JP2008028264A - Manufacturing method of mounting substrate - Google Patents

Manufacturing method of mounting substrate Download PDF

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JP2008028264A
JP2008028264A JP2006201236A JP2006201236A JP2008028264A JP 2008028264 A JP2008028264 A JP 2008028264A JP 2006201236 A JP2006201236 A JP 2006201236A JP 2006201236 A JP2006201236 A JP 2006201236A JP 2008028264 A JP2008028264 A JP 2008028264A
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Prior art keywords
substrate
wire
capillary
elements
discharge
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Makoto Takeuchi
誠 竹内
Harumitsu Sato
晴光 佐藤
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Victor Company of Japan Ltd
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Victor Company of Japan Ltd
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Priority to JP2006201236A priority Critical patent/JP2008028264A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a mounting substrate in which, even when there are variations in thicknesses of elements, the surfaces of the elements are flush with each other. <P>SOLUTION: A predetermined height is defined when a plurality of elements 11, 12 are mounted such that the surfaces of the elements 11, 12 are flush with each other on a substrate 10, modified parts 13, 15 weaker in strength than an Au wire 2 are formed by electric discharge at a length position of the Au wire 2 corresponding to a difference between the predetermined height and each height of the plurality of the elements 11, 12. Then, a ball 2B is formed on the tip end 2A of the Au wire 2, is subjected to thermal contact bonding to the substrate 10, and is then cut down at the modified parts 13, 15 to form Au bumps 14, 16 on the substrate 10. Then, the plurality of the elements 11, 12 are placed on the plurality of the Au bumps 14, 16 via thermosetting sheets 17A, 17B. Heat is applied to the thermosetting sheets 17A, 17B and the elements 11, 12 are pressurized from above. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、基板上に複数のバンプ電極を形成した後、この複数のバンプ電極と半導体等の素子部品の電極とを接続して、この基板上に素子部品を効率良く実装する実装基板の作製方法に関する。   In the present invention, after a plurality of bump electrodes are formed on a substrate, the plurality of bump electrodes are connected to an electrode of an element component such as a semiconductor, and a mounting substrate for efficiently mounting the element component on the substrate is manufactured. Regarding the method.

基板上に複数の素子部品を実装するためには、基板上に複数のバンプ電極を形成した後、この複数のバンプ電極上に複数の素子部品を載置した後、熱圧着して行う。このような実装基板の作製方法が特許文献１に記載されている。
まずは、特許文献１には、基板上に接合用パターンと配線パターンが予め形成されおり、この基板上の接合用パターン上にＡｕ（金）バンプを形成し、このＡｕバンプ上に素子を載置した後、熱圧着して、この素子と基板とを電気的に接続することが記載されている。
特開２０００−２６９３８３号公報 In order to mount a plurality of element components on a substrate, a plurality of bump electrodes are formed on the substrate, and then a plurality of element components are placed on the plurality of bump electrodes, and then thermocompression bonded. A method for manufacturing such a mounting substrate is described in Patent Document 1.
First, in Patent Document 1, a bonding pattern and a wiring pattern are formed in advance on a substrate, an Au (gold) bump is formed on the bonding pattern on the substrate, and an element is placed on the Au bump. After that, it is described that the element and the substrate are electrically connected by thermocompression bonding.
JP 2000-269383 A

ところで、複数の素子部品を基板に効率よく実装するには、素子部品毎に熱圧着の処理を行わず、これらの素子部品の表面を面一にして、一括して熱圧着の処理ができる実装基板の作製方法が必要である。
通常、Ａｕバンプは、画一的に同一高さになるように形成されている一方、素子の厚さは、ばらばらであるので、実装基板上での素子部品の表面を面一にすることはできかった。
このため、実装基板の製作の際、複数の素子部品の表面は厚さバラツキによって凸凹するため、熱圧着の均一な処理が一括してできなかった。 By the way, in order to efficiently mount a plurality of element parts on the board, the thermocompression process is not performed for each element part, and the surface of these element parts is flush and the thermocompression process can be performed collectively. A method for manufacturing a substrate is required.
Normally, the Au bumps are uniformly formed to have the same height, but the thicknesses of the elements are different, so that the surface of the element component on the mounting board is not flush with each other. It was not possible.
For this reason, when the mounting substrate is manufactured, the surfaces of the plurality of element parts are uneven due to the thickness variation, and therefore, uniform processing of thermocompression bonding cannot be performed at once.

