CN1942071A - Display device, repairing structure for display device circuit and its production - Google Patents

Display device, repairing structure for display device circuit and its production Download PDF

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Publication number
CN1942071A
CN1942071A CN 200510112530 CN200510112530A CN1942071A CN 1942071 A CN1942071 A CN 1942071A CN 200510112530 CN200510112530 CN 200510112530 CN 200510112530 A CN200510112530 A CN 200510112530A CN 1942071 A CN1942071 A CN 1942071A
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Prior art keywords
lead
conductive pattern
display
circuit
fracture
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CN 200510112530
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CN100437223C (en
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黄雪瑛
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AU Optronics Corp
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AU Optronics Corp
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Abstract

The method comprises: using a mask to define a first wire on a baseplate, and the first wire has a fracture; then changing the position of the mask with a preset distance, and defining a second wire on the baseplate; one end of the second wire is connected to the one end of first wire; forming an insulation pattern to cover the fracture of the wires, and forming a conducting pattern on the insulation pattern. The layout made by invention can be used as the repairing line between any two circuit components in display; when the insulation pattern is burned, the conducting pattern touches the wires and connects them.

Description

The repair structure of display, display circuit and manufacture method thereof
Technical field
The present invention relates to a kind of structure and manufacture method thereof of display circuit cabling, the repair wire structure and the manufacture method thereof of particularly a kind of display, display circuit.
Background technology
Circuit trace on circuit board or the display pannel may be discontinuous line pattern because of the difference of design.When a part of a circuit trace need be designed to disconnect, for example repair line (Rescue Line), holding wire, scan line etc.If gap is not coincident with the repeated exposure place, then inconvenient method with existing stepping repeated exposure forms cabling.
Reparation line with active display is that example is described as follows: have a pel array on the substrate of active display, this pel array is made up of a plurality of mutually perpendicular data wires and scan line.As switch, the source electrode of this thin-film transistor and drain electrode are connected to the data wire and the scan line of this pixel cell respectively to each pixel cell in the pel array with a thin-film transistor.When data wire or scan line fracture, signal can't cause picture quality to reduce by the line feed-in of fracture.Therefore, United States Patent (USP) discloses one for No. 4807973 and repairs line to rebuild the data wire or the scan line of fracture.
Please refer to Fig. 1, be the repair wire structure of existing display circuit.Display 10 comprises a plurality of scan lines 1, a plurality of data wire 2 and a reparation line 7.Scan line 1 forms a plurality of pixel cells perpendicular to data wire 2, and the zone at this a plurality of pixel cells place is called active region (Active area).Repair line 7 and be separated into two line segment 7a and 7b with fracture 6, and separately around a part of active region.As shown in the figure, display 10 has two breakaway poing 3a of place and 3b, and wherein breakaway poing 3a is positioned at line segment 7a institute region surrounded, and breakaway poing 3b is positioned at line segment 7b institute region surrounded.The circuit of breakaway poing 3a and 3b both sides is connected to line segment 7a and 7b by an electric conducting material 8 respectively, and signal is able to by line segment 7a and 7b feed-in geosutures.
For example, when scan line 1 did not rupture, the signal of telecommunication was opened all pixel cells on the scan line 1 by scan line 1 end points 9a to another end points 9b transmission.But during scan line 1 fracture, the signal of telecommunication can only be opened the pixel cell between end points 9a and the breakaway poing 3a.At this moment, as long as with electric conducting material 8 end points 9a and end points 9b are connected to line segment 7a, then the signal of telecommunication can be passed to pixel cell between end points 9b and the breakaway poing 3a by line segment 7a.
If the structure that will make line segment 7a and 7b on a large size panel utilizes a small size mask to make the stepping repeated exposure to obtain preferable exposure efficiency usually.Yet if the pattern on the mask is a continuous line segment, the stepping repeated exposure can't produce fracture 6.If the pattern on the mask is a discontinuous line segment, then the result of stepping repeated exposure will produce a plurality of fractures 6 in the position that should not disconnect.But do not disclose series of solutions in the prior art.In addition, the circuit that disconnects the position periphery may be irregular pattern, must cooperate these irregular patterns to design the mask of different pattern in addition this moment and causes trouble in the manufacturing.Therefore, the present invention proposes a kind of repair wire structure and manufacture method solves above-mentioned shortcoming.
Summary of the invention
The object of the present invention is to provide the repair structure and the manufacture method thereof of a kind of display, display circuit, in order to make discontinuous circuit trace apace, this circuit trace comprises: a disconnection portion, this disconnection portion provide a kind of mechanism that path or maintenance are opened circuit that optionally forms.
