CN100449701C - Peeling device and peeling method - Google Patents

Peeling device and peeling method Download PDF

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Publication number
CN100449701C
CN100449701C CN 200580013436 CN200580013436A CN100449701C CN 100449701 C CN100449701 C CN 100449701C CN 200580013436 CN200580013436 CN 200580013436 CN 200580013436 A CN200580013436 A CN 200580013436A CN 100449701 C CN100449701 C CN 100449701C
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CN
China
Prior art keywords
sheet
peeling
release
tape
surface
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CN 200580013436
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Chinese (zh)
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CN1947228A (en
Inventor
吉冈孝久
小林贤治
辻本正树
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琳得科株式会社
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Priority to JP133068/2004 priority Critical
Priority to JP2004133068A priority patent/JP4485248B2/en
Priority to JP218483/2004 priority
Application filed by 琳得科株式会社 filed Critical 琳得科株式会社
Publication of CN1947228A publication Critical patent/CN1947228A/en
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Publication of CN100449701C publication Critical patent/CN100449701C/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/68395Separation by peeling using peeling wheel

Abstract

本发明的剥离装置(10)具有对粘贴有片(S)的晶片(W)进行支承的剥离用台(11)和配置在该剥离用台(11)上方的片剥离单元(12),使该片剥离单元(12)和剥离用台(11)相对移动而可剥离片(S),其中具有剥离用带(PT)的支承辊(20)、使剥离用带(PT)与片(S)的面粘接的第一及第二辊(30、31)、和剥离用带(PT)的卷绕辊(21)。 Peeling the peeling apparatus of the present invention (10) having a wafer with a sheet of adhesive (S), (W) is supported by the table (11) and disposed in the sheet separation unit (12) the release above a table (11), so that the film peeling unit (12) and peeling station (11) can be moved relative to the release sheet (S), wherein a support roller (20) peeling tape (PT) of the peeling tape (PT) and the sheet (S ) of the first winding roller and a second roller (30, 31) bonded to a surface, and a peeling tape (PT) (21). 以在形成于第二辊(31)与片(S)间的间隙(C)中弯折剥离用带(PT)地形成初期剥离角度(α1)的状态进行剥离,而后以对应于第二辊(31)的直径的后期剥离角度(α2)剥离片(S)。 A gap (C) formed on the second roller (31) and the sheet (S) between the folded state with the peeling tape (PT) formed in initial peel angle (alpha] l) were peeled off, and then to a second roll corresponding to late peeling angle diameter (31) (alpha] 2) the release sheet (S).

Description

片剥离装置及剥离方法 Sheet peeling apparatus and a peeling method

技术领域 FIELD

本发明涉及片剥离装置及剥离方法,特别涉及适于剥离被粘贴在半导体晶片的电路面上的保护片的片剥离装置及剥离方法。 The present invention relates to a sheet peeling apparatus and a peeling method, more particularly to a sheet peeling apparatus and a peeling method of peeling is adapted to be affixed to the semiconductor wafer surface protection sheet of the circuit.

背景技术 Background technique

现有技术中,在对半导体晶片(以下只称为"晶片")进行极薄化的研磨加工时,通常在电路面侧粘贴保护片,该保护片在向环构架的装配工序等完成后要被剥离。 In the prior art, when a semiconductor wafer (hereinafter simply referred to as "wafer") for the polishing of an extremely thin, usually after the completion of the step of mounting the ring frame and the like on the circuit surface side of the adhesive protective sheet, the protective sheet peeled. 在剥离保护片时,由于晶片非常薄,所以需要特别注意。 In peeling off the protective sheet, since the wafer is very thin, it requires special attention.

专利文献1和2公开了上述保护片的剥离装置及剥离方法。 Patent Documents 1 and 2 discloses an apparatus and a peeling method of peeling the protective sheet. 该文献提出了以下构成,即,通过组合多个辊而确保大的剥离角度,沿着相对于晶片的面尽可能平行的方向剥离保护片,从而防止晶片断裂等。 This document proposes the following configuration, i.e., by combining a plurality of rollers to ensure a large peeling angle, along a direction parallel to the surface of the wafer as the protective release sheet, so as to prevent wafer breakage.

[专利文献lj特开2001-31"06号公报 [Lj Laid-Open Patent Document 2001-31 "Publication No. 06

【专利文献2】特开2000-91281号公报 [Patent Document 2] Laid-Open Patent Publication No. 2000-91281

但是,例如像图9所示出的那样,晶片W在电路面侧形成有保证芯片的电路面侧通电用的称为焊锡凸块(以下称"凸块")的凸部100, 在这样的晶片W上粘贴保护片S,而将该晶片W作为剥离对象物, 此时,在专利文献的剥离装置及剥离方法中,由于初期剥离角度ocl 是接近180度的角度,所以可不给晶片W施加以应力地进行剥离,而另一方面,在把初期剥离角度ctl保持到最后的状态下剥离保护片S。 However, for example as a convex portion 100 the wafer W is referred solder bump (hereinafter referred to as "bumps") have a guaranteed chip circuit surface side of the current-carrying image shown in FIG. 9 on the circuit surface side, in such a paste on the wafer W protective sheet S, and the wafer W as an object to be peeled off, this time, the peeling apparatus and peeling method in Patent Document, since the initial peel angle ocl close an angle of 180 degrees, it may be applied to the wafer W for peeling stress, on the other hand, peeling of the protective sheet at the initial stage to the final peel angle holding state ctl S. 因而,出现了在凸部IOO之间残留保护片S的粘接剂101的问题。 Thus, there is a problem between the convex portions IOO residual protective adhesive S is 101.

另外,在上述专利文献公开的片剥离装置中,在剥离用的辊给予晶片面按压力的状态下一边转动一边粘贴剥离用带,然后同样一边按压晶片面一边进行剥离,所以同时作用片的剥离阻力和按压力,这成为施加给晶片的负荷,存在导致该晶片损伤的问题。 Further, the sheet peeling device of Patent Document disclosed, the peeling roll administering wafer surface in the state pressing force while rotating adhesive release tape, and the same side of the pressing surface of the wafer while peeling, so while peeling action sheet pressing force and resistance, which becomes a load applied to the wafer, the wafer causes problems exist injury.

