CN201732815U - Led引线框架及包括该led引线框架的led灯 - Google Patents

Led引线框架及包括该led引线框架的led灯 Download PDF

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CN201732815U
CN201732815U CN2010202349989U CN201020234998U CN201732815U CN 201732815 U CN201732815 U CN 201732815U CN 2010202349989 U CN2010202349989 U CN 2010202349989U CN 201020234998 U CN201020234998 U CN 201020234998U CN 201732815 U CN201732815 U CN 201732815U
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lead frame
led
diode
light
metal electrode
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胡建华
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Ningbo Ruikang Photoelectric Co., Ltd.
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Shenzhen Refond Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

本实用新型适用于LED封装领域，提供了一种LED引线框架及包括该LED引线框架的LED灯。该引线框架包括引线框架金属电极、引线框架塑胶、发光二极管，以及用于对所述发光二极管做静电保护的保护二极管，所述发光二极管和保护二极管与所述引线框架金属电极进行电连接，所述保护二极管位于所述引线框架塑胶内部。该引线框架避免了保护二极管对光的吸收，提高了LED产品的光强，并消除了产品光强空间分布不对称的现象。

Description

LED引线框架及包括该LED引线框架的LED灯
技术领域
本实用新型属于LED封装领域，尤其涉及一种LED引线框架及包括该LED引线框架的LED灯。
背景技术
LED是半导体材料制成的光电器件，它以高效、节能、环保、长寿命、易维护等显著优点，成为近年来最具发展前景的技术领域之一，成为人类照明史上继白炽灯、荧光灯之后的又一次标志性的飞跃，将孕育和催生新的光源革命。由于LED是静电敏感器件，当其应用在高端领域的时候，需要添加齐纳二极管或起到稳压作用的二极管(以下简称为保护二极管)对发光二极管做静电保护(如图2)，这样可以提升整体产品的抗静电特性。传统的LED引线框架结构中，发光二极管1与保护二极管2设置在同一个反射杯中(如图1)，这样会影响LED的光学特性，包括因为保护二极管的光吸收而导致的产品光强的降低，以及出现产品光强的空间分布不对称的现象。
实用新型内容
本实用新型实施例的目的在于提供一种LED引线框架，旨在解决由现有LED引线框架中的保护二极管引起的LED产品光强低，以及光强的空间分布不对称的问题。
本实用新型实施例是这样实现的，LED引线框架包括引线框架金属电极、引线框架塑胶、发光二极管，以及用于对所述发光二极管做静电保护的保护二极管，所述发光二极管和保护二极管与所述引线框架金属电极进行电连接，所述保护二极管位于所述引线框架塑胶内部。
根据本实用新型的优选技术方案：
所述发光二极管和保护二极管均位于所述引线框架金属电极的正面。
所述发光二极管和保护二极管分别位于所述引线框架金属电极的正面和背面。
本实用新型实施例的另一目的在于提供一种LED灯，所述LED灯包括上述的LED引线框架。
本实用新型实施例将保护二极管埋设在引线框架塑胶内部，避免了由于保护二极管对发光二极管发出的光的吸收导致的产品光强降低，以及光强空间分布不对称的现象。该引线框架结构可使产品的光强提升5～10％。
附图说明
图1是现有LED引线框架的俯视图；
图2是现有LED引线框架中保护二极管与发光二极管的连接示意图；
图3是本实用新型第一实施例提供的LED引线框架的剖面图；
图4是本实用新型第一实施例提供的LED引线框架的俯视图；
图5a至5c-2是本实用新型实施例提供的LED引线框架的制作流程图。
具体实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型实施例将保护二极管埋设在LED引线框架塑胶内部，避免了保护二极管对光的吸收，进而增大了产品的光强，并避免了光强空间分布不对称的现象。
本实用新型实施例提供了一种LED引线框架，包括引线框架金属电极、引线框架塑胶、发光二极管，以及用于对发光二极管做静电保护的保护二极管，发光二极管和保护二极管与引线框架金属电极进行电连接，保护二极管位于引线框架塑胶内部。
本实用新型实施例还提供了一种LED灯，该LED灯包括上述的LED引线框架。
本实用新型实施例将保护二极管埋设在引线框架塑胶内部，避免了由于保护二极管对发光二极管发出的光的吸收导致的产品光强降低，以及光强空间分布不对称的现象。
以下结合具体实施例对本实用新型的具体实现进行详细描述：
实施例一：
图3和图4示出了本实用新型第一实施例提供的LED引线框架的剖面图和俯视图，为了便于说明，仅示出了与本实用新型实施例相关的部分。
该LED引线框架中，引线框架金属电极5和引线框架塑胶6构成了LED支架。发光二极管1固定在引线框架金属电极5上，通过键合线3与引线框架金属电极5实现电连接。发光二极管1发出的光经反射杯4反射后，激发封装胶7内的荧光粉发光。保护二极管2埋设在引线框架塑胶6内部，与引线框架金属电极5进行电连接，用于对发光二极管1做静电保护。图3省略了保护二极管2和引线框架金属电极5之间的具体连接结构。由于发光二极管1的两个电极和保护二极管2的极性可以调整，因此在使用过程中，保护二极管与发光二极管可以固定在引线框架金属电极5的同一极或不同极上。
该引线框架的制作流程与现有引线框架的制作流程类似，包括金属料片冲压、电镀、注塑成型、切断弯角，不同点在于在注塑引线框架塑胶(注塑成型)之前进行保护二极管的固定工作。图5a-5c示出了本实用新型实施例提供的LED引线框架的制作流程图，该流程图仅示出了与本实用新型实施例相关的部分。该制作流程为：
根据需要的线路将金属料片冲压成所需的外形，根据所需的表面镀层进行表面电镀，如图5a。
将保护二极管2固定在引线框架金属电极5上，通过键合线使保护二极管2与引线框架金属电极5实现电连接，如图5b-1；也可以采用覆晶的方式将保护二极管2连接到引线框架金属电极5上，如图5b-2。
通过注塑方式完成引线框架塑胶6的包封，根据需要裁切成所需形状，以便后续作业，如图5c-1和图5c-2。
其中，保护二极管2可以设置在引线框架金属电极5的正面，如图5c-1；也可以设置在引线框架金属电极5的背面，如图5c-2。
该引线框架的使用和现有引线框架的使用相同，经过前处理、固晶、焊线、灌胶、测试分选、包装等工序，形成完整的LED产品。
本实用新型实施例将保护二极管埋设在引线框架塑胶内部，避免了由于保护二极管对发光二极管发出的光的吸收导致的产品光强降低，以及光强空间分布不对称的现象。该引线框架结构可使产品的光强提升5～10％。
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。

