CN205211736U - MOS (Metal oxide semiconductor) tube fixing structure - Google Patents

MOS (Metal oxide semiconductor) tube fixing structure Download PDF

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Publication number
CN205211736U
CN205211736U CN201521065770.0U CN201521065770U CN205211736U CN 205211736 U CN205211736 U CN 205211736U CN 201521065770 U CN201521065770 U CN 201521065770U CN 205211736 U CN205211736 U CN 205211736U
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CN
China
Prior art keywords
oxide
metal
semiconductor
screw
fixed block
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521065770.0U
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Chinese (zh)
Inventor
曾学飞
何俊峰
郑洪涛
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Shanghai Zhaoneng Electric & Electronic Technology Co Ltd
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Shanghai Zhaoneng Electric & Electronic Technology Co Ltd
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Priority to CN201521065770.0U priority Critical patent/CN205211736U/en
Application granted granted Critical
Publication of CN205211736U publication Critical patent/CN205211736U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a MOS (Metal oxide semiconductor) tube fixing structure, the pin welding of MOS pipe is on the PCB board, the fixed structure is including being located the mounting of MOS pipe with the accommodation space of PCB plate -type one -tenth, the PCB board is stretched out to the one end of mounting, and the other end closes with the MOS pipe thread to be connected, still include the screw, the mounting passes through the screw connection with the radiator, and the one end that the mounting stretches out the PCB board is arranged in to the card on the screw, and its lower extreme penetrates from the one end that the mounting stretches out the PCB board to the screw in radiator is stretched out to one end from mounting and MOS pipe thread close, the mounting is for the arc structure and can follow the screw center pin to taking place deformation, when the screw passed mounting screw in radiator, the mounting was warp to flat structure by the arc structure to support the MOS pipe on the radiator. The utility model discloses a two MOS pipes can be fixed simultaneously to the fixed structure, improve work efficiency, when the screw passed mounting screw in radiator, the mounting took place to warp, applyed the effort to the MOS pipe, made the MOS pipe levelly and smoothly closely laminate with the radiator, improved the radiating effect.

