CN1962155A - 一种二氧化碳激光焊接装置 - Google Patents
一种二氧化碳激光焊接装置 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/041—Arrangements for thermal management for gas lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
Abstract
本发明涉及一种二氧化碳激光焊接装置,其包括一二氧化碳激光器、一控制器、一透镜系统及一载台,所述二氧化碳激光器用于产生激光,所述控制器用于控制所述激光器的运行,所述透镜系统用于将所述二氧化碳激光器产生的激光聚集到待焊接工件焊缝处,所述载台上设置有一冷却装置,焊接时,待焊接工件置于所述冷却装置上。利用上述焊接装置进行焊接所得工件焊缝处平滑,结合力强。
Description
【技术领域】
本发明涉及一种激光焊接装置,尤其涉及一种二氧化碳激光焊接装置。
【背景技术】
玻璃作为一种透明材料,广泛应用于各种计算机、消费性电子产品中,如各种显示屏中的玻璃面板。玻璃的加工过程中,经常遇到需要将两片玻璃焊接到一起的情形。
传统的焊接方法包括熔焊、钎焊等,熔焊会有较明显的焊缝,而钎焊会导入杂质。二十世纪七十年代开始应用激光进行焊接,但主要应用于焊接薄壁材料。
随着高功率二氧化碳激光器的出现,激光深熔焊接得以在产业上应用。利用激光进行深熔焊接时,高功率密度的激光使工件表面处材料蒸发形成小孔,此小孔犹如一个黑体,几乎全部吸收入射的激光能量,小孔内温度迅速升高,熔化小孔周围金属。小孔内充满在光束照射下壁体材料连续蒸发产生的高温蒸汽,小孔四壁包围着熔融金属,液态金属四周为固体材料。小孔外材料在连续流动,随光束移动,熔融的金属填充小孔移动留下的空隙并随之冷凝,形成焊缝。
上述冷凝过程中,若热量散发不均匀快速,则会导致焊缝处局部过热,最终造成焊接不良,从外观看焊缝不平滑,焊缝处结合力不足。
【发明内容】
有鉴于此,有必要提供一种焊缝平滑,焊缝处结合力强的二氧化碳激光焊接装置。
一种二氧化碳激光焊接装置,其包括一二氧化碳激光器、一控制器、一透镜系统及一载台,所述二氧化碳激光器用于产生激光,所述控制器用于控制所述激光器的运行,所述透镜系统用于将所述二氧化碳激光器产生的激光聚集到待焊接工件焊缝处,所述载台上设置有一冷却装置,焊接时,待焊接工件置于所述冷却装置上。
相对于现有技术,所述的二氧化碳焊接装置中,待焊接工件置于一冷却装置中,焊缝处的热量可快速经由所述冷却装置散发出去,无局部过热现象的发生,待焊接工件焊缝处平滑,结合力强。
【附图说明】
图1是本发明实施例的二氧化碳焊接装置示意图。
图2是二氧化碳焊接装置中的激光器示意图。
图3是图1的二氧化碳焊接装置中的冷却装置示意图。
图4是冷却装置中致冷单元示意图。
【具体实施方式】
以下将结合图示说明一种二氧化碳激光焊接装置。
请参阅图1,本发明实施例的二氧化碳激光焊接装置包括一二氧化碳激光器10、一控制器11、一透镜系统12及一载台13。图中箭头表示能量或信号的传递方向。
二氧化碳激光器10用于产生焊接所需的高能量激光束,请参阅图2,本发明实施例的二氧化碳激光焊接装置使用的二氧化碳激光器10包括一放电管20、分别设置于放电管20两端的阴极212及阳极214、设置于放电管20表面的水冷套22及设置于水冷套22外的贮气套管23。放电管20、水冷套22及贮气套管23形成一三层结构。放电管20在靠近阴极212的一端与贮气套管23相连通,在另一端通过螺旋状回气管24与贮气套管23相连通。水冷套22作为冷却系统,二氧化碳激光器10工作时,其中通冷却水,用以确保放电管20内温度,增加二氧化碳激光器10输出功率稳定性。当然,还可用其它冷却系统取代水冷套22,例如风冷,对于极端情况,如放电管中温度过高,甚至可以使用液氮等进行冷却。优选的,冷却系统与一温度控制器协同工作,所述温度控制器用于控制冷却系统。贮气套管23两端设有反射镜25,从而形成一谐振腔。阴极212用钼片或镍片做成圆筒状。
控制器11用于控制二氧化碳激光器10的运行,例如控制二氧化碳激光器10的激活、关闭及运行参数。二氧化碳激光器10运行时影响焊接品质的参数包括:脉冲能量、脉冲宽度及脉冲频率。根据实验,优选的,焊接玻璃时,二氧化碳激光器10的脉冲能量为20-100微焦,脉冲宽度为20-200微秒,重复频率为1000-10,000赫兹。
