CN1947228A - Peeling device and peeling method - Google Patents
Peeling device and peeling method Download PDFInfo
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- CN1947228A CN1947228A CNA2005800134363A CN200580013436A CN1947228A CN 1947228 A CN1947228 A CN 1947228A CN A2005800134363 A CNA2005800134363 A CN A2005800134363A CN 200580013436 A CN200580013436 A CN 200580013436A CN 1947228 A CN1947228 A CN 1947228A
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- sheet
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- band
- stripping
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- 239000004065 semiconductor Substances 0.000 claims description 19
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 239000007767 bonding agent Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
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- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 102000020897 Formins Human genes 0.000 description 1
- 108091022623 Formins Proteins 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A peeling apparatus (10) is provided with a peeling table (11) for supporting a wafer (W) whereupon a sheet (S) is adhered, and a sheet peeling unit (12) arranged on an upper part of the peeling table (11). In the peeling apparatus, the sheet peeling unit (12) and the peeling table (11) are relatively shifted and the sheet (S) can be peeled. The peeling apparatus is also provided with a supporting roll (20) for a peeling tape (PT), first and second rolls (30, 31) for adhering the peeling tape (PT) on the surface of the sheet (S), and a take-up roll (21) for the peeling tape (PT). Peeling is performed under a condition where an initial peeling angle (alpha1) is formed by bending the peeling tape (PT) in a space (C) formed between the second roll (31) and the sheet (S), and then, the sheet (S) is peeled at a subsequent peeling angle (alpha2) corresponding to a diameter of the second roll (31).
Description
Technical field
The present invention relates to sheet stripping off device and stripping means, particularly be suitable for peeling off the sheet stripping off device and the stripping means of the screening glass on the circuit face that is secured at semiconductor wafer.
Background technology
In the prior art, when the attrition process that semiconductor wafer (following is called " wafer ") is changed as thin as a wafer, paste screening glass in the circuit face side usually, this screening glass will be stripped from after the assembly process of hoop truss etc. is finished.When peeling off screening glass, because wafer is extremely thin, so pay particular attention to.
[patent documentation 1] spy opens the 2001-319906 communique
[patent documentation 2] spy opens the 2000-91281 communique
But; for example image pattern 9 is shown such; wafer W is formed with the protuberance 100 that is called solder bump (to call " projection " in the following text) of the circuit face side energising usefulness that guarantees chip in the circuit face side; on such wafer W, paste screening glass S; and with this wafer W as peeling off object; at this moment; in the stripping off device and stripping means of patent documentation; because initial stage peel angle α 1 is the angle near 180 degree; peel off so can not apply with stress ground to wafer W; and on the other hand, under the state that initial stage peel angle α 1 is kept to the final, peel off screening glass S.Thereby, the problem of the bonding agent 101 of residual screening glass S between protuberance 100 has appearred.
In addition, in disclosed stripping off device of above-mentioned patent documentation, give at the roller of peeling off usefulness to peel off with band while rotating to paste under the state of wafer face pressing force, peel off while pushing wafer face equally then, so act on the peel resistance and the pressing force of sheet simultaneously, this becomes the load that imposes on wafer, has the problem that causes this damage to wafers.
Summary of the invention
The present invention is conceived to the problems referred to above and puts forward, its objective is the sheet stripping off device and the stripping means that provide such, promptly, can be when stripping film, the special peel angle of peeling off the initial stage that fractures on the object etc. at wafer etc. of setting easily, keep the later stage peel angle stripping film littler, thereby can avoid remaining bonding agent under the situation that protuberances such as projection exist than the initial stage peel angle thereafter.
Another object of the present invention provides such sheet stripping off device and stripping means, that is, can be when stripping film, the load that suppresses wafer etc. is peeled off object is peeled off sheet on the object for Min..
For achieving the above object, stripping off device of the present invention has: what supporting was pasted with sheet peels off peeling off with platform and being arranged to and can peeling off the unit along the sheet that the face of peeling off object relatively moves of object, can be by peel off the peeling off with being with and sheet is bonding and reel and peel off this sheet of unit output from this sheet; Wherein, the described unit of peeling off has: peel off with the band supply unit, peel off with tape wrapping portion, reach the stripping head between above-mentioned supply unit and coiling portion; Described stripping head can make to peel off with band and make direction of delaminate along the initial stage peel angle of peeling off the face of object to the direction bending and the formation of upset at the described end position of peeling off object, peels off described boundary belt and form the later stage peel angle littler than the initial stage peel angle by peeling off of the described bending of reeling with band.
