CN201213136Y - Led发光二极管 - Google Patents
Led发光二极管 Download PDFInfo
- Publication number
- CN201213136Y CN201213136Y CN 200720177580 CN200720177580U CN201213136Y CN 201213136 Y CN201213136 Y CN 201213136Y CN 200720177580 CN200720177580 CN 200720177580 CN 200720177580 U CN200720177580 U CN 200720177580U CN 201213136 Y CN201213136 Y CN 201213136Y
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- CN
- China
- Prior art keywords
- led
- resistance
- resistor
- led chip
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
本实用新型提供了一种内置电阻的LED发光二极管本产品将LED的外置限流电阻,集成在了LED发光二极管的内部。LED发光二极管,包括正极支架、LED芯片、电阻和负极支架,正极支架顶端连接电阻,再由导线将电阻和LED芯片连接,LED芯片负极接导线到负极支架构成回路,在用透明树脂将元件封装起来,电阻也可接在负极支架顶端。本实用新型LED发光二极管,在增加电阻的情况下不增加体积,且增加了LED的自保护能力,节省后续加工步骤,降低成本,产品广泛应用在各种照明和指示产品上。
Description
技术领域
本实用新型属于一种LED发光二极管,具体涉及一种内置电阻的LED发光二极管。
背景技术
目前公知的LED发光二极管均未带限流电阻,可在使用中又需另外加电阻来限流保护,一方面占用安装空间,也增加了后期加工成,且LED芯片极易被静电击坏。
发明内容
通过将微型电阻内置在LED发光二极管内部的方法,可在不增加LED体积的情况下达到对LED自带限流保护的目的。
本实用新型采用的技术方案是,包括正极支架、LED芯片、电阻和负极支架,特征在于:正极支架近LED芯片端连接电阻,电阻再连接LED芯片,LED芯片再由导线连接负极支架,根据具体情况电阻也可由负极支架接LED芯片。
本实用新型专利还在于,
所述的LED发光二极管,其支架、电阻和LED芯片封装在透明树脂内。
所述的电阻是可根据生产要求安放在正极支架上或负极支架上的,对于双芯单脚的LED也同样适用,且电阻参数可按电路要求改变。
本实用新型LED发光二极管,在集成了外部限流电阻的同时,没有增加LED的原有体积,并能增强LED芯片的防静电能力,且在后续生产加工中省去了众多步骤,节省安装空间。
附图说明
图1是本实用新型LED发光二极管结构示意图,
图2是本实用新型LED发光二极管电阻正极电路示意图,
图3是本实用新型LED发光二极管电阻负极电路示意图,
图中,1.正极支架,2.LED芯片,3.负极支架,4.电阻,5.导线,6.透明树脂.
具体实施方式
下面结合附图和具体实施方式对本实用新型进行详细说明.
本实用新型LED发光二极管,如图1所示,包括正极支架1、LED芯片2、电阻4和负极支架3,正极支架1顶端连接电阻4,电阻4通过导线5连接LED芯片2,LED芯片2负极由另一条导线5接负极支架3,连接好的元件在由透明树脂6封装固定,电阻4也可连接在负极支架顶端安装。
本实用新型LED发光二极管,如图2所示,LED发光二极管电源正极接电阻R后进入LED芯片,LED芯片负极接电源负极,形成LED发光二极管电路。
本实用新型LED发光二极管,如图3所示,LED发光二极管电源正极接LED芯片,电阻R接在LED芯片负极端,形成LED发光二极管电路。
本实用新型采用的微型电阻,接入LED内部电路,在由树脂封装,在不增加体积的情况下LED集成了外部的限流电阻,省掉了外部的限流保护器件,相应节省了加工工艺,应用非常广泛。
Claims (3)
1、一种内置限流电阻的LED发光二极管,包括正极支架(1)、LED芯片(2)、电阻(4)和负极支架(3),特征在于:正极支架(1)顶端连接电阻(4),电阻(4)在连接LED芯片(2),LED芯片(2)再由导线(5)连接负极支架(3),电阻(4)也可接在LED芯片负极支架(3)。
2、根据权利要求1所述的LED发光二极管,其特征在于,所述的电阻(4)是固定在正极支架(1)上的,且电阻(4)也可在负极支架(3)上固定。
3、根据权利要求1所述的LED发光二极管,其特征在于,LED发光二极管的元件是封装在透明树脂(6)内。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200720177580 CN201213136Y (zh) | 2007-10-18 | 2007-10-18 | Led发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200720177580 CN201213136Y (zh) | 2007-10-18 | 2007-10-18 | Led发光二极管 |
Publications (1)
Publication Number | Publication Date |
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CN201213136Y true CN201213136Y (zh) | 2009-03-25 |
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ID=40497314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200720177580 Expired - Fee Related CN201213136Y (zh) | 2007-10-18 | 2007-10-18 | Led发光二极管 |
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CN (1) | CN201213136Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102769097A (zh) * | 2012-05-21 | 2012-11-07 | 王定锋 | 带贴片电阻的led支架和led器件和制造方法 |
CN103335236A (zh) * | 2013-05-31 | 2013-10-02 | 鄂尔多斯市荣泰光电科技有限责任公司 | 高压led灯条制造工艺、高压led灯组及其组装方法 |
-
2007
- 2007-10-18 CN CN 200720177580 patent/CN201213136Y/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102769097A (zh) * | 2012-05-21 | 2012-11-07 | 王定锋 | 带贴片电阻的led支架和led器件和制造方法 |
CN103335236A (zh) * | 2013-05-31 | 2013-10-02 | 鄂尔多斯市荣泰光电科技有限责任公司 | 高压led灯条制造工艺、高压led灯组及其组装方法 |
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Addressee: Yao Chunxia Document name: Notification to Pay the Fees |
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Granted publication date: 20090325 Termination date: 20091018 |