Description

A kind of metal-oxide-semiconductor fixed structure
Technical field
The utility model relates to the technique for fixing of metal-oxide-semiconductor, particularly relates to a kind of metal-oxide-semiconductor fixed structure.
Background technology
Along with industrialized high speed development, the application of metal-oxide-semiconductor is more and more extensive, also more and more higher to the requirement of its fixed structure.The fixed structure of current extensive use is fixed by screw fixed structure, but adopt the efficiency of assembling of screw fixed structure lower, and the metal-oxide-semiconductor after fixing exists rotation stress, there is breakdown risk.
Utility model content
The purpose of this utility model is to provide a kind of structure simple metal-oxide-semiconductor fixed structure, reduces production cost, makes metal-oxide-semiconductor with radiator is smooth fits closely, raising radiating effect.
For reaching this object, the utility model by the following technical solutions:
A kind of metal-oxide-semiconductor fixed structure, the pin of metal-oxide-semiconductor is welded on pcb board, and metal-oxide-semiconductor is provided with radiator away from the side of pcb board;
This fixed structure comprises the fixture being positioned at the spatial accommodation that metal-oxide-semiconductor and pcb board are formed; Pcb board is stretched out in one end of described fixture, and its other end and metal-oxide-semiconductor are fastened and connected;
Also comprise screw, described fixture and radiator are connected by screw, and described screw upper end is placed in one end that fixture stretches out pcb board, one end that pcb board is stretched out from fixture in its lower end penetrates, and stretches out screw-in radiator from one end that fixture and metal-oxide-semiconductor fasten;
Described fixture is arcuate structure and can along the central shaft of screw to generation deformation; When described screw screws in radiator through fixture, described fixture is out of shape to slab construction by arcuate structure, and is compressed on a heat sink by metal-oxide-semiconductor.
Further, described fixture comprises the first fixed block be fastened and connected with metal-oxide-semiconductor, and one end is through the second fixed block of pcb board, and the shell fragment between the first fixed block and the second fixed block; Described first fixed block, shell fragment and the second fixed block pressing are formed as one arcuate structure.
Further, described first fixed block comprises the first fixed block body, and the centre position of described first fixed block body is provided with baffle plate, described first fixed block body is arranged with the reference column about baffle plate symmetry; One end of described first fixed block body is provided with catch.
Further, the centre position on described baffle plate is provided with the first hole.
Further, described second hole is shoulder hole, and is hole, large footpath away from one end of metal-oxide-semiconductor; Described screw is arranged with pad, and the external diameter of described pad is greater than the diameter of the diameter holes in the second hole.
Further, the position in corresponding first hole of described shell fragment is provided with the 3rd hole.
Further, the described second corresponding position in the first hole of fixed block and the one end away from shell fragment is provided with positioning pipe; Described positioning pipe runs through along its central axis and is provided with the second hole.
Further, described first fixed block and the second fixed block are made by strengthening nylon; Described shell fragment is made up of stainless steel substrates.
Further, described 3rd hole is waist-shaped hole.
The beneficial effects of the utility model: when adopting the utility model to fix metal-oxide-semiconductor, two metal-oxide-semiconductors can be fixed simultaneously, improve its operating efficiency, reduce production cost; When adopting screw to screw in radiator through fixture, fixture generation deformation, be out of shape to planar structure by arcuate structure, active force is applied to metal-oxide-semiconductor, the lower surface of metal-oxide-semiconductor is made to be pressed on the upper surface of radiator, ensure metal-oxide-semiconductor and radiator is smooth fits closely, to realize best radiating effect.
Accompanying drawing explanation
Fig. 1 is assembling explosive view of the present utility model;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is the explosive view of Fig. 2.
In figure:
1, fixture; 11, the first fixed block; 111, the first fixed block body; 112, reference column; 113, baffle plate; 1131, the first hole; 12, the second fixed block; 122, positioning pipe; 1221, the second hole; 13, shell fragment; 131, the 3rd hole; 2, metal-oxide-semiconductor; 3, pcb board; 4, screw; 5, spatial accommodation; 6, radiator; 7, pad.
Embodiment
The technical solution of the utility model is further illustrated by embodiment below in conjunction with accompanying drawing.
Present embodiments provide a kind of metal-oxide-semiconductor fixed structure, make metal-oxide-semiconductor 2 and radiator have good contact and heat radiation all the time.In the present embodiment, as shown in Figure 1, the pin of described metal-oxide-semiconductor 2 is welded on pcb board 3, and metal-oxide-semiconductor 2 is provided with radiator 6 away from the side of pcb board 3; This fixed structure comprises the spatial accommodation 5 being positioned at metal-oxide-semiconductor 2 and being formed with pcb board 3, and pcb board 3 is stretched out in its one end, and the other end and metal-oxide-semiconductor 2 are fastened and connected; Also comprise screw 4, fixture 1 is connected by screw 4 with radiator 6, and described screw 4 upper end is placed in one end that fixture 1 stretches out pcb board 3, one end that pcb board 3 is stretched out from fixture 1 in its lower end penetrates, and stretches out from the one end fastened with fixture 1 and metal-oxide-semiconductor 2 and screw in radiator 6; By fixture 1, the lower surface of metal-oxide-semiconductor 2 is compressed on the upper surface of radiator 6 all the time; The air line distance at screw 4 edge and metal-oxide-semiconductor 2 edge and insulation clearance is made to meet the certification of UL1741 security regulations by fixture 1.
Fixture 1 described in the present embodiment is arcuate structure and can along the central shaft of screw 4 to generation deformation; When described screw 4 screws in radiator 6 through fixture 1, described fixture 1 is out of shape to slab construction by arcuate structure, and is pressed on radiator 6 by metal-oxide-semiconductor 2.