In addition, stripping off device of the present invention has: the supporting be pasted with sheet peel off object peel off with platform, and the setting can peel off the unit along the sheet that the above-mentioned face of peeling off object relatively moves; Can be by bonding and reel and peel off this sheet with band and sheet peel off peeling off of unit output from this sheet; Wherein, peel off the unit and have for described: peel off with the band supply unit, make peel off with the first bonding roller of the band and the face of sheet, the bonding position of this first roller and sheet and this sheet between form the gap second roller, reach the described coiling portion that is with that uses of peeling off; Can make peeling off between described first roller and second roller, between second roller and sheet, make to peel off to be bent to form the initial stage peel angle to the direction of upset with band with the band partial relaxation; Can be after with described initial stage peel angle stripping film, with described second roller with the later stage peel angle stripping film littler than the initial stage peel angle.
At described stripping off device, the described object of peeling off is a semiconductor wafer, and described is the screening glass of the face of protection semiconductor wafer.
In addition, stripping off device of the present invention has peeling off with platform and sheet of support semi-conductor wafers and peels off the unit; This semiconductor wafer has projection in circuit face, simultaneously, is pasted with sheet in this circuit face; This sheet is peeled off the unit and is arranged on the top that this peels off the usefulness platform, simultaneously, can relatively move along the sheet stickup face of described semiconductor wafer; Can be by bonding and reel and peel off this sheet with band and sheet peel off peeling off of unit output from this sheet; Wherein, peel off the unit and have for described: peel off with the band supply unit, make peel off with the first bonding roller of the band and the face of sheet, the bonding position of this first roller and sheet and this sheet between form the gap second roller, reach the described coiling portion that is with that uses of peeling off; Can make peeling off between described first roller and second roller, between second roller and sheet, make to peel off to be bent to form the initial stage peel angle to the direction of upset with band with the band partial relaxation; Can be after with described initial stage peel angle stripping film, with described second roller with the later stage peel angle stripping film littler than the initial stage peel angle.
Also have described stripping head of adjustment and the described distance adjusting system of peeling off with the relative distance of platform at stripping off device of the present invention; Described distance adjusting system, keeps and peels off with being with relative distance roughly the same when sticking on the sheet described when peel off the sheet initial stage of carrying out to the inside the end of peeling off object at described stripping head.Peel off in the early stage in addition after finishing before peel off fully during enlarge described relative distance, described stripping head is kept leaving the direction of peeling off object.
In addition, stripping means of the present invention is peeled off described peeling off with being with to be adhered on the sheet that is attached on the face of peeling off object; Wherein, bonding peeling off with in the band bends this at the end position of peeling off object to the direction of overturning and peels off with band on described, forms the initial stage peel angle; With the end of described initial stage peel angle from the end stripping film of peeling off object; Then, keep the later stage peel angle littler to peel off described than described initial stage peel angle.
In addition, in described stripping means, the described object of peeling off is a semiconductor wafer, and described is the screening glass of the face of protection semiconductor wafer.
In addition, a kind of stripping means of the present invention, on sheet, paste to peel off sheet is peeled off with band, on the circuit face that described is secured at semiconductor wafer, and on this circuit face, be formed with projection, it is characterized in that, make the described end position that is bonded in wafer with band of peeling off, under the state that stops to peel off with the coiling action of being with, peeling off with band of outlet side applied pulling force to a side opposite with coiling direction, with peeling off with band output bit by bit so that peel off to produce lax the time this is peeled off with the direction of band to upset and bend of outlet side with band, thus formation initial stage peel angle, then, peel off with band with described initial stage peel angle coiling, the end of stripping film, then, the above-mentioned part that is bent of reeling is peeled off described with the later stage peel angle littler than the initial stage peel angle.