透镜系统12用于将二氧化碳激光器10产生的激光聚集成一均匀,大小适宜的光斑。使用激光进行焊接时,为避免局部过热造成焊接瑕疵,要求激光光斑具有高度均匀性,大小与实际焊缝相符,为达到此要求,优选的,透镜系统12采用透镜组。
载台13上设置有一冷却装置14,冷却装置14可为热电致冷器(ThermalElectric Cooler),请参阅图3及图4,本实施例中采用的热电致冷器包括夹于第一基板31与第二基板32间的多个热电致冷单元30。第一基板31与第二基板32均为导热绝缘材料,优选的,其可为陶瓷。热电致冷单元30包括焊接于第一铜电极331上的一P型半导体301及一焊接于第二铜电极332上的一N型半导体302,一导热元件34将P型半导体301及N型半导体302上与电极相对的一侧连接起来。P型半导体301及N型半导体302的材料可为铋碲合金。若以从N型半导体302到P型半导体301的方向向热电致冷单元30中通以电流,则热电致冷单元将从导组件34处吸热。热电致冷器中,将多个热电致冷单元中与P型半导体相连的铜电极331及与N型半导体相连的铜电极332分别焊接到一起,形成一体结构。基于上述致冷原理,因此本实施例中,第一基板31为吸热侧。
焊接时待焊接基材17置于冷却装置14上,从而焊接时待焊接工件17焊缝处的热量可迅速散去,无局部过热的情形发生,最终所得的焊缝处平滑,结合力强。
载台13可水平设置,优选的,若以其所在平面为XY面,以与XY面垂直的任一轴为Z轴,则于空间坐标系XYZ内,载台13可沿X、Y、Z方向平移,具体的,可分别安装X轴电动机,Y轴电动机及Z轴电动机,实现三个方向的平移。载台13可于空间内平移,则可调节待焊接工件17表面相对于透镜系统12焦平面的偏离量,亦即离焦量。
所谓离焦,是指透镜系统12的焦平面与工件表面不处于同一平面内,焦平面位于工件上方为正离焦,反之为负离焦。离焦量是指工件表面偏离焦产面的程度。按几何光学原理论,当正负离焦量相等时所对应平面上功率密度近似相同,但实际进行焊接时,所获得的熔池形状不同。负离焦时可获得更大的熔深。这与熔池的形成过程有关。实验表明,对工件激光加热50-200微秒时材料开始熔化,形成液相金属并出现部分汽化,形成高压蒸汽,并以极高的速度喷射。与此同时,高浓度蒸汽使液相金属运动至熔池边缘,在熔池中心形成凹陷。当负离焦时,材料内部功率密度较表面高,易形成更强的熔化及汽化,使光能向材料更深处传递。实际应用中,当要求熔深较大时,采用负离焦;焊接薄材料时,宜用正离焦。
前已述及,焊接时会形成熔池,焊接时,熔池的状态决定最终的焊接品质,因此对熔池的状态进行监测并实时改变激光器的发射参数对提高焊接品质实为必要。
优选的,二氧化碳激光焊接装置1还包括一检测器15及一信号处理器16。检测器15用于检测熔池状态,信号处理器16将检测器15检测到的信号进行处理,并根据处理结果向控制器11发送是否改变二氧化碳激光器10发射参数的指令。焊接时熔池中可用于检测的信号包括可听声信号、超声波信号、紫外光辐射、可见光、红外辐射、电信号与机器视觉。根据检测到的信号,信号处理器16计算出熔池所处的状态,必要时向控制器11发送指令,改变二氧化碳激光器10的发射参数如脉冲能量、脉冲宽度及脉冲频率。
使用上述二氧化碳焊接装置的焊接方法如下:
请参阅图1,将两待焊接工件17置于冷却装置14上,冷却装置14固定于载台13上;根据待焊接工件17的物性计算出二氧化碳激光器10适宜的参数,调节透镜系统12与载台13的位置,使二氧化碳激光器10发射的激光束可对准两待焊接工件17的待焊接处,开动二氧化碳激光器10,以一定速度沿水平方向移动载台13,以使二氧化碳激光器10发射出的激光束熔化待焊处的材料,完成焊接,激光束离开焊缝后,藉由冷却装置14的帮助,焊缝处的热量快速,均匀散发出来,焊缝处无局部过热的现象,最终所得的焊缝具有很高的光滑度,内部应力小,结合强度高。
Claims (9)
1.一种二氧化碳激光焊接装置,其包括一二氧化碳激光器、一控制器、一透镜系统及一载台,所述二氧化碳激光器用于产生激光,所述控制器用于控制所述激光器的运行,所述透镜系统用于将所述二氧化碳激光器产生的激光聚集到待焊接工件焊缝处,所述载台上设置有一冷却装置,焊接时,待焊接工件置于所述冷却装置上。
