LED heat radiating module Download PDFInfo
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- CN101118883A CN101118883A CNA2007101457527A CN200710145752A CN101118883A CN 101118883 A CN101118883 A CN 101118883A CN A2007101457527 A CNA2007101457527 A CN A2007101457527A CN 200710145752 A CN200710145752 A CN 200710145752A CN 101118883 A CN101118883 A CN 101118883A
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- heat
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- radiating module
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Abstract
The present invention relates to a LED heat emission pattern assembly with high efficiency, and the heat emission pattern assembly directly makes an electric insulation heat conducting layer with diamond element on the heat absorbing end face of the radiator. The metal circuit layer can be provided with one or a plurality of LED components. The pattern assembly structure of the heat emission glue is not used, the present invention solves the problems of heat emission, blocking and piling to keep that the LED works in a normal temperature.
Description
Technical field
The present invention relates to a kind of LED heat radiating module, belong to the technical field of cooling application, this heat radiation modular structure can be used for the light-emitting diode assembling to be used.
Background technology
Along with improving constantly of light-emitting diode power, the work waste heat increases and not equivalent raising of discharge capacity, causes component temperature rising operating efficiency to reduce the problem of damaging element even.The radiating mode that self-criticism is commonly used, for example light-emitting diode contacts with radiator by circuit substrate, thermal paste, makes the heat of electric elements be transmitted to the radiator discharge.Right actual the use shows that present radiating mode still exists following three thermal resistance shortcomings, one. between radiator and the light-emitting diode, and the high heat resistant plastic layer structure that exists insulation-encapsulated to use; Two. the light-emitting diode electronic component is installed on the polyester circuit substrate of high thermal resistance insulation; Three. use thermal paste between each structure sheaf, because of the thermal paste pyroconductivity has only 1 ~ 5w/km, and interface can exist bubble and fault of construction etc., causes the huge thermal instability of product.Therefore improve methods such as radiator fins area or raising rotation speed of the fan at present, just palliative fails to improve above-mentioned shortcoming.Following several mode is arranged in the development that overcomes the problems referred to above, as technology one, Japan Patent JP2004-200347A, disclose a kind of technology: with diamond and metal material is mixture, conductive radiating layer for the light-emitting diode p utmost point and n interpolar lamination structure, right this technology is to improve the conductive radiating layer of light-emitting diode p/n internal structure, fails to solve foregoing problems for outside high hot plugging plug accumulation situation.Technology two; as the flat 5-347369A of Japan Patent JP; a kind of technology is disclosed: with diamond fine particle blending epoxy or Gui acid esters; radiating insulating encapsulated layer as electronic component; this technology has been improved the top encapsulated layer heat dissipation problem of heat-generating electronic elements; but, fail to provide the method for dealing with problems for the problem of high thermal resistance insulating circuit board in bottom and thermal paste interface defective.Technology three as Chinese patent CN1545148A, discloses a kind of technology: for large-power light-emitting diodes is mounted on radiator structure on the cvd diamond substrate, so this technology uses multilayer thermal paste between each structure sheaf, in the hope of reaching the heat conduction purpose.This technology does not rationally solve heat conduction problem yet because of increasing the raising that multilayer thermal paste interface causes thermal resistance.Technology four as Chinese patent CN1941347A, discloses a kind of technology: be coated with a heat conductive insulating layer that contains diamond powder and epoxy resin on a substrate, the heat of putting semiconductor chip on the insulating barrier is got rid of to extraneous via the heat conductive insulating layer.Right this patented technology still has following several problems, one. the heat conductive insulating layer is made on the what substrate, and substrate and external heat sink use thermal paste to be heat-conducting medium, could make heat energy arrive outside radiator by substrate, carry out the heat exchange heat radiation with outside air again, therefore do not improve the problem of thermal paste left and right sides heat sinking function; Two. the heat conductive insulating layer is made and is used diamond powder and two kinds of raw materials of epoxy resin, the intensity of this constituent, heat resistance and the coefficient of expansion, can't be under the frequent environment of large-power light-emitting diodes high temperature and switch steady operation, cause the quick reduction problem in useful life.Comprehensive above-mentioned several technology newly developed show that the problem of relevant heat conduction globality does not rationally solve yet.
Summary of the invention
Purpose of the present invention, being provides a kind of high efficiency LED heat radiating module of guaranteeing to dispel the heat at the problem of above-mentioned integral heat sink generation thermal resistance.
The objective of the invention is to be achieved through the following technical solutions.
A kind of high efficiency LED heat radiating module, it is characterized in that: this heat radiation module, it comprises a radiator, this radiator is not for using the modular structure of thermal paste, directly lamination is made the electric-insulation heat-conduction layer that contains the diamond composition on radiator heat absorption end face, this electric-insulation heat-conduction layer top makes the metallic circuit layer on demand, installs and encapsulate one or more light-emitting diode chip for backlight unit on the metallic circuit layer.
