CN208170343U

CN208170343U - Integrated radiator

Info

Publication number: CN208170343U
Application number: CN201820710861.2U
Authority: CN
Inventors: 冯圣勋; 黄远杰
Original assignee: PR Lighting Ltd
Current assignee: PR Lighting Ltd
Priority date: 2018-05-11
Filing date: 2018-05-11
Publication date: 2018-11-30
Anticipated expiration: 2028-05-11

Abstract

The utility model discloses a kind of integrated radiator, including substrate, the substrate side has lamp installation face, and the other side is fixed with radiating subassembly；The radiating subassembly includes cooling fin and heat-transfer pipe, the heat-transfer pipe has the first heat transfer segment, the second heat transfer segment and third heat transfer segment, first heat transfer segment connects the third heat transfer segment by second heat transfer segment, first heat transfer segment is at least partly contacted with the substrate, and the third heat transfer segment is arranged in the cooling fin.The integrated radiator is compact-sized, good heat dissipation effect.

Description

Integrated radiator

Technical field

The utility model relates to stage lamp technical fields, and in particular to a kind of integrated radiator.

Background technique

In light of stage field, the power of used stage lamp is usually all bigger, especially light source site, work A large amount of heat is often generated when making, and then influences the using effect and service life of lamps and lanterns, it is therefore desirable to stage lamp Light source part radiate.

When radiating to the light source part of stage lamp, the heat transfer of light source part need to be carried out into radiator scattered Heat, but existing radiator, structure is mostly complex, reduces the transmission efficiency of heat, so that the big discounting of effect of heat dissipation Button.

Summary of the invention

The purpose of this utility model is to provide a kind of integrated radiators, and the integrated radiator is compact-sized, heat dissipation Effect is good.

Its technical solution is as follows：

Integrated radiator, including substrate, the substrate side have lamp installation face, and the other side is fixed with heat dissipation group Part；The radiating subassembly includes cooling fin and heat-transfer pipe, and there is the heat-transfer pipe the first heat transfer segment, the second heat transfer segment and third to pass Hot arc, first heat transfer segment connect the third heat transfer segment by second heat transfer segment, first heat transfer segment with it is described Substrate at least partly contacts, and the third heat transfer segment is arranged in the cooling fin.

First heat transfer segment, fin array are distributed on the substrate, first heat transfer segment and the cooling fin It is arranged in a mutually vertical manner, the third heat transfer segment is arranged in a mutually vertical manner with the cooling fin.

Heat release hole is offered on the cooling fin.

There are gaps between each adjacent cooling fin.

Gap between each adjacent cooling fin is 0.5~1mm.

The cooling fin is in contact with first heat transfer segment, substrate simultaneously.

There is groove, first heat transfer segment is set in the groove on the substrate.

The third heat transfer segment is equipped with two layers.

It should be noted that：

Aforementioned " first, second, third ... " does not represent specific quantity and sequence, is only used for the area to title Point.

The advantages of below to the utility model or principle are illustrated：

1, in use, light source is installed on lamp installation face, when light source is started to work, the heat that light source generates passes through Substrate passes in the first heat transfer segment of heat-transfer pipe, and the heat in the first heat transfer segment passes to third heat transfer segment using the second heat transfer segment On, the heat in third heat transfer segment using fin conductive into air, to achieve the purpose that heat dissipation；

The integrated radiator is compact-sized, and the heat that light source generates is transmitted on heat-transfer pipe by substrate, and heat-transfer pipe is again It transfers heat on cooling fin and radiates, the transmitting of heat is directly efficient, good heat dissipation effect.

2, the first heat transfer segment, fin array are distributed on substrate, can make full use of the limited mounting area of substrate, so that The transmitting of heat is more efficient, and heat dissipation effect is more preferable；First heat transfer segment, third heat transfer segment are mutually perpendicular to cooling fin, can be made It is more compact, beautiful to obtain the integrated radiator structure.

