CN1960605A - Reinforced bonding method and bonding method between shielding layer of print circuit board and supporting material - Google Patents
Reinforced bonding method and bonding method between shielding layer of print circuit board and supporting material Download PDFInfo
- Publication number
- CN1960605A CN1960605A CN 200510022017 CN200510022017A CN1960605A CN 1960605 A CN1960605 A CN 1960605A CN 200510022017 CN200510022017 CN 200510022017 CN 200510022017 A CN200510022017 A CN 200510022017A CN 1960605 A CN1960605 A CN 1960605A
- Authority
- CN
- China
- Prior art keywords
- silver foil
- supporting material
- plasma etching
- bonding method
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 40
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000001020 plasma etching Methods 0.000 claims abstract description 16
- 230000003746 surface roughness Effects 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 abstract 3
- 238000007731 hot pressing Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- 230000002787 reinforcement Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007719 peel strength test Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The method comprises: before the strength enhancing materials joints with the silver foil shielding layer, a plasma etching process is used to make surface treatment for the silver foil in order to increase its surface roughness, and by rough surface, the binding force between silver foil and strength enhancing materials will be increased, the peal strength between the silver foil and strength enhancing materials will be also increased.
Description
[technical field]
The present invention relates to strengthen in associated methods, the especially flexible print circuit board between the silver foil shielding material and supporting material in the wiring board a kind of method of the peel strength that combines between silver foil shielding material and the supporting material.
[background technology]
As everyone knows, various electronic equipments are being realized miniaturization and light-weighted while, to multifunction and high speed development.When work, can produce and launch the electromagnetic wave of different frequency and form cross interference.Therefore the effective measures of anti-electromagnetic wave interference are to shield to electronic equipment.This not only can prevent and control the interference of outside incident electromagnetic wave to the electronic equipment of working, and can also stop these equipment launching electromagnetic wave when work to remove to disturb the various electronic equipments of other running status effectively.In this case, the flexible print circuit board (FPC) that is used for electronic equipment assembling also requires to take the electromagnetic wave shielding measure more and more.
At present, the method for the electromagnetic wave shielding of FPC has:
The Copper Foil mode realizes electromagnetic shielding method to the FPC product by hot pressing Copper Foil on product, and this method has shield effectiveness and bending performance preferably preferably, but thickness is big, need be through repeatedly hot pressing, and the cycle is long, the cost height.
Silver slurry mode evenly apply one deck conduction seal coat by modes such as printings on the surface of product, such as the silver slurry is realized the electromagnetic wave shielding to the FPC product.It is low that this method has a cost, the advantage that bending performance is good, but shield effectiveness is relatively poor, easily comes off, and needs technologies such as printing and curing, and the cycle is long.
The silver foil mode; a kind of novel shielding material-silver foil of Japan TATSUTA company exploitation; its structure as shown in Figure 1; form by protective film 1, insulating barrier 2, metal foil layer 3, anisotropy conductiving glue layer 4, release film 5; have excellent shield effectiveness and bending performance; the number of times of pressing simultaneously is few, the cycle short, and the production efficiency height extensively adopts in flexible print circuit board in recent years.
Along with the miniaturization of electronic product, various electronic devices and components also all develop towards miniaturization, miniaturization direction.The flexible print circuit board that carries various electronic devices and components is no exception certainly, towards miniaturization, densification, the development of multifunction aspect.Need to carry various electronic devices and components such as IC, resistance, electric capacity in the flexible print circuit board.For the ease of the assembling of components and parts, need have certain intensity and rigidity for the insertion portion of flexible circuit board, this just requires at these part lamination reinforcement materials of flexible circuit board.Supporting material commonly used has: glass cloth or glass fibre are the epoxy laminate of reinforcing material, as say FR4, heat stable resin moulding product such as PI stiffening plate, aluminium sheet, corrosion resistant plate, perhaps use mould these materials to be struck out the composite reinforcing material of three-dimensional shape.