The invention provides a kind of repair structure of display circuit, this repair structure comprises: one first conductive pattern, an insulating barrier and one second conductive pattern.This first conductive pattern is in order to connecting two circuit elements, and has a fracture and intercept between this two circuit element.This insulating barrier covers this fracture, and this second conductive pattern is positioned on this insulating barrier.When this insulating barrier during by burn through, this first conductive pattern is electrically connected at this second conductive pattern so that the electrical signal transfer between this two circuit element to be provided.
The present invention also provides a kind of manufacture method of repair structure of display circuit, it is a kind of manufacture method of circuit trace, utilize simple mask pattern to carry out the stepping repeated exposure and make a kind of circuit trace, its step comprises: at first, define one first lead on a substrate by a mask, and make this first lead comprise a fracture; This mask is moved a preset distance, define one second lead again on this substrate, make this second lead identical, and control this preset distance one end of this two lead is contacted with this first lead essence; Form an insulating pattern subsequently covering the fracture of these leads, and form a conductive pattern on this insulating pattern.
The present invention also provides a kind of display, it is characterized in that, comprising: a pel array is arranged on the substrate; One driver element is arranged at a side of described pel array, and is electrically connected to described pel array; And one repair line, comprising: a lead, and the one end is connected to described driver element, and the other end is connected to described pel array, and has a fracture and intercept between described driver element and described pel array; One insulating barrier covers described fracture; And a conductive layer, be positioned on the described insulating barrier.
Beneficial effect of the present invention is, can make discontinuous circuit trace apace, and making the disconnection portion of this circuit trace be formed at the precalculated position, this disconnection portion provides a kind of mechanism that path or maintenance are opened circuit that optionally forms, and makes this circuit trace keep elasticity on using.
Description of drawings
Fig. 1 is the repair wire structure of existing display circuit;
Fig. 2 A is the reparation line allocation plan of display circuit;
Fig. 2 B is the display circuit of another pattern;
Fig. 3 A is the open circuit A-A ' profile of portion of Fig. 2;
Fig. 3 B is Fig. 3 A portion of opening circuit vertical view of conducting state not;
Fig. 3 C is the open circuit vertical view of portion's conducting state of Fig. 3 A;
Fig. 4 A-4D is the manufacturing step of circuit trace of the present invention;
Fig. 5 is for using the display of circuit trace of the present invention, and this circuit trace is a plurality of according to line in order to repair;
Fig. 6 is for using the display of circuit trace of the present invention, and this circuit trace is in order to repair scan line.
The main element symbol description
Scan line 1 is repaired line 25d data wire 2 breakaway poing 3a
Breakaway poing 3b fracture 6 breakaway poing 6a repair line 7
Line segment 7a, 7b electric conducting material 8 scan line end points 9a scan line end points 9b
Display 10 display circuits 20 display circuit 20a, 20b
Thin-film transistor 21 active regions 22 data-driven unit 23,23 '
Data wire 231,231a, 231b, 231c scan drive cell 24,24 '
Repair line 25,25a, 25b, 25c first conductive pattern 2511
The first lead 2511a, the second lead 2511b
The 251a of portion that opens circuit, 251b, 251c, 251d, 251e, 251f
Second conductive pattern, 2512 insulating barriers, insulating pattern 2513
Fracture 2514 protective layers 2515 burn throughs are put 2,516 first masks 30
Second mask 40 the 3rd mask, 50 displays, 60 pel arrays 61
Data wire 611 scan lines 612 substrates 62 amplifying circuits 63
Overlapping part 64 displays 70
Embodiment
Cooperate icon that the circuit trace structure and the manufacture method thereof of display of the present invention are described in detail in detail, and enumerate preferred embodiment and be described as follows:
Please refer to Fig. 2 A, be the reparation line allocation plan of display circuit.The circuit structure 20a of one display pannel comprise a plurality of thin-film transistors 21 be positioned at an active region 22, data-driven unit 23,23 ' and scan drive cell 24,24 ' be located at around the active region 22, and electrically connect with thin-film transistor 21.One repairs line 25 is surrounded on around the active region 22 connecting data driver element 23,23 ' or scan drive cell 24,24 ', and extends into active region 22.