そこで、本発明は、かかる従来の問題点に鑑みてなされたものであり、複数の素子部品を基板上に載置して電気的に接続する際、各素子に厚さバラツキがあっても、その各素子部品の表面が面一となる実装基板の作製方法を提供することを目的とする。   Therefore, the present invention has been made in view of such conventional problems, and when a plurality of element parts are placed on a substrate and electrically connected, even if each element has a thickness variation, It is an object of the present invention to provide a mounting substrate manufacturing method in which the surface of each element component is flush.

本願発明は、基板に形成されている複数の基板電極と複数の素子に形成されている複数の素子電極とを接続して、前記基板上に前記複数の素子を実装した際、前記複数の素子の表面を面一にする実装基板の作製方法において、前記Ａｕワイヤを挿入可能な貫通孔及び前記貫通孔の側面から前記貫通孔に達する複数の放電孔を有し、更に前記貫通孔の側面に沿い、かつ各放電孔に埋め込まれた金属部を有するキャピラリと、前記キャピラリを前記貫通孔と平行な方向に稼働させる稼働部と、前記貫通孔に挿入されて前記キャピラリの出口側から突き出た前記Ａｕワイヤの先端部を放電により溶融してボールを形成するトーチと、前記キャピラリの入口側の前記Ａｕワイヤをクランプするクランパと、前記金属部に放電エネルギーを供給する放電部とを有するワイヤボンディング装置を用いて、前記キャピラリの入口側から挿入され、前記出口側から突き出た前記Ａｕワイヤに対して前記トーチを放電させて、前記Ａｕワイヤの先端部にボールを形成する第１工程と、前記複数の素子を前記基板上に実装する際に、各素子の表面が面一となるように、前記Ａｕワイヤの先端部から前記キャピラリの入口側に向かった長さ位置に、前記放電部から放電エネルギーを前記金属部に供給することにより、前記Ａｕワイヤを放電して前記Ａｕワイヤよりも強度の弱い変質部を形成する第２工程と、次に、前記稼働部を稼働させることにより、前記キャピラリを前記基板側に移動させて、前記基板上に前記Ａｕワイヤの先端部に形成されたボールを前記基板電極に熱圧着する第３工程と、次に、前記クランパにより前記Ａｕワイヤをクランプし、前記稼働部を稼働させることにより、前記キャピラリを前記基板側から遠ざけるように移動させて、前記Ａｕワイヤを前記変質部から切断して、前記基板上に前記ボールと前記ボールに一体化された棒状部からなるＡｕバンプを形成する第４工程と、前記第１〜第４工程を繰り返し、前記基板の複数の電極上に複数のＡｕバンプを形成する第５工程と、前記複数のＡｕバンプ上に熱硬化性シートを載置した後、前記複数の基板電極と前記素子に形成されている複数の素子電極とが対向配置するように、前記素子を熱硬化性シート上に載置する第６工程と、前記熱硬化性シートに熱を加えると共に前記素子上方から加圧して、前記複数のＡｕバンプの棒状部により熱硬化性シートを突き破ぶるようにして、前記素子の複数の素子電極と前記基板に形成されている複数の基板電極とを接続する第７工程と、を有することを特徴とする実装基板の作製方法を提供する。   In the present invention, when the plurality of elements are mounted on the substrate by connecting the plurality of substrate electrodes formed on the substrate and the plurality of element electrodes formed on the plurality of elements, the plurality of elements In the method of manufacturing a mounting substrate in which the surface of the through hole is flush, a through hole into which the Au wire can be inserted and a plurality of discharge holes reaching the through hole from the side surface of the through hole are provided, and further on the side surface of the through hole. And a capillary having a metal part embedded in each discharge hole, an operating part for operating the capillary in a direction parallel to the through hole, and the protrusion inserted from the capillary through the outlet side. A torch for melting the tip of the Au wire by discharge to form a ball, a clamper for clamping the Au wire on the inlet side of the capillary, and a discharge for supplying discharge energy to the metal part And forming a ball at the tip of the Au wire by discharging the torch with respect to the Au wire inserted from the inlet side of the capillary and protruding from the outlet side. In one step, when mounting the plurality of elements on the substrate, at a length position from the tip of the Au wire toward the inlet side of the capillary so that the surface of each element is flush with each other, A second step of discharging the Au wire to form an altered portion having a lower strength than the Au wire by supplying discharge energy from the discharge portion to the metal portion; and then operating the operating portion. Thus, the capillary is moved to the substrate side, and a ball formed on the tip of the Au wire on the substrate is thermocompression bonded to the substrate electrode; The Au wire is clamped by a clamper, and the operating portion is operated to move the capillary away from the substrate side, so that the Au wire is cut from the altered portion, and the ball is placed on the substrate. And a fourth step of forming Au bumps formed of rod-shaped portions integrated with the ball, and a fifth step of forming a plurality of Au bumps on the plurality of electrodes of the substrate by repeating the first to fourth steps. And the thermosetting sheet is placed on the plurality of Au bumps, and then the element is thermoset so that the plurality of substrate electrodes and the plurality of element electrodes formed on the element are opposed to each other. A sixth step of placing on the sheet, and applying heat to the thermosetting sheet and pressurizing from above the element so as to break through the thermosetting sheet by the bar-shaped portions of the plurality of Au bumps And a seventh step of connecting a plurality of element electrodes of the element and a plurality of substrate electrodes formed on the substrate.

