CN201122606Y

CN201122606Y - Power type LED encapsulation base plate

Info

Publication number: CN201122606Y
Application number: CNU2007201929241U
Authority: CN
Inventors: 曹宏国
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-11-30
Filing date: 2007-11-30
Publication date: 2008-09-24
Anticipated expiration: 2017-11-30

Abstract

The utility model discloses a power type LED enclosing base seat, which comprises a base plate, an enclosing pipe and an outgoing line. The enclosing and matching requirement on power type LED displays between 5 watts and 10 watts can be met, and by being combined with the heat emission structure of the system, the base seat is provided with a plurality of heat emitting channels based on the heat emission type base plate; simultaneously, the base seat has firmer structure, and thus the range of use is enlarged; the highly effective light taking effect enhances the overall performance of the product, and thereby the aim of energy conservation is achieved.

Description

Power type LED encapsulation base plate

Technical field

The utility model relates to power type LED encapsulation base plate.

Background technology

LED is because of plurality of advantages such as its green, environmental protection, is considered to replace that power consumptions such as incandescent lamp, fluorescent lamp are big, the revolutionary solid light source of the traditional lighting light source of contaminated environment.Conventional LED generally is a stent-type, adopts epoxy encapsulation, and power is less, and whole luminous luminous flux is little, and what brightness was high also can only use as some special lightings.Along with led chip technology and Development of Packaging Technology, comply with the demand of lighting field to high light flux LED product, power-type LED progressively enters into market.The LED of this power-type is placed on luminescence chip on the base, fills the flexible silica gel of low stress above with the protection luminescence chip.For the light-emitting diode of forming by PN junction, when forward current when PN junction flows through, PN junction has the heating loss.For power led, drive current generally all is that the current density of PN junction is very big more than the hundreds of milliampere, so the temperature rise of PN junction is very obvious.Because the rising of junction temperature can make the luminous compound probability of PN junction descend, the brightness of light-emitting diode will descend, and promptly luminous efficiency reduces.Simultaneously, because the temperature rise that thermal losses causes is increased, light-emitting diode luminance will no longer continue promptly to demonstrate thermal saturation phenomenon along with the proportional raising of electric current.

At present, base is generally the substrate-type that the lead-out wire of the substrate of plastic material and metal material is formed, the perhaps stent-type of being made up of the metal electrode of two separation in the prior art.The former forms by injection moulding or press mold, and the latter is then by fixing shaping the in epoxy resin parcel back in the postorder processing.Base does not have reasonable in design and is specifically designed to the structure of heat radiation like this, the heat-sinking capability that can provide and limited, though can adapt to the use needs of other LED device of mW level, base such for W rank power-type LED can not be competent fully.Therefore the encapsulation base plate of present power-type LED existence heat radiation is slow, optical efficiency is low, easy aging shortcoming.

In the prior art, the reflection in encapsulation process is handled, and power-type LED normally is assemblied in the power-type chip on the metallic support or substrate of band reflection cavity, that is to say that support or substrate body are provided with the structure of reflection cavity.The reflection cavity of stent-type generally is to take plating mode to improve reflecting effect, and the reflection cavity of substrate-type generally is to adopt the polishing mode, with good conditionsily also can carry out electroplating processes, but above two kinds of processing modes are subjected to mould and die accuracy and technogenic influence, reflection cavity after grinding process has certain reflecting effect, but unsatisfactory.The reflection cavity of present domestic making substrate-type, because the oxidation of the polishing precision deficiency or the coat of metal, reflecting effect is relatively poor, causes a lot of light to be absorbed after being mapped to the echo area like this, can't reflex to exiting surface by the set goal, thus cause after the final encapsulation to get optical efficiency on the low side.

The utility model content

The technical problems to be solved in the utility model provides a kind of power type LED encapsulation base plate, and simple in structure firm, rapid heat dissipation is got the optical efficiency height.

