CN201150164Y

CN201150164Y - Evacuation structure for heat between two sides of circuit board

Info

Publication number: CN201150164Y
Application number: CNU2007202017445U
Authority: CN
Inventors: 林昌亮; 李季龙; 颜久焱; 陈昱廷
Original assignee: CHENGHAN THERMAL TRANSMISSION TECHNOLOGY Co Ltd
Current assignee: CHENGHAN THERMAL TRANSMISSION TECHNOLOGY Co Ltd
Priority date: 2007-12-21
Filing date: 2007-12-21
Publication date: 2008-11-12
Anticipated expiration: 2017-12-21

Abstract

The utility model relates to a heat radiating structure between the both sides of a circuit board. The heat radiating structure is mainly a heat conduction component provided with quite good heat conducting effect and is penetrated and fixed in a prearranged penetrating hole on the circuit board, to ensure a first interface and a second interface to be respectively formed at the different side of the circuit board at both ends of the heat conduction component; a first contact surface is jointed to a high heat energy electronic part, and a second contact surface can be contacted with a heat radiating component, thereby adapting the heat radiating situation where the high heat energy electronic part and the heat radiating component are required to be respectively arranged at both different sides of the circuit board.

Description

Heat is evacuated structure between circuit board two sides

Technical field:

The utility model relates to heat evacuation structure between a kind of circuit board two sides, is meant a kind of flexible structure of the electronic component of circuit board associated component arrangement peripheral with it planning of promoting own especially.

Background technology:

Demand along with different circuit design, the various electronic components (as: central processing unit, power crystal etc.) that can produce a large amount of heat energy also are widely used gradually, this kind electronic component is owing to can produce high heat, therefore common use of radiating subassembly (as: fin, radiator fan) that many necessary cooperations are relevant is in the hope of outwards dispersing the heat that it produced fast and effectively.

And the composition mode of traditional high heat energy electronic component and relevant radiating subassembly, be as shown in Figure 1, it is a surface that the bottom side of this high heat energy electronic component 3 (being heat source body) is arranged at a circuit board 20, and radiating subassembly (i.e. this fin 40) closely is attached at other surface (top side) of this high heat energy electronic component 3, utilize contacting of this radiating subassembly (fin 40) and this high heat energy electronic component 3, also outwards disperse and can make heat conduct to this radiating subassembly (fin 40), to reach the effect of cooling; Yet, above-mentioned composition mode, its radiating subassembly (fin 40) is the top that directly repeatedly places this high heat energy electronic component 3, formed rolling up of whole height, thus, not only cause the planning restriction of these circuit board 20 perimeter components, also influence the electronic component on the circuit board 20 and the arrangement of associated component, the design and development that is unfavorable for product, easier modern electronic product trend and the trend that makes its product be difficult to satisfy miniaturization, sophistication.

The utility model content:

Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, heat evacuation structure between a kind of circuit board two sides is provided, its heat that circuit board one side thermal source can be produced effectively is passed to the opposite side of circuit board, uses the elasticity that promotes circuit board itself and the planning of peripheral associated component.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: heat is evacuated structure between a kind of circuit board two sides, it comprises a circuit board, be characterized in: a heat-conductive assembly runs through the perforation on the circuit board, and make two ends of this heat-conductive assembly form first and second contact-making surface respectively in the phase heteropleural of circuit board, this first contact-making surface fits in this high heat energy electronic component, and this second contact-making surface then is contacted with a radiating subassembly.

So, its heat that circuit board one side thermal source can be produced effectively is passed to the opposite side of circuit board, uses the elasticity that promotes circuit board itself and the planning of peripheral associated component.

As for detailed construction of the present utility model, application principle, effect and effect, then the explanation of doing with reference to following adjoint can be understood completely:

Description of drawings:

Fig. 1 is traditional high heat energy electronic component and the composition schematic diagram of relevant radiating subassembly.

Fig. 2 is the structure decomposition map of the utility model first embodiment.

Fig. 3 is the combination schematic diagram of the utility model first embodiment.

Fig. 4 is the application scenarios schematic diagram of the utility model first embodiment.

Fig. 5 is the combination section of the utility model first embodiment.

Fig. 6 is the structural profile schematic diagram of the utility model second embodiment.

Fig. 7 is the structural profile schematic diagram of the utility model the 3rd embodiment.

Fig. 8 is the structural representation of the utility model the 4th embodiment.

Fig. 9 is the structural representation of the utility model the 5th embodiment.

Figure 10 is the structural representation of the utility model the 6th embodiment.

Figure 11 is the structural representation of the utility model the 7th embodiment.

Label declaration:

1,10,100,5,6,7,8... heat-

conductive assembly

11,51,61,71.... through hole

12,121,102,82,821.... expansion flange 13,1001,83.. first contact-making surface

131,1002,831.. second contact-

making surface

2,20.... circuit board

21.... the high heat energy electronic component of perforation 3.....