In said method, described stripping head is carrying out described initial stage and is peeling off peeling off state that object applies the relative distance of pressing force described the peeling off with being with of reeling keeping when sticking on the sheet peeling off with band; Then, make described stripping head under the state of peeling off object and leaving enlarging described relative distance, described is peeled off fully from peeling off object.
According to the present invention, because the initial stage peel angle is become as far as possible along the angle of the face of sheet, peel angle is peeled off with diminishing, so even exist under the situation of protuberances such as projection being pasted with on the face of sheet, also residual bonding agent ground stripping film between this protuberance not.
In addition,, apply pressing force when only peeling off in the early stage when peeling off the object stripping film, after before peel off fully during in can under the state of releasing, carry out the pressing force of peeling off object.Thereby, with to compare peeling off the situation that object applying the state stripping film of pressing force continuously, can reduce to peeling off the load of object, thus, even peel off object is the parts of crisp matter such as wafer, also can further avoid this to peel off the damage of object effectively.
Description of drawings
Fig. 1 is the front schematic view that sheet is peeled off the unit;
Fig. 2 is the initial stage of unit stripping film is peeled off in expression by sheet a front schematic view;
Fig. 3 is the front schematic view that described final stage is peeled off in expression;
Fig. 4 (A)～(D) is the action specification figure of described stripping off device;
Fig. 5 (A) is the initial stage peel angle of expression sheet and the profile of later stage peel angle, (B) is the amplification profile of the band bump wafer after the stripping film;
Fig. 6 is the action front schematic view midway of the sheet stripping off device of expression modified example;
Fig. 7 is the front schematic view of sheet stripping off device of the modified example of the state sheet peeled off fully from the wafer of expression;
Fig. 8 (A)～(E) is the action specification figure of the sheet stripping off device of modified example;
Fig. 9 (A) is with the generalized section of peeling off the occasion that the existing stripping off device that is secured at the sheet of band on the bump wafer peels off, (B) is the local amplification profile of Fig. 9 (A), (C) is the amplification profile of the state after the expression stripping film.
Description of reference numerals
10 stripping off devices
11 peel off and use platform
Peel off the unit for 12
22 stripping heads
24 (distance adjusting systems)
W semiconductor wafer (peeling off object)
The S screening glass
PT peels off with band
α 1 initial stage peel angle
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
Fig. 1 is the front schematic view of the sheet stripping off device of present embodiment.In the figure, sheet stripping off device 10 has to peel off with platform 11 and sheet and peels off unit 12.This peels off the wafer W of peeling off object with platform 11 supporting conducts, and this sheet is peeled off unit 12 and is configured in the top that this peels off usefulness platform 11 relatively.
There is no particular limitation for described wafer W, is bearing on the hoop truss RF via mounting strap MT and joint fastener (chip join sheet) DS, pastes screening glass S in the circuit face side (upper face side among Fig. 1) of this wafer W.There is no particular limitation for this screening glass S, pastes via UV cured type bonding agent in present embodiment.
Described peeling off with platform 11 is arranged to and can be moved along direction of arrow A among Fig. 1 via guide rail etc., and side (wafer supporting face side) is provided with a plurality of adsorption holes in the above, via described mounting strap MT and joint fastener DS absorption supporting as the wafer W of peeling off object.In addition, also can not establish adsorption hole, but by configuration porous part absorption supporting wafer W.
Peel off unit 12 from peeling off described screening glass S for described by peeling off with platform 11 wafer supported W.This sheet is peeled off unit 12 and is had: be positioned at and peel off the backing roll 20 that constitutes the supply unit of peeling off usefulness band PT with platform 11 tops; Be located at the regional interior of tabular frame F and constitute the take up roll of peeling off with the coiling portion of band PT 21; Apply the pressing force of regulation in screening glass S end and bonding peeling off with band PT, simultaneously, by reeling by the bonding stripping head 22 of peeling off screening glass S with being with PT from wafer W of peeling off; As making stripping head 22 along peeling off the cylinder 24 that leaves the distance adjusting system of approaching direction lifting with platform 11 relatively; Be located at the guide roller 26 between stripping head 22 and the backing roll 20; Peel off with the driven roller 27 on band PT output shaft take-up force, that be fixed on motor M 1; And this driven roller 27 between clip peel off with the band PT pinch roll 29; Drive the motor M 2 that described take up roll 21 rotates at coiling direction.In addition, described backing roll 20 is connected with the output shaft of motor M 3, thus, can apply and the opposite rotatory force of peeling off with band PT of outbound course, peels off the little tension force with band PT.Be arranged to not make frame F to make in the present embodiment to peel off with moving horizontally and move, move in the horizontal direction but can be arranged to that also frame F is peeled off relatively with platform 11 with platform 11 along continuous straight runs.