For solving the problems of the technologies described above, the utility model adopts following technical scheme: this power type LED encapsulation base plate comprises substrate and lead-out wire, described lead-out wire is fixed on the substrate, described lead-out wire outwards forms projection on the top of described substrate, also be provided with insulated column between described lead-out wire and the substrate, described substrate is flat metal, described substrate center is provided with the copper stem stem that runs through substrate and be connected with the substrate close-fitting, described copper stem stem outwards forms projection on described substrate top, described height of projection equates with the projection of lead-out wire, described substrate edges is provided with fixing hole, described substrate top also is provided with the package tube of through and inner wall smooth, described package tube bottom is fixedly connected by welding on substrate, all is positioned at package tube in the projection of the described lead-out wire in described substrate top and the projection of described copper stem stem.

As a kind of improvement of the present utility model, described copper stem stem radially is provided with the extension in the projection on substrate top along the copper stem stem, and separate with the projection of lead-out wire described extension.Such layout can be placed more LED luminescence chip on substrate, can be the LED luminescence chip of same kind, regulates bright degree by the energising of controlling each LED luminescence chip; Also can be the LED luminescence chip of different types, send the light of different colours equally by the energising of controlling each LED luminescence chip, play the function of a multiple glow color of LED lamp.

As of the present utility model a kind of preferred, described package tube is the cylindrical metal tube of inwall.The effect of package tube is to replace original reflecting surface, the light reflection process is concentrated on one the device, because package tube is processed easily, so reflecting surface can be accomplished even more ideal precision, is well got optical efficiency.Adopt straight cavate metal tube then can also play to strengthen the effect of base hardness, make understructure more firm,, just can bear sizable external force than the base of in the past all-plastic quality or half plastics quality and push because substrate and package tube all be metal; The heat transmission of metal simultaneously is fast, so increased the area of dissipation of base, has stronger heat-sinking capability.

As the above-mentioned preferred a kind of improvement of the utility model, the bottom of described package tube is provided with the flange that is used to increase joint face.Flange has increased bonding area, and package tube is welded on the firm degree that just can strengthen connection behind the substrate, thereby base can adapt to the more strict usage side's requirement that makes.

Preferred as another kind of the present utility model, described package tube is that inwall is bowl-shape metallized ceramic pipe.Metallized ceramic pipe sintering rear surface is smooth, adds reflecting surface and has certain gradient, can change the direction of propagation of light according to the so as can be known structure of the reflection law of light, causes having more rays to penetrate forward, has strengthened base and has got optical efficiency.

As the above-mentioned preferred a kind of improvement of the utility model, described inner wall surface is provided with nickel dam or silver layer.Compare the vitrifying surface of metallized ceramic, the reflecting effect of metal level is better, because the reflecting rate of metal is big, therefore adopt the base of this spline structure under equal conditions finally can provide brighter illumination effect, not only has energy-efficient advantage, and the thermal radiation when led chip worked is reflected in the air, plays good heat sinking function.Metallized ceramic also has the hard characteristic of metal, so the welding rear base has firm structure.

The utility model adopts technique scheme, can satisfy five watts of supporting requirements of the encapsulation to ten watts of power-type LED displays, combines the radiator structure of system, and base has been gathered around the multiple tracks heat dissipation channel that has based on the heat radiating type substrate; Have more firm structure simultaneously, enlarged the scope of application; Get light effect efficiently, increase the product overall performance, reach the purpose of energy savings.

Description of drawings

Below in conjunction with the drawings and specific embodiments the utility model is further specified.

Fig. 1 is first embodiment of the utility model power type LED encapsulation base plate;

Fig. 2 is the A-A figure of Fig. 1;

Fig. 3 is second embodiment of the utility model power type LED encapsulation base plate;

Fig. 4 is the B-B figure of Fig. 3.