Concrete, when described screw 4 screws in radiator 6 through fixture 1, the both sides of fixture 1 are pressed on the end face of metal-oxide-semiconductor 2 respectively, fixture 1 is acted in screw 4 gradually screw-in process, fixture 1 is out of shape to slab construction by arcuate structure, the center of fixture 1 is gradually near radiator 6, the two ends of fixture 1 compress the upper surface of metal-oxide-semiconductor 2 under the effect of screw 4, attach pliability load can ensure compress metal-oxide-semiconductor and do not loosen for a long time simultaneously, thus the lower surface of metal-oxide-semiconductor 2 is pressed on radiator 6 all the time, ensure that the radiating efficiency of metal-oxide-semiconductor 2.When being screwed out by screw 4, along with the back-out gradually of screw 4, the power that screw acts on fixture 1 reduces gradually, fixture is restored to the original state gradually, fixture 1 lower surface reduces gradually to the pressure of metal-oxide-semiconductor 2, until screw 4 screws out completely, will realize being separated of metal-oxide-semiconductor 2 and radiator 6.
In the present embodiment, described fixture 1 comprises the first fixed block 11 be fastened and connected with metal-oxide-semiconductor 2, and one end is through the second fixed block 12 of pcb board, and the shell fragment 13 between the first fixed block 11 and the second fixed block 12; Described first fixed block 11, shell fragment 13 and the second fixed block 12 pressing are formed as one arcuate structure.Wherein, described first fixed block 11 and the second fixed block 12 are made up of enhancing nylon, and concrete is made up of nylon+30% glass fibre, improves the mechanical property of fixture 1, stability, heat resistance, ageing-resistant performance and fatigue performance; Described shell fragment 13 is made up of stainless steel substrates.When described screw 4 screws in radiator 6 through fixture 1, screw 4 promotes shell fragment 13 and deformation occurs, and makes the first fixed block 11 along identical direction, deformation occur with the second fixed block 12, and compresses metal-oxide-semiconductor 2, the lower surface of metal-oxide-semiconductor 2 is pressed on radiator 6.Because shell fragment 13 is made up of stainless steel substrates, when having a down load, shell fragment 13 can be flexible by fixed for metal-oxide-semiconductor 2.
As shown in Figure 2, described first fixed block 11 comprises the first fixed block body 111, the centre position of described first fixed block body 111 is provided with baffle plate 113, by baffle plate 113, first fixed block body 111 is divided into two parts, two metal-oxide-semiconductors 2 can be compressed simultaneously, reduce the quantity of fixed structure, reduce production cost; Described first fixed block body 111 is arranged with the reference column 112 about baffle plate 113 symmetry, metal-oxide-semiconductor 2 is provided with location hole, and this reference column 112 is suitable with the location hole on metal-oxide-semiconductor 2, when installing metal-oxide-semiconductor 2, make reference column 112 stretch into metal-oxide-semiconductor 2, it is positioned.
One end of described first fixed block body 111 is provided with catch 114, concrete, described catch 114 vertical with baffle plate 113 and with the central axis place plane parallel of two reference columns 112.Compress in the process of metal-oxide-semiconductor 2 at fixture 1, catch 114 can calibrate the position of metal-oxide-semiconductor 2, thus ensures that in the process of imposed load, metal-oxide-semiconductor 2 remains at correct position.
As shown in Figure 2, the centre position on described baffle plate 113 is provided with the first hole 1131; The position in corresponding first hole 1131 of described shell fragment 13 is provided with the 3rd hole 131, and preferably, in the present embodiment, described 3rd hole 131 is waist-shaped hole; The position in corresponding first hole 1131 of described second the fixed block 12 and one end away from shell fragment 13 is provided with positioning pipe 122, described positioning pipe 122 runs through being provided with the second hole 1221 along its central axis.Screw 4 is screwed on radiator 6 through behind the second hole 1221, the 3rd hole 131 and the first hole 1131 successively, avoids screw 4 and directly contacts with metal-oxide-semiconductor 2 and pcb board 3.
Described second hole 1221 is shoulder hole, and is hole, large footpath away from one end of metal-oxide-semiconductor 2; Described screw 4 is arranged with pad 7, the external diameter of described pad 7 is greater than the diameter of the diameter holes in the second hole 1221, when the lower end of screw 4 is screwed in radiator 6 through fixture 1, pad 7 will be placed in the hole, large footpath in the second hole 1221, along with the screw-in of screw 4, screw 4 will act on fixture 1 makes it deform.
Adopt above-mentioned fixed structure to fix metal-oxide-semiconductor, its concrete installation steps are as follows:
S1. the pin of metal-oxide-semiconductor 2 is welded on relevant position on pcb board 3;
S2. being placed in by fixture in spatial accommodation 5 that metal-oxide-semiconductor 2 and pcb board 3 formed makes itself and metal-oxide-semiconductor 2 fasten, concrete, is inserted by reference column 112 in the location hole on metal-oxide-semiconductor 2;
S3. screw 4 upper end is placed in one end that fixture 1 stretches out pcb board 3, one end that pcb board 3 is stretched out from fixture 1 in its lower end penetrates, rear screw-in radiator 6 is stretched out in the one end fastened from fixture 1 and metal-oxide-semiconductor 2, screw in screw 4 gradually, screw 4 acts on fixture 1 and makes it by arc structure to slab construction generation deformation, the center of fixture 1 is gradually near radiator 6, and its both sides are pressed on metal-oxide-semiconductor 2 upper surface, realizes metal-oxide-semiconductor 2 lower surface to be pressed on radiator 6 upper surface.
When adopting above-mentioned fixed structure to fix metal-oxide-semiconductor, two metal-oxide-semiconductors can be fixed simultaneously, improve its operating efficiency, reduce production cost.Screw 4 is adopted to screw in radiator 6 through fixture 1, making screw 4 act on fixture 1 makes it that deformation occur, be out of shape to planar structure by arcuate structure, active force is applied to metal-oxide-semiconductor 2, the lower surface of metal-oxide-semiconductor 2 is made to be pressed on the upper surface of radiator 6, ensure that metal-oxide-semiconductor 2 is fitted with radiator is smooth, closely to realize best radiating effect; The air line distance at screw 4 edge and metal-oxide-semiconductor 2 edge and insulation clearance is made to meet the certification of UL1741 security regulations by fixture 1; Described in the present embodiment, fixed structure can be applicable to photovoltaic DC-to-AC converter, by improving radiating effect, ensures that photovoltaic DC-to-AC converter is indeformable within service life.
Obviously, above-described embodiment of the present utility model is only used to clearly demonstrate the utility model example, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.All do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., within the protection range that all should be included in the utility model claim.

