CN1960013A

CN1960013A - Method for fabricating luminous body with two poles

Info

Publication number: CN1960013A
Application number: CNA2005101176149A
Authority: CN
Inventors: 李明顺; 孙平如
Original assignee: LIZHOU SCIENCE-TECHNOLOGY Co Ltd
Current assignee: LIZHOU SCIENCE-TECHNOLOGY Co Ltd
Priority date: 2005-11-02
Filing date: 2005-11-02
Publication date: 2007-05-09

Abstract

Using glue of fixing crystal emplaces luminous chip to load supporting part in drop pit shape setup on carrier in advance. Also, conducting circuits with different electrodes are setup on basal plate on circumference of the load supporting part. Using gold thread connects luminous chip to each conducting circuit. Then, fluorescence glue mixed from fluorescence powder and colloid covers the load supporting part by using jet printing method. Finally, transparent outer cover is placed on the fluorescence glue in order to form light emitting diode. The jet printing method quickens productive speed, and raises producing capacity greatly. Moreover, jet-printing region can be controlled accurately so that fluorescence glue covers the load supporting part evenly.

Description

The manufacture method of light-emittingdiode

Technical field

The present invention relates to the technology of the packaging efficiency of light-emittingdiode, aim to provide a kind of light-emittingdiode manufacture method that can evenly cover fluorescent glue and promote production capacity.

Background technology

As shown in Figure 1, it is essential structure schematic diagram for a kind of light-emittingdiode, this light-emittingdiode is to utilize crystal-bonding adhesive 40 that luminescence chip 10 fixations are preset with in the middle of the carrier 20 of pit shape supporting part 22 one, and utilize gold thread 30 to constitute the binding of this luminescence chip 10 and electrode tip 21, and utilize fluorescent glue 50 that luminescence chip 10 is coated with fluorescence powdered material 51, with under luminescence chip 10 energising effects, make the fluorescence powdered material 51 of the light source activation fluorescent glue 50 of luminescence chip 10, use forming the photochromic of expection.

Wherein, the coverage mode of this fluorescent glue 50 mostly is a glue greatly, draws glue and die casting mode, its mid point glue with draw the glue mode, be with fluorescence powdered material with after colloid mixes mutually with certain proportion, flow in the plastic pin tube, utilize point gum machine and X-Y displacement mechanism to do point point then or lines draw the glue mode, the colloid that will contain fluorescence powdered material is coated on the luminescence chip, its fluorescent arogel amount is difficult for accurately control, easily causes to form the photochromic of expection, reaches problems such as the wayward easy off normal in colloid position.

And its production method of die casting is with after die casting fully mixes according to certain proportion with the glue cake with fluorescence powdered material, again with the synthetic former die casting of both pressings glue cake size, utilize the glue cake that die casting machine and mould will contain fluorescence powdered material to form on the luminescence chip then, though wherein can evenly control the glue amount, but fluorescence powdered material if content is higher or the colloid thinner thickness, volume that contain fluorescence powdered material hour, then easily take place to produce and be difficult for the problem that promptly causes carrier and colloid to peel off.

Summary of the invention

In view of this, the manufacture method of light-emittingdiode of the present invention is about to less fluorescence powdered material and the colloid of particle and is mixed into fluorescent glue, and utilizes the spray printing mode being covered in the peripheral position of luminescence chip in this fluorescent glue.

Because, utilize the mode of nozzle spray printing fluorescent glue, not only faster production can significantly promote its production capacity, and may command jet size and position more do not have die casting mode stress problem, the problem that causes carrier and colloid to peel off with control glue amount.

Description of drawings

Fig. 1 is a structural representation of commonly using light-emittingdiode;

Fig. 2 is the manufacturing flow chart of light-emittingdiode among the present invention;

Fig. 3 is the structural representation of white luminous diode among the present invention;

Fig. 4 is for utilizing the structural representation of nozzle spray printing fluorescent glue among the present invention;

Fig. 5 is the structural perspective of light-emittingdiode among the present invention.