Embodiment

As shown in Figure 1, 2, power type LED encapsulation base plate has comprised substrate 2, lead-out wire 4 and package tube 1.Substrate 2 is a flat steel plate, and is rounded, but also can be designed to any pattern according to the needs of practical application.The steel matter of substrate 2 makes that it can conduct electricity, heat conduction.Have a plurality of fixing holes 3 at the edge of substrate 2, fixing hole 3 has increased the area of dissipation of substrate 2 to a certain extent, but the main external radiator that still is used for, to improve radiating rate.Lead-out wire 4 also is a metal material, and it is fixed on the substrate 2 by the insulated column 7 of glass material, thereby is not conducting between it and the substrate 2, and both are in state of insulation.All protrude on substrate 2 surfaces as lead-out wire 4 two ends of electrode, longer at an end of substrate 2 bottoms, and the other end on substrate 2 tops just forms very short projection, is one by the T font of longitudinal stretching from its cross section.Copper stem stem 5 also is installed on the substrate 2, and it is as electrode and close-fitting is connected on the substrate 2.Copper stem stem 5 also is provided with projection on substrate 2 tops, and projection radially is being provided with the extension along copper stem stem 5, as shown in Figure 1, separate with the projection of lead-out wire 4 this extension, as shown in Figure 2, both are equal height in the projection on substrate 2 tops, so just led chip can be placed on this projection.Because the extension can the cross break setting, for example form cross, shape such as quincunx, circular, square, as long as guarantee its with lead-out wire 4 between be the effect that just can realize electrode that separates.Package tube 1 bottom is welded on substrate 2 surfaces, back lead-out wire 4 and the projection of copper stem stem 5 on substrate 2 tops are installed all are positioned at the smooth inside of package tube 1, as shown in Figure 2, package tube 1 is the metal tube that cylindric and bottom is provided with flange 6 for inwall, flange 6 is in order to increasing bonding area, thereby increases firm degree.

In the said structure as can be seen, existing relatively substrate 2, the utility model will dispel the heat as one independently function incorporate corresponding structure into and form a system, be exactly substrate 2 structural improvement, substrate 2 original conducting functions are arranged on lead-out wire 4 and the copper stem stem 5, thereby shape, structure, the material of substrate 2 do not played constraint.Simultaneously copper stem stem 5 not only have preferably electric conductivity and also the capacity of heat transmission also very strong, so heat radiation can also be undertaken by copper stem stem 5.By package tube 1 also is the reason of metal material, and therefore heat radiation also can be by carry out herein.And then the heat radiation of whole base can be undertaken by three approach, again because of the three be connected to whole, so three approach is to connect each other, carry out continuously.

Control in the reflective process is finished by package tube 1 smooth inwall, thereby strengthens the optical efficiency of getting of base.The processing previous crops is independently parts, and the production of package tube 1 is easy to, and can produce the package tube 1 that adapts to various requirement, precision.Shown in Fig. 3,4, package tube 1 also can be that inwall is bowl-shape metallized ceramic, and its inwall tilts, and the effect of optically focused is arranged, and can more light be reflected away.Further improving can be at metallized ceramic surface plating one deck nickel dam or silver layer, and to increase reflecting effect, the thermal radiation during led chip work is reflected in the air, accomplishes energy-efficient purpose.

Claims

1, power type LED encapsulation base plate, comprise substrate (2) and lead-out wire (4), described lead-out wire (4) is fixed on the substrate (2), described lead-out wire (4) outwards forms projection on the top of described substrate (2), it is characterized in that: also be provided with insulated column (7) between described lead-out wire (4) and the substrate (2), described substrate (2) is flat metal, described substrate (2) central authorities are provided with the copper stem stem (5) that runs through substrate (2) and be connected with substrate (2) close-fitting, described copper stem stem (5) outwards forms projection on described substrate (2) top, described height of projection equates with the projection of lead-out wire (4), described substrate (2) edge is provided with fixing hole (3), described substrate (2) top also is provided with the package tube (1) of through and inner wall smooth, described package tube (1) bottom is fixedly connected by welding on substrate (2), all is positioned at package tube (1) in the projection of the described lead-out wire in described substrate (2) top (4) and the projection of described copper stem stem (5).

2, according to the described power type LED encapsulation base plate of claim 1, it is characterized in that: described copper stem stem (5) radially is provided with the extension in the projection on substrate (2) top along copper stem stem (5), and separate with the projection of lead-out wire (4) described extension.

3, according to the described power type LED encapsulation base plate of claim 1, it is characterized in that: described package tube (1) is the cylindrical metal tube of inwall.

4, according to the described power type LED encapsulation base plate of claim 3, it is characterized in that: the bottom of described package tube (1) is provided with the flange (6) that is used to increase joint face.

5, according to the described power type LED encapsulation base plate of claim 1, it is characterized in that: described package tube (1) is bowl-shape metallized ceramic pipe for inwall.

6, according to the described power type LED encapsulation base plate of claim 5, it is characterized in that: described inner wall surface is provided with nickel dam or silver layer.