4,40.... radiating subassembly 41.... heat pipe

411... convex extension part 42.... radiating fin

40.... fin

Embodiment:

See also Fig. 2 to Fig. 5, can clearly find out, the utility model mainly is to run through perforation 21 default on the circuit board 2 with a heat-conductive assembly 1, in this heat-conductive assembly 1, be provided with the through hole 11 of longitudinal extension, and two ends that make this heat-conductive assembly 1 can process (punching press) and be the expansion flange 12 that protrudes out to periphery via external force, 121, utilize this expansion flange 12,121 are held on the perforation 21 2 end peripheries outside of circuit board 2 and can form the location, and can make and respectively expand flange 12,121 outer surfaces form one first contact-making surface 13 and one second contact-making surface 131 respectively, a contact-making surface wherein (being second contact-making surface 131 in the diagram) can be for fitting in this high heat energy electronic component 3 (or other produces the thermal source of heat), another contact-making surface (first contact-making surface 13) then can contact with the heat pipe 41 of a radiating subassembly 4, utilizes this heat pipe 41 that heat is directed to default radiating fin 42 and outwards disperses; By combinations thereof, can form the radiator structure that a high heat energy electronic component 3 (thermal source) and radiating subassembly 4 are arranged at circuit board 2 two heteropleurals respectively, it can provide on electronic product intraware or the circuit board 2 in the electronic building brick planning selection of elasticity more and diversification.

Above-mentioned radiating subassembly 4 of the present utility model is except that can directly establishing a plane contact in this first contact-making surface 13 in heat pipe 41 sides, also can on the plane of these heat pipe 41 end sides, establish a convex extension part 411 or an end, use in the through hole 11 that inserts this heat-conductive assembly 1, more to increase contact (heat conduction) area and can form more firm location.

Referring to Fig. 6, for the structural profile schematic diagram of the utility model second embodiment, shown in this figure, the expansion flange 102 of this heat-conductive assembly 10 reflexed that is convexly curved can form the location so that be held on the perforation 21 2 end peripheries of circuit board 2 as can be known.

Referring to Fig. 7, structural profile schematic diagram for the utility model the 3rd embodiment, shown in this figure, this heat-conductive assembly 100 is embedded in the perforation 21 of this circuit board 2 and packings and form positioning states as can be known, and proper surperficial concordant with this circuit board 2 of first and second contact-making surface 1001,1002 that makes these heat-conductive assembly 100 2 ends.

In addition referring to Fig. 8 to Figure 10, each structural representation for the 4th to six embodiment of the present utility model, shown in each figure, as can be known this heat-conductive assembly its not only shown in each figure of first embodiment, can be outside the cylinder (as: heat-conductive assembly 1) of rectangle section (and its through hole also is identical rectangle), it also can be triangular section (as the heat-conductive assembly 5 of Fig. 8, has identical triangle through hole 51), the square section is (as the heat-conductive assembly 6 of Fig. 9, has identical square through hole 61), circular cross section is (as the heat-conductive assembly 7 of Figure 10, have identical manhole 71) etc. different shapes, and more can be other various different section shapes of not describing on it is used, and can reach identical implementation result.

Referring to Figure 11, structural representation for the utility model the 7th embodiment, shown in this figure, this heat-conductive assembly 8 also can be one solid (cancellation through hole) structure as can be known, its two end forms expansion flange 82,821 and can be clamped on the perforation periphery of circuit board 2 and form the location, and can make and respectively expand flange 82,821 outer surfaces and form one first contact-making surface 83 and one second contact-making surface 831 respectively, can fit in radiating subassembly 40 (or radiating fin) and high heat energy electronic component 3 (or other thermal source) respectively, it also has identical application form and radiating effect.

From the above mentioned as can be known, heat is evacuated structure and is had the electronic component of circuit board of enhancement associated component peripheral with it own really and plan flexible effect, true usability, novelty and the progressive that has had on the industry between the utility model circuit board two sides.

Claims

1. heat is evacuated structure between circuit board two sides, it comprises a circuit board, it is characterized in that: a heat-conductive assembly runs through the perforation on the circuit board, two ends of this heat-conductive assembly form first and second contact-making surface respectively in the phase heteropleural of circuit board, this first contact-making surface fits in this high heat energy electronic component, and this second contact-making surface then is contacted with a radiating subassembly.

2. heat is evacuated structure between circuit board two sides as claimed in claim 1, it is characterized in that: first and second contact-making surface of described heat-conductive assembly two ends just with the concordant applying of this circuit board surface.

3. heat is evacuated structure between circuit board two sides as claimed in claim 1, it is characterized in that: two ends of described heat-conductive assembly are the expansion flange that outwards protrudes out via external force processing, and this heat-conductive assembly forms the location with this expansion flange clamping perforation two end peripheries outside.

4. heat is evacuated structure between circuit board two sides as claimed in claim 3, it is characterized in that: the expansion flange of the described heat-conductive assembly reflexed that is convexly curved.

5. evacuate structure as heat between claim 1 or 2 or 3 or 4 described circuit board two sides, it is characterized in that: vertically providing in the described heat-conductive assembly can be for the through hole of this radiating subassembly with relative convex extension part or end insertion.

6. evacuate structure as heat between claim 1 or 2 or 3 or 4 described circuit board two sides, it is characterized in that: described heat-conductive assembly has circle, triangle, square or rectangular section configuration.

7. heat is evacuated structure between circuit board two sides as claimed in claim 5, and it is characterized in that: described heat-conductive assembly has circle, triangle, square or rectangular section configuration.

8. heat is evacuated structure between circuit board two sides as claimed in claim 5, and it is characterized in that: described through hole has the section configuration identical with its outer peripheral edges.

9. heat is evacuated structure between circuit board two sides as claimed in claim 7, and it is characterized in that: described through hole has the section configuration identical with its outer peripheral edges.

10. heat is evacuated structure between circuit board two sides as claimed in claim 5, and it is characterized in that: described through hole has the section configuration inequality with its outer peripheral edges.

11. heat is evacuated structure between circuit board two sides as claimed in claim 7, it is characterized in that: described through hole has the section configuration inequality with its outer peripheral edges.