Be the laminating type that example is introduced supporting material below with the silver foil:
As shown in Figure 2, earlier heat curing-type semi-curing glue 7 is affixed on any one side of stiffening plate 6, lamination sticks on the stiffening plate it at a certain temperature, can take release film 8 off is standard, be processed into then and require the size supporting material, during use release film is taken off, supporting material is affixed on product or the silver foil assigned address carries out hot pressing.But in the pressing process, remove the blue protective film 1 on silver foil surface after, also have the extremely thin transparent diaphragm of one deck very smooth above the silver foil, make it not realize combining closely with supporting material, peel strength does not reach design, instructions for use.
[summary of the invention]
Purpose of the present invention overcomes the deficiencies in the prior art exactly, provides a kind of simple and feasible, obvious results shielding layer of print circuit board to strengthen method and the associated methods that combines with supporting material.
For achieving the above object, the present invention proposes to strengthen between the screen and supporting material in a kind of printed substrate the method that combines, it is characterized in that: before supporting material and the applying of silver foil screen, adopt plasma etching process that silver foil is carried out surface treatment, its surface roughness, surface active groups are increased, combining when strengthening silver foil with the supporting material pressing.
Described plasma etching process condition is as follows: O
2: more than the 300CC/min; CF
4: more than the 300CC/min; Time: more than 3 minutes; Radio-frequency power: 1500～2500W.
Simultaneously, the present invention proposes the associated methods between the screen and supporting material in a kind of printed substrate, comprise the steps: A) remove the silver foil release film, with silver foil screen and printed substrate hot binding; B) remove the silver foil diaphragm, plasma etching is carried out on the silver foil surface; C) with supporting material and etched the hot binding of silver foil of processing through plasma etching.
Described supporting material is formed through false applying of lamination by prepreg and stiffening plate.
Described plasma etching process condition is as follows: O
2: more than the 300CC/min; CF
4: more than the 300CC/min; Time: more than 3 minutes; Radio-frequency power: 1500～2500W.
Owing to adopted above scheme, gas molecule such as CF
4And O
2, destroying down in " ionization " effect that is being subjected to powerful electric power, generation utmost point polyion free radical (Free Radicals) with accessory substance, is added the mixture that numerous particle such as original uncracked molecule is formed.When in the plasma etching cavity, being full of the grain (Species) of various strong activity, its various ions or free radical or accessory substance etc., when not destroying its material property, structure, sheet material is produced bombardment (Bombardment) effect, and also can produce the variation of chemistry and physics aspect respectively to various nonmetallic materials.Through the silver foil of plasma etch process, surface roughness increases on the one hand, and surface active groups increases on the other hand, thus with the pressing process of supporting material in, the peel strength between silver foil and the supporting material increases substantially, and reaches designing requirement fully.
This method technology of the present invention is simple and easy to realize, easy to operate, suitable volume production.
[description of drawings]
The structural representation of Fig. 1, silver foil,
The supporting material structure chart that Fig. 2, heat curing-type prepreg combine with stiffening plate,
Fig. 3, product structure schematic diagram,
Test structure figure is peeled off in Fig. 4, reinforcement,
Wherein 1, blue protective film, 2, insulating barrier, 3, metal silver foil layer 4, anisotropy conductiving glue layer, 5, release film, 6, stiffening plate, 7, semi-curing glue, 8, release film, 9, FPC, 10, silver foil.
[embodiment]
The following example is to further explanation of the present invention and explanation.