发明内容 SUMMARY

本发明着眼于上述问题而提出来,其目的是提供这样的片剥离装置及剥离方法,即,能够在剥离片时,特别设定容易在晶片等剥离对象物上发生折断等的初期的剥离角度,其后保持比初期剥离角度小的后期剥离角度剥离片,从而可避免在凸块等凸部存在的情况下残存粘接剂。 The present invention focuses on the above problems, the object of which is to provide a sheet peeling apparatus and a peeling method, i.e., the release sheet can be, in particular, the initial peel angle setting prone to breakage or the like on an object such as a wafer release thereafter maintaining the angle is smaller than the initial peel the release sheet post peel angle, the adhesive remaining can be avoided in case of bumps projecting portion exists.

本发明的另一个目的是提供这样的片剥离装置及剥离方法,即, 能够在剥离片时,抑制对晶片等剥离对象物的负荷为最小限度而剥离剥离对象物上的片。 Another object of the present invention is to provide a sheet peeling apparatus and a peeling method, i.e., the release sheet can be suppressed to release the load object such as a wafer can be minimized and the release sheet was peeled off the object.

为实现上述目的,本发明的一种片剥离装置,具有:对粘贴有片的一个面的剥离对象物进行支承的剥离用台、和设置成能够沿剥离对象物的面相对移动的片剥离单元;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行巻绕而剥离该片,其特征在于,所述剥离单元具有:剥离用带的供给部、剥离用带的巻绕部、和位于所述供给部及巻绕部之间的剥离头,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,所述剥离头能够在所述剥离对象物的端部位置向翻转的方向弯折剥离用带而形成初期剥离角度,另一方面,在巻绕所述弯折的剥离用带时形成比所述初期剥离角度小的后期剥离角度而剥离所述片。 To achieve the above object, a sheet peeling apparatus according to the present invention includes: a release adhesive to the release surface of the object to a supporting sheet with the table, and arranged to face the object can be peeled off along a relative movement of sheet separation unit ; can be output through the sheet from the separation unit with the peeling tape and the adhesive sheet peeled off the sheet about Volume, wherein said peeling unit includes: a supply portion of the peeling tape, the tape for peeling when Volume wound portion, and positioned between the peeling head portion and a supply Volume wound portion, the surface of the sheet in a surface of the release sheet is peeled off the object to form an angle peel angle the peeling head capable of reversing the direction of the peeling tape is bent to form the initial peel angle end position of the release of the object, on the other hand, are formed than when the peeling tape winding Volume bent He said small initial peel angle and peel angle post the release sheet.

另外,本发明的一种片剥离装置,具有:对粘贴有片的一个面的剥离对象物进行支承的剥离用台、和设置成能够沿所述剥离对象物的面相对移动的片剥离单元;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行巻绕而剥离该片,其特征在于,所述片剥离单元包括:剝离用带的供给部、所述剥离用带的巻绕部、和位于所述供给部及巻绕部之间的剥离头;该剥离头包括:使剥离用带与片的面粘接的第一辊、和相对该第一辊隔开规定间隔并列设置并且当巻挂于所述第一辊的剥离用带与片接触时能够相对该片的面形成间隙的第二辊,能够使所述第一辊和第二辊之间的剥离用带局部松弛,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,在第二辊和片之间使剥离用带向翻转的方向弯折而形成初期剥离角度,能 Further a sheet peeling apparatus according to the present invention, having: a surface of the object to release the sheet is attached for supporting the peeling station, and can be arranged along the surface of the release sheet is peeled off the object unit relatively movable; the sheet can be peeled off by the peeling tape from the adhesive sheet with the release sheet output unit Volume and around, wherein the sheet separation unit comprises: a supply portion of the peeling tape, the peeling Volume band around a portion, located between the peeling head portion and the supply portion about Volume; the peeling head comprising: a first peeling the adhesive tape roll surface and the sheet, and a separator roller relative to the first opposing surface forming the sheet can be a second roller gap opening when a predetermined interval and disposed in parallel to the release when hung Volume contacting the sheet with the first roll can be made between the first roller and second roller partial peeling tape slack, when the surface of the sheet a surface of the release sheet is peeled off the object to form an angle peel angle, so that the peeling tape and the sheet between the second roll reversing direction of initial peel angle formed by bending, can 在以所述初期剥离角度剥离片后,以比所述初期剥离角度小的后期剥离角度剥离片。 After initial peel angle to the release sheet to peel angle is smaller than the initial angle of the release sheet post release.

在所述片剥离装置,所述剥离对象物是半导体晶片,所述片是保 In the sheet peeling apparatus, the release object is a semiconductor wafer, the protection sheet is

护半导体晶片的面的保护片。 Protection by the sheet surface of the semiconductor wafer.

另外,本发明的一种片剥离装置,具有支承半导体晶片的剥离用 Further a sheet peeling apparatus according to the present invention, a support having a peeling of the semiconductor wafer

台和片剥离单元;该半导体晶片在电路面具有凸块,同时,在该电路面粘贴有片的一个面;该片剥离单元设置在该剥离用台的上方,同时, 可沿所述半导体晶片的片粘贴面相对移动;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行巻绕而剥离该片,其特征在于, 所述片剥离单元包括:剥离用带的供给部、所述剥离用带的巻绕部、 和位于所述供给部及巻绕部之间的剥离头;该剥离头包括:使剥离用带与片的面粘接的第一辊、和相对该第一辊隔开规定间隔并列设置并且当巻桂于所述第一辊的剥离用带与片接触时能够相对该片的面形成间隙的第二辊,能够使所述第一辊和第二辊之间的剥离用带局部松弛, 在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,在第二辊和片之间使剥离用带向翻转的方向弯折 And the sheet release station unit; the semiconductor wafer having a bump on the circuit surface, while the circuit surface of the adhesive sheet has a surface; release unit is disposed above the sheet table with the release, while the semiconductor wafer along relatively moving the sheet adhering surface; the release tape can be output through the sheet from the separation unit and the adhesive sheet peeled off the sheet about Volume, wherein said sheet peeling unit comprising: tape peeling supplying section, the tape peeling Volume wound portion, and peeling head positioned between the supply portion and the portion around the Volume; the peeling head comprising: peeling tape adhesive surface of the first roller and the sheet, and relative to the first roller and disposed in parallel at predetermined intervals Volume Gui when in contact with the first roller and the sheet peeling tape can be formed of the second surface of the sheet opposite the nip, it is possible to make the first roller and peeling between the second roller with local relaxation, when the surface of the sheet to a surface of the release sheet is peeled off the object to form an angle peel angle, and the second roller in the sheet between the peeling tape folded in the direction of the flipping 而形成初期剥离角度,能够在以所述初期剥离角度剥离片后,以比所述初期剥离角度小的后期剥离角度剥离片。 Initial peel angle is formed, it is possible to after the initial peel angle of release sheet, the initial peel angle than post-peeling angle smaller release sheet.