Described stripping head 22 has: a body 22A; Be supported on this body 22A and on screening glass S end, apply regulation pressing force and bonding peel off with the band PT first roller 30; Across being arranged on the second horizontal roller 31 of first roller 30 by the spacing parallel arranging of peeling off with band PT; Be configured in the 3rd roller 32 on the top of first roller 30.Second roller 31 is arranged to littler than first roller, 30 diameters, hangs over peeling off with band PT when contacting with screening glass S on first roller 30 at volume, is arranged on the height and position of the face formation clearance C (with reference to Fig. 4 (A)) of screening glass S relatively.Thus, the state forming initial stage peel angle α 1 described later (with reference to Fig. 4 (C)) carries out the initial stage of screening glass S and peels off.In addition, the 3rd roller 32 becomes the guide roller that usefulness band PT is peeled off in guiding.
The cylinder 24 that constitutes described distance adjusting system has: by the cylinder body 35 of frame F supporting; Extend and be fixed with the piston rod 36 of above-mentioned body 22A downwards in the bottom from this cylinder body 35.This cylinder 24 is when peeling off, and piston rod 36 elongations are pushed and are bonded in above the end of screening glass S peeling off with band PT by first roller 30, keep stripping head 22 and the relative distance of peeling off with platform 11.
The sheet stripping means of present embodiment below is described.
Be assemblied in wafer W on the hoop truss RF is made screening glass S by irradiation ultraviolet radiation in advance UV cured type adhesive hardens via joint fastener DS.Then, shown in Fig. 2 and Fig. 4 (A), make and peel off head 22 and descend, make the end WE of the foot of first roller 30 and wafer W bonding mutually.Then, keep reeling with motor M2 is halted state, and on the other hand, backing roll 20 is with following degree rotation urging, that is, giving this with the opposite direction of the outbound course of band PT with little power and peel off to use and be with PT tension force with peeling off.
Stripping table 11 moves relative to peeling off head 22 right side in Fig. 4, peels off with band PT to be output moving.At this moment, remain on halted state with motor M2, so peeling off with band PT formation bending part (with reference to Fig. 4 (B)) owing to reel.
Shown in Fig. 4 (C),, form initial stage peel angle α 1 peeling off with after being with the described bending part that forms on the PT to put into clearance C.In addition, in order to form initial stage peel angle α 1 reliably, also can be repeatedly two to three times the operation of Fig. 4 (A)～(C).
Behind the formation initial stage peel angle α 1, drive motors M1 makes and peels off the outer peripheral face (with reference to Fig. 4 (D)) that is attached to first roller 30 with band PT tightly.Like this, at the state of peeling off on the outer peripheral face that is attached to first roller 30 with band PT tightly, keep the later stage peel angle α 2 that directly determines by this roller and screening glass S is peeled off up to the end of the opposition side of wafer W (with reference to Fig. 3) (with reference to Fig. 5 (A)).In addition; in Fig. 5; the circuit face that is illustrated in wafer W is formed with the situation of projection B; when on this projection B, being provided with screening glass S; be present in adhesive A between the projection B by with above-mentioned later stage peel angle α 2 effects and deviate from upward, be attached to screening glass S on the wafer W and peel off thereby can not remain in.In addition, even do not exist in wafer W under the situation of projection, because begin to peel off with initial stage peel angle α 1, so, even later stage peel angle α 2 thereafter is littler than initial stage peel angle α 1, can be not wafer W not be applied the stress that produces fracture etc. yet.This is because when peeling off the sheet that is secured on the such light sheet material of wafer, and the initial stage peel angle becomes sixty-four dollar question, and the later stage peel angle of peeling off after the beginning is comparatively less important as the reason that fracture etc. takes place.Thereafter, the screening glass S of stage UV sclerosis is in the early stage peeled off from the wafer circuit face by sheet stripping off device 10.
