CN200997752Y

CN200997752Y - Radiater of electronic solid device

Info

Publication number: CN200997752Y
Application number: CN 200720006026
Authority: CN
Inventors: 林一民
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-01-10
Filing date: 2007-01-10
Publication date: 2007-12-26
Anticipated expiration: 2017-01-10

Abstract

A heat sink of an electric solid unit is composed of a thermal group (1) with a base (11), and a face of the base (11) is arranged with a plurality of bulges (12), and the gap is remained between the two adjacent bulges (12), as well as the thermal group (1) is distributed with a plurality of holes (13).

Description

Electricity solid state device heat abstractor

Technical field

The utility model relates to a kind of parts to semiconductor or other solid state device for ease of the cooling device of cooling to the selection of moulding, particularly a kind of electric solid state device heat abstractor.

Technical background

At present, development along with the electronic industry technology, the transistor density of all kinds of chips (particularly central processing unit) increases day by day, the speed of data processing is more and more faster, but the power that consumes and the heat of generation are also more and more higher, therefore, for guaranteeing the normal operation of each electric solid state device and equipment, need heat abstractor be set at thermal source, existing heat abstractor is generally a kind of radiating fin group, fins group by a base and base wherein the one side on a plurality of fins form, the bottom of fins group is covered on the thermal source, makes fins group draw the heat that heater element produced, and enlarges heat by fin and distributes the zone, heat is distributed, reach the purpose of heat radiation.But, for enlarging heat dissipation region, just need a fairly large number of fin, but be subjected to the restriction of electric solid state device volume, the volume of radiating fin group again can not be too big, therefore, gap between each fin is less, and it is still slower that heat distributes speed, thereby heat is detained on fins group, can't fast heat be distributed, influence the normal operation and the useful life of electric solid state device.

Summary of the invention

Technical problem to be solved in the utility model is to provide a kind of can make the heat on the electric solid state device distribute more rapidly, the electric solid state device heat abstractor that makes electric solid state device can normal operation and prolong its useful life.

The utility model is realized by following approach.

Electricity solid state device heat abstractor comprises the heat radiation group, and its structural feature is: the heat radiation group has base and in some projectioies that the wherein one side of base forms, has the gap between adjacent two projectioies, and be distributed with plurality of holes on this heat radiation group.

Like this, the base of heat radiation group is attached on the thermal source, draws the heat that heater element produced by base, be passed on the projection then, enlarge area of dissipation by projection, simultaneously, the plurality of holes that on the heat radiation group, distributes, thereby further enlarge the area of dissipation on the heat radiation group, accelerate radiating rate, have rapid heat dissipation, the characteristics of good heat dissipation effect, can make the better normal operation of electric solid state device, and prolong the useful life of electric solid state device.

Structure of the present utility model can be specially:

Described hole or be a kind of perforation perhaps is a kind of blind hole.

Like this, when hole is a kind of blind hole, can enlarge the area of dissipation on the heat radiation group; When hole is a kind of perforation, both can enlarge the area of dissipation of heat radiation group, and, when this heat radiation assembly is closed fan and is used simultaneously, this perforation forms the passage of airflow again on the heat radiation group, when dispelling heat, can make the speed of airflow faster, further accelerate radiating rate by fan.

Described hole or be distributed on the base of heat radiation group perhaps is distributed on the projection of heat radiation group.

When hole is that this perforation is through to another side from the one side of base on a kind of base of the heat radiation group of boring a hole and be distributed in.

Like this, some perforation that on base, distribute, area of dissipation that not only can enlarged base, and also the hot-fluid that thermal source produces can be more conducive to distributing of heater element heat by the circulation of the perforation on the base.

When hole is on a kind of projection of the heat radiation group of boring a hole and be distributed in, and runs through each projection of heat radiation group with a kind of direction parallel with base.

Like this, on each projection of heat radiation group, all have perforation, and, this perforation to run through direction parallel with base, when all having perforation on the base of heat radiation group and the projection, therefore have crisscross heat dissipation channel on the heat radiation group, thereby help distributing of heat more.

The heat radiation group is by carborundum, alundum (Al, the injection molding a kind of heat-sink unit of a kind of ceramic material that silicon dioxide and binding agent mix.

Like this, because carborundum has high thermal conductivity, be that main raw material(s) is processed into the heat radiation group with carborundum, therefore, this heat radiation group has the characteristic of good heat dissipation effect.

Structure of the present utility model can further be specially:

Each is protruding or be a kind of vertical bar shape that is parallel to each other, and perhaps is a kind of bending.

In sum, the utility model has following advantage compared to prior art: the heat radiation group is made up of the projection on base and the base, and on the heat radiation group, plurality of holes is set, thereby enlarge the area of dissipation of heat radiation group, increase radiating effect, help the normal operation of electric solid state device and prolong its useful life.

Description of drawings

Fig. 1 is one of structural representation of the present utility model.

Fig. 2 is the cutaway view of Fig. 1.

Fig. 3 is two of a structural representation of the present utility model.

Fig. 4 is one of user mode reference diagram of the present utility model.

Fig. 5 is two of a user mode reference diagram of the present utility model.

Wherein, 11 bases, 12 protruding 13 holes, 2 heater elements, 3 fans are organized in 1 heat radiation.

Embodiment

Embodiment 1:

With reference to Fig. 1, Fig. 2, electricity solid state device heat abstractor, comprise heat radiation group 1, heat radiation group 1 have base 11 and the wherein one side of base form some protruding 12, each projection 12 is a kind of vertical bar shape that is parallel to each other, between adjacent two projectioies 12, has the gap, and on this heat radiation group, be distributed with plurality of holes 13, this hole 13 is a kind of perforation, perforation distributions is on the base 11 of heat radiation group 1, and this perforation is through to another side from the one side of base, simultaneously, perforation also is distributed on the projection 12 of heat radiation group 1, and runs through each projection 12 of heat radiation group with a kind of and base 11 parallel directions.Heat radiation group 1 is by carborundum, alundum (Al, the injection molding a kind of heat-sink unit of a kind of ceramic material that silicon dioxide and binding agent mix.

With reference to Fig. 4, the base 11 of electric solid state device heat abstractor is directly pasted on heater element 2, conduct on the heat abstractor by the heat of base 11 heater element 2, the projection by heat abstractor enlarges area of dissipation again, and the heat on the heater element is distributed.

Embodiment 2:

With reference to Fig. 3, electric solid state device heat abstractor comprises heat radiation group 1, heat radiation group 1 have base 11 and the wherein one side of base form some protruding 12, each projection is a kind of bending, has the gap between adjacent two projectioies 12, and be distributed with plurality of holes 13 on this heat radiation group.This hole 13 is distributed on the base 11 and projection 12 of heat radiation group, and this hole 13 both comprised perforation, also comprises blind hole.The perforation that is distributed on the base 11 is through to another side from the one side of base, simultaneously, is distributed in perforation on the projection 12 of heat radiation group 1 runs through the heat radiation group with a kind of and base 11 parallel directions each projection 12.Heat radiation group 1 is by carborundum, alundum (Al, the injection molding a kind of heat-sink unit of a kind of ceramic material that silicon dioxide and binding agent mix.

Most preferred embodiment:

With reference to Fig. 1, Fig. 2, electricity solid state device heat abstractor, comprise heat radiation group 1, heat radiation group 1 have base 11 and the wherein one side of base form some protruding 12, each projection is a kind of vertical bar shape that is parallel to each other, between adjacent two projectioies 12, has the gap, and on this heat radiation group, be distributed with plurality of holes 13, this hole 13 is a kind of perforation, perforation distributions is on the base 11 of heat radiation group 1, and this perforation is through to another side from the one side of base, simultaneously, perforation also is distributed on the projection 12 of heat radiation group 1, and runs through each projection 12 of heat radiation group with a kind of and base 11 parallel directions.Heat radiation group 1 is by carborundum, alundum (Al, the injection molding a kind of heat-sink unit of a kind of ceramic material that silicon dioxide and binding agent mix.

With reference to Fig. 5, the base 11 of electric solid state device heat abstractor is pasted on heater element 2, and in the top of projection installation fan 3, conduct on the heat abstractor by the heat of base 11 heater element, at this moment, base then conducts to projection with the heat that is absorbed, afterwards again by fan 3 blowings, projection between 12 the gap and bore a hole and produce air-flow on 13, the heat on base 11 and the projection 12 is dispelled.

It is same as the prior art that the utility model is not stated part.

Claims

1. electric solid state device heat abstractor, comprise heat radiation group (1), it is characterized in that, some projectioies (12) that heat radiation group (1) has base (11) and forms in the wherein one side of base (11), between adjacent two projectioies (12), have the gap, and on this heat radiation group (1), be distributed with plurality of holes (13).

2. electric solid state device heat abstractor according to claim 1 is characterized in that, hole (13) or be a kind of perforation perhaps is a kind of blind hole.

3. electric solid state device heat abstractor according to claim 2 is characterized in that, perforation (13) is distributed on the base (11) of heat radiation group (1), and this perforation (13) is through to another side from the one side of base (11).

4. according to claim 2 or 3 each described electric solid state device heat abstractor wherein, it is characterized in that perforation (13) is distributed on the projection (12) of heat radiation group (1), and perforation (13) runs through each projection (12) of heat radiation group (1).

5. according to claim 1 or 2 each described electric solid state device heat abstractor wherein, it is characterized in that hole (13) or be distributed on the base (11) of heat radiation group perhaps is distributed on the projection (12) of heat radiation group.

6. electric solid state device heat abstractor according to claim 1 is characterized in that heat radiation group (1) is by carborundum, alundum (Al, the injection molding a kind of heat-sink unit of a kind of ceramic material that silicon dioxide and binding agent mix.

7. electric solid state device heat abstractor according to claim 1 is characterized in that, each projection (12) or for a kind of vertical bar shape that is parallel to each other perhaps is a kind of bending.