在本发明的剥离装置还具有调整所述剥离头和所迷剥离用台的相对距离的距离调整装置;所述距离调整装置在所述剥离头从剥离对象物的端部向内侧对片进行初期剥离时,保持与把所述剥离用带粘贴在片上时大致相同的相对距离。 In the peeling apparatus of the present invention further includes adjusting the stripping head and the peeling fans distance adjusting device the relative distance of the station; means for adjusting the distance from the end sheet is peeled off the object to the inside of the peeling head in the early peeling, while maintaining substantially the same as the release tape with the adhesive on the sheet relative distance. 另外在初期剥离完成后至完全剥离之前的期间扩大所述相对距离,将所述剥离头保持离开剥离对象物的方向。 Further expansion of the period prior to full release after completion of the initial peel relative distance, the direction away from the peeling peeling head holding the object.

另外,本发明的一种片剥离方法,将剥离用带与一个面被粘贴在受到剥离用台支承的剥离对象物的面上的片粘接,剥离所述片,其特征在于,在所述片上粘接剥离用带,而且,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,在剥离对象物的端部位置向翻转的方向弯折剥离用带,形成初期剥离角度, 以所述初期剥离角度从剥离对象物的端部剥离片的端部,在巻绕被弯折的剥离用带时,形成比所述初期剥离角度小的后期剥离角度,保持该后期剥离角度地剥离所述片。 Further A sheet peeling method of the present invention, the peeling tape is stuck to one surface of the release sheet bonding surface by peeling the support of the object table, said release sheet, characterized in that, in the peeling tape on the adhesive sheet, and, when the surface of the sheet a surface of the release sheet is peeled off the object to form an angle peel angle, the end position of the object to release the flipped the bending direction of the peeling tape, the initial peel angle is formed, to the initial peel angle from the end portion end portion release sheet was peeled off the object, when Volume is bent around the peeling tape, the ratio of initial peel formed post peel angle small angle, release the holding of the sheet post-peeling angle.

另外,在所述片剥离方法中,所述剥离对象物是半导体晶片,所述片是保护半导体晶片的面的保护片。 Further, the sheet peeling process, peeling the object is a semiconductor wafer, the protective sheet is a semiconductor wafer surface protection sheet.

另外,本发明的一种片剥离方法,在被剥离用台支承的半导体晶片的电路面上形成有凸块,并且,在一个面被粘贴于该电路面的片上粘贴剥离用带而将片剥离,其特征在于,使所述剥离用带粘接在晶片 Further A sheet peeling method of the present invention, the circuit surface of the semiconductor wafer is peeled off the support table is formed with bumps, and are bonded to one adhesive face of the peeling tape and the release sheet on the surface of the circuit chip characterized in that the peeling tape adhered to the wafer

的端部位置,在停止剥离用带的巻绕动作的状态下,对输出侧的剥离用带向与巻绕方向相反的一侧施加拉力,将输出侧的剥离用带一点一点地输出以使剥离用带产生松弛,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,将剥离用带向翻转的方向弯折从而形成初期剥离角度,接着,以所述初期剥离角度巻 End position, the stop operation of a Volume peeling tape wound state, the opposite side of the pulling force, the release side of the release to the output side of the output winding direction of the belt and the belt Volume output bit by bit in the peeling tape slack, when the surface of the sheet a surface of the release sheet is peeled off the object to form an angle peel angle, with the direction of the peeling tape is bent so that the flipped initial peel angle is formed, and then, to the initial peel angle Volume

绕剥离用带,剥离片的端部,然后,巻绕所述被弯折的部分而形成比所述初期剥离角度小的后期剥离角度,以该后期剥离角度剥离所述片。 Winding the peeling tape, the end portion of the release sheet, and to form an angle smaller than the initial peel Volume peel angle post is bent about the portion to which the release sheet post peel angle. 在上述方法中,所述剥离头在把剥离用带粘贴在片上时以保持对剥离对象物施加按压力的相对距离的状态巻绕所述剥离用带,进行所 In the above method, the peeling head is in the peeling tape adhered to the sheet while holding the pressing force is applied to the relative distance of the object of peeling the peeling tape about Volume, for the

述片的初期剥离;然后,在扩大所述相对距离使所述剥离头从剥离对象物离开的状态下,把所述片从剥离对象物完全剥离。 Initial peel said sheet; Then, the relative distance in the expanded stripped off the head away from the object to be peeled off, the peeling of the sheet is fully peeled from the object.

根据本发明,由于使初期剥离角度成为尽可能沿着片的面的角度, 其后使剥离角度变小地进行剥离,所以即使在粘贴有片的面上存在凸块等凸部的情况下,也能够不在该凸部之间残留粘接剂地剥离片。 According to the present invention, since the case where the initial peel as the angle becomes an angle along the plane of the sheet, followed by peeling the peeling angle becomes small, even if there is a bump on the surface sheet or the like is attached to the convex portion, the residue can be not between the adhesive sheet peeled off the protruding portion.