本願発明によれば、複数の素子を前記基板上に実装する際に、各素子の表面が面一となるように決められた一定の高さと前記複数の素子のそれぞれの高さとの差分に相当するＡｕワイヤの先端部から一方の側に向かった長さ位置に、放電によってＡｕワイヤよりも強度の弱い変質部を形成し、この変質部で切断して基板上に複数のＡｕバンプを形成するので、各素子の厚さバラツキがあっても、その各素子の表面が面一となる実装基板を得ることができる。   According to the present invention, when a plurality of elements are mounted on the substrate, this corresponds to a difference between a certain height determined so that the surface of each element is flush with each of the plurality of elements. An altered portion having a strength lower than that of the Au wire is formed by discharge at a length position from the tip of the Au wire to one side, and a plurality of Au bumps are formed on the substrate by cutting at the altered portion. Therefore, even if the thickness of each element varies, it is possible to obtain a mounting substrate in which the surface of each element is flush.

本発明の実施の形態に係る実装基板の作製方法について図１〜図１２を用いて説明する。
図１は、本発明の実施の形態に用いられるワイヤボンディング装置を示す概略図である。図２は、本発明の実装基板の作製方法における（基板準備工程）を示す断面図である。図３は、本発明の実装基板の作製方法における（第１のボール及び第１の変質部形成工程）を示す断面図である。図４は、本発明の実装基板の作製方法における（第１の熱圧着工程）を示す断面図である。図５は、本発明の実装基板の作製方法における（第１のＡｕバンプ形成工程）を示す断面図である。図６は、本発明の実装基板の作製方法における（第１の繰り返し工程）を示す断面図である。図７は、本発明の実装基板の作製方法における（第２のボール及び第２の変質部形成工程）を示す断面図である。図８は、本発明の実装基板の作製方法における（第２の熱圧着工程）を示す断面図である。図９は、本発明の実装基板の作製方法における（第２のＡｕバンプ形成工程）を示す断面図である。図１０は、本発明の実装基板の作製方法における（第２の繰り返し工程）を示す断面図である。図１１は、本発明の実装基板の作製方法における（素子載置工程）を示す断面図である。図１２は、本発明の実装基板の作製方法における（実装基板の作製工程）を示す断面図である。 A method for manufacturing a mounting substrate according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic view showing a wire bonding apparatus used in an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a (substrate preparation step) in the method for manufacturing a mounting substrate of the present invention. FIG. 3 is a cross-sectional view showing the (first ball and first altered portion forming step) in the method for manufacturing a mounting substrate of the present invention. FIG. 4 is a cross-sectional view showing a (first thermocompression bonding step) in the method for manufacturing a mounting substrate of the present invention. FIG. 5 is a cross-sectional view showing a (first Au bump forming step) in the method for manufacturing a mounting substrate of the present invention. FIG. 6 is a cross-sectional view showing a (first repeating step) in the method for manufacturing a mounting board of the present invention. FIG. 7 is a cross-sectional view showing (second ball and second altered portion forming step) in the method for manufacturing a mounting substrate of the present invention. FIG. 8 is a cross-sectional view showing a (second thermocompression bonding step) in the mounting substrate manufacturing method of the present invention. FIG. 9 is a cross-sectional view showing a (second Au bump forming step) in the method for manufacturing a mounting substrate of the present invention. FIG. 10 is a cross-sectional view showing the (second repetitive step) in the method for manufacturing a mounting board of the present invention. FIG. 11 is a cross-sectional view showing an (element placement step) in the method for manufacturing a mounting board of the present invention. FIG. 12 is a cross-sectional view showing a (mounting substrate manufacturing step) in the mounting substrate manufacturing method of the present invention.