3, heat release hole is offered on cooling fin, it is possible to increase the contact area of cooling fin and air further improves heat dissipation Effect, meanwhile, can reduce the weight of the integrated radiator, save material cost.

4, there are gaps between each abutting fins, can further increase the contact area of cooling fin and air, further Improve the effect of heat dissipation.

5, when in the heat transfer to substrate that light source generates, on the one hand, the heat on substrate is transmitted to by heat-transfer pipe It radiates on cooling fin, on the other hand, the heat on substrate, which is directly delivered on cooling fin, to radiate, and reaches " dual " and dissipates The effect of heat, heat transfer efficiency is high, further improves the effect of heat dissipation.

6, the first heat transfer segment is set in the groove of substrate, it is possible to increase the contact area of the first heat transfer segment and substrate improves Substrate transfers heat to the efficiency on heat-transfer pipe, further improves the effect of heat dissipation.

7, under the premise of not increasing small product size, third heat transfer segment is equipped with two layers, cooling fin can be made full use of to have in this way The surface area of limit will farthest radiate in the heat transfer to cooling fin on heat-transfer pipe, further improve heat dissipation Effect, meanwhile, but also the structure of the integrated radiator is more compact.

Detailed description of the invention

Fig. 1 is the back side dimensional structure diagram of the utility model embodiment integrated radiator；

Fig. 2 is the schematic diagram of front three-dimensional structure of the utility model embodiment integrated radiator；

Fig. 3 is the side view of Fig. 1；

Fig. 4 is the structural schematic diagram of the utility model embodiment substrate；

Description of symbols：

1, substrate, 11, lamp installation face, 12, groove, 2, heat-transfer pipe, the 21, first heat transfer segment, the 22, second heat transfer segment, 23, Third heat transfer segment, 3, cooling fin, 31, heat release hole.

Specific embodiment

The embodiments of the present invention are described in detail below.

As shown in Figures 1 to 4, which includes substrate 1, and 1 side of substrate has lamp installation face 11, The other side is fixed with radiating subassembly；The radiating subassembly includes cooling fin 3 and heat-transfer pipe 2, and the heat-transfer pipe 2 has the first heat transfer The 21, second heat transfer segment 22 of section and third heat transfer segment 23, first heat transfer segment 21 are connected described by second heat transfer segment 22 Third heat transfer segment 23, first heat transfer segment 21 are at least partly contacted with the substrate 1, and the third heat transfer segment 23 is arranged in institute It states in cooling fin 3, the third heat transfer segment 23 is equipped with two layers.

Wherein, first heat transfer segment 21,3 arranged distribution of cooling fin be on the substrate 1, first heat transfer segment 21 with The cooling fin 3 is arranged in a mutually vertical manner, and the third heat transfer segment 23 is arranged in a mutually vertical manner with the cooling fin 3；The cooling fin 3 On offer heat release hole 31；There are gaps between each adjacent cooling fin 3；Gap between each adjacent cooling fin 3 is 0.5~1mm；The cooling fin 3 is in contact with first heat transfer segment 21, substrate 1 simultaneously；There is groove 12 on the substrate 1, First heat transfer segment 21 is set in the groove 12.

Wherein, the substrate 1 is die casting aluminum substrate 1, and the heat-transfer pipe 2 is copper heat pipe, and the cooling fin 3 is aluminium radiating fin Piece.

The present embodiment has the following advantages that：

1, in use, light source is installed on lamp installation face 11, when light source is started to work, the heat that light source generates is logical It crosses substrate 1 to pass in the first heat transfer segment 21 of heat-transfer pipe 2, the heat in the first heat transfer segment 21 is passed to using the second heat transfer segment 22 In third heat transfer segment 23, the heat in third heat transfer segment 23 is transmitted in air using cooling fin 3, to reach the mesh of heat dissipation 's；

The integrated radiator is compact-sized, and the heat that light source generates is transmitted on heat-transfer pipe 2 by substrate 1, heat-transfer pipe 2 It transfers heat on cooling fin 3 and radiates again, the transmitting of heat is directly efficient, good heat dissipation effect.