Claims (4)

1.LED引线框架，包括引线框架金属电极、引线框架塑胶、发光二极管，以及用于对所述发光二极管做静电保护的保护二极管，所述发光二极管和保护二极管与所述引线框架金属电极进行电连接，其特征在于，
所述保护二极管位于所述引线框架塑胶内部。
2.如权利要求1所述的LED引线框架，其特征在于，所述发光二极管和保护二极管均位于所述引线框架金属电极的正面。
3.如权利要求1所述的LED引线框架，其特征在于，所述发光二极管和保护二极管分别位于所述引线框架金属电极的正面和背面。
4.一种LED灯，其特征在于，所述LED灯包括权利要求1至3任一项所述的LED引线框架。
CN2010202349989U 2010-06-22 2010-06-22 Led引线框架及包括该led引线框架的led灯 Expired - Lifetime CN201732815U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018174355A (ja) * 2018-08-02 2018-11-08 日亜化学工業株式会社 発光装置
CN109103318A (zh) * 2017-06-20 2018-12-28 隆达电子股份有限公司 发光二极管封装结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109103318A (zh) * 2017-06-20 2018-12-28 隆达电子股份有限公司 发光二极管封装结构
JP2018174355A (ja) * 2018-08-02 2018-11-08 日亜化学工業株式会社 発光装置

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