まずは、Ａｕバンプを形成するために用いられるワイヤボンディング装置について説明する。
図１に示すように、ワイヤボンディング装置１は、Ａｕワイヤ２を挿入する貫通孔３及びこの貫通孔３に沿って側面４Ａから貫通孔３に達する複数の放電孔４Ｂを有するキャピラリ４と、キャピラリ４を貫通孔３と平行な方向に稼働させる稼働部５と、Ａｕワイヤ２の貫通孔３に挿入され、キャピラリ４から突き出たＡｕワイヤ２に対して所定の位置から放電を与えＡｕワイヤ２の先端部２Ａを溶融してボール２Ｂを形成するトーチ６と、キャピラリ４のＡｕワイヤ２の挿入側に配置され、Ａｕワイヤ２をクランプする一対のクランパ７と、後述する金属部９に放電エネルギーを供給する複数の放電部８とから構成されている。キャピラリ４の側面４Ａには、各放電孔４Ｂに挿入された金属部９が形成されている。 First, a wire bonding apparatus used for forming Au bumps will be described.
As shown in FIG. 1, a wire bonding apparatus 1 includes a capillary 4 having a through hole 3 into which an Au wire 2 is inserted and a plurality of discharge holes 4B that reach the through hole 3 from a side surface 4A along the through hole 3. 4 is operated in the direction parallel to the through hole 3 and the Au wire 2 inserted into the through hole 3 of the Au wire 2 and protrudes from the capillary 4 to discharge from a predetermined position. Discharge energy is supplied to a torch 6 that melts the tip 2A to form a ball 2B, a pair of clampers 7 that are disposed on the insertion side of the Au wire 2 of the capillary 4 and clamps the Au wire 2, and a metal portion 9 that will be described later. It is comprised from the several discharge part 8 to supply. On the side surface 4A of the capillary 4, a metal portion 9 inserted into each discharge hole 4B is formed.

以下では、基板上に高さの異なる２つの素子を実装する場合について説明する。
（基板準備工程）
図２に示すように、素子１１を実装する領域Ｐに複数の基板電極１０Ａが形成されると共に、素子１２を実装する領域Ｑに複数の基板電極１０Ｂが形成された基板１０を用意する。素子１１は、複数の基板電極１０Ａに対応した素子電極１１Ａを有し、その厚さがｈ1である。素子１２は、複数の基板電極１０Ｂに対応した素子電極１２Ａを有し、その厚さがｈ2である。ｈ2として、ｈ1＞ｈ2であるとする。最初に、素子１１のＡｕバンプ２を基板１０に形成する場合について説明する。 Hereinafter, a case where two elements having different heights are mounted on a substrate will be described.
(Board preparation process)
As shown in FIG. 2, a substrate 10 is prepared in which a plurality of substrate electrodes 10 </ b> A are formed in a region P where the element 11 is mounted and a plurality of substrate electrodes 10 </ b> B are formed in a region Q where the element 12 is mounted. The element 11 has an element electrode 11A corresponding to the plurality of substrate electrodes 10A, and the thickness thereof is h 1 . Element 12 has an element electrodes 12A corresponding to a plurality of substrate electrodes 10B, the thickness of h 2. as h 2, and a h 1> h 2. First, the case where the Au bump 2 of the element 11 is formed on the substrate 10 will be described.

（第１のボール及び第１の変質部形成工程）
図３に示すように、キャピラリ４の入口側から挿入され、出口側から突き出たＡｕワイヤ２の先端部２Ａにトーチ６から放電を与えて、Ａｕワイヤ２の先端部２Ａにボール２Ｂを形成する。そして、クランパ７を解除しＡｕワイヤを引き上げキャピラリ４の出口側にボール２Ｂを接触させる。
この後、先端部２Ａから素子１１の厚さｈ1に相当するＡｕワイヤ２の長さ位置の放電孔４Ｂに挿入された金属部９に放電部８から放電エネルギーを供給して、Ａｕワイヤ２を放電してＡｕワイヤ２よりも強度の弱い変質部１３を形成する。 (First ball and first altered portion forming step)
As shown in FIG. 3, the torch 6 discharges the tip 2A of the Au wire 2 inserted from the inlet side of the capillary 4 and protrudes from the outlet side to form a ball 2B on the tip 2A of the Au wire 2. . Then, the clamper 7 is released, the Au wire is pulled up, and the ball 2B is brought into contact with the outlet side of the capillary 4.
Thereafter, discharge energy is supplied from the discharge portion 8 to the metal portion 9 inserted into the discharge hole 4B at the length position of the Au wire 2 corresponding to the thickness h 1 of the element 11 from the tip portion 2A, and the Au wire 2 To form an altered portion 13 having a strength lower than that of the Au wire 2.

