CN1985410A - 磁头悬架组件上柔性印刷电路的“两步接触”夹紧机构 - Google Patents

磁头悬架组件上柔性印刷电路的“两步接触”夹紧机构 Download PDF

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CN1985410A
CN1985410A CNA2004800435582A CN200480043558A CN1985410A CN 1985410 A CN1985410 A CN 1985410A CN A2004800435582 A CNA2004800435582 A CN A2004800435582A CN 200480043558 A CN200480043558 A CN 200480043558A CN 1985410 A CN1985410 A CN 1985410A
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test probe
anchor clamps
testing cushion
slide block
test
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CN100452551C (zh
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Y·赵
S·黄
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SAE Magnetics HK Ltd
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

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Abstract

本发明揭示了一种用于将测试探头夹紧到磁头悬架组件的柔性印刷电路的测试垫的系统和方法。使用两步接触方法以防止静电损伤。该夹具由耗散材料制成，与测试探头外壳相同。测试探头外壳内的弹簧负载滑块使得测试垫与测试探头接触之前，夹具与测试垫接触。夹具和外壳的耗散材料使得测试垫的电势和测试探头的电势在两者相互接触之前相等。

Description

磁头悬架组件上柔性印刷电路的“两步接触”夹紧机构
技术领域
本发明涉及磁头悬架组件(head gimbal assembly)的滑触头(slider)的电连接。更具体而言，本发明涉及将前置放大器板的测试探头夹紧至磁头悬架组件的柔性印刷电路构件的接触垫。
背景技术
图1示出了将测试探头连接到磁头悬架组件(HGA)的柔性印刷电路(FPC)的测试垫的现有技术夹紧系统的分解视图。具有FPC104的HGA102插入夹具106内的凹槽。FPC104具有从该FPC两侧可访问的多个测试垫108，例如正和负读取垫(read pad)以及正和负写入垫(write pad)。顶盖110将FPC104恰当地固定在夹具106上。在一个实施方案中，顶盖通过螺丝112耦合到夹具106。夹具由表面电阻率为1010至1012欧姆/平方的抗静电塑料制成。
前置放大器板114具有向上延伸的一个或多个测试探头116。测试探头外壳118耦合到前置放大器板114。在一个实施方案中，两个塑料螺丝120用于将测试探头外壳118耦合到前置放大器板114。接地垫122可置于各个螺丝周围以防止放电。测试探头116向上延伸穿过测试探头外壳118并对应于FPC104上的各个底部测试垫。
测试探头外壳118通过旋转销124耦合到夹具106。图2a示出了处于开放位置例如当FPC插入到该夹具时该夹具系统的图示。图2b示出了处于该开放位置的夹具系统的特写剖面图。此时，FPC104的测试垫108不接触测试探头116。
压力弹簧126对夹具106施加力使其旋转接触测试探头外壳118。图2c示出了处于闭合位置的夹具系统的图示。图2d示出了处于闭合位置的夹具系统的特写剖面图。此时，FPC104的测试垫108受力而接触测试探头116。
该方法的问题在于，测试探头116和测试垫108在二者之间的电势差或电压相等之前相互接触。这会产生巨大的瞬态电流放电，导致对磁头悬架组件的磁性读写头造成静电损伤。
附图说明
图1示出了将测试探头连接到磁头悬架组件的柔性印刷电路的测试垫的现有技术夹紧系统的分解视图。
图2a至d示出了使用中的现有技术夹具系统的图示。
图3示出了将测试探头连接到磁头悬架组件的柔性印刷电路的测试垫的“两步接触”夹具系统一个实施方案的分解视图。
图4a至f的视图示出了使用中的“两步接触”夹具系统。
图5示出了该两步接触过程的一个实施方案的流程图。
图6a至b示出了两步接触卡具(fixture)静电电势放电路径的一个实施方案的图示。
图7示出了HGA损伤比较测试的模拟设备的一个实施方案的图示。
图8a至b示出了由图7的评估产生的结果波形。