Embodiment one: please in conjunction with Fig. 1, Fig. 2, shown in Figure 3, a FPC product surface applying silver foil (adopting the Japanese TATSUTA SF-PC1000 of company) shields, the silver foil surface release film 5 that processes profile is torn, itself and product 9 are combined closely at 160 ℃ of temperature, pressure 250PSI vacuum hotpressing 100min.Tear the blue diaphragm 1 on silver foil surface after the hot pressing, carry out plasma etching silver foil surface (coming down to the insulating barrier 2 of silver foil is carried out alligatoring) carried out alligatoring, the following (O of plasma process condition
2: 325CC/min; CF
4: 325CC/min; Time: 5 minutes; Radio-frequency power: 2000W), the release film of prepreg 7 (adopting platform rainbow BS-25) one side is torn, fit on the stiffening plate and carrying out becoming supporting material after lamination is fitted stiffening plate 6 (surging FR-4 is built in employing) and prepreg 7 vacations under 120 ℃ with small-sized laminating machine, be processed into the size that needs, prepreg another side release film 8 is torn, and supporting material is affixed on the place's hot pressing of product silver foil reinforcement applying mark line.As shown in Figure 4, the good product of pressing is gone up supporting material that test is combined into by stiffening plate 6 and prepreg 7 and the peel strength between the silver foil 10 at 180 degree peel strength testers (adopting the World Trusu Technology FL-X90 of company).Test result is listed table 1 in.
Embodiment two: please in conjunction with Fig. 1, Fig. 2, shown in Figure 3, a FPC product surface applying silver foil (adopting the Japanese TATSUTA SF-PC1000 of company) shields, the silver foil surface release film 5 that processes profile is torn, itself and product are combined closely at 160 ℃ of temperature, pressure 250PSI vacuum hotpressing 100min.Tear the blue diaphragm 1 on silver foil surface after the hot pressing, carry out plasma etching alligatoring is carried out on the silver foil surface, the following (O of plasma process condition
2: 375CC/min; CF
4: 375CC/min; Time: 3 minutes; Radio-frequency power: 2000W), prepreg 7 (adopt the FR1500 of Du Pont) directly fitted on the stiffening plate 6 with the fast press of vacuum becomes supporting material after pressing 30S under the condition of 80 degree 10kgf makes stiffening plate 6 (surging FR-4 is built in employing) and prepreg 7 false applyings, be processed into the size that needs, the centrifugal film 8 of prepreg another side is torn, and reinforcement is affixed on the place's hot pressing of product silver foil reinforcement applying mark line.As shown in Figure 4, the good product of pressing is gone up supporting material that test is combined into by stiffening plate 6 and prepreg 7 and the peel strength between the silver foil 10 at 180 degree peel strength testers (the World Trusu Technology FL-X90 of company).Test result is listed table 1 in.
Embodiment three: with the difference of embodiment one be: the radio-frequency power of the plasma etching process that this is routine is 1500W, and be 8 minutes process time, and test result is as shown in table 1.
Embodiment four: with the difference of embodiment one be: the radio-frequency power of the plasma etching process that this is routine is 1800W, and be 5 minutes process time, and test result is as shown in table 1.
Comparative example: a FPC product surface applying silver foil (the Japanese TATSUTA SF-PC1000 of company) shields, and the silver foil surface release film that processes profile is torn, and at 160 ℃ of temperature, pressure 250PSI vacuum hotpressing 100min itself and product is combined closely.Tear the blue diaphragm on silver foil surface after the hot pressing; the centrifugal paper of prepreg (adopting platform rainbow BS-25) one side is torn; fit on the stiffening plate and carrying out becoming supporting material after lamination makes the false applying of stiffening plate (surging FR-4 is built in employing) and prepreg under 120 ℃ the temperature with small-sized laminating machine; be processed into the size that needs; the centrifugal film of prepreg another side is torn, and reinforcement is affixed on the place's hot pressing of product silver foil reinforcement applying mark line.The product that pressing is good is gone up the peel strength of testing between reinforcement and the silver foil at 180 degree peel strength testers (the World Trusu Technology FL-X90 of company).Test result is listed table 1 in.Test result as table 1 shows that surface treated product reinforcing peel strength increases substantially, and reaches designing requirement fully.
