CN201213136Y - Led发光二极管 - Google Patents

Led发光二极管 Download PDF

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Publication number
CN201213136Y
CN201213136Y CN 200720177580 CN200720177580U CN201213136Y CN 201213136 Y CN201213136 Y CN 201213136Y CN 200720177580 CN200720177580 CN 200720177580 CN 200720177580 U CN200720177580 U CN 200720177580U CN 201213136 Y CN201213136 Y CN 201213136Y
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China
Prior art keywords
led
resistance
resistor
led chip
emitting diode
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Expired - Fee Related
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CN 200720177580
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English (en)
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姚春霞
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Individual
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Individual
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Priority to CN 200720177580 priority Critical patent/CN201213136Y/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型提供了一种内置电阻的LED发光二极管本产品将LED的外置限流电阻，集成在了LED发光二极管的内部。LED发光二极管，包括正极支架、LED芯片、电阻和负极支架，正极支架顶端连接电阻，再由导线将电阻和LED芯片连接，LED芯片负极接导线到负极支架构成回路，在用透明树脂将元件封装起来，电阻也可接在负极支架顶端。本实用新型LED发光二极管，在增加电阻的情况下不增加体积，且增加了LED的自保护能力，节省后续加工步骤，降低成本，产品广泛应用在各种照明和指示产品上。

Description

LED发光二极管
技术领域
本实用新型属于一种LED发光二极管，具体涉及一种内置电阻的LED发光二极管。
背景技术
目前公知的LED发光二极管均未带限流电阻，可在使用中又需另外加电阻来限流保护，一方面占用安装空间，也增加了后期加工成，且LED芯片极易被静电击坏。
发明内容
通过将微型电阻内置在LED发光二极管内部的方法，可在不增加LED体积的情况下达到对LED自带限流保护的目的。
本实用新型采用的技术方案是，包括正极支架、LED芯片、电阻和负极支架，特征在于：正极支架近LED芯片端连接电阻，电阻再连接LED芯片，LED芯片再由导线连接负极支架，根据具体情况电阻也可由负极支架接LED芯片。
本实用新型专利还在于，
所述的LED发光二极管，其支架、电阻和LED芯片封装在透明树脂内。
所述的电阻是可根据生产要求安放在正极支架上或负极支架上的，对于双芯单脚的LED也同样适用，且电阻参数可按电路要求改变。
本实用新型LED发光二极管，在集成了外部限流电阻的同时，没有增加LED的原有体积，并能增强LED芯片的防静电能力，且在后续生产加工中省去了众多步骤，节省安装空间。
附图说明
图1是本实用新型LED发光二极管结构示意图，
图2是本实用新型LED发光二极管电阻正极电路示意图，
图3是本实用新型LED发光二极管电阻负极电路示意图，
图中，1.正极支架，2.LED芯片，3.负极支架，4.电阻，5.导线，6.透明树脂.
具体实施方式
下面结合附图和具体实施方式对本实用新型进行详细说明.
本实用新型LED发光二极管，如图1所示，包括正极支架1、LED芯片2、电阻4和负极支架3，正极支架1顶端连接电阻4，电阻4通过导线5连接LED芯片2，LED芯片2负极由另一条导线5接负极支架3，连接好的元件在由透明树脂6封装固定，电阻4也可连接在负极支架顶端安装。
本实用新型LED发光二极管，如图2所示，LED发光二极管电源正极接电阻R后进入LED芯片，LED芯片负极接电源负极，形成LED发光二极管电路。
本实用新型LED发光二极管，如图3所示，LED发光二极管电源正极接LED芯片，电阻R接在LED芯片负极端，形成LED发光二极管电路。
本实用新型采用的微型电阻，接入LED内部电路，在由树脂封装，在不增加体积的情况下LED集成了外部的限流电阻，省掉了外部的限流保护器件，相应节省了加工工艺，应用非常广泛。

Claims (3)

1、一种内置限流电阻的LED发光二极管，包括正极支架(1)、LED芯片(2)、电阻(4)和负极支架(3)，特征在于：正极支架(1)顶端连接电阻(4)，电阻(4)在连接LED芯片(2)，LED芯片(2)再由导线(5)连接负极支架(3)，电阻(4)也可接在LED芯片负极支架(3)。
2、根据权利要求1所述的LED发光二极管，其特征在于，所述的电阻(4)是固定在正极支架(1)上的，且电阻(4)也可在负极支架(3)上固定。
3、根据权利要求1所述的LED发光二极管，其特征在于，LED发光二极管的元件是封装在透明树脂(6)内。
CN 200720177580 2007-10-18 2007-10-18 Led发光二极管 Expired - Fee Related CN201213136Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200720177580 CN201213136Y (zh) 2007-10-18 2007-10-18 Led发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200720177580 CN201213136Y (zh) 2007-10-18 2007-10-18 Led发光二极管

Publications (1)

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CN201213136Y true CN201213136Y (zh) 2009-03-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102769097A (zh) * 2012-05-21 2012-11-07 王定锋 带贴片电阻的led支架和led器件和制造方法
CN103335236A (zh) * 2013-05-31 2013-10-02 鄂尔多斯市荣泰光电科技有限责任公司 高压led灯条制造工艺、高压led灯组及其组装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102769097A (zh) * 2012-05-21 2012-11-07 王定锋 带贴片电阻的led支架和led器件和制造方法
CN103335236A (zh) * 2013-05-31 2013-10-02 鄂尔多斯市荣泰光电科技有限责任公司 高压led灯条制造工艺、高压led灯组及其组装方法

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