发明详述
本发明揭示了一种用于将测试探头夹紧到磁头悬架组件(HGA)的柔性印刷电路(FPC)的测试垫的系统和方法。在一个实施方案中，使用两步接触方法防止静电损伤。夹具由耗散材料(dissipative material)制成，与测试探头外壳的材料相同。测试探头外壳内的弹簧负载滑块(slider block)使得在测试垫接触测试探头之前夹具与测试垫接触。夹具和外壳的耗散材料使得测试垫的电势与测试探头的电势相等之后再相互接触。
图3示出了将测试探头连接到HGA的FPC测试垫的夹具系统一个实施方案的分解视图。具有FPC104的HGA102置于夹具302下方，使得夹具与一个或多个测试垫108的顶部接触，例如FPC104的正和负读取垫以及正和负写入垫的顶部。夹具由耗散材料例如耗散塑料(例如由DSM Engineering Plastic Products，Inc.生产的Semitron420)制成。在一个实施方案中，该耗散材料表面电阻率为106至108欧姆/平方。
前置放大器板304具有向上延伸的一个或多个测试探头306。测试探头外壳308耦合到前置放大器板304。在一个实施方案中，两个塑料螺丝310用于将测试探头外壳308耦合到前置放大器板304。接地垫312可置于各个螺丝周围以防止放电。测试探头306向上延伸穿过测试探头外壳308，并对应于FPC104上各个底部测试垫。滑块314安装于测试探头外壳308内的腔内。滑块314具有用于置入FPC104的凹槽。滑块314在测试探头外壳308内垂直滑动。第一压力弹簧316对滑块314施加向上的压力。一对终止导向销318限制该滑块314可滑动的范围。测试探头外壳308通过旋转销320耦合到夹具302。第二压力弹簧322对夹具302施加力使其旋转以接触测试探头外壳308。在一个实施方案中，该整个系统置于接地卡具(未示出)上。该接地卡具可由金属制成。尽管在本实施方案中，夹具执行旋转运动，滑块执行线性运动，但是其他实施方案中，夹具可执行线性运动或者滑块执行旋转运动。
图4a至f示出了两步接触夹具系统的一个实施方案。图4a示出了处于开放位置的该夹具系统。图4b示出了处于开放位置的该两步接触夹具系统的特写剖面图。此时，FPC104的测试垫108不与测试探头306接触。滑块314处于完全展开的位置。此外，夹具302端部上的凸起402尚未接触测试垫108。
图4c示出了处于第一步位置的该夹具系统。图4d示出了处于第一位置的该两步接触夹具系统的特写剖面图。此时，FPC104的测试垫108仍未接触测试探头306。滑块314处于完全展开的位置。夹具302端部上的凸起402现在接触测试垫108。这使得测试垫108的电势与测试探头306的电势通过夹具和测试探头外壳变得相等。耗散材料的本性防止该电势变化太急剧。通过销钉318、测试探头外壳308、接地垫312、前置放大器板304和接地卡具，可能的静电电势将通过夹具302释放。
图4e示出了处于第二位置的该夹具系统。图4f示出了处于第一步位置的该两步接触夹具系统的特写剖面图。此时，滑块314已经移动到缩回位置，第二弹簧316受压。FPC104的测试垫108现在接触测试探头306。
图5示出了该两步接触过程的一个实施方案的流程图。该过程开始于(区块510)将HGA102的FPC104置于滑块314内(区块520)。夹具302置成与HGA102的测试垫108接触(区块530)。测试垫的电荷被释放(区块540)。测试探头置成与测试垫接触(区块550)，由此结束该过程(区块560)。
图6a和6b分别示出了静电电势释放路径的一个实施方案的图示和特写图示。夹具302的凸起402触及FPC104的测试垫108。测试探头306随后在1至5秒之后触及测试垫108。夹具302和测试垫108之间的接触与测试探头306与测试垫108之间的接触之间的时间延迟使得测试垫108上的电荷通过放电变得相等。测试垫108上的电荷沿着放电路径602通过夹具302、弹簧322和外壳308被释放到接地垫312。
图7示出了用于该两步接触夹具系统的评估设备的一个实施方案的图示。电路104的两个测试垫108先耦合到现有技术动态性能(DP)卡具702并接着耦合到“两步接触”DP卡具702。一对弹簧顶针(pogopin)704将测试垫108耦合到DP卡具702。带电平板监测仪(chargeplate monitor，CPM)706用于提供电场以模拟HGA102和DP卡具702之间的不同电压并感应电荷。具有50欧姆电阻器710的电流探头708用于测量由弹簧顶针与HGA正读取垫和负读取垫之间接触导致的瞬态电流。该50欧姆的电阻器模拟磁头悬架组件的磁性读写头电阻。由该评估产生的结果波形示于图8a至b。图8a示出了现有技术DP卡具的波形。示出了5ns和10.0mV的范围。当由CPM提供200伏特时，产生6.94mA的瞬态电流。图8b示出了“两步接触”DP卡具的波形。示出了5ns和5.0mV的范围。当由CPM提供200伏特时，无瞬态电流产生。