Claims (9)

1. a metal-oxide-semiconductor fixed structure, the pin of metal-oxide-semiconductor (2) is welded on pcb board (3), and metal-oxide-semiconductor (2) is provided with radiator (6) away from the side of pcb board (3); It is characterized in that,
This fixed structure comprises the fixture (1) being positioned at the spatial accommodation (5) that metal-oxide-semiconductor (2) is formed with pcb board (3); Pcb board (3) is stretched out in one end of described fixture (1), and its other end and metal-oxide-semiconductor (2) are fastened and connected;
Also comprise screw (4), fixture (1) is connected by screw (4) with radiator (6), and described screw (4) upper end is placed in one end that fixture (1) stretches out pcb board (3), one end that pcb board (3) is stretched out from fixture (1) in its lower end penetrates, and stretches out from one end that fixture (1) and metal-oxide-semiconductor (2) fasten and screw in radiator (6);
Described fixture (1) for arcuate structure and can along the central shaft of screw (4) to generation deformation; When described screw (4) screws in radiator (6) through fixture (1), described fixture (1) is out of shape to slab construction by arcuate structure, and is pressed on radiator (6) by metal-oxide-semiconductor (2).
2. metal-oxide-semiconductor fixed structure according to claim 1, it is characterized in that, described fixture (1) comprises the first fixed block (11) be fastened and connected with metal-oxide-semiconductor (2), one end through second fixed block (12) of pcb board (3), and is positioned at the shell fragment (13) between the first fixed block (11) and the second fixed block (12); Described first fixed block (11), shell fragment (13) and the second fixed block (12) pressing are formed as one arcuate structure.
3. metal-oxide-semiconductor fixed structure according to claim 2, it is characterized in that, described first fixed block (11) comprises the first fixed block body (111), the centre position of described first fixed block body (111) is provided with baffle plate (113), described first fixed block body (111) is arranged with about the symmetrical reference column (112) of baffle plate (113); One end of described first fixed block body (111) is provided with catch (114).
4. metal-oxide-semiconductor fixed structure according to claim 3, is characterized in that, the centre position on described baffle plate (113) is provided with the first hole (1131).
5. metal-oxide-semiconductor fixed structure according to claim 3, is characterized in that, the position of corresponding first hole (1131) of described shell fragment (13) is provided with the 3rd hole (131).
6. metal-oxide-semiconductor fixed structure according to claim 5, is characterized in that, the position of corresponding first hole (1131) of described second fixed block (12) and the one end away from shell fragment (13) is provided with positioning pipe (122); Described positioning pipe (122) runs through along its central axis and is provided with the second hole (1221).
7. metal-oxide-semiconductor fixed structure according to claim 6, is characterized in that, described second hole (1221) is shoulder hole, and is hole, large footpath away from one end of metal-oxide-semiconductor (2); Described screw (4) is arranged with pad (7), described pad (7) external diameter is greater than the diameter of the diameter holes in the second hole (1221).
8. metal-oxide-semiconductor fixed structure according to claim 2, is characterized in that, described first fixed block (11) and the second fixed block (12) are made up of enhancing nylon; Described shell fragment (13) is made up of stainless steel substrates.
9. metal-oxide-semiconductor fixed structure according to claim 6, is characterized in that, described 3rd hole (131) is waist-shaped hole.
CN201521065770.0U 2015-12-18 2015-12-18 MOS (Metal oxide semiconductor) tube fixing structure Expired - Fee Related CN205211736U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521065770.0U CN205211736U (en) 2015-12-18 2015-12-18 MOS (Metal oxide semiconductor) tube fixing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521065770.0U CN205211736U (en) 2015-12-18 2015-12-18 MOS (Metal oxide semiconductor) tube fixing structure

Publications (1)

Publication Number Publication Date
CN205211736U true CN205211736U (en) 2016-05-04

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CN201521065770.0U Expired - Fee Related CN205211736U (en) 2015-12-18 2015-12-18 MOS (Metal oxide semiconductor) tube fixing structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470221A (en) * 2015-12-18 2016-04-06 上海兆能电力电子技术有限公司 Fixing structure and fixing method for MOS transistor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105470221A (en) * 2015-12-18 2016-04-06 上海兆能电力电子技术有限公司 Fixing structure and fixing method for MOS transistor
CN105470221B (en) * 2015-12-18 2018-08-31 上海兆能电力电子技术有限公司 A kind of metal-oxide-semiconductor fixed structure and fixing means

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160504

Termination date: 20191218

CF01 Termination of patent right due to non-payment of annual fee