CN201145246Y - Light emitting diode component - Google Patents
Light emitting diode component Download PDFInfo
- Publication number
- CN201145246Y CN201145246Y CNU2007200723538U CN200720072353U CN201145246Y CN 201145246 Y CN201145246 Y CN 201145246Y CN U2007200723538 U CNU2007200723538 U CN U2007200723538U CN 200720072353 U CN200720072353 U CN 200720072353U CN 201145246 Y CN201145246 Y CN 201145246Y
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- emitting diode
- light
- flat
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses an LED assembly which has a structure as follows: the center of a flat heat tube (1) is stuck with an aluminium substrate with a circuit structure, the aluminium substrate is provided with a power LED chip (3), and the center of the other surface of the flat heat tube (1) is stuck with a circuit heat tube evaporator (4). When the assembly is electrified and works, the conduction of the heat generated in the illuminating process is realized by the flat heat tube in x and y directions; the heat conduction and radiation are realized by the circuit heat tube in z direction, thereby realizing the high-efficiency three-dimensional heat conduction and radiation, ensuring that the power is up to 20 to 50 watts, and the power is up to the light source level.
Description
Two, affiliated technical field:
The utility model relates to a kind of electric light source.
Two, background technology:
What at present general power type light-emitting diode adopted is that metal or pottery are made substrate, with the made device of power type light-emitting diode chip, the heat that is produced during its work is mainly by heat conducting and radiating, the device power of making is generally at 1 to 5 watt, but in fact the device of 5W must be equipped with more heat sink, could operate as normal.If what 5W was above must make assembly.In June, 2005, Neopac company in Taiwan released the LED assembly light source that adopts hot pipe technique, utilized heat conduction with phase change, made the thermal efficiency increase substantially.But traditional heat pipe is one dimension heat conduction also can only make 8～10 watts assembly unit.For forming light fixture, must be the unit with this assembly, could form light output and reach the above light fixture of 1000 lumens.
Three, summary of the invention:
The purpose of this utility model: adopt the flat-plate heat pipe of existing two-dimentional heat pipe and the heat pipe assembly that loop heat pipe is formed three-dimensional heat conduction, make heat pipe for thermal conductivity and heat radiation realize optimization.
The utility model is achieved by the following technical solution: flat-plate heat pipe (1) central authorities are stained with the aluminium base (2) that has circuit, power led chip (3) is housed on aluminium base, so just realize two dimension (x, y) heat conduction, have bigger area of dissipation and be convenient to be hinged with light-emitting diode chip for backlight unit, and higher with respect to the one dimension heat transfer efficiency of conventional heat pipe.If the vertical direction of flat-plate heat pipe is connected metalwork as heat sink, then can improve radiating effect greatly, if and in the another side central authorities of flat-plate heat pipe (1), promptly be stained with or the evaporimeter (4) of the backflow heat pipe of burn-oning in the vertical direction (z) of flat-plate heat pipe, then can realize three-dimensional (x, y, z) heat pipe for thermal conductivity structure makes heat pipe for thermal conductivity and heat radiation realize optimization.
The effect of invention:
The advantage of technical solutions of the utility model: adopt the light-emitting diode component of this three-dimensional heat conduction heat pipe structure, can reach 20 to 50 watts power, thereby make light output reach 1500 to 4000 lumens, can be directly as the light source of light fixture.Simultaneously also can utilize it as the unit, be combined into the light fixture of velvet-like, planar or stereo structure, make the bigger light output of acquisition, its value is equivalent to each unit and sends the luminous flux sum.
Description of drawings:
The utility model is further described in conjunction with the accompanying drawings with embodiment.
Accompanying drawing 1 is the vertical view of embodiment.
Accompanying drawing 2 is main cutaway views of embodiment.
The specific embodiment:
Embodiment as shown in Figure 1 and Figure 2.
Fig. 1 is the vertical view of embodiment.Central authorities' bonding at flat-plate heat pipe (1) goes up aluminium base (2), and power led chip (3) is housed on aluminium base.
Fig. 2 is embodiment master's cutaway view.Central authorities in flat-plate heat pipe (1) below, above the hot junction (evaporimeter (4)) of loop heat pipe was connected, the return duct of (5) backflow heat pipe was equipped with radiating fin (6) above.
When light emitting diode energising work, realize horizontal direction (x at the luminous heat that sends simultaneously by flat-plate heat pipe, y) the two-dimentional heat conduction on, by third dimension heat conduction and heat radiation on the following loop heat pipe realization vertical direction (z), this construction package has been realized three-dimensional efficiently heat conduction and heat radiation simultaneously.
Claims (5)
1. light-emitting diode component, comprise that flat-plate heat pipe (1) central authorities are stained with the aluminium base (2) that has circuit, power led chip (3) is housed on aluminium base, the another side central authorities of flat-plate heat pipe (1) are stained with or the evaporimeter (4) of the backflow heat pipe of burn-oning, and its principal character is to have formed the structure of three-dimensional heat conduction and heat radiation.