At display circuit 20a not during fault, data-driven unit 23,23 ' and thin-film transistor 21 between or scan drive cell 24,24 ' and thin-film transistor 21 between reparation line 25 must keep off states.In the present embodiment, repair line 25 respectively around the first half and the Lower Half of active region 22 for two, its line segment that extends into active region 22 has a plurality of 251a-251f of portion that open circuit, and across a plurality of data wires 231.By the design of the portion 251a-251f position of opening circuit, active region 22 can be divided into a plurality of reparations district, each is repaired the district and provides repair mechanism by the different sections of repairing line 25.What deserves to be mentioned is, the structure of the 251a-251f of portion that opens circuit can be optionally in addition burn through make its conducting.For example, selection will be opened circuit the 251a of portion and 251c conducting and the portion 251b of opening circuit when still remaining stationary, and about then promptly being divided into around the reparation line 25 of active region 22 first halves two sections, be responsible for the circuit reparation of active region 22 first halves left side and right side area respectively.
Please refer to Fig. 2 B, be the circuit structure 20b of another kind of display pannel.When making large size panel, the data wire 231 among Fig. 2 A may be designed to as independent disjunct data wire 231a and data wire 231b among Fig. 2 B.See it by vertical view, the end of data wire 231a and 231b is interlaced with each other with reparation line 25, but its side cross-section structure separates with insulating barrier each other for overlapping up and down.Thereby under normal condition, data wire 231a does not link to each other in fact with reparation line 25 with 231b.In Fig. 2 A and 2B, the better position of the 251a-251f of portion that opens circuit for example opens circuit the 251b of portion between data wire 231a and data wire 231c between two parallel data wires 231.Open circuit the 251a-251f of portion the formation method and be configured to emphasis of the present invention, describe in detail as after.
Please refer to Fig. 3 A-3B, Fig. 3 A is the A-A ' profile of the 251c of portion of opening circuit.The portion 251c of opening circuit comprise one first conductive pattern 2511, one second conductive pattern 2512 and an insulating barrier 2513 between first conductive pattern 2511 and second conductive pattern 2512 to intercept both signals of telecommunication.First conductive pattern 2511 is formed at the metal level on the substrate, has a fracture 2514.Insulating barrier 2513 is across on the fracture 2514, is overlapped in fracture 2514 both sides with first conductive pattern 2511.Second conductive pattern 2512 is formed at the metal level of insulating barrier 2513 tops, covers thereon with a protective layer 2515 usually.
Please refer to Fig. 3 B, when regular link does not have fault, must not enable and repair line 25, vertical view such as Fig. 3 B of the 251c of portion that opens circuit this moment.First conductive pattern 2511 can extend to the left and right and form a Wiring construction, and 2512 of the insulating barrier 2513 and second conductive patterns are the arbitrary graphic pattern that strides across fracture 2514.
Please refer to Fig. 3 C, desire to enable when the regular link fault when repairing line 25, can provide a laser energy burn through insulating barrier 2513 with conducting second conductive pattern 2513 and first conductive pattern 2511, burn through position 2516 is positioned at fracture 2514 both sides among the figure.Please be simultaneously with reference to Fig. 3 A, if it is breakdown because of insulating barrier 2513 to be positioned at second conductive pattern 2513 of insulating barrier 2513 tops, melt metal contacts with first conductive pattern 2511 and makes the 251c of the portion conducting of opening circuit.
By display on the whole, first conductive pattern 2511 has and connects thin-film transistor 21, data-driven unit 23,23 ' or the contact of scan drive cell 24, circuit element such as 24 '.First conductive pattern 2511 is designed to discontinuous pattern or Wiring construction and forms fracture 2514 intercept between between thin-film transistor 21 and the scan drive cell 24,24 ' or thin-film transistor 21 and data-driven unit 23,23 '.First conductive pattern 2511 and second conductive pattern, 2512 materials can be selected different metal, and for example first conductive pattern 2511 can be selected the less metal of resistance, and second conductive pattern 2512 can select to be fit to the metal of burn through.Insulating barrier 2513 can form by dielectric materials such as deposited silicon nitrides.
Please refer to Fig. 4 A-4D, be the manufacturing step of above-mentioned reparation line 25.Owing to be illustrated with Wiring construction, above-mentioned first conductive pattern 2511 is called lead in the following description, and insulating barrier 2513 is called insulating pattern, and second conductive pattern 2512 still claims conductive pattern.At first, design one broken string pattern is on one first mask 30.Fig. 4 A for another example, with first mask, 30 definition, one first lead 2511a on substrate and form fracture 2514.As Fig. 4 B, with 30 steppings of first mask move (as the direction of arrow) preset distance after, define one second lead 2511b again on substrate.The second lead 2511b and the first lead 2511a are except the position is different, and shape, material are all identical.