This radiator has following architectural feature:
Be made into preposition radiating fin or Hou and put radiating fin, various difform radiating seat and fins group adult;
Be made into heat pipe, radiating seat and the fins group adult of difformity configuration;
Be made into semiconductor cooler, heat pipe and the fins group adult of difformity configuration;
Make the electric-insulation heat-conduction layer that contains the diamond composition on its heat absorption end face, can make by the different angles curved surface of concave surface, plane or convex surface;
Make the electric-insulation heat-conduction layer contain the diamond composition on its heat absorption end face, use the composite material that contains the diamond composition, through extrude, pressing mold, injection, wire mark, spraying or irritate relevant mode such as mould, form the insulating heat-conductive layer of suitable shape and thickness.
Make the electric-insulation heat-conduction layer that contains the diamond composition on its heat absorption end face, the composite material constituent that contains the diamond composition is made by reinforcing fiber, diamond fine particle and macromolecule bond.
Make the electric-insulation heat-conduction layer that contains the diamond composition on its heat absorption end face, the diamond particles degree is between the 0.5-100 micron.
Make the electric-insulation heat-conduction layer that contains the diamond composition on its heat absorption end face, this diamond layer can use chemical vapour deposition technique to make, the polycrystalline structure layer of thickness 3-300 micron.
LED heat radiating module of the present invention can reach following target:
1. do not use thermal paste, the complete no bubble zero defect in each composition surface improves heat and passes benefit;
2. adjust the electric-insulation heat-conduction layer material structures, make the improvement such as intensity, heat resistance and the coefficient of expansion of this constituent, to improve the useful life of large-power light-emitting diodes.
Description of drawings
Fig. 1 is the three-dimensional generalized section of the heat radiation module of the preposition fin of light-emitting diode;
Fig. 2 puts the heat radiation module schematic perspective view of fin for light-emitting diode Hou.
Among the figure: 1-diamond layer, 2-heat pipe, 21-radiator heat absorption end face, 22-radiator release end of heat, the 3-radiating fin, 4-metallic circuit layer, the light-emitting diode of 5-encapsulation, 6-circuit duct, the 7-power line, 8-convex surface electric-insulation heat-conduction layer, 9-concave curved surface electric-insulation heat-conduction layer
Embodiment
Technological means of the present invention is to use a kind of high efficiency LED heat radiating module, this module that dispels the heat, comprise a radiator, this radiator does not use thermal paste to be heat-conduction medium, direct lamination making one contains the electric-insulation heat-conduction layer 1 of diamond composition on radiator, this electric-insulation heat-conduction layer 1 top makes metallic circuit layer 4 on demand, can install and encapsulate one or more light-emitting diode chip for backlight unit on metallic circuit layer 4.So form the LED heat radiating module of a high cooling efficiency, actual solve because of the bad efficient that causes of dispelling the heat low or damage the problem of element.
The LED heat radiating module practice of high cooling efficiency is analyzed as follows, and an is according to the radiator that designs and produces of radiating requirements; The 2nd, is on the heat absorption end face of radiator, and directly lamination making one contains the electric-insulation heat-conduction layer of diamond composition; The 3rd. this electric-insulation heat-conduction layer 1 top, make metallic circuit layer 4 in modes such as printing, plating or etchings; The 4th. on metallic circuit layer 4, can install and encapsulate one or more light-emitting diode chip for backlight unit.Because of not using thermal paste, can guarantee heat-generating electronic elements heat extraction fast, to keep the condition of normal working temperature.
The LED heat radiating module practice of high cooling efficiency as shown in Figure 1, is 1. made the radiator of preposition radiating fin 3 according to radiating requirements, the umbilicate structure of radiator is formed; 2. on the intermediate recess heat absorption end face 21 of radiator, use the diamond composite of reinforcing fiber, diamond fine granular powder, insulating properties inorganic material and macromolecule bond, directly lamination making one contains the convex surface electric-insulation heat-conduction layer 8 of diamond composition; The 3rd. this electric-insulation heat-conduction layer top, make metallic circuit layer 4 with mode of printing; The 4th. between electric-insulation heat-conduction layer and bottom radiator, there are two circuit ducts 6 to pass through for signal and power line 7; The 5th. on the metallic circuit layer, install and encapsulate a plurality of light-emitting diode chip for backlight unit 5.
Embodiment 2
The LED heat radiating module practice of high cooling efficiency, as shown in Figure 2, the radiator that an designs and produces according to radiating requirements, by the heat pipe 2 that contains the front end pressing, warp-wise Hou extends to the structure of Hou section and radiating fin 3 compositions; The 2nd, uses diamond composite on the heat pipe heat absorption end face 21 of front end pressing, directly lamination making one contains the concave curved surface electric-insulation heat-conduction layer 9 of diamond composition; The 3rd. this electric-insulation heat-conduction layer top, make metallic circuit layer 4 with etching mode; The 4th. on metallic circuit layer 4, install and encapsulate a plurality of light-emitting diode chip for backlight unit 5.
