JP2000246696A - Method of recessing board for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To considerably increase the number of products while improving processing speed and reducing manufacturing cost by adopting a water jet for recessing a board for electronic parts. SOLUTION: A board 1 for electronic parts is placed on a support body 4 with a hole 4A formed to make a water jet 6 flow out, and a water jet is jetted to the board 1 from above for recessing. Prior to recessing the board 1, a hole piercing the board 1 is bored at a recessing start end of the board 1 by a means other than a water jet, and recessing by a water jet is performed from the hole 3 part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a groove in a substrate for manufacturing electronic components, and more particularly to a method for forming a groove in the substrate by a water jet. The present invention relates to a method of processing a groove in the substrate, which can prevent the occurrence of the groove.

[0002]

2. Description of the Related Art FIG. 3 is a plan view showing a substrate for an electronic component, for example, a chip LED substrate, wherein 1 is a substrate, P is a part to be a product, and 3 is a formed groove. Conventionally, the groove of the substrate is formed by punching with a mold, but according to this, burrs are inevitable when punching.
Therefore, at present, groove processing by a router is performed. However, when using a router, although the occurrence of burrs is less than when punching with a mold, processing is troublesome and not only increases the processing cost, but also the router itself has a diameter of, for example, about 0.5 mm Therefore, the groove that can be produced by this method is about 0.8 mm in diameter, and it is difficult to further narrow the groove width. On the other hand, water-jet processing cuts the workpiece instantaneously and requires a shorter processing time than etching, etc., and also provides a high-precision processing and a good cut surface without side edges. There is an advantage that can be created with high accuracy. In addition, since water is used, there is no risk of generating heat during processing. For this reason, it is used in various fields as disclosed in, for example, JP-A-6-5452 and JP-A-5-8021.

[0003]

However, water jet processing is directly performed on electronic component substrates, for example,
There are the following problems when it is applied to groove processing of a chip LED (light emitting diode) substrate. That is, (1) Since the chip LED is usually 1 mm or less in thickness, and preferably about 0.2 mm in thickness, it is easily deformed by applying a water jet, and it is difficult to perform groove processing with high accuracy. (2) The cross section of the chip LED substrate is BT resin,
Since the substrate 1 made of a liquid polymer, glass epoxy (glass epoxy resin) or the like has a sandwich structure in which both surfaces of the substrate 1 are sandwiched between copper shells 2 (see FIG. 4A), the water jet is started at the time of the water jet processing. First, when the copper cladding 2 of the substrate is pierced (see FIG. 4B), and then the substrate made of resin starts to be pierced, there is no escape for the jet water flow at this stage, so that the water flow rebounds against the resin of the substrate, and the water rebounds. There is a possibility that the resin on the lower side of the copper mold 2 provided on the surface of the substrate 1 may be blown off to lift the copper mold 2 (see FIG. 4C). When the copper mold 2 floats, for example, as shown in FIG.
When the ED 10 is mounted, the chip LED is tilted, and the connection between the wire 12 and the conductor is also tilted, so that the mounting heights are not uniform, and there is a possibility that a connection failure may occur.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems.
A method of processing a groove for an electronic component substrate having a metal mold on a surface, wherein the substrate is supported on a support provided with a water flow escape hole, and the substrate is subjected to groove processing by a water jet. This is a groove processing method for a substrate for an electronic component.

According to a second aspect of the present invention, in the method of processing a groove for an electronic component substrate according to the first aspect, the support has a hole having substantially the same width and length as the groove formed in the substrate. A groove processing method for an electronic component substrate, wherein the groove is a plate-shaped body.