2, the first heat transfer segment 21,3 arranged distribution of cooling fin are on substrate 1, can making full use of the limited mounting surface of substrate 1 Product, so that the transmitting of heat is more efficient, heat dissipation effect is more preferable；First heat transfer segment 21, third heat transfer segment 23 with 3 phase of cooling fin It is mutually vertical, it may make the integrated radiator structure more compact, beautiful.

3, heat release hole 31 is offered on cooling fin 3, it is possible to increase the contact area of cooling fin 3 and air further improves The effect of heat dissipation, meanwhile, it can reduce the weight of the integrated radiator, save material cost.

4, there are gaps between each abutting fins 3, the contact area of cooling fin 3 Yu air can be further increased, into one Step improves the effect of heat dissipation.

5, when in the heat transfer to substrate 1 that light source generates, on the one hand, the heat on substrate 1 is transmitted by heat-transfer pipe 2 It radiates on to cooling fin 3, on the other hand, the heat on substrate 1, which is directly delivered on cooling fin 3, to radiate, and reaches " double The effect of weight " heat dissipation, heat transfer efficiency is high, further improves the effect of heat dissipation.

6, the first heat transfer segment 21 is set in the groove 12 of substrate 1, it is possible to increase the contact surface of the first heat transfer segment 21 and substrate 1 Product, improves the efficiency that substrate 1 transfers heat on heat-transfer pipe 2, further improves the effect of heat dissipation.

7, under the premise of not increasing small product size, third heat transfer segment 23 is equipped with two layers, can make full use of cooling fin 3 in this way Limited surface area will farthest radiate in the heat transfer on heat-transfer pipe 2 to cooling fin 3, further improve The effect of heat dissipation, meanwhile, but also the structure of the integrated radiator is more compact.

8, in this embodiment, there is on substrate 1 groove 12, structure is complex, according to traditional machining mode, Processing cost can be very high, and uses die casting aluminium die sinking part that production efficiency can be improved as substrate 1, reduces use cost；Heat-transfer pipe 2 use copper heat pipe, and at low cost, heat transfer efficiency is high；Cooling fin 3 uses aluminium radiating fin, at low cost, good heat dissipation effect.

The above are only specific embodiments of the present invention, does not limit the protection scope of the utility model with this；Not It violates made any replacement on the basis of the utility model is conceived and improves, the category protection scope of the utility model.

Claims

1. integrated radiator, which is characterized in that including substrate, the substrate side has lamp installation face, and the other side is fixed There is radiating subassembly；The radiating subassembly includes cooling fin and heat-transfer pipe, and the heat-transfer pipe has the first heat transfer segment, the second heat transfer segment With third heat transfer segment, first heat transfer segment connects the third heat transfer segment, first heat transfer by second heat transfer segment Section is at least partly contacted with the substrate, and the third heat transfer segment is arranged in the cooling fin.

2. integrated radiator as described in claim 1, which is characterized in that first heat transfer segment, fin array are distributed in On the substrate, first heat transfer segment is arranged in a mutually vertical manner with the cooling fin, the third heat transfer segment and the cooling fin It is arranged in a mutually vertical manner.

3. integrated radiator as claimed in claim 2, which is characterized in that offer heat release hole on the cooling fin.

4. integrated radiator as claimed in claim 3, which is characterized in that there are gaps between each adjacent cooling fin.

5. integrated radiator as claimed in claim 4, which is characterized in that the gap between each adjacent cooling fin is 0.5 ~1mm.

6. the integrated radiator as described in any one of claim 1 to 5, which is characterized in that the cooling fin is simultaneously with described the One heat transfer segment, substrate are in contact.

7. the integrated radiator as described in any one of claim 1 to 5, which is characterized in that there is groove on the substrate, it is described First heat transfer segment is set in the groove.

8. the integrated radiator as described in any one of claim 1 to 5, which is characterized in that the third heat transfer segment is equipped with two layers.