2.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述冷却装置为热电致冷器,所述热电致冷器包括一吸热侧,焊接时待焊接工件置于所述吸热侧上。
3.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述热电致冷器包括多个热电致冷单元,所述热电致冷单元中包括一P型半导体及一N型半导体,所述P型半导体与所述N型半导体的材料可为铋碲合金。
4.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述激光焊接装置进一步包括一检测器,用于焊接时焊缝处各制程参数;及一信号处理器,用于将对所述检测器检测到的信号进行处理,并根据处理结果向所述控制器发送是否改变二氧化碳激光器发射参数的指令。
5.如权利要求4项所述的二氧化碳激光焊接装置,其特征在于所述检测器检测的信号包括可听声信号、超声波信号、紫外光辐射、可见光、红外辐射、电信号与机器视觉。
6.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述载台可于空间内平移,藉此可使激光对准待焊接工件不同位置,还可改变所述激光器发射出的激光束相对于待焊接工件表面的离焦量。
7.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述二氧化碳激光器的脉冲能量为20-100微焦,脉冲宽度20-200微秒,重复频率1000-10,000赫兹。
8.如权利要求1项所述的二氧化碳激光焊接装置,其特征在于所述二氧化碳激光器中包括一水冷系统。
9.如权利要求8项所述的二氧化碳激光焊接装置,其特征在于所述二氧化碳激光器中包括一温度控制器。
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US11/309,606 US20070104243A1 (en) | 2005-11-10 | 2006-08-30 | Laser apparatus for treating workpiece |
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CN104253370A (zh) * | 2013-06-25 | 2014-12-31 | 通快激光两合公司 | 固体激光组件 |
CN111136382A (zh) * | 2019-12-29 | 2020-05-12 | 北京航空航天大学合肥创新研究院 | 一种基于声波监测的激光制造过程调控方法 |
CN114523193A (zh) * | 2022-04-24 | 2022-05-24 | 中国工程物理研究院材料研究所 | 一种激光强化加工装置 |
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CN114603249A (zh) | 2014-08-28 | 2022-06-10 | Ipg光子公司 | 用于切割和切割后加工硬质电介质材料的多激光器系统和方法 |
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CN101569961B (zh) * | 2009-03-06 | 2011-08-03 | 深圳市大族激光科技股份有限公司 | 一种使两块金属薄板对接的激光焊接方法 |
CN104253370A (zh) * | 2013-06-25 | 2014-12-31 | 通快激光两合公司 | 固体激光组件 |
CN111136382A (zh) * | 2019-12-29 | 2020-05-12 | 北京航空航天大学合肥创新研究院 | 一种基于声波监测的激光制造过程调控方法 |
CN114523193A (zh) * | 2022-04-24 | 2022-05-24 | 中国工程物理研究院材料研究所 | 一种激光强化加工装置 |
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