[figure number explanation]

10 luminescence chips, 40 crystal-bonding adhesives

20 carriers, 50 fluorescent glue

21 electrode tips, 51 fluorescence powdered materials

22 supporting parts, 60 nozzles

30 gold threads, 70 transparent housings

Embodiment

For the clear structure of the present invention of your auditor is formed, and the overall operation mode, cooperate graphic being described as follows now:

The manufacture method of light-emittingdiode of the present invention, the manufacture method of its whole light-emittingdiode and flow process are as shown in Figures 2 and 3, provide a carrier 20 with pit shape supporting part 22, and in carrier 20, be covered with crystal-bonding adhesive 40, utilize crystal-bonding adhesive 40 with luminescence chip 10 fixations in the middle of carrier 20, and utilize gold thread 30 to constitute the binding of luminescence chip 10 and electrode tip 21, and utilize fluorescent glue 50 that luminescence chip 10 is coated with fluorescence powdered material 51, with under luminescence chip 10 energising effects, make the fluorescence powdered material 51 of the light source activation fluorescent glue 50 of luminescence chip 10, use forming the photochromic of expection.

During concrete enforcement, luminescence chip 10 is positioned in the supporting part 22, and is fixed in the above-mentioned crystal-bonding adhesive 40, and with luminescence chip 10 and crystal-bonding adhesive 40 roasting closing; Utilize gold thread 30 to constitute the overlap joint of luminescence chip 10 and electrode tip 21; The fluorescence powdered material 51 that particle is less blendes together with colloid and is fluorescent glue 50, utilizes nozzle 60 to spray towards the position more than luminescence chip 10 peripheries, please consults shown in Figure 4 simultaneously; And, with the roasting step such as close of fluorescent glue; Utilize transparent housing 70 with the encapsulation of the white luminous diode of integral body at last again, so that associated components is wherein formed the protection effect, as shown in Figure 5.

Wherein, the visual desire of these nozzle 60 pore sizes covering part area size and adjusting, and can be by Position Control nozzle 60 positions and the glue amount number of luminescence chip 10, and may command jet size and position are with control glue amount, more there is not die casting mode stress problem, the problem that causes carrier and colloid to peel off.

Certainly, it is photochromic and material that change luminescence chip and fluorescence powdered material is formed that also visual expection forms, form near going out of white light effect photochromicly as desire, can use the blue-light-emitting chip, and utilize fluorescent glue that the blue-light-emitting chip is coated with yellow fluorescence powdered material; Perhaps use the blue-light-emitting chip equally, and be mixed with redness, green two kinds of fluorescence powdered materials in the middle of the fluorescent glue, the white luminous diode of this type is to use the blue-light-emitting chip to excite and is blended in fluorescent glue central red fluorescent powder material and green fluorescent powder material, combine utilize to produce red, green double-colored blue light with the blue-light-emitting chip, and photochromic near white light of reaching three primary colors mixed light effect generation high color rendering.

As mentioned above, the invention provides a preferable feasible light-emittingdiode manufacture method, so offer the application of novel patent in accordance with the law; Yet, above implementation and graphic shown in, be this creation preferred embodiment, be not to limit to this creation with this, be with, approximate, identical with the structure of this creation, device, feature etc. such as, all should belong to this creation found purpose and claim in.

Claims

1, a kind of manufacture method of light-emittingdiode includes the following step:

A. provide one to have the carrier of pit shape supporting part, and in carrier, be covered with crystal-bonding adhesive;

B. luminescence chip is fixed in the above-mentioned crystal-bonding adhesive, and closes crystal-bonding adhesive is roasting;

C. carry out the overlap joint of luminescence chip and electrode tip;

D. fluorescence powdered material and colloid are mixed into fluorescent glue, and utilize the spray printing mode at the position that is covered in more than the luminescence chip periphery in this fluorescent glue;

E. at last with the roasting processing procedure of promptly finishing light-emittingdiode that closes of fluorescent glue.

2, the manufacture method of light-emittingdiode according to claim 1, wherein, this spray printing mode is to utilize nozzle to spray towards the position more than the luminescence chip periphery in fluorescent glue.

3, the manufacture method of light-emittingdiode according to claim 1, wherein, this fluorescent glue is to utilize less fluorescence powdered material of particle and colloid to mix.

4, as the manufacture method of light-emittingdiode as described in the claim 1, wherein, be to utilize gold thread to constitute the overlap joint of blue-light-emitting chip and electrode tip.

5, the manufacture method of light-emittingdiode according to claim 1 wherein, is to utilize transparent housing that whole light-emittingdiode is encapsulated.