By the adjustment of displacement, this two lead 2511a is connected or divergence mutually with the end of 2511b.For example, identical with the first lead 2511a length or when displacement less than the width of first mask 30 on moving direction, or during less than the length of the first lead 2511a, the defined second lead 2511b may contact with the first lead 2511a.When displacement greater than first mask 30 on moving direction width or during greater than the length of the first lead 2511a, the defined second lead 2511b does not contact with the first lead 2511a.
Then, design a blocky on one second mask 40, move to stepping (as the direction of arrow) second mask 40 and cover these leads 2511a, the fracture 2514 of 2511b to form an insulating pattern 2513 as Fig. 4 C.As Fig. 4 D, design another blocky on one the 3rd mask 50, move to stepping the 3rd mask 50 to form a conductive pattern 2512 on insulating pattern 2513.Like this then finish the structure of the 251c of portion that opens circuit.
Please refer to Fig. 5, a display 60 comprises a pel array 61, a data-driven unit 23 and 23 ', one scan driver element 24 and 24 ', a data wire 611, one scan line 612 and four reparation line 25a one 25d.Pel array 61 is arranged on the substrate 62, data-driven unit 23,23 ' and scan drive cell 24,24 ' be arranged at a side of pel array 61, and be electrically connected to pel array 61 with data wire 611 and scan line 612 respectively.Arbitrary reparation line 25a-25d includes the portion that opens circuit 251 structures of repairing line 25 as the aforementioned.Please be simultaneously with reference to Fig. 2 and Fig. 3 A-3C, lead 2511 can be selected across the viewing area or only be located at the periphery, viewing area.
Before repairing, the repair wire structure of display 60 is shown in Fig. 2 B.Repair line 25a, 25b, 25c, 25d all across one or more data wire 611, when the normal data lines 611 in zone, display 60 lower left has a breakaway poing 6a, the 251e of portion that opens circuit keeps off state with the laser burn through with the 251d of the portion that opens circuit of Fig. 2 B, the reparation line 25c that then forms Fig. 5 as data wire 611 faults after best signaling path.After will repairing overlapping part 64 burn throughs of line 25c and data wire 611 again, then can smoothly source signal be passed to the data line segment of fault.Because after the insulating barrier 2513 of reparation line 25c was got through, the resistance ratio regular link was big, so lead 2511 must be connected to an amplifying circuit 63, the signal that makes data-driven unit 23 ' is earlier by being passed in the thin-film transistor 21 after amplifying circuit 63 amplifications again.
Reparation line 25 shown in Figure 5 be applied to data-driven unit 23,23 ' and thin-film transistor 21 between.After lead 2511 and overlapping part 64 processes were repaired, data-driven unit 23 ' was by repairing the source terminal S that line 25c is electrically connected to thin-film transistor 21.
Yet, to repair line 25 and also can be applicable to repair scan line 612, its structure please refer to Fig. 6.In the display 70, an end of repairing line 25 is connected to amplifying circuit 63 and scan drive cell 24,24 ' earlier; The other end then extends into active region, and across one or more scan line 612.As previously mentioned, according to trouble location select the suitable portion that opens circuit 251 in addition burn through enable the part section of repairing line and repair scan line 612, and the better position of the portion 251 that opens circuit also is located between two parallel scanning beams 612.
Compare with prior art, the present invention can make discontinuous circuit trace apace, and making the disconnection portion of this circuit trace be formed at the precalculated position, this disconnection portion provides a kind of mechanism that path or maintenance are opened circuit that optionally forms, and makes this circuit trace keep elasticity on using.
Though the structure and the manufacture method that more than describe in detail to repair line are embodiment, are not to be used to limit protection scope of the present invention, allly do not break away from equivalence of the present invention and implement or change, all should be contained in the protection range originally.For example, have disconnection portion circuit trace, all can use manufacture method of the present invention so long as must form on circuit board or the display pannel.

Claims (19)

1. the repair structure of a display circuit is characterized in that, comprising:
One first conductive pattern in order to connecting two circuit elements, and has a fracture and intercepts between described two circuit elements;
One insulating barrier covers described fracture; And
One second conductive pattern is positioned on the described insulating barrier, and when described insulating barrier during by burn through, described first conductive pattern is electrically connected at described second conductive pattern so that the electrical signal transfer between described two circuit elements to be provided.