另外,在从剥离对象物剥离片时,只在初期剥离时施加按压力, 在之后到完全剥离之前的期间内可以在解除对剥离对象物的按压力的状态下进行。 Further, only when the pressing force is applied from the initial peel the release sheet was peeled off the object, in the period prior to full release can after releasing the pressing force of the object to be peeled. 因而,与以连续地对剥离对象物施加着按压力的状态剥离片的情况相比,可以减少对剥离对象物的负荷,由此,即使剥离对象物是晶片等脆质的部件,也可以进一步有效地避免该剥离对象物的损伤。 Accordingly, peeling and to continuously applied to the case where the object of the pressing state of the pressure release sheet can be reduced compared to the peel load object, thereby, even if the object is a fragile substance release member like a wafer, it may be further effectively prevent damage to the release of the object. 附图说明 BRIEF DESCRIPTION

图l是片剥离单元的正面示意图; Figure l is a schematic front view of the sheet separation unit;

图2是表示由片剥离单元剥离片的初期阶段的正面示意图; FIG 2 is a front early stages of cell release sheet is peeled from the schematic;

图3是表示剥离所述片的最后阶段的正面示意图; 3 is a schematic front view of the final phase of the release sheet;

图4(A) ~ (D)是所述片剥离装置的动作说明图; FIG. 4 (A) ~ (D) are the sheet peeling apparatus described in FIG operation;

图5( A )是表示片的初期剥离角度和后期剥离角度的剖面图,(B ) FIG 5 (A) is a sectional view of the initial peel angle and peel angle expressed late sheet, (B)

是剥离片后的带凸块的晶片的放大剖面图; It is an enlarged sectional view of a wafer with bumps after peeling sheet;

图6是表示变型例的片剥离装置的动作中途的正面示意图; FIG 6 is a schematic front view showing an operation of the intermediate sheet peeling device of the modification;

图7是表示从晶片上把片完全剥离的状态的变型例的片剥离装置 7 is a modification sheet peeling device of the sheet from the wafer is completely exfoliated state

的正面示意图; Front schematic;

图8(A) ~ (E)是变型例的片剥离装置的动作说明图; FIG 8 (A) ~ (E) is an operation of the sheet peeling apparatus of modification explanatory view;

图9 ( A )是用剥离被粘贴在带凸块的晶片上的片的现有剥离装置 FIG. 9 (A) is a release sheet is stuck onto the wafer with bumps conventional peeling device

进行剥离的场合的剖面示意图,(B)是图9 (A)的局部放大剖面图, (C)是表示剥离片后的状态的放大剖面图。 Peeling occasion sectional schematic view, (B) are diagrams 9 (A) is a partial enlarged sectional view, (C) is an enlarged sectional view showing a state after the release sheet. 附图标记说明 REFERENCE NUMERALS

10 片剥离装置 Peeling means 10

11 剥离用台 Peeling station 11

12 片剥离单元22 剥离头 12 peeling peeling head unit 22

24 缸(距离调整装置) Cylinder 24 (distance adjusting means)

W 半导体晶片(剥离对象物) The semiconductor wafer W (object to be peeled)

S 保护片 Protective sheet S

PT 剥离用带 Peeling tape PT

al 初期剥离角度 initial peel angle al

oc2 后期剥离角度 oc2 late peel angle

具体实施方式 Detailed ways

下面,参照附图说明本发明的实施方式。 Hereinafter, embodiments of the present invention are shown.

图l是本实施方式的片剥离装置的正面示意图。 Figure l is a front schematic view of apparatus according to the embodiment peeled sheet. 在该图中,片剥离装置IO具有剥离用台11和片剥离单元12。 In the drawing, the sheet peeling device having a peeling IO sheet peeling unit 11 and the table 12. 该剥离用台11支承作为剥离对象物的晶片W,该片剥离单元12相对配置在该剥离用台11 的上部。 Peeling the support base 11 of the wafer W as the object to be peeled off, the film peeling unit 12 disposed opposite the upper table 11 with the peeling.

所述晶片W没有特别的限定,经由安装带MT和接合片(芯片接合片)DS支承在环构架RF上,在该晶片W的电路面侧(图1中上面侧)粘贴保护片S。 The wafer W is not particularly limited, and DS via the mounting tape MT support sheet (die bonding sheet) bonded on the ring frame RF, the circuit surface of the wafer W side (upper side in FIG. 1) applying the protective sheet S. 该保护片S没有特别的限定,在本实施方式经由紫外线硬化型粘接剂粘贴。 The protective sheet S is not particularly limited, in the present embodiment are pasted via the ultraviolet curing adhesive.

所述剥离用台ll设置成可经由导轨等沿图1中箭头方向A移动, 并在上面侧(晶片支承面侧)设有多个吸附孔,经由所述安装带MT 和接合片DS吸附支承作为剥离对象物的晶片W。 Ll is provided with the peeling station 1 so as to be movable via the direction of the arrow along the guide rail, etc. A, and provided with a plurality of suction holes on the top side (wafer support surface side), via the mounting tape MT sheet and suction support engagement DS as the release object wafer W. 另外,也可以不设吸附孔,而是通过配置多孔质部件吸附支承晶片W。 Further, suction holes may not be provided, but by arranging the porous suction support member wafer W.

所述片剥离单元12从由剥离用台11支承的晶片W剥离所述保护 The sheet was peeled from the protective means 12 by the peeling station 11 the wafer W supported by the release

片S。 Sheet S. 该片剥离单元12具有:位于剥离用台11上方而构成剥离用带PT的供给部的支承辊20;设在板状的构架F的区域内并且构成剥离用带PT的巻绕部的巻绕辊21;在保护片S端部施加规定的按压力而粘接剥离用带PT,同时,通过巻绕被粘接的剥离用带PT而从晶片W 剥离保护片S的剥离头22;作为使剥离头22沿相对剥离用台11离开接近的方向升降的距离调整装置的缸24;设在剥离头22和支承辊20 之间的导向辊26;给予剥离用带PT巻绕力的、固定在电机M1的输出轴上的驱动辊27;在与该驱动辊27之间夹着剥离用带PT的夹紧辊29;驱动所述巻绕辊21在巻绕方向转动的电机M2。 The film peeling unit 12 includes: a peeling positioned above the support roller station 11 is configured supplying portion 20, the peeling tape PT; provided in the plate-like framework region and constitutes F Volume Volume peeling tape portion wound around PT roller 21; applied at a predetermined end portion of the protective sheet S peeled off the pressing force of the adhesive tape PT, at the same time, is bonded by Volume of about 22 and the peeling tape PT from a wafer W peeling head peeling off the protective sheet S; so as peeling head 22 in the opposite direction away from the table 11 with the closest distance adjusting means of the release of the lifting cylinder 24; provided between the peeling head 22 and the support roller 20 guide roller 26; Volume administered peeling tape PT forces around fixed the output shaft of the driving roller 27 of the motor M1; with the driving roller 27 interposed between the peeling tape PT pinch roller 29; Volume around the drive roller 21 in the winding Volume motor M2 direction of rotation. 另外,所述支承辊20与电机M3的输出轴连接,由此,可以施加与剥离用带PT的输出方向相反的转动力,给予剥离用带PT小的张力。 Further, the support roller 20 is connected to the output shaft of the motor M3, and thus, may be applied to the output direction of the peeling tape PT is opposite to rotational force given peeling tape PT with a small tension. 在本实施方式中设置成不使构架F水平移动地使剥离用台11沿水平方向移动,但也可以设置成使构架F相对剥离用台ll在水平方向移动。 Frame F is provided so as not to be horizontally moved by the moving release station 11 in the horizontal direction, but may be arranged such that the frame F is moved in the horizontal direction relative release station ll used in the present embodiment.