（第１の熱圧着工程）
図４に示すように、稼働部５を稼働させることにより、キャピラリ４を基板１０側に移動させて、基板１０上にＡｕワイヤ２の先端部２Ａに形成されたボール２Ｂを素子１１を載置する領域Ｐ内の基板電極１０Ａに熱圧着する。 (First thermocompression bonding process)
As shown in FIG. 4, by operating the operating unit 5, the capillary 4 is moved to the substrate 10 side, and the element 11 is placed on the substrate 10 with the ball 2 </ b> B formed on the tip 2 </ b> A of the Au wire 2. Thermocompression bonding to the substrate electrode 10A in the region P to be performed.

（第１のＡｕバンプ形成工程）
図５に示すように、クランパ７によりＡｕワイヤ２をクランプし、稼働部５を稼働させることにより、キャピラリ４を上方に引き上げて、Ａｕワイヤ２を変質部１３から切断して、基板１０上にボール２Ｂとこのボール２Ｂに一体化された棒状部２Ｃからなる長さｄ1のＡｕバンプ１４を形成する。 (First Au bump forming step)
As shown in FIG. 5, the Au wire 2 is clamped by the clamper 7, and the operating part 5 is operated, whereby the capillary 4 is pulled upward, and the Au wire 2 is cut from the altered part 13, so as to be placed on the substrate 10. An Au bump 14 having a length d 1 composed of a ball 2B and a rod-like portion 2C integrated with the ball 2B is formed.

（第１の繰り返し工程）
図６に示すように、上記したと同様な繰り返し工程を行って、基板１０に形成されている素子１１を載置する領域内の複数の基板電極１０Ａ上に複数のＡｕバンプ１４を形成する。 (First repetition step)
As shown in FIG. 6, a plurality of Au bumps 14 are formed on the plurality of substrate electrodes 10 </ b> A in the region where the element 11 formed on the substrate 10 is placed by performing the same repeating process as described above.

（第２のボール及び第２の変質部形成工程）
最初に、素子１２のＡｕバンプ２を基板１０に形成する場合について説明する。
図７に示すように、（第１のボール及び第１の変質部形成工程）と同様に、キャピラリ４の入口側から挿入され、出口側から突き出たＡｕワイヤの先端部２Ｂにトーチ６から放電を与えて、Ａｕワイヤ２の先端部２Ａにボール２Ｂを形成する。
この後、先端部２Ａから（ｈ1−ｈ2）＋ｄ1に相当するＡｕワイヤ２の長さ位置の放電孔４Ｂに挿入された金属部９に放電部８から放電エネルギーを供給して、Ａｕワイヤ２を放電してＡｕワイヤ２よりも強度の弱い変質部１５を形成する。 (Second ball and second altered portion forming step)
First, the case where the Au bump 2 of the element 12 is formed on the substrate 10 will be described.
As shown in FIG. 7, the discharge from the torch 6 to the tip 2B of the Au wire inserted from the inlet side of the capillary 4 and protruding from the outlet side, as in the (first ball and first altered portion forming step). Then, the ball 2B is formed on the tip 2A of the Au wire 2.
Thereafter, the discharge energy is supplied from the discharge portion 8 to the metal portion 9 inserted into the discharge hole 4B at the length position of the Au wire 2 corresponding to (h 1 −h 2 ) + d 1 from the tip portion 2A. The wire 2 is discharged to form an altered portion 15 that is weaker than the Au wire 2.

（第２の熱圧着工程）
図８に示すように、稼働部５を稼働させることにより、キャピラリ４を基板１０側に移動させて、基板１０上にＡｕワイヤ２の先端部２Ａに形成されたボール２Ｂを素子１２を載置する領域Ｑ内の基板電極１０Ｂに熱圧着する。 (Second thermocompression bonding process)
As shown in FIG. 8, by operating the operating section 5, the capillary 4 is moved to the substrate 10 side, and the element 2 is placed on the substrate 10 with the ball 2 </ b> B formed at the tip 2 </ b> A of the Au wire 2. Thermocompression bonding to the substrate electrode 10B in the region Q to be performed.

（第２Ａｕバンプ形成工程）
図９に示すように、クランパ７によりＡｕワイヤ２をクランプし、稼働部５を稼働させることにより、キャピラリ４を上方に引き上げて、Ａｕワイヤ２を変質部１５から切断して、基板１０上にボール２Ｂとこのボール２Ｂに一体化された棒状部２ＣからなるＡｕバンプ１６を形成する。
このＡｕバンプ１６の棒状部２Ｃの長さは、Ａｕバンプ１４の棒状部２Ｃの長さよりも長い。 (Second Au bump formation process)
As shown in FIG. 9, the Au wire 2 is clamped by the clamper 7 and the operating portion 5 is operated, whereby the capillary 4 is pulled upward, and the Au wire 2 is cut from the altered portion 15 to be formed on the substrate 10. An Au bump 16 composed of a ball 2B and a rod-like portion 2C integrated with the ball 2B is formed.
The length of the bar-shaped part 2C of the Au bump 16 is longer than the length of the bar-shaped part 2C of the Au bump 14.

（第２繰り返し工程）
図１０に示すように、上記したと同様な繰り返し工程を行って、基板１０に形成されている素子１２を載置する領域Ｑ内の複数の基板電極１０Ｂ上に複数のＡｕバンプ１６を形成する。 (Second repetition step)
As shown in FIG. 10, a plurality of Au bumps 16 are formed on the plurality of substrate electrodes 10B in the region Q where the element 12 formed on the substrate 10 is placed by performing the same repeating process as described above. .

（素子載置工程）
図１１に示すように、素子１１を載置する領域に形成されている複数のＡｕバンプ１４上に熱硬化性シート１７Ａを載置すると共に、素子１２を載置する領域に形成されている複数のＡｕバンプ１６上に熱硬化性シート１７Ｂを載置した後、複数の基板電極１０Ａ、１０Ｂがそれぞれ素子１１、１２に形成されている複数の素子電極１１Ａ、１２Ａとが対向配置するように、素子１１、１２をそれぞれ熱硬化性シート１７Ａ、１７Ｂ上に載置する。この際、基板１０からの素子１１の表面までの高さは、（ｄ1＋ｈ1）であるのに対して、基板からの素子１２の表面までの高さは、（ｈ1−ｈ2）＋ｄ1＋ｈ2であるので、素子１１の表面と素子１２の表面は、面一にすることができる。 (Element placement process)
As shown in FIG. 11, a thermosetting sheet 17 </ b> A is placed on a plurality of Au bumps 14 formed in a region where the element 11 is placed, and a plurality is formed in a region where the element 12 is placed. After the thermosetting sheet 17B is placed on the Au bump 16, the plurality of substrate electrodes 10A and 10B are arranged to face the plurality of element electrodes 11A and 12A formed on the elements 11 and 12, respectively. Elements 11 and 12 are mounted on thermosetting sheets 17A and 17B, respectively. At this time, the height from the substrate 10 to the surface of the element 11 is (d 1 + h 1 ), whereas the height from the substrate to the surface of the element 12 is (h 1 −h 2 ). Since + d 1 + h 2 , the surface of the element 11 and the surface of the element 12 can be flush with each other.

（実装基板の作製工程）
図１２に示すように、熱硬化性シート１７Ａ、１７Ｂに熱を加えると共に素子１１、１２上方から一括して加圧して、複数のＡｕバンプ１４、１６の棒状部２Ｃにより熱硬化性シート１７Ａ、１７Ｂを突き破ぶるようにして、素子１１、１２の複数の素子電極１１Ａ、１２Ａと複数の基板電極１０Ａ、１０Ｂとを接続して、素子１１、１２を基板１０上に実装した実装基板１８を作製する。 (Mounting substrate manufacturing process)
As shown in FIG. 12, heat is applied to the thermosetting sheets 17A and 17B and the elements 11 and 12 are collectively pressed from above, and the thermosetting sheets 17A and 17A are formed by the rod-like portions 2C of the plurality of Au bumps 14 and 16, A mounting substrate 18 in which the elements 11 and 12 are mounted on the substrate 10 by connecting the plurality of element electrodes 11A and 12A of the elements 11 and 12 and the plurality of substrate electrodes 10A and 10B so as to break through 17B. Make it.

以上のように、本発明の実施形態によれば、素子１１、１２の厚さがｈ1、ｈ2である場合に、Ａｕワイヤ２の先端部２Ａから素子１１の厚さｈ1に相当するＡｕワイヤ２の長さ位置に変質部１３を形成し、先端部２Ａから（ｈ1−ｈ2）＋ｄ1に相当するＡｕワイヤ２の長さ位置に変質部１５を形成した後、基板１０上に素子１１、１２を実装するため、素子１１、１２の表面を面一にすることができる。このため、実装基板の作製工程で、複数の素子の表面から一括して、熱圧着の均一な処理が可能にすることができる。 As described above, according to the embodiment of the present invention, when the thicknesses of the elements 11 and 12 are h 1 and h 2 , they correspond to the thickness h 1 of the element 11 from the tip portion 2A of the Au wire 2. After the altered portion 13 is formed at the length position of the Au wire 2 and the altered portion 15 is formed at the length position of the Au wire 2 corresponding to (h 1 −h 2 ) + d 1 from the distal end portion 2A, Since the elements 11 and 12 are mounted on the surface, the surfaces of the elements 11 and 12 can be flush with each other. For this reason, in the manufacturing process of a mounting substrate, the uniform process of thermocompression bonding can be made collectively from the surface of a plurality of elements.

なお、２つの素子を基板上に実装する場合について説明したが、多数の素子を実装する場合も同様である。
また、ボールを形成するためのトーチ６は、変質部１３、もしくは１５を形成するための放電部８を兼用しても良く、これ以外は同様である。 Although the case where two elements are mounted on the substrate has been described, the same applies to the case where a large number of elements are mounted.
Further, the torch 6 for forming the ball may also serve as the discharge portion 8 for forming the altered portion 13 or 15, and the rest is the same.

本発明の実施の形態に用いられるワイヤボンディング装置を示す概略図である。It is the schematic which shows the wire bonding apparatus used for embodiment of this invention. 本発明の実装基板の作製方法における（基板準備工程）を示す断面図である。It is sectional drawing which shows the (substrate preparation process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第１のボール及び第１の変質部形成工程）を示す断面図である。It is sectional drawing which shows (the 1st ball | bowl and 1st quality-change part formation process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第１の熱圧着工程）を示す断面図である。It is sectional drawing which shows (1st thermocompression-bonding process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第１のＡｕバンプ形成工程）を示す断面図である。It is sectional drawing which shows (the 1st Au bump formation process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第１の繰り返し工程）を示す断面図である。It is sectional drawing which shows (the 1st repetition process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第２のボール及び第２の変質部形成工程）を示す断面図である。It is sectional drawing which shows (the 2nd ball | bowl and 2nd quality-change part formation process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第２の熱圧着工程）を示す断面図である。It is sectional drawing which shows (the 2nd thermocompression-bonding process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第２のＡｕバンプ形成工程）を示す断面図である。It is sectional drawing which shows (2nd Au bump formation process) in the preparation methods of the mounting substrate of this invention. 本発明の実装基板の作製方法における（第２の繰り返し工程）を示す断面図である。It is sectional drawing which shows (the 2nd repetition process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（素子載置工程）を示す断面図である。It is sectional drawing which shows the (element mounting process) in the manufacturing method of the mounting substrate of this invention. 本発明の実装基板の作製方法における（実装基板の作製工程）を示す断面図である。It is sectional drawing which shows (the manufacturing process of a mounting board | substrate) in the manufacturing method of the mounting board | substrate of this invention.

符号の説明Explanation of symbols

１…ワイヤボンディング装置、２…Ａｕワイヤ、２Ａ…先端部、２Ｂ…Ａｕボール、３…貫通孔、４…キャピラリ、４Ａ…側面、６…トーチ、７…クランパ、８…放電部、９…金属部、１０…基板、１０Ａ、１０Ｂ…基板電極、１１、１２…素子、１１Ａ、１２Ａ…素子電極、１３、１５…変質部、１４、１６…Ａｕバンプ、１７Ａ、１７Ｂ…熱硬化性シート、１８…実装基板

DESCRIPTION OF SYMBOLS 1 ... Wire bonding apparatus, 2 ... Au wire, 2A ... Tip part, 2B ... Au ball | bowl, 3 ... Through-hole, 4 ... Capillary, 4A ... Side surface, 6 ... Torch, 7 ... Clamper, 8 ... Discharge part, 9 ... Metal Part, 10 ... substrate, 10A, 10B ... substrate electrode, 11, 12 ... element, 11A, 12A ... element electrode, 13, 15 ... altered part, 14, 16 ... Au bump, 17A, 17B ... thermosetting sheet, 18 ... Mounted board

Claims (1)

基板に形成されている複数の基板電極と複数の素子に形成されている複数の素子電極とを接続して、前記基板上に前記複数の素子を実装した際、前記複数の素子の表面を面一にする実装基板の作製方法において、
前記Ａｕワイヤを挿入可能な貫通孔及び前記貫通孔の側面から前記貫通孔に達する複数の放電孔を有し、更に前記貫通孔の側面に沿い、かつ各放電孔に埋め込まれた金属部を有するキャピラリと、前記キャピラリを前記貫通孔と平行な方向に稼働させる稼働部と、前記貫通孔に挿入されて前記キャピラリの出口側から突き出た前記Ａｕワイヤの先端部を放電により溶融してボールを形成するトーチと、前記キャピラリの入口側の前記Ａｕワイヤをクランプするクランパと、前記金属部に放電エネルギーを供給する放電部とを有するワイヤボンディング装置を用いて、
前記キャピラリの入口側から挿入され、前記出口側から突き出た前記Ａｕワイヤに対して前記トーチを放電させて、前記Ａｕワイヤの先端部にボールを形成する第１工程と、
前記複数の素子を前記基板上に実装する際に、各素子の表面が面一となるように、前記Ａｕワイヤの先端部から前記キャピラリの入口側に向かった長さ位置に、前記放電部から放電エネルギーを前記金属部に供給することにより、前記Ａｕワイヤを放電して前記Ａｕワイヤよりも強度の弱い変質部を形成する第２工程と、
次に、前記稼働部を稼働させることにより、前記キャピラリを前記基板側に移動させて、前記基板上に前記Ａｕワイヤの先端部に形成されたボールを前記基板電極に熱圧着する第３工程と、
次に、前記クランパにより前記Ａｕワイヤをクランプし、前記稼働部を稼働させることにより、前記キャピラリを前記基板側から遠ざけるように移動させて、前記Ａｕワイヤを前記変質部から切断して、前記基板上に前記ボールと前記ボールに一体化された棒状部からなるＡｕバンプを形成する第４工程と、
前記第１〜第４工程を繰り返し、前記基板の複数の電極上に複数のＡｕバンプを形成する第５工程と、
前記複数のＡｕバンプ上に熱硬化性シートを載置した後、前記複数の基板電極と前記素子に形成されている複数の素子電極とが対向配置するように、前記素子を熱硬化性シート上に載置する第６工程と、
前記熱硬化性シートに熱を加えると共に前記素子上方から加圧して、前記複数のＡｕバンプの棒状部により熱硬化性シートを突き破ぶるようにして、前記素子の複数の素子電極と前記基板に形成されている複数の基板電極とを接続する第７工程と、
を有することを特徴とする実装基板の作製方法。

When a plurality of substrate electrodes formed on a substrate are connected to a plurality of device electrodes formed on a plurality of elements and the plurality of elements are mounted on the substrate, the surfaces of the plurality of elements are faced. In the manufacturing method of the mounting substrate to be unified,
It has a through hole into which the Au wire can be inserted and a plurality of discharge holes reaching the through hole from the side surface of the through hole, and further includes a metal portion along the side surface of the through hole and embedded in each discharge hole. A capillary, an operating part for operating the capillary in a direction parallel to the through hole, and a tip of the Au wire inserted into the through hole and protruding from the outlet side of the capillary are melted by discharge to form a ball Using a wire bonding apparatus having a torch, a clamper that clamps the Au wire on the inlet side of the capillary, and a discharge part that supplies discharge energy to the metal part,
A first step of forming a ball at the tip of the Au wire by discharging the torch with respect to the Au wire inserted from the inlet side of the capillary and protruding from the outlet side;
When mounting the plurality of elements on the substrate, from the discharge part to a length position from the tip of the Au wire toward the inlet side of the capillary so that the surface of each element is flush. Supplying a discharge energy to the metal part to discharge the Au wire to form an altered part having a lower strength than the Au wire;
Next, by operating the operating portion, the capillary is moved to the substrate side, and a third step of thermocompression bonding the ball formed on the tip of the Au wire on the substrate to the substrate electrode; ,
Next, the Au wire is clamped by the clamper and the working unit is operated to move the capillary away from the substrate side, thereby cutting the Au wire from the altered portion, and A fourth step of forming an Au bump consisting of the ball and a rod-shaped portion integrated with the ball;
Repeating the first to fourth steps to form a plurality of Au bumps on the plurality of electrodes of the substrate;
After placing the thermosetting sheet on the plurality of Au bumps, the element is placed on the thermosetting sheet so that the plurality of substrate electrodes and the plurality of element electrodes formed on the element are arranged to face each other. A sixth step to be placed on,
Heat is applied to the thermosetting sheet and is pressed from above the element so that the thermosetting sheet is pierced by the rod-shaped portions of the plurality of Au bumps. A seventh step of connecting the plurality of formed substrate electrodes;
A method for manufacturing a mounting board, comprising:

JP2006201236A 2006-07-24 2006-07-24 Manufacturing method of mounting substrate Pending JP2008028264A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104806582A (en) * 2015-04-23 2015-07-29 圣邦集团有限公司 Engineering machinery intelligent confluence control hydraulic system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104806582A (en) * 2015-04-23 2015-07-29 圣邦集团有限公司 Engineering machinery intelligent confluence control hydraulic system

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