Table 1, stiffening plate and silver foil peel strength test result
| Scheme | Peel strength test result (N/CM) | ||||
| Embodiment 1 | 9.8 | 11.2 | 12.4 | 20.1 | 13.8 |
| Embodiment 2 | 10.9 | 12.1 | 16.7 | 12.3 | 17.8 |
| | 9.4 | 8.9 | 10.0 | 12.2 | 12.6 |
| Embodiment 4 | 7.8 | 9.6 | 8.7 | 11.0 | 9.8 |
| Comparative example | 1.8 | 1.5 | 1.4 | 1.8 | 2.9 |
Claims (5)
1, strengthens the method that combines in a kind of printed substrate between screen and the supporting material, it is characterized in that: before supporting material and the applying of silver foil screen, adopt plasma etching process that silver foil is carried out surface treatment, its surface roughness, surface active groups are increased, combining when strengthening silver foil with the supporting material pressing.
2, the method for claim 1 is characterized in that: described plasma etching process condition is as follows: O
2: more than the 300CC/min; CF
4: more than the 300CC/min; Time: more than 3 minutes; Radio-frequency power: 1500～2500W.
3, the associated methods between screen and the supporting material in a kind of printed substrate comprises the steps: A) remove the silver foil release film, with silver foil screen and printed substrate hot binding; B) remove the silver foil diaphragm, plasma etching is carried out on the silver foil surface; C) with supporting material and etched the hot binding of silver foil of processing through plasma etching.
4, method as claimed in claim 3 is characterized in that: described supporting material is formed through false applying of lamination by prepreg and stiffening plate.
5, as claim 3 or 4 described methods, it is characterized in that: described plasma etching process condition is as follows: O
2: more than the 300CC/min; CF
4: more than the 300CC/min; Time: more than 3 minutes; Radio-frequency power: 1500～2500W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100220178A CN100505988C (en) | 2005-11-01 | 2005-11-01 | Bonding method between shielding layer of print circuit board and supporting material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100220178A CN100505988C (en) | 2005-11-01 | 2005-11-01 | Bonding method between shielding layer of print circuit board and supporting material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1960605A true CN1960605A (en) | 2007-05-09 |
| CN100505988C CN100505988C (en) | 2009-06-24 |
Family
ID=38072033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100220178A Active CN100505988C (en) | 2005-11-01 | 2005-11-01 | Bonding method between shielding layer of print circuit board and supporting material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100505988C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437358B (en) * | 2007-11-14 | 2010-04-14 | 昆山雅森电子材料科技有限公司 | Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| CN101868118A (en) * | 2010-05-28 | 2010-10-20 | 珠海国能电力科技发展有限公司 | High-frequency circuit substrate and production method thereof |
| CN101472398B (en) * | 2007-12-28 | 2011-07-06 | 比亚迪股份有限公司 | Multilayer flexible printed circuit board and method of manufacturing the same |
| CN101772271B (en) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | Method for single-sided lamination reinforcement of flexible printed circuit board |
| CN104582248A (en) * | 2014-12-23 | 2015-04-29 | 广东生益科技股份有限公司 | FR4 reinforcement plate production method and FPC (flexible printed circuit) reinforcement method |
| WO2015169234A1 (en) * | 2014-05-09 | 2015-11-12 | 武汉芯宝科技有限公司 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
| CN106030770A (en) * | 2014-02-27 | 2016-10-12 | 株式会社电装 | Resin molded article, and manufacturing method for same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6629348B2 (en) * | 2001-05-01 | 2003-10-07 | Oak-Mitsui, Inc. | Substrate adhesion enhancement to film |
-
2005
- 2005-11-01 CN CNB2005100220178A patent/CN100505988C/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437358B (en) * | 2007-11-14 | 2010-04-14 | 昆山雅森电子材料科技有限公司 | Protection film for printed circuit board and procedure for processing circuit board using the protection film |