所述剥离头22具有:头本体22A;支承于该头本体22A并在保护片S端部上面施加规定的按压力而粘接剥离用带PT的第一辊30; 隔着可通过剥离用带PT的间隔并列设置在第一辊30的橫向的第二辊31;配置在第一辊30的上部的第三辊32。 The peeling head 22 includes: a head body 22A; 22A and a support applied to the predetermined head body in the upper end portion of the protective sheet S while pressing the pressure roller 30 by a first adhesive peeling tape PT; via the peeling tape by PT disposed in parallel spaced lateral first roller 30, second roller 31; a first roller 30 disposed in an upper portion of the third roller 32. 第二辊31设置成比第一辊30直径小,在巻挂在第一辊30上的剥离用带PT与保护片S接触时, 设置在可相对保护片S的面形成间隙C(参照图4(A))的高度位置。 The second roller 31 is provided a first roller 30 than the smaller diameter, at Volume hung on the first roller 30 contacts with the peeling tape PT S and the protective sheet, disposed to form a gap C (see FIG relative surface protective sheet in the S 4 (a)) height. 由此,在形成后述的初期剥离角度ocl (参照图4(C))的状态,进行保护片S的初期剥离。 Thus, the initial peel angle of ocl described later is formed (see FIG. 4 (C)), the protective sheet S for the initial peel. 另外,第三辊32成为引导剥离用带PT的导向辊。 Further, the third roller 32 is guided by the peeling tape PT guide rollers.

构成所述距离调整装置的缸24具有:由构架F支承的缸本体35; 从该缸本体35向下方延伸并且在下端部固定有上述头本体22A的活塞杆36。 A cylinder constituting said distance adjusting means 24 includes: a frame supported by the cylinder body 35 F; the cylinder body 35 and extends downward from the head body is fixed to a piston rod 36 of the lower end portion 22A from. 该缸24在剥离时,活塞杆36伸长,由第一辊30把剥离用带PT按压并粘接在保护片S的端部上面,保持剥离头22和剥离用台11的相对距离。 The release cylinder 24 when the piston rod 36 extended, by the first roller 30 presses the peeling tape PT and bonded upper end portion of the protective sheet S, to maintain the relative distance peeling peeling head 22 and stage 11.

以下说明本实施方式的片剥离方法。 The following sheet peeling method according to the present embodiment described embodiment.

经由接合片DS装配在环构架RF上的晶片W被预先照射紫外线 DS via the engaging piece fitted in the wafer W on the ring frame RF is previously irradiated with ultraviolet rays

而使保护片S的紫外线硬化型粘接剂硬化。 The ultraviolet curing adhesive protective sheet S is hardened. 然后,如图2和图4 (A) 所示,使剥离头部22下降,使第一辊30的最下部和晶片W的端部WE相互粘接。 Then, as shown in FIG. 2 and FIG. 4 (A), the peeling head 22 is lowered, so that the lowermost end portion of the wafer W and WE are bonded to each of the first roller 30. 然后,保持巻绕用电机M2为停止状态,另一方面, 支承辊20以下述程度转动施力,即,在与剥离用带PT的输出方向相反的方向以小的力给予该剥离用带PT张力。 Then, holding Volume motor M2 about a stopped state, on the other hand, the support roller 20 is rotated to the extent that the urging, i.e., a small force given to the peeling tape PT in the opposite direction to the output direction of the peeling tape PT tension.

剥离台11相对剥离头部22向图4中右侧移动,剥离用带PT对应该移动而净皮输出。 Peeling the peeling station 11 opposite the head 22 moves in the right direction in FIG. 4, the peeling tape PT on the skin should be moved while the net output. 此时,由于巻绕用电机M2保持在停止状态,所以在剥离用带PT形成弯折部分(参照图4 (B))。 In this case, since the wound is kept stationary Volume motor M2, so that the bent portion is formed in the peeling tape PT (refer to FIG. 4 (B)).

如图4 (C)所示,把在剥离用带PT上形成的所述弯折部分放入间隙C后,形成初期剥离角度ocl。 After in FIG 4 (C), the said bent portion is formed on the peeling tape PT into the gap C, the initial peel angle formed ocl. 另外,为了可靠地形成初期剥离角度ctl,也可以反复二至三次的图4 (A) ~ (C)的工序。 In order to reliably form the initial peel angle CTL, the step may be repeated two to three times in FIG. 4 (A) ~ (C) of.

形成初期剥离角度ocl后,驱动电机M1,使剥离用带PT紧紧地贴在第一辊30的外周面(参照图4 (D))。 After forming the initial peel angle ocl, the driving motor M1, the peeling tape PT tightly attached to the outer circumferential surface of the first roller 30 (see FIG. 4 (D)). 这样,在剥离用带PT紧紧地贴在第一辊30的外周面上的状态,维持由该辊径确定的后期剥离角度cx2 (参照图5 (A))地使保护片S剥离直到晶片W的相反侧的端部(参照图3)。 Thus, the peeling tape PT tightly attached state of the outer circumferential surface of the first roller 30, to maintain the peel angle of the post-roll diameter determined CX2 (see FIG. 5 (A)) to the protective sheet S peeled off until the wafer the opposite end of the W (see FIG. 3). 另外,在图5中,表示在晶片W的电路面形成有凸块B的情况,在该凸块B上设有保护片S时,存在于凸块B之间的粘接剂A通过以上述后期剥离角度oc2作用而向上方脱出,从而能够不残留在晶片W上地附着于保护片S而剥离。 Further, in FIG. 5, showing bumps formed when B is the case in the circuit surface of the wafer W, a protective sheet S on which the bump B, A is present in the adhesive between the bumps B by the above-described late peel angle oc2 detached upward action, thereby not remaining on the wafer W adhered to the protective sheet S peeled off. 另外,即使在晶片W 不存在凸块的情况下,因为以初期剥离角度ctl开始剥离,所以,即使其后的后期剥离角度a2比初期剥离角度ocl小,也可以不对晶片W施加产生断裂等的应力。 Further, even where the bumps do not exist in the wafer W, since the initial peel angle ctl start to peel, so that even if the subsequent post-peel angle a2 ocl smaller than the initial peel angle, may be applied to the wafer W does not produce fracture or the like stress. 这是因为在剥离被粘贴在晶片这样的薄板材料上的片时,初期剥离角度成为最重要的问题,而剥离开始后的后期剥离角度作为发生断裂等的原因较为次要。 This is because more secondary reason is adhered on the peeling sheet material such as a wafer sheet, initial peel angle of the most important issues, and the post-peeling peeling angle after breakage or the like as the start. 其后,在初期阶段UV 硬化的保护片S由片剥离装置IO从晶片电路面剥离。 Thereafter, in the initial stage of the UV-curable protective sheet S peeled off by the peeling sheet from the wafer circuit surface IO device.

如上所述,根据本发明所述的实施方式,特别是即使在剥离被粘贴在具有凸块B的电路面侧上的保护片时,能够以尽量沿着晶片面方向的大的剥离角度进行初期的剥离而避免对晶片施加应力,在初期剥离完成后,以相对变小了角度的后期剥离角度cx2剥离保护片,由此, As described above, according to embodiments of the present invention, in particular, even the peeling is stuck on the circuit surface side of the bump B having a protective sheet can be made to the initial peel angle as large as possible along the surface direction of the wafer avoid peeling stress is applied to the wafer, after completion of the initial release, with a relatively small angle peel angle late cx2 stripping the sheet, whereby,

存在于凸块B间的粘接剂A受到大体垂直向上地相对晶片W的面将其脱出的剥离力,从而,可防止在凸块B间残留保护片S的粘接剂A。 Present in the adhesive agent A between the bumps B by the opposing generally vertical surface of the wafer W from coming off upward peeling force, thereby to prevent the adhesive between the bump B of the remaining protective sheet S A.

如上所述,用于实施本发明的最佳构成和方法等由上述说明公开, 但本发明并不限于此。 As described above, the optimum composition and method for practicing the invention disclosed in the foregoing description, but the present invention is not limited thereto.

即,用图示说明了本发明的主要的特定的实施方式,但只要不脱离本发明的技术思想和目的的范围,对以上的实施方式,涉及到形状、 位置或配置等,本领域的技术人员可以根据需要进行各种变更。 That is, the main illustrated with particular embodiments of the invention, but without departing from the scope of the technical idea and object of the present invention, the above embodiment relates to the shape, location or the like configuration, those skilled in the art you can make various changes as needed.

例如,在所述实施方式中虽构成为保持着第一辊30与晶体面接触的状态从初期剥离进行到完全剥离,但本发明并不限于此。 For example, although in the embodiment described above is configured for holding a contact with the crystal surface of the first roller 30 to completely release from the initial release, but the present invention is not limited thereto. 例如也可以如图6到图8所示进行剥离。 It may be, for example, in FIG. 6 to FIG. 8 peeled off. 即,在初期剥离时,伸长缸35的活塞杆36,用第一辊30把剥离用带PT按压并粘接在保护片S的端部上面,保持剥离头22和剥离用台11的相对距离,另一方面,在初期剥离完成后到完全剥离之前的期间,扩大所述相对距离,保持使第一辊30从晶片W离开、向上方移动的状态,由此,可形成后期剥离角度ot 2地进行剥离。 That is, when the initial peel, elongate cylinder rod 3635, and a first roller 30 and pressing the peeling tape PT joined end portion of the upper protective sheet S, to maintain the peeling head 22 and the peeling station 11 with relative distance, on the other hand, in the period before the initial peel completely peeled after completion, enlarging the relative distance of the first roller 30 remains away from the wafer W, the state is moved upward, thus, may be formed post-peel angle ot 2 to peel.

也就是说,在成为剥离用带PT紧紧地贴在第一辊30的外周面上的状态时(参照图8 (D))或在其近前的状态,可驱动上述缸24,使剥离头22上升,将第一辊30保持在从保护片S离开而从晶片W上升的位置。 That is, the peeling tape PT becomes tightly attached to the outer circumferential surface of the first state of the roller 30 (see FIG. 8 (D)) or near its state to drive the cylinder 24, the peeling head 22 rises from the position held in the protective sheet S is raised away from the first roller 30 of the wafer W. 由该相对距离等形成后期剥离角度a2(参照图6、图8(E)), 在保持该角度cc2的状态下,驱动电机M1,同时使剥离用台ll向右側移动,由此从晶片W的面完全剥离保护片S (参照图7)。 It is formed by the post-peeling angle relative distance A2 (see FIG. 6, FIG. 8 (E)), while maintaining the angle of cc2, the driving motor M1, while the peeling station ll moved to the right, whereby the wafer W from completely peeled surface protective sheet S (see FIG. 7).

在用后期剥离角度cx2剥离时,与解除由第一辊30产生的按压力对应,不对晶片W施加产生断裂等的应力。 When peeling cx2 post peel angle, and releasing the pressing force generated by the first roller 30 corresponds to the stress generated breakage of the wafer W is not applied. 另外,在晶片电路面上形成有凸块的情况下,所述后期剥离角度cc2和第一辊30上升的位置相互作用,存在于凸块间的粘接剂更强地受到向上方脱出的作用,由此, 可以不使粘接剂残留在晶片W上地剥离保护片S。 Further, the circuit surface of the wafer is formed with a bump, the post-peeling angle cc2 and the first roller 30 interacts raised position, is present in the adhesive between the bumps emerge more strongly by the upward action thus, may not be peeled off the adhesive protective sheet remaining on the wafer W S.

在釆用这种变型例的情况下,与保持连续把按压力施加在晶片W 上剥离保护片S的情况相比,可以减少加在晶片W上的负荷。 In the case preclude the use of this modification, the pressing force is applied to maintain a continuous peeling the protective sheet S on the wafer W can be reduced compared wafer W is applied to the load. 因此, 即使在晶片等脆质的部件上粘贴保护片S而把该保护片S从晶片W剥 Thus, even if the protective sheet S attached on the wafer frangible member or the like to the protective sheet S peeled from the wafer W

离的情况下,也可以避免晶片w的损坏。 From the case, but also to avoid possible damage of the wafer w.

另外,虽在所述实施方式中,缸24在上下方向调整剥离头22的位置,但也可以把使剥离用台11上下移动的缸设在剥离用台11侧。 Further, although in the above embodiment, the cylinder 24 adjusts the position of the peeling head 22 in the vertical direction, but may be used to move the peeling station 11 provided on the vertical cylinder 11 side peeling station. 另外,剥离用带PT不限于连续的带状,也可以使用单张状的带。 Further, the peeling tape PT is not limited to a continuous belt, it may also be used with a single shape. 此时,可通过在剥离头22设置单张状的剥离用带的供给装置与之对应。 At this time, with the corresponding supply device by peeling head 22 is provided with a single tape-like release.

另外,上述实施方式的剥离头22不限于图中的构成例,只要是可进行使剥离用带PT弯折的动作形成初期剥离角度,其后可形成后期剥离角度的构造就可以。 Further, in FIG 22 is not limited to the embodiments peeling head configuration of the above embodiment, as long as it can be formed in the peeling tape PT initial peel angle bending operation, may thereafter be configured to form an angle post can be peeled off. 另外,初期剥离角度ctl可设定在当从晶片W等剥离对象物的端部剥离保护片S时不给该剥离对象物造成断裂等损坏的范围。 Further, initial peel angle ctl may be set when the protective sheet S peeled off from the end portion of the wafer W, does not release the object to release the object to cause damage such as breakage of the range. 后期剥离角度ot 2可设定在比初期剥离角度a 1小且极力使粘接剂等不残留的范围。 Late peel angle ot 2 may be set at an angle smaller than the initial peel a 1 and so strongly adhesive without leaving the scope.

另外,作为本发明的剥离装置的剥离对象物,不限于晶片W,也适用于从粘贴有片、膜的剥离对象物剥离该片等的情况。 Further, the release means release the object of the present invention is not limited to the wafer W, is also applicable to the case where there is adhesive sheet, the release sheet was peeled off the object film or the like.

Claims (9)

1.一种片剥离装置,具有:对粘贴有片的一个面的剥离对象物进行支承的剥离用台、和设置成能够沿剥离对象物的面相对移动的片剥离单元;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行卷绕而剥离该片,其特征在于, 所述剥离单元具有:剥离用带的供给部、剥离用带的卷绕部、和位于所述供给部及卷绕部之间的剥离头, 在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,所述剥离头能够在所述剥离对象物的端部位置向翻转的方向弯折剥离用带而形成初期剥离角度,另一方面,在卷绕所述弯折的剥离用带时形成比所述初期剥离角度小的后期剥离角度而剥离所述片。 A sheet peeling apparatus, comprising: a release adhesive to the release surface of the object to a supporting sheet with the table, and arranged to face the object can be peeled off along the relatively movable sheet release unit; through from the peeling the release sheet output unit with the tape and winding the adhesive sheet is peeled off the sheet, wherein the release means includes: a supplying portion of the peeling tape, the peeling tape winding portion, and located in between the peeling head portion and a winding supply portion, the surface of the sheet when the sheet is peeled off a surface and a release object angle formed peel angle is set, the peeling head can release end position of the object is bent in a direction reversed to form the initial release tape peel angle, on the other hand, form an angle smaller than the initial peel during winding the peeling tape bent the peel angle and late release sheet.
2. —种片剥离装置,具有:对粘贴有片的一个面的剥离对象物进行支承的剥离用台、和设置成能够沿所述剥离对象物的面相对移动的片剥离单元;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行巻绕而剥离该片,其特征在于,所述片剥离单元包括:剥离用带的供给部、所述剥离用带的巻绕部、和位于所述供给部及巻绕部之间的剥离头;该剥离头包括:使剥离用带与片的面粘接的第一辊、和相对该第一辊隔开规定间隔并列设置并且当巻桂于所述第一辊的剥离用带与片接触时能够相对该片的面形成间隙的第二辊,能够使所述第一辊和第二辊之间的剥离用带局部松弛,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,在第二辊和片之间使剥离用带向翻转的方向弯折而形成初期剥离角度,能够在以所述初 2. - Species sheet peeling device having: a release adhesive to the release surface of the object to a supporting sheet with the table, and can be arranged along the surface of the release sheet is peeled off the object unit relative movement; can be prepared by peeling from the sheet output unit with the peeling tape and the adhesive sheet peeled off the sheet about Volume, wherein said sheet peeling unit comprising: a supply portion of the peeling tape, the tape is peeled Volume around portion, and is located between the peeling head portion and the supply portion about Volume; the peeling head comprising: a first peeling the adhesive tape roll surface and the sheet, and relative to the first roller at predetermined intervals in parallel Volume set and when in contact with the first roller Gui peeling tape and the second sheet can roll relative to the sheet surface forming a gap, so that the peeling tape can be partially between said first and second rollers relaxation, when the surface of the sheet a surface of the release sheet is peeled off the object to form an angle peel angle between the second roller and the sheet peeling tape to a direction reversed bending initial peel off to form an angle, can be at the beginning of the 剥离角度剥离片后,以比所述初期剥离角度小的后期剥离角度剥离片。 After peeling angle of release sheet, a small initial peel angle than the angle of post-release release sheet.
3. 如权利要求1或2所述的片剥离装置,其特征在于,所述剥离对象物是半导体晶片,所述片是保护半导体晶片的面的保护片。 3. A sheet peeling apparatus of claim 1 or claim 2, wherein the release object is a semiconductor wafer, the protective sheet is a semiconductor wafer surface protection sheet.
4. 一种片剥离装置,具有支承半导体晶片的剥离用台和片剥离单元;该半导体晶片在电路面具有凸块,同时,在该电路面粘贴有片的一个面;该片剥离单元设置在该剥离用台的上方,同时,可沿所述半导体晶片的片粘贴面相对移动;能够通过将从该片剥离单元输出的剥离用带与所述片粘接并进行巻绕而剥离该片,其特征在于,所述片剥离单元包括:剥离用带的供给部、所述剥离用带的巻绕部、和位于所述供給部及巻绕部之间的剥离头;该剥离头包括:使剝离用带与片的面粘接的第一辊、和相对该第一辊隔开规定间隔并列设置并且当巻挂于所述第一辊的剥离用带与片接触时能够相对该片的面形成间隙的第二辊,能够使所述第一辊和第二辊之间的剥离用带局部松弛,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时, A sheet peeling device having a peeling sheet peeling unit support table and the semiconductor wafer; bumps of the semiconductor wafer having a circuit surface, while the circuit surface of the adhesive sheet has a surface; sheet separation unit provided the top of the peeling station at the same time, the sheet may be attached along the surface of the semiconductor wafer relative movement; sheet can be peeled off by peeling the sheet from the output unit with the peeling tape and adhesive sheet about Volume, wherein the sheet separation unit comprises: peeling tape supplying section, the tape peeling Volume wound portion, and peeling head positioned between the supply portion and the portion around the Volume; the peeling head comprising: when peeling the first adhesive tape roll surface and the sheet, and spaced apart a predetermined interval relative to the first roller and disposed in parallel to said first hanging when Volume peeling tape roll in contact with the sheet the sheet can be relatively a second surface forming the nip, it is possible to make a partial peeling tape slack between said first and second rollers, the surface in the one surface of the sheet with a release sheet is peeled off the object angle was set to peel angle, 第二辊和片之间使剥离用带向翻转的方向弯折而形成初期剥离角度,能够在以所述初期剥离角度剥离片后,以比所述初期剥离角度小的后期剥离角度剥离片。 The peeling tape is bent in a direction between the reversing roller and the second sheet to form the initial peel angle, it is possible to after the initial peel angle of release sheet, the initial peel angle than post-peeling angle smaller release sheet.
5. 如权利要求l、 2或4所述的片剥离装置,其特征在于,还包括调整所述剥离头和所述剥离用台的相对距离的距离调整装置,在所述剥离头从剥离对象物的端部向内侧对片进行初期剥离时, 所述距离调整装置保持与将所述剥离用带粘贴在片上时大致相同的相对距离,另一方面,在初期剥离完成后至完全剥离之前的期间,扩大所述相对距离,将所述剥离头保持在离开剥离对象物的方向。 L as claimed in claim 5. The sheet peeling apparatus of claim 2 or 4, characterized by further comprising adjusting the peeling of the peeling head and adjusting the relative distance of the station from the apparatus, the object is peeled off from the peeling head when the end portion of the sheet was peeled off for initial inward, said distance adjusting means to maintain substantially the same distance relative to the release tape attached to the sheet, on the other hand, to complete the peeling completion prior to initial peel during expansion of the relative distance, the peeling head holder in a direction away release the object.
6. —种片剥离方法,将剥离用带与一个面被粘贴在受到剥离用台支承的剥离对象物的面上的片粘接,剥离所述片,其特征在于,在所述片上粘接剥离用带,而且,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,在剥离对象物的端部位置向翻转的方向弯折剥离用带,形成初期剥离角度,以所述初期剥离角度从剥离对象物的端部剥离片的端部,在巻绕被弯折的剥离用带时,形成比所述初期剥离角度小的后期剥离角度,保持该后期剥离角度地剥离所述片。 6. - The method of the kinds of films peeled off, the peeling tape is stuck to one surface of the release sheet bonding surface by peeling the support of the object table, the release sheet, wherein the adhesive on the sheet peeling tape, and, when the surface of the sheet a surface of the release sheet is peeled off the object to form an angle peel angle, the direction reversal is bent end position release the object when peeled off with tape, the initial peel angle is formed, the initial end portion of the peel angle from the end portion of the release sheet was peeled off the object, and is bent around in Volume tape peeling, the peel angle than the initial formation of a small late peel angle was maintained at the post-peeling the release sheet angularly.
7. 如权利要求6所述的片剥离方法,其特征在于,所述剥离对象物是半导体晶片,所述片是保护半导体晶片的面的保护片。 7. A sheet peeling method according to claim 6, wherein the release object is a semiconductor wafer, the protective sheet is a semiconductor wafer surface protection sheet.
8. —种片剥离方法,在被剥离用台支承的半导体晶片的电路面上形成有凸块,并且,在一个面被粘贴于该电路面的片上粘贴剥离用带而将片剥离,其特征在于,使所述剥离用带粘接在晶片的端部位置,在停止剥离用带的巻绕动作的状态下,对输出侧的剥离用带向与巻绕方向相反的一侧施加拉力,将输出侧的剥离用带一点一点地输出以使剥离用带产生松弛,在将所述片的所述一个面与该片被剥离的剥离对象物的面所呈的角度设为剥离角度时,将剥离用带向翻转的方向弯折从而形成初期剥离角度,接着,以所述初期剥离角度巻绕剥离用带,剥离片的端部,然后,巻绕所述被弯折的部分而形成比所述初期剥离角度小的后期剥离角度,以该后期剥离角度剥离所述片。 8. - kind of sheet peeling method, the circuit surface of the semiconductor wafer is peeled off the support table is formed with bumps, and are bonded to one adhesive face of the peeling tape and the release sheet on the surface of the circuit chip, characterized in wherein, the peeling tape adhered to the end position of the wafer, the tape for peeling Volume stopping the operation state around the peeling of the side opposite to the output side of the tensile force to the belt winding direction and Volume, the peeling tape output side little by little so that the output of the peeling tape slack, the surface of the sheet in a surface of the release sheet is peeled off the object to form an angle peel angle , folded in the direction of the peeling tape so as to form the reversed initial peel angle, then the angle to the initial peel Volume tape around the stripped end portions, the release sheet, then forming the bent portion of about Volume smaller than the initial peel angle peel angle post, the post to release the sheet peel angle.
9. 如权利要求6、 7或8所述的片剥离方法,其特征在于,在将剥离用带粘贴在片上时以保持对剥离对象物施加按压力的相对距离的状态巻绕所述剥离用带,进行所述片的初期剥离,然后,在扩大所述相对距离而使所述剥离头从剥离对象物离开的状态下,将所述片从剥离对象物完全剥离。 9. The sheet peeling method 6, 7 or claim 8, wherein, when the peeling tape to the sheet while holding the pressing force is applied to the relative distance of the object of peeling the peeling about Volume with, for initial release of the sheet, then expanding the relative distance from the state of the peeling head peeling away the object, the sheet is fully peeled from the release of the object.
CN 200580013436 2004-04-28 2005-04-27 Peeling device and peeling method CN100449701C (en)

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