2. structure as claimed in claim 1 is characterized in that, described two circuit elements are a thin-film transistor and one scan driver element.
3. structure as claimed in claim 1 is characterized in that, described two circuit elements are a thin-film transistor and a data-driven unit.
4. structure as claimed in claim 1 is characterized in that, described first conductive pattern is a Wiring construction.
5. structure as claimed in claim 1 is characterized in that, described first conductive pattern and the described second conductive pattern material are selected different metal.
6. structure as claimed in claim 1 is characterized in that, comprises that also a protective layer is on described second conductive pattern.
7. the manufacture method of the repair structure of a display circuit is characterized in that, comprising:
Define one first lead on a substrate with a mask, wherein said first lead comprises a fracture;
Described mask is moved a preset distance;
Define one second lead on described substrate with described mask, described second lead is identical with the described first lead essence;
Form an insulating pattern to cover the described fracture of described lead; And
Form a conductive pattern on described insulating pattern.
8. method as claimed in claim 7 is characterized in that, described mask is moved a preset distance after, formed described second lead contacts with an end of described first lead.
9. method as claimed in claim 7 is characterized in that, also comprises the described insulating barrier of burn through so that described lead is electrically connected at described conductive pattern.
10. method as claimed in claim 9 is characterized in that, the step of the described insulating barrier of burn through also comprises provides a laser energy.
11. method as claimed in claim 7 is characterized in that, described preset distance is identical with described first conductor length.
12. method as claimed in claim 7 is characterized in that, the step that forms described insulating barrier comprises that also deposition one dielectric material is on described fracture.
13. a display is characterized in that, comprising:
One pel array is arranged on the substrate;
One driver element is arranged at a side of described pel array, and is electrically connected to described pel array; And
One repairs line, comprising:
One lead, the one end is connected to described driver element, and the other end is connected to described pel array, and has a fracture and intercept between described driver element and described pel array;
One insulating barrier covers described fracture; And
One conductive layer is positioned on the described insulating barrier.
14. display as claimed in claim 13 is characterized in that, described lead is connected to an amplifying circuit, is connected to described driver element by described amplifying circuit again.
15. display as claimed in claim 13 is characterized in that, described reparation line extends partially in the described pel array region for part is laid in described pel array periphery.
16. display as claimed in claim 13 is characterized in that, described driver element is the one scan driver element.
17. display as claimed in claim 16 is characterized in that, described scan drive cell connects a plurality of scan lines, and described reparation line is across at least one described scan line.
18. display as claimed in claim 13 is characterized in that, described driver element is a data-driven unit.
19. display as claimed in claim 18 is characterized in that, described data-driven unit connects a plurality of data wires, and described reparation line is across at least one described data wire.
CNB2005101125306A 2005-09-30 2005-09-30 Display device, repairing structure for display device circuit and its production Active CN100437223C (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104575366A (en) * 2013-10-15 2015-04-29 昆山工研院新型平板显示技术中心有限公司 Scanning driving circuit structure and OLED (organic light-emitting display)
CN104733496A (en) * 2013-12-23 2015-06-24 三星显示有限公司 Method Of Manufacturing Organic Light Emitting Display Apparatus
CN108962162A (en) * 2018-07-10 2018-12-07 武汉华星光电半导体显示技术有限公司 A kind of GOA circuit and embedded type touch control display panel
US11132968B2 (en) 2018-07-10 2021-09-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Gate on array circuit and built-in touch display panel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW300341B (en) * 1995-05-30 1997-03-11 Advanced Display Kk
TW594161B (en) * 2003-02-18 2004-06-21 Au Optronics Corp Flat panel display with repairable defects for data lines and the repairing method
JP4342969B2 (en) * 2004-01-30 2009-10-14 三菱電機株式会社 Display device and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104575366A (en) * 2013-10-15 2015-04-29 昆山工研院新型平板显示技术中心有限公司 Scanning driving circuit structure and OLED (organic light-emitting display)
CN104575366B (en) * 2013-10-15 2017-04-19 昆山工研院新型平板显示技术中心有限公司 Scanning driving circuit structure and OLED (organic light-emitting display)
CN104733496A (en) * 2013-12-23 2015-06-24 三星显示有限公司 Method Of Manufacturing Organic Light Emitting Display Apparatus
CN108962162A (en) * 2018-07-10 2018-12-07 武汉华星光电半导体显示技术有限公司 A kind of GOA circuit and embedded type touch control display panel
US11132968B2 (en) 2018-07-10 2021-09-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Gate on array circuit and built-in touch display panel

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