| CN101472398B (en) * | 2007-12-28 | 2011-07-06 | 比亚迪股份有限公司 | Multilayer flexible printed circuit board and method of manufacturing the same |
| CN101772271B (en) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | Method for single-sided lamination reinforcement of flexible printed circuit board |
| CN101868118A (en) * | 2010-05-28 | 2010-10-20 | 珠海国能电力科技发展有限公司 | High-frequency circuit substrate and production method thereof |
| CN101868118B (en) * | 2010-05-28 | 2012-02-01 | 珠海国能电力科技发展有限公司 | High-frequency circuit substrate and production method thereof |
| CN106030770A (en) * | 2014-02-27 | 2016-10-12 | 株式会社电装 | Resin molded article, and manufacturing method for same |
| CN106030770B (en) * | 2014-02-27 | 2019-06-18 | 株式会社电装 | Resin-formed body and its manufacturing method |
| US10395947B2 (en) | 2014-02-27 | 2019-08-27 | Denso Corporation | Manufacturing method of a resin molded article |
| WO2015169234A1 (en) * | 2014-05-09 | 2015-11-12 | 武汉芯宝科技有限公司 | Circuit board cross-band veneer with function of absorbing instantaneous high-voltage electric pulse energy and manufacturing method therefor |
| CN104582248A (en) * | 2014-12-23 | 2015-04-29 | 广东生益科技股份有限公司 | FR4 reinforcement plate production method and FPC (flexible printed circuit) reinforcement method |
| CN104582248B (en) * | 2014-12-23 | 2017-11-03 | 广东生益科技股份有限公司 | A kind of production method of FR4 stiffening plates and FPC reinforcement |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100505988C (en) | 2009-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100505988C (en) | Bonding method between shielding layer of print circuit board and supporting material | |
| CN1265688C (en) | Carrier-attached copper foil and printed board using copper foil | |
| CN100596257C (en) | Method for preparing flexibility printed circuit board using PET as base material | |
| CN1809251A (en) | Method of fabricating rigid flexible printed circuit board | |
| JPH10512099A (en) | Manufacture of multilayer rigid and flexible composite printed circuit boards | |
| CN1867226A (en) | Method of manufacturing wiring circuit board | |
| CN102673053A (en) | Copper-clad plate, printed circuit plate and manufacturing method thereof | |
| US4810326A (en) | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | |
| JP2001177224A (en) | Microwave circuit substrate and manufacturing method | |
| JP2003071937A (en) | Laminated body, method for manufacturing it, and multi- layer circuit board | |
| JP2010144081A (en) | Adhesive composition, and adhesive sheet and cover-lay film, using the same | |
| CN1229002C (en) | Circuit formed substrate and method of manufacturing circuit formed substrate | |
| CN103687331A (en) | Method for improving binding force of rigid-flexible combination board flexible board covering film | |
| CN1578588A (en) | Flexible wiring plate and producing method thereof | |
| TW462922B (en) | Copper-clad laminate, multilayer copper-clad laminate and process for producing the same | |
| JPH07232405A (en) | Production of metal foil clad laminated sheet | |
| JP3227874B2 (en) | Manufacturing method of laminated board | |
| CN107466165A (en) | A kind of method of the FR4 plate reinforcement of flexible PCB | |
| JP2508389B2 (en) | Laminated board and manufacturing method thereof | |
| CN117677062A (en) | Flexible single panel and manufacturing method thereof | |
| JP2000252594A (en) | Double-sided printed-wiring board | |
| JP2002273824A (en) | Copper foil laminate with adhesive and its manufacturing method | |
| CN106364070B (en) | A kind of high intensity copper-clad plate of symmetrical folded structure and preparation method thereof | |
| JPH06237055A (en) | Manufacture of circuit board | |
| JP2001177199A (en) | Laminated board for printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Reinforced bonding method and bonding method between shielding layer of print circuit board and supporting material License type: Exclusive license Record date: 20080504 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150901 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150901 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |