CN1991872B - Manufacturing method for memory card - Google Patents
Manufacturing method for memory card Download PDFInfo
- Publication number
- CN1991872B CN1991872B CN2006101640937A CN200610164093A CN1991872B CN 1991872 B CN1991872 B CN 1991872B CN 2006101640937 A CN2006101640937 A CN 2006101640937A CN 200610164093 A CN200610164093 A CN 200610164093A CN 1991872 B CN1991872 B CN 1991872B
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- China
- Prior art keywords
- special
- shaped portion
- storage card
- mentioned
- preset lines
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 238000000926 separation method Methods 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 230000011218 segmentation Effects 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229910001651 emery Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- Credit Cards Or The Like (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Milling Processes (AREA)
- Nonmetal Cutting Devices (AREA)
Abstract
The present invention aims to form an abnomity part for confirming the insert direction of a memory card expeditiously, and improve productivity. Provding a manufacture method of a memory card, comprising a step of forming the abnomity part and a step of cutting; in the step of forming abnomity part, forming an abnomity part unitedly to a plurality of memory cards, in which the abnomity part is used for confirming the insert direction of a memory card; in the cutting step, separating a separation destine line to several memory cards. So, forming a plurality of abnomity parts at a time to a plurality of memory cards with high efficiency and improved productivity.
Description
Technical field
The present invention relates to a kind of manufacture method that is inserted into the storage card that uses in the draw-in groove of electronic equipment.
Background technology
Be inserted into the SD card (registered trademark), the miniSD storage cards such as (registered trademarks) that use in the draw-in groove of various electronic equipments and form (for example with reference to TOHKEMY 2003-44804 communique) by covering at Wiring substrate plate installation memory element, by mold pressing resin.This storage card is being installed on memory element 1 Wiring substrate plate, whole is being covered and after forming enclosed chip by mold pressing resin with clathrate, and regional between the memory element of cutting enclosed chip also makes its separation and form.
Yet,, must be formed for determining the special-shaped portion of direction of insertion in its bight because the shape of storage card is subjected to standardized restriction.Therefore, after cutting apart,, there is the low problem of throughput rate in the occasion that each storage card is formed special-shaped portion by cutting etc.
Summary of the invention
Therefore, the special-shaped portion that the problem to be solved in the present invention is to be formed for expeditiously to determine the direction of insertion of storage card boosts productivity.
The enclosed chip that the manufacture method of storage card of the present invention will form a plurality of storage cards by separating preset lines to divide is processed into storage card one by one; Wherein: comprise that special-shaped portion forms operation and segmentation process; Form in the operation in this abnormity portion, this suitable portion of abnormity portion of above-mentioned enclosed chip by will having the special-shaped portion suitable portion suitable with special-shaped portion, by cutting off the table back side is connected from the injection of the water of water jet machining machine, a plurality of storage cards are formed above-mentioned special-shaped portion uniformly, and this abnormity portion is used for determining the direction of insertion of the relative draw-in groove of this storage card; In this segmentation process, by cutting above-mentioned enclosed chip along above-mentioned separation preset lines, make and separate the preset lines separation by cutting tip, be divided into storage card one by one.Have and after special-shaped portion forms operation, carry out the situation of segmentation process and behind segmentation process, carry out the situation that special-shaped portion forms operation.
For the situation of carrying out segmentation process after forming operation in special-shaped portion, form in the operation in special-shaped portion, have at the upright mould that has with special-shaped portion shape corresponding shape of establishing of Wiring substrate plate, thereby potting resin forms the method for special-shaped portion on Wiring substrate plate, to form that suitable portion of the special-shaped portion of special-shaped portion shape cuts off and the method that forms special-shaped portion by the processing machine that digs up the roots, thereby by cutting off the method that the suitable portion of special-shaped portion that forms special-shaped portion shape forms special-shaped portion, and cut off and form the method etc. of special-shaped portion by the suitable portion of special-shaped portion that the injection from the water of water jet machining machine will form special-shaped portion shape from the laser radiation of laser processing machine.
Water in the suitable portion of special-shaped portion by forming special-shaped portion shape relatively from the water jet machining machine sprays the method that forms special-shaped portion, form before the special-shaped portion, be preferably in and separate preset lines and form the escape groove, this escape groove is used to make the water that is ejected on the extended line of suitable portion of special-shaped portion from the water jet machining machine to escape.
Behind segmentation process, carry out the situation of special-shaped portion formation operation, has such method, promptly, in segmentation process, enclosed chip is cut apart, do not form the storage card of special-shaped portion, form in the operation in special-shaped portion, the suitable portion of special-shaped portion of removing a plurality of storage cards with separate the zone between preset lines of separating that finishes, form special-shaped portion.
In the present invention, owing to can once form a plurality of special-shaped portions to a plurality of storage cards, so the efficient height can be boosted productivity.
For the situation of after forming special-shaped portion operation, carrying out segmentation process, after forming a plurality of special-shaped portions by the state of the enclosed chip that a plurality of memory elements have been installed, make and separate the preset lines separation, be divided into storage card one by one, thereby can form the storage card of special-shaped portion by the good efficiency manufacturing.
In addition, for the situation of behind segmentation process, carrying out special-shaped portion formation operation, after being divided into the storage card that does not form special-shaped portion, the suitable portion of special-shaped portion of removing a plurality of storage cards with separate the zone between preset lines of separating that finishes, once form a plurality of special-shaped portions, so, can form the storage card of special-shaped portion by the good efficiency manufacturing.
Description of drawings
Fig. 1 is the skeleton view that an example of enclosed chip is shown.
Fig. 2 for slightly illustrating the sectional view of the structure of this enclosed chip with showing.
Fig. 3 is for forming the skeleton view of the state of special-shaped portion at this enclosed chip.
Fig. 4 is the skeleton view that the state that the enclosed chip that forms this abnormity portion is cut apart is shown.
Fig. 5 is the skeleton view that an example of storage card is shown.
Fig. 6 be illustrate the present invention's second example formation cut off the skeleton view of the enclosed chip of groove.
Fig. 7 is illustrated in the skeleton view that this enclosed chip forms the state of special-shaped portion.
Fig. 8 illustrates having formed the skeleton view of the state cut apart of enclosed chip that should abnormity portion.
Fig. 9 is the skeleton view that the enclosed chip of the present invention's the 3rd example is shown.
Figure 10 is the outboard profile that this enclosed chip is shown.
Figure 11 is illustrated in the skeleton view that this enclosed chip forms the state of special-shaped portion.
Figure 12 illustrates having formed the skeleton view of the state cut apart of enclosed chip that should abnormity portion.
Figure 13 is the skeleton view that the state that the enclosed chip of the present invention's the 4th example is cut apart is shown.
Figure 14 is illustrated in the skeleton view that forms the state of special-shaped portion by the storage card of cutting apart formation.
Embodiment
(1) first example
Enclosed chip 1 illustrated in figures 1 and 2 is installed a plurality of memory elements 3 with clathrate on Wiring substrate plate 2, seal by resin 4, divide by the separation preset lines 5 that is provided with in length and breadth, form a plurality of with make the suitable suitable portion 6 of storage card of storage card that separates after preset lines 5 is separated.
The suitable portion 6 of storage card has suitable portion 7 of special-shaped portion, suitable portion 7 of this abnormity portion is suitable with the special-shaped portion that is formed at storage card for the direction of insertion of the draw-in groove of determining relative electronic equipment, separate suitable portion 7 of special-shaped portion by modes such as cut-outs the table back side is connected, thereby can form special-shaped portion.
Then, as shown in Figure 4, use the cutting tip 10 of high speed rotary to cut separation preset lines 5 in length and breadth, make and separate preset lines 5 separation, then form storage card 12 with special-shaped portion 11 shown in Figure 5.
Form in the operation in special-shaped portion, also can use laser machine to replace digging up the roots processing machine 8, from laser machine with laser radiation to suitable portion 7 of special-shaped portion, form the suitable groove 9 of special-shaped portion.
(2) second examples
Enclosed chip 1 illustrated in figures 1 and 2 relatively as shown in Figure 6, cuts off and separates preset lines 5, forms and cuts off groove 13.This cuts off the separation preset lines 5 of groove 13 about at least one direction, arrives on the extended line of all suitable portions 7 of special-shaped portion to form.Also can be in the residual not cut-out of the end side portion 14 that cuts off groove 13.Not cut-out portion 14 be formed at enclosed chip 1 end suitable portion 7 of special-shaped portion near.In the formation of cutting off groove 5, can use cutting tip 10 for example shown in Figure 4 etc.
Then, as shown in Figure 7, cut off suitable portion 7 of special-shaped portion by the water under high pressure that is mixed with abrasive particle 16 that sprays from water jet machining machine 15.At this moment, water under high pressure 16 is moved its cut-out along cutting off groove 13, form the suitable groove 17 of special-shaped portion (special-shaped portion forms operation).Like this, cut off the escape groove that groove 13 becomes water under high pressure, do not stop the injection of water under high pressure 16, can form special-shaped portion.Like this, once form special-shaped portion.
Then, as shown in Figure 8, all the separation preset lines 5 by the cutting tip 10 of high speed rotary cuts the longitudinal direction transverse directions then form storage card 12 shown in Figure 5 (segmentation process).
(3) the 3rd examples
Enclosed chip shown in Figure 9 18 in the manufacturing of storage card 12 shown in Figure 5, use cut apart before substrate, the suitable portion 19 of a plurality of storage cards that becomes the zone of storage card after cutting apart is divided by the separation preset lines 20 that is provided with in length and breadth and constitutes.
As shown in Figure 10, in enclosed chip 18, memory element 21 is installed, by resin 22 sealings.
As Fig. 9 and as shown in Figure 10, establish special-shaped portion and form mould 24 by the state at the table back side that connects Wiring substrate plate 23 is upright in a bight of the suitable portion 19 of storage card.Abnormity portion formation mould 24 has the shape corresponding shape with special-shaped portion 11 shown in Figure 5, under the state that inserts this abnormity portion formation mould 24, resin is filled on the Wiring substrate plate 23, behind resin solidification, remove special-shaped portion and form mould 24, then once form special-shaped portion 11 (special-shaped portion forms operation) as shown in Figure 11 in the bight of the suitable portion 19 of storage card uniformly.
Then, as shown in Figure 12, make its separation, then form storage card 12 shown in Figure 5 (segmentation process) by cutting tip 10 all separation preset lines 20 that form in length and breadth of cutting.
(4) the 4th examples
As shown in Figure 13, the separation preset lines 5 of using cutting tip 10 to cut enclosed chip 1 illustrated in figures 1 and 2 in length and breadth is divided into the storage card 12a (segmentation process) one by one that does not form special-shaped portion.
Then, for example as shown in Figure 14, making a plurality of storage card 12a that do not form special-shaped portion be arranged in base station 25 ground stands and establishes and fixing, this base station 25 has a plurality of accepting holes that are used to accommodate about half of each storage card, emery wheel 27 has the corresponding grinding face 26 of shape with the special-shaped portion 11 of storage card 12 shown in Figure 5, make emery wheel 27 revolutions, make it be contacted with the bight 7a that suitable portion 7 of special-shaped portion has simultaneously and carry out grinding, then unified formation special-shaped portion 11 shown in Figure 5 becomes storage card 12 (special-shaped portion forms operation).In this occasion, also can side by side form the special-shaped portion 11 of a plurality of storage cards, so, the efficient height.
When using method shown in above-mentioned first～the 4th the example that chamfering is carried out in the bight of storage card, can similarly form chamfered section with special-shaped portion.
Claims (3)
1. the manufacture method of a storage card, the enclosed chip that will form a plurality of storage cards by separating preset lines to divide is processed into storage card one by one; It is characterized in that:
Comprise that special-shaped portion forms operation and segmentation process;
Form in the operation in this abnormity portion, this suitable portion of abnormity portion of above-mentioned enclosed chip by will having the special-shaped portion suitable portion suitable with special-shaped portion, by from the injection of the water of water jet machining machine and cut off, the table back side is connected, a plurality of storage cards are formed above-mentioned special-shaped portion uniformly, and this abnormity portion is used for determining the direction of insertion of the relative draw-in groove of this storage card;
In this segmentation process, by cutting above-mentioned enclosed chip along above-mentioned separation preset lines, this separation preset lines is separated by cutting tip, be divided into storage card one by one.
2. the manufacture method of storage card according to claim 1, it is characterized in that: form in the operation in above-mentioned special-shaped portion, form before the above-mentioned special-shaped portion, form the escape groove in above-mentioned separation preset lines, this escape groove is used to make the water that is ejected on the extended line of the suitable portion of special-shaped portion that forms this abnormity portion shape from above-mentioned water jet machining machine to escape.
3. the manufacture method of storage card according to claim 1 is characterized in that: in above-mentioned segmentation process, above-mentioned enclosed chip cut apart, do not formed the storage card of above-mentioned special-shaped portion,
Form in the operation in above-mentioned special-shaped portion, the suitable portion of special-shaped portion of removing a plurality of storage cards with separate the zone between preset lines of separating that finishes, form special-shaped portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-372019 | 2005-12-26 | ||
| JP2005372019 | 2005-12-26 | ||
| JP2005372019A JP4815212B2 (en) | 2005-12-26 | 2005-12-26 | Memory card manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1991872A CN1991872A (en) | 2007-07-04 |
| CN1991872B true CN1991872B (en) | 2010-05-19 |
Family
ID=38214119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101640937A Active CN1991872B (en) | 2005-12-26 | 2006-12-07 | Manufacturing method for memory card |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4815212B2 (en) |
| CN (1) | CN1991872B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007179176A (en) * | 2005-12-27 | 2007-07-12 | Disco Abrasive Syst Ltd | Wiring board and manufacturing method for memory card |
| JP4989323B2 (en) * | 2007-06-12 | 2012-08-01 | 株式会社ディスコ | Memory card manufacturing method |
| JP2010539583A (en) * | 2007-09-14 | 2010-12-16 | ハンミ セミコンダクター カンパニー リミテッド | Memory card processing equipment |
| JP2009260096A (en) * | 2008-04-18 | 2009-11-05 | Disco Abrasive Syst Ltd | Division processing method |
| CN101609514B (en) * | 2008-06-20 | 2013-04-24 | 上海中京电子标签集成技术有限公司 | Method for preparing electric tag with high efficiency |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005088531A1 (en) * | 2004-03-16 | 2005-09-22 | Omron Corporation | Thin ic tag and method of producing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000246696A (en) * | 1999-02-26 | 2000-09-12 | Rohm Co Ltd | Method of recessing board for electronic parts |
| EP1376452B1 (en) * | 2001-04-02 | 2007-04-25 | Hitachi, Ltd. | Multi media card and its manufacturing method |
| JP2005294755A (en) * | 2004-04-05 | 2005-10-20 | Toshiba Corp | Semiconductor device |
-
2005
- 2005-12-26 JP JP2005372019A patent/JP4815212B2/en active Active
-
2006
- 2006-12-07 CN CN2006101640937A patent/CN1991872B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005088531A1 (en) * | 2004-03-16 | 2005-09-22 | Omron Corporation | Thin ic tag and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1991872A (en) | 2007-07-04 |
| JP2007172473A (en) | 2007-07-05 |
| JP4815212B2 (en) | 2011-11-16 |
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| C14 | Grant of patent or utility model | ||
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