2. light-emitting diode component according to claim 1 is characterized in that horizontal direction heat radiation employing flat-plate heat pipe.
3. light-emitting diode component according to claim 1 is characterized in that vertical direction heat radiation employing backflow heat pipe.
4. light-emitting diode component according to claim 1 is characterized in that installation power light-emitting diode chip for backlight unit on the flat-plate heat pipe, adopts the aluminium base that has the loop, also can directly be welded in or be bonded on the flat-plate heat pipe with power led without aluminium base.
5. light-emitting diode component according to claim 1 is characterized in that used loop heat pipe also can receive away from hot junction place heat radiation by the flexible pipe cold junction that will dispel the heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200723538U CN201145246Y (en) | 2007-07-11 | 2007-07-11 | Light emitting diode component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200723538U CN201145246Y (en) | 2007-07-11 | 2007-07-11 | Light emitting diode component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201145246Y true CN201145246Y (en) | 2008-11-05 |
Family
ID=40082126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200723538U Expired - Lifetime CN201145246Y (en) | 2007-07-11 | 2007-07-11 | Light emitting diode component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201145246Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645153B (en) * | 2018-04-26 | 2018-12-21 | 泰碩電子股份有限公司 | The same tube is divided into a steam flow channel and a liquid flow channel loop heat pipe |
-
2007
- 2007-07-11 CN CNU2007200723538U patent/CN201145246Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645153B (en) * | 2018-04-26 | 2018-12-21 | 泰碩電子股份有限公司 | The same tube is divided into a steam flow channel and a liquid flow channel loop heat pipe |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201351897Y (en) | Heat dissipating structure of high power LED projecting lamp | |
| CN201003737Y (en) | Heat dissipation structure light-emitting diode head light | |
| CN202082883U (en) | Integral high-power LED heat pipe heat dissipation device | |
| CN101691920B (en) | Heat dissipation module of high-power LED lamp | |
| CN201145246Y (en) | Light emitting diode component | |
| CN202598171U (en) | Replaceable light-emitting diode (LED) lamp module | |
| CN201555187U (en) | Radiating structure for LED illuminating lamp | |
| CN102588926A (en) | Combination type three-dimensional light-emitting diode (LED) radiator | |
| CN202469989U (en) | Combined three-dimensional LED (light-emitting diode) radiator | |
| CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
| CN201636616U (en) | LED (Light-Emitting Diode) lamp | |
| CN101696789A (en) | Heat radiating structure of light emitting diode (LED) illuminating lamp | |
| CN203099379U (en) | Straight-tube type LED (light emitting diode) lamp | |
| CN201992414U (en) | Light-emitting diode (LED) daylight lamp capable of dissipating heat through heat conduction holes | |
| CN102691952A (en) | LED (light emitting diode) street lamp device | |
| CN201651989U (en) | High-power LED street lamp | |
| CN203453861U (en) | Water-cooling heat dissipation type high-power LED device | |
| CN201731459U (en) | Two-layer radiating structure of high-power light-emitting diode (LED) lamp | |
| CN202371677U (en) | Light type light-emitting diode (LED) radiating module | |
| CN208170343U (en) | Integrated radiator | |
| CN207702391U (en) | Heat conduction installation part and its LED automobile lamp | |
| CN201416867Y (en) | Led lamp | |
| CN102913802A (en) | Straight-tube-type LED (light-emitting diode) lamp | |
| CN201351899Y (en) | Backlight module heat radiation structure | |
| CN202484949U (en) | Fin type heat radiator applied to LED (Light Emitting Diode) street lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI DINGHUI SCIENCE CO., LTD. ADDRESS Free format text: FORMER OWNER: LI JIANSHENG ADDRESS Effective date: 20081128 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20081128 Address after: Shanghai City, Huangpu District Beijing East Road Beijing Science and technology No. 668 West Building 8 floor J block, zip code: 200001 Patentee after: Shanghai Toplight Tech. Co., Ltd. Address before: Shanghai City, Huangpu District Beijing East Road science and Technology City, No. 668 West 11F block G, zip code: 200001 Co-patentee before: Fang Zhilie Patentee before: Li Jian Sheng |
|
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI DINGHUI SCIENCE CO., LTD. Free format text: FORMER OWNER: LI JIANSHENG Effective date: 20081128 |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 200001, Shanghai, Beijing East Road, No. 668, East Building, 26 floor, block D, Huangpu District Patentee after: Shanghai Dinghui Technology Co., Ltd. Address before: 200001 Shanghai City, Huangpu District Beijing East Road Beijing Science and technology No. 668 West Building 8 floor J block Patentee before: Shanghai Toplight Tech. Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081105 |