As mentioned above; according to execution mode of the present invention; even particularly when peeling off the screening glass that is secured on the circuit face side with projection B; can be as far as possible to carry out peeling off of initial stage and avoid to the wafer stress application along the big peel angle of wafer face direction; peel off in the early stage finish after; later stage peel angle α 2 with the angle that diminished relatively peels off screening glass; thus; be present in adhesive A between projection B and be subjected to substantially vertically upward relatively the face of wafer W its peeling force of deviating from; thereby, can prevent the adhesive A of residual screening glass S between projection B.
As mentioned above, it is open by above-mentioned explanation to be used to implement best formation of the present invention and method etc., but the present invention is not limited to this.
Promptly, illustrated main specific execution mode of the present invention, but only otherwise break away from the scope of technological thought of the present invention and purpose, to above execution mode, relate to shape, position or configuration etc., those skilled in the art can carry out various changes as required.
For example, keeping first roller 30 and crystal face state of contact to peel off to proceed to fully from the initial stage peeling off though constitute in said embodiment, the present invention is not limited to this.For example also can peel off to shown in Figure 8 as Fig. 6.Promptly; when peeling off in the early stage; the piston rod 36 of elongate cylinder 35 is pushed and is bonded in above the end of screening glass S peeling off with band PT with first roller 30, keeps stripping head 22 and peels off the relative distance of using platform 11; on the other hand; peel off in the early stage after finishing before peel off fully during, enlarge described relative distance, keep the state that makes first roller 30 leave, be moved upward from wafer W; thus, can form later stage peel angle α 2 ground peels off.
That is to say; peel off when being attached to state on the outer peripheral face of first roller 30 tightly (with reference to Fig. 8 (D)) or at its state nearby becoming with band PT; can drive above-mentioned cylinder 24, stripping head 22 is risen, first roller 30 be remained on from screening glass S leave and from position that wafer W rises.Form later stage peel angle α 2 (with reference to Fig. 6, Fig. 8 (E)) by this relative distance etc., under the state that keeps this angle [alpha] 2, drive motors M1 makes simultaneously to peel off with platform 11 and moves to the right, peels off screening glass S (with reference to Fig. 7) fully from the face of wafer W thus.
When peeling off with later stage peel angle α 2, the pressing force that is produced by first roller 30 is corresponding with removing, and wafer W is not applied the stress that produces fracture etc.In addition; be formed with on the wafer circuit face under the situation of projection; the position that the described later stage peel angle α 2 and first roller 30 rise interacts; be present in bonding agent between projection and be subjected to the effect of deviating from upward more strongly; thus, bonding agent is remained in and peel off screening glass S on the wafer W.
Under the situation that adopts this modified example, continuously pressing force is applied to the situation of peeling off screening glass S on the wafer W with maintenance and compares, can reduce the load that is added on the wafer W.Therefore, even under the situation about this screening glass S being peeled off from wafer W, also can avoid the damage of wafer W pasting screening glass S on the parts of crisp matter such as wafer.
In addition, though in said embodiment, cylinder 24 is adjusted the position of stripping head 22 at above-below direction, also can peel off the cylinder that moves up and down with platform 11 and is located at and peels off usefulness platform 11 sides making.In addition, peel off with band PT and be not limited to continuous band shape, also can use the band of individual shape.At this moment, can be corresponding with it by peeling off with the feedway of band of individual shape is set at stripping head 22.
In addition, the stripping head 22 of above-mentioned execution mode is not limited to the configuration example among the figure, so long as can make the action of peeling off with band PT bending form the initial stage peel angle, the structure that can form the later stage peel angle thereafter is just passable.In addition, initial stage peel angle α 1 can be set in and not peel off object to this cause fracture to wait the scope of damaging when screening glass S is peeled off in the end of peeling off object from wafer W etc.Later stage peel angle α 2 can be set in littler and do one's utmost to make not residual scopes such as bonding agent than initial stage peel angle α 1.
In addition, the object of peeling off as stripping off device of the present invention is not limited to wafer W, also is applicable to from being pasted with the situation that object is peeled off this sheet etc. of peeling off of sheet, film.