According to a third aspect of the present invention, in the method of processing a groove for an electronic component substrate according to the first aspect, prior to the groove processing of the substrate by a water jet, a groove other than a water jet is formed at a groove processing start end of the substrate. A groove processing method for an electronic component substrate, wherein a groove is formed by a water jet from a portion of the through hole.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows a method of forming a groove by applying a water jet to a chip LED substrate according to the method of the first and second aspects. In the drawing, reference numeral 4 denotes a support, 5 denotes a water jet injection nozzle, and 6 denotes a water jet. At the time of processing, the substrate 1 is placed and supported on a support 4, and a water jet 6 is jetted from the jet nozzle 5 onto the substrate 1 to relatively move the water jet head 5 and the support 4. Thus, the groove is formed by moving the water jet 6 along the substrate surface in the groove forming direction. The support 4 has a water flow escape hole (groove) 4A at the time of the processing, preferably a groove 3 to be formed.
A hole 4A having substantially the same width and substantially the same length as that of the substrate 4 is formed.
Spills out of the device. Therefore, according to the present invention, no extra force due to the water jet acts on the substrate 1,
For example, a groove having a width of about 0.2 mm can be accurately formed, whereby the number of chip LEDs to be obtained can be increased by about 20 to 30% as compared with the case where a conventional router is used. Since the water flow is used, no heat is generated at the processing point, and there is no risk of thermal deformation.

FIG. 2 shows a chip L according to the method of claim 3.
FIG. 4 is a diagram for explaining a method of forming a groove by applying a water jet to an ED substrate, that is, a processing method capable of preventing the occurrence of floating of a metal hull, for example, a copper husk, which occurs during the processing by the water jet. According to the present invention, prior to subjecting the substrate 1 to water jet processing, a hole 3A is drilled by means other than a water jet, such as a drill, in the groove processing start end, that is, the substrate portion corresponding to the starting point. Start water jet processing from the part. By employing the above processing method, the jet water flow 6 that first hits the substrate 1 mostly flows out of the substrate 1 through the holes 3A and mixes with the water flow flowing out from the back side of the substrate 1. Therefore, the rebound is extremely weak, and there is no danger that, at the initial stage of the groove processing, the substrate below the copper hull 2 of the substrate 1 is blown off to lift the copper hull and generate burrs.

[0009]

According to the first and second aspects of the present invention, since a support having a water flow escape hole is used, even a very thin electronic component substrate such as a chip LED substrate is extremely narrow using a water jet. The groove width can be formed quickly. Thus, the number of products can be significantly increased, and at the same time, the processing speed can be improved and the manufacturing cost can be reduced. Further, since no heat is generated at the processing point, there is no risk of dimensional change due to thermal expansion of the substrate. According to the third aspect of the present invention, since the through hole is formed in advance at the groove processing start end of the substrate, the jet water flow at the start of the water jet processing flows out of the substrate through the through hole to greatly rebound the jet water flow. Therefore, it is possible to eliminate a phenomenon in which the metal hammer, for example, the copper hammer is raised by the rebound.

[Brief description of the drawings]

FIG. 1 is a view for explaining a processing method of the present invention in a case where a groove for an electronic component substrate is processed by a water jet.

FIG. 2 is a view for explaining a processing method of the present invention for preventing floating of copper husks in processing grooves of an electronic component substrate.

FIG. 3 is a front view of the electronic component substrate.

FIG. 4 is a diagram for explaining a process in which a float is generated in a copper hoop by a water jet.

FIG. 5 is a diagram for explaining a product in a case where floating occurs in a copper shell.

[Explanation of symbols]

1 ... chip LED substrate, 2 ... metal (copper) huck,
3 ... groove, 4 ... support, 4 A ... water flow escape hole (groove), 5 ... injection nozzle, 6 ... water jet, 10 ... chip LED, 12 ... wire , P
... Products

Claims (3)

[Claims] 1. A groove forming method for an electronic component substrate having a metal surface on a surface, wherein the substrate is supported on a support provided with a water flow escape hole, and the substrate is grooved by a water jet. A method for processing a groove in an electronic component substrate. 2. The method according to claim 1, wherein the support is a plate-like body having holes having substantially the same width and length as the grooves formed in the substrate. A groove processing method for an electronic component substrate. 3. The method according to claim 1, wherein prior to the groove forming of the substrate by a water jet, a through hole is formed at a groove processing start end of the substrate by means other than a water jet. Forming a groove with a water jet from a portion of the through hole.