Claims (20)

1.一种夹紧机构，包括：
第一测试探头，与磁头悬架组件的柔性印刷电路的测试垫连接；
由耗散材料制成的测试探头外壳，用于保持所述第一测试探头；
由所述耗散材料制成的夹具，耦合到所述测试探头外壳以压住所述测试垫；以及
所述测试探头外壳内的滑块，以防止所述第一测试探头和所述测试垫之间的接触，直到所述夹具和所述测试探头外壳使得所述第一测试探头和所述测试垫之间的直流电势相等。
2.根据权利要求1所述的夹紧机构，其中所述夹具的耗散材料的表面电阻率为106至108欧姆/平方。
3.根据权利要求1所述的夹紧机构，其中所述夹具旋转运动。
4.根据权利要求1所述的夹紧机构，其中所述夹具线性运动。
5.根据权利要求1所述的夹紧机构，其中所述滑块旋转运动。
6.根据权利要求1所述的夹紧机构，其中所述滑块线性运动。
7.根据权利要求1所述的夹紧机构，进一步包括多个测试探头。
8.一种夹紧系统，包括：
第一测试探头，与磁头悬架组件的柔性印刷电路的测试垫连接；
由耗散材料制成的测试探头外壳，用于保持所述第一测试探头；
电耦合到所述第一探头的前置放大器板；
将所述测试探头外壳接地的接地垫；
支持所述前置放大器板的卡具；
由所述耗散材料制成的夹具，耦合到所述测试探头外壳以压住所述测试垫；以及
所述测试探头外壳内的滑块，以防止所述第一测试探头和所述测试垫之间的接触，直到所述夹具使得所述第一测试探头和所述测试垫之间的电势相等。
9.根据权利要求8所述的夹紧系统，其中所述夹具的耗散材料的表面电阻率为106至108欧姆/平方。
10.根据权利要求8所述的夹紧系统，其中所述夹具旋转运动，所述滑块旋转运动。
11.根据权利要求8所述的夹紧系统，其中所述夹具线性运动，所述滑块线性运动。
12.根据权利要求8所述的夹紧系统，进一步包括多个测试探头。
13.根据权利要求8所述的夹紧系统，其中所述卡具为金属，以将所述前置放大器板接地。
14.一种方法，包括：
将耗散材料形成的夹具压住磁头悬架组件的柔性印刷电路的测试垫；
防止第一测试探头与具有滑块的所述测试垫之间接触；
通过所述夹具使所述第一测试探头和所述测试垫之间的电势相等；以及
降低所述滑块以允许所述第一测试探头和所述测试垫之间的接触。
15.根据权利要求14所述的方法，其中所述夹具的耗散材料的表面电阻率为106至108欧姆/平方。
16.根据权利要求14所述的方法，进一步包括使所述夹具旋转运动。
17.根据权利要求14所述的方法，进一步包括使所述夹具线性运动。
18.根据权利要求14所述的方法，进一步包括使所述滑块旋转运动。
19.根据权利要求14所述的方法，进一步包括使所述滑块线性运动。
20.根据权利要求14所述的方法，其中多个测试探头接触多个测试垫。
CNB2004800435582A 2004-07-09 2004-07-09 磁头悬架组件上柔性印刷电路的“两步接触”夹紧机构 Expired - Fee Related CN100452551C (zh)

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PCT/CN2004/000773 WO2006005221A1 (en) 2004-07-09 2004-07-09 “2-step contact” clamping fixture for the flexible print circuit on a head gimbal assembly

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CN1985410A true CN1985410A (zh) 2007-06-20
CN100452551C CN100452551C (zh) 2009-01-14

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CN100452551C (zh) 2009-01-14

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