Claims (9)
1. sheet stripping off device has: what supporting was pasted with sheet peels off peeling off with platform and being arranged to and can peeling off the unit along the sheet that the face of peeling off object relatively moves of object; Can be bonding and reel and peel off this sheet with band and sheet by peeling off peeling off of unit output from this sheet, it is characterized in that,
The described unit of peeling off has: peels off with the supply unit of being with, peels off coiling portion and the stripping head between described supply unit and coiling portion with band,
Described stripping head can be peeled off with band to the direction bending of upset at the described end position of peeling off object, and formation makes the initial stage peel angle of direction of delaminate along the face of peeling off object, on the other hand, the described bending of reeling peel off with band the time formation peel off described than the little later stage peel angle of initial stage peel angle.
2. sheet stripping off device has: what supporting was pasted with sheet peels off peeling off with platform and being arranged to and can peeling off the unit along the sheet that the described face of peeling off object relatively moves of object; Can be bonding and reel and peel off this sheet with band and sheet by peeling off peeling off of unit output from this sheet, it is characterized in that,
Peeling off the unit for described comprises: peel off supply unit with band, make peel off with the first bonding roller of the band and the face of sheet, on the bonding position of this first roller and sheet and this sheet between second roller and the described coiling portion that is with that uses of peeling off in formation gap,
Can make peeling off between described first roller and second roller, between second roller and sheet, make to peel off to form the initial stage peel angle to the direction bending of overturning with band with the band partial relaxation,
Can be after with described initial stage peel angle stripping film, with described second roller with the later stage peel angle stripping film littler than the initial stage peel angle.
3. a stripping off device as claimed in claim 1 or 2 is characterized in that, the described object of peeling off is a semiconductor wafer, and described is the screening glass of the face of protection semiconductor wafer.
4. a sheet stripping off device has peeling off with platform and sheet of support semi-conductor wafers and peels off the unit; This semiconductor wafer has projection in circuit face, simultaneously, is pasted with sheet in this circuit face; This sheet is peeled off the unit and is arranged on the top that this peels off the usefulness platform, simultaneously, can relatively move along the sheet stickup face of described semiconductor wafer; Can be bonding and reel and peel off this sheet with band and sheet by peeling off peeling off of unit output from this sheet,
It is characterized in that, peel off the unit for described and comprise: peel off supply unit with band, make peel off with the first bonding roller of the band and the face of sheet, on the bonding position of this first roller and sheet and sheet between second roller and the described coiling portion that is with that uses of peeling off in formation gap,
Can make peeling off between described first roller and second roller, between second roller and sheet, make to peel off to form the initial stage peel angle to the direction bending of overturning with band with the band partial relaxation,
Can be after with described initial stage peel angle stripping film, with described second roller with the later stage peel angle stripping film littler than the initial stage peel angle.
5. as claim 1,2 or 4 described stripping off devices, it is characterized in that, also comprise and adjust described stripping head and the described distance adjusting system of peeling off with the relative distance of platform,
At described stripping head when peel off the sheet initial stage of carrying out to the inside the end of peeling off object, described distance adjusting system keeps and will describedly peel off with being with relative distance roughly the same when sticking on the sheet, on the other hand, peel off in the early stage after finishing before peel off fully during, enlarge described relative distance, described stripping head is remained on leave the direction of peeling off object.
6. a sheet stripping means is bonding with the sheet that is secured on the face of peeling off object with peeling off with band, peels off described, it is characterized in that,
Bonding peeling off with band on described simultaneously, bends this at the end position of peeling off object to the direction of overturning and peels off with band, forms the initial stage peel angle,
With the end of described initial stage peel angle from the end stripping film of peeling off object,
Then, keep peeling off described than the little later stage peel angle of described initial stage peel angle.
7. a stripping means as claimed in claim 6 is characterized in that, the described object of peeling off is a semiconductor wafer, and described is the screening glass of the face of protection semiconductor wafer.