Claims (9)
1. high efficiency LED heat radiating module, it is characterized in that: this heat radiation module comprises that one does not use the radiator of thermal paste, direct lamination on the heat absorption end face of this radiator, making contains the electric-insulation heat-conduction layer of diamond composition, can make the metallic circuit layer on this electric-insulation heat-conduction layer top, on the metallic circuit layer, install and encapsulate one or more light-emitting diode chip for backlight unit.
2. high efficiency LED heat radiating module according to claim 1 is characterized in that: described radiator is shaped on preposition radiating fin or rearmounted radiating fin, and difform radiating seat and fin combination.
3. high efficiency LED heat radiating module according to claim 1 is characterized in that: described heat sink arrangements has difform heat pipe, radiating seat and fin combination.
4. high efficiency LED heat radiating module according to claim 1 is characterized in that: described heat sink arrangements has semiconductor cooler, heat pipe and fin combination.
5. high efficiency LED heat radiating module according to claim 1 is characterized in that: be shaped on the electric-insulation heat-conduction layer that contains the diamond composition on the heat absorption end face of described radiator, can be made by the different angles curved surface of concave surface, plane or convex surface.
6. high efficiency LED heat radiating module according to claim 1, it is characterized in that: on the heat absorption end face of described radiator, make the electric-insulation heat-conduction layer that contains the diamond composition, employing contains the composite material of diamond composition, through extrude, pressing mold, injection, wire mark, spraying or irritate technology such as mould, make the insulating heat-conductive layer of suitable shape and thickness.
7. high efficiency LED heat radiating module according to claim 1, it is characterized in that: make the electric-insulation heat-conduction layer that contains the diamond composition on the heat absorption end face of described radiator, the composite material constituent that contains the diamond composition is made by reinforcing fiber, diamond fine particle and macromolecule bond.
8. high efficiency LED heat radiating module according to claim 1 is characterized in that: make the electric-insulation heat-conduction layer that contains the diamond composition on the heat absorption end face of described radiator, its adamantine granularity is between the 0.5-100 micron.
9. high efficiency LED heat radiating module according to claim 1, it is characterized in that: make the electric-insulation heat-conduction layer that contains the diamond composition on the heat absorption end face of described radiator, this diamond layer can use chemical vapour deposition technique to make the polycrystalline structure layer of thickness as the 3-300 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101457527A CN101118883A (en) | 2007-09-05 | 2007-09-05 | High efficiency LED heat radiating module |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007101457527A CN101118883A (en) | 2007-09-05 | 2007-09-05 | High efficiency LED heat radiating module |
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| CN101118883A true CN101118883A (en) | 2008-02-06 |
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| CNA2007101457527A Pending CN101118883A (en) | 2007-09-05 | 2007-09-05 | High efficiency LED heat radiating module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998758A (en) * | 2010-10-28 | 2011-03-30 | 哈尔滨工业大学 | LED printed circuit board and preparation method of amorphous diamond heat dissipation and insulation film layer thereof |
| US7918580B2 (en) | 2008-06-27 | 2011-04-05 | Foxconn Technology Co., Ltd. | LED illumination device |
| CN102130244A (en) * | 2010-12-17 | 2011-07-20 | 天津理工大学 | LED (light-emitting diode) radiating substrate based on diamond film and manufacturing method thereof |
| CN103759235A (en) * | 2014-01-31 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED radiating method |
-
2007
- 2007-09-05 CN CNA2007101457527A patent/CN101118883A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7918580B2 (en) | 2008-06-27 | 2011-04-05 | Foxconn Technology Co., Ltd. | LED illumination device |
| CN101998758A (en) * | 2010-10-28 | 2011-03-30 | 哈尔滨工业大学 | LED printed circuit board and preparation method of amorphous diamond heat dissipation and insulation film layer thereof |
| CN101998758B (en) * | 2010-10-28 | 2012-07-25 | 哈尔滨工业大学 | Preparation method of amorphous diamond heat dissipation and insulation film layer of LED printed circuit board |
| CN102130244A (en) * | 2010-12-17 | 2011-07-20 | 天津理工大学 | LED (light-emitting diode) radiating substrate based on diamond film and manufacturing method thereof |
| CN102130244B (en) * | 2010-12-17 | 2013-03-06 | 天津理工大学 | LED (light-emitting diode) radiating substrate based on diamond film and manufacturing method thereof |
| CN103759235A (en) * | 2014-01-31 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED radiating method |
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