8. sheet stripping means is pasted to peel off with being with on sheet sheet is peeled off, and on the circuit face that described is secured at semiconductor wafer, and is formed with projection on this circuit face, it is characterized in that,
Make the described end position that is bonded in wafer with band of peeling off,
Under the state that stops to peel off with the coiling action of being with, peeling off with band of outlet side applied pulling force to a side opposite with coiling direction,
With peeling off with band output bit by bit so that peel off to produce lax the time this is peeled off with the direction bending of band to upset of outlet side with band, thus formation initial stage peel angle,
Then, peel off with band with described initial stage peel angle coiling, the end of stripping film,
Then, the described part that is bent of reeling is peeled off described with the later stage peel angle littler than the initial stage peel angle.
9. as claim 6,7 or 8 described stripping meanss, it is characterized in that, described stripping head carries out described initial stage and peels off peeling off state that object applies the relative distance of pressing force described the peeling off with band of reeling keeping when sticking on the sheet will peeling off with band
Then, make described stripping head under the state of peeling off object and leaving enlarging described relative distance, described is peeled off fully from peeling off object.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004133068A JP4485248B2 (en) | 2004-04-28 | 2004-04-28 | Peeling apparatus and peeling method |
| JP133068/2004 | 2004-04-28 | ||
| JP218483/2004 | 2004-07-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1947228A true CN1947228A (en) | 2007-04-11 |
| CN100449701C CN100449701C (en) | 2009-01-07 |
Family
ID=35444823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800134363A Expired - Fee Related CN100449701C (en) | 2004-04-28 | 2005-04-27 | Peeling device and peeling method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4485248B2 (en) |
| CN (1) | CN100449701C (en) |
Cited By (6)
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| CN102138208A (en) * | 2008-08-28 | 2011-07-27 | 琳得科株式会社 | Sheet peeling apparatus and sheet peeling method |
| CN102187448A (en) * | 2008-10-22 | 2011-09-14 | 琳得科株式会社 | Apparatus and method for peeling sheet |
| CN101388332B (en) * | 2007-09-10 | 2012-04-25 | 日东电工株式会社 | Method and apparatuses for separating protective tape |
| WO2014201731A1 (en) * | 2013-06-19 | 2014-12-24 | 深圳市华星光电技术有限公司 | Release paper peeling device |
| CN106183359A (en) * | 2016-08-30 | 2016-12-07 | 深圳市兴图科技有限责任公司 | A kind of dyestripping mechanism and equipment |
| CN106450469A (en) * | 2016-09-26 | 2017-02-22 | 东莞市骏智机电科技有限公司 | Flexible film tearing method of lithium battery |
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| JPH0691153B2 (en) * | 1987-11-28 | 1994-11-14 | 日東電工株式会社 | How to peel off the protective film |
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-
2004
- 2004-04-28 JP JP2004133068A patent/JP4485248B2/en not_active Expired - Fee Related
-
2005
- 2005-04-27 CN CNB2005800134363A patent/CN100449701C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101388332B (en) * | 2007-09-10 | 2012-04-25 | 日东电工株式会社 | Method and apparatuses for separating protective tape |
| CN102138208A (en) * | 2008-08-28 | 2011-07-27 | 琳得科株式会社 | Sheet peeling apparatus and sheet peeling method |
| CN102138208B (en) * | 2008-08-28 | 2013-06-19 | 琳得科株式会社 | Sheet peeling apparatus and sheet peeling method |
| CN102187448A (en) * | 2008-10-22 | 2011-09-14 | 琳得科株式会社 | Apparatus and method for peeling sheet |
| CN102187448B (en) * | 2008-10-22 | 2014-02-19 | 琳得科株式会社 | Apparatus and method for peeling sheet |
| WO2014201731A1 (en) * | 2013-06-19 | 2014-12-24 | 深圳市华星光电技术有限公司 | Release paper peeling device |
| CN106183359A (en) * | 2016-08-30 | 2016-12-07 | 深圳市兴图科技有限责任公司 | A kind of dyestripping mechanism and equipment |
| CN106450469A (en) * | 2016-09-26 | 2017-02-22 | 东莞市骏智机电科技有限公司 | Flexible film tearing method of lithium battery |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2005317711A (en) | 2005-11-10 |
| JP4485248B2 (en) | 2010-06-16 |
| CN100449701C (en) | 2009-01-07 |
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