JP4342969B2 - Display device and manufacturing method thereof - Google Patents

Description

The present invention relates to a display device and a manufacturing method thereof .

  In an active matrix liquid crystal display device, a lateral electric field method in which the direction of an electric field applied to liquid crystal is a direction parallel to a substrate is mainly used as a technique for obtaining an ultra-wide viewing angle (Patent Document 1). ). It has been clarified that when this method is adopted, there is almost no change in contrast and inversion of gradation levels when the viewing angle direction is changed (Non-Patent Document 1). FIG. 6A is a plan view showing a pixel portion of a conventional general horizontal electric field type liquid crystal display device. FIG. 6B is an enlarged cross-sectional view of a part thereof. In the figure, 100 is a TFT array substrate, and 200 is a color filter (CF) substrate. Further, 1 is a gate wiring which is a plurality of scanning signal lines formed on an insulating substrate, 2 is a gate insulating film, 3 is a source wiring, 4 is an insulating film provided on the source wiring 3, 5a, 5b Is a common electrode provided in the same layer as the gate wiring. In particular, in this example, the common electrode 5 is arranged separately to the common electrode 5a and the common electrode 5b. Therefore, when a voltage is applied to the source wiring, an electric field E is generated by the voltage, and the alignment state of the liquid crystal provided between the TFT array substrate 100 and the CF substrate 200 is changed. For this reason, in the configuration shown in FIG. 6, the width shown by L1 in the drawing is required to be wide, and light transmission is restricted, so that the aperture ratio is low.

  In order to solve such a problem, a structure shown in FIGS. 7A and 7B has been proposed. In this structure, the common electrode 5 covers the source wiring 3 and is disposed so as to overlap each other. According to such a configuration, since the electric field generated from the source wiring 3 is blocked by the common electrode 5, the change in the alignment state of the liquid crystal can be reduced without reaching the liquid crystal. For this reason, the width | variety L2 which restrict | limits transmission of light can be narrowed, and an aperture ratio can be made high.

  In general, in a liquid crystal display device, a source wiring is disconnected at a certain probability, which causes a decrease in yield. Similarly, in the structure shown in FIG. 7, the source wiring 3 may be broken. Here, a method is disclosed in which when a disconnection occurs in a certain wiring, a short circuit is generated between the upper layer wiring by a laser and the disconnection is repaired (Patent Document 2). However, the source wiring 3 and the common electrode 5 cannot be short-circuited because the source signal flows on the common electrode 5.

  In order to solve this problem, the present applicant has disclosed a method for repairing the disconnection of the source wiring (Patent Document 3). In this method, in the pixel where the disconnection occurs, the portion where the source wiring and the common electrode overlap is short-circuited by irradiating the laser beam, and the separation region for disconnection repair around the pixel is irradiated with the laser beam to short-circuit the source wiring. The pattern is separated from the common electrode.

Further, in the horizontal electric field type liquid crystal display device, in order to reduce parasitic capacitance, an organic planarizing film is further provided between the source wiring 3 and the common electrode 5 in addition to the insulating film 4 as shown in FIG. There is. Since the organic planarizing film is usually 2 to 3 μm in thickness, it is difficult to short-circuit the source wiring 3 and the common electrode 5 with a laser. As described above, the conventional liquid crystal display device has a problem that it is difficult to repair the source wiring beyond the organic film.
JP-A-8-254712 Japanese Patent Application Laid-Open No. 9-113930 JP 2003-307748 A M. Oh-e, etc., Asia Display '95, pp. 577-580

As described above, the conventional lateral electric field liquid crystal display device has a problem that it is difficult to repair the source wiring beyond the organic film. Furthermore, even in a display device other than a liquid crystal display device, this problem may occur when the disconnection is repaired beyond the organic film disposed between the first conductive layer and the second conductive layer. .
The present invention has been made in view of such problems, and an object of the present invention is to provide a display device that can be easily repaired and a method for manufacturing the same.

  The display device according to the first aspect of the present invention is provided on the first conductive layer (for example, the source wiring 3 in the present embodiment) provided on the substrate and the first conductive layer. Insulating film (for example, insulating film 4 in the present embodiment), an insulating organic film (for example, organic planarizing film 9 in the present embodiment) formed on the insulating film, and the organic insulating film And a second conductive layer that overlaps the first conductive layer in a certain region (for example, a common electrode in this embodiment), and the first conductive layer and the second conductive layer In the region where the layers overlap, a disconnection repair region from which the organic film has been removed (for example, disconnection repair regions 51 and 51 in the present embodiment) is formed on the insulating film. Thereby, the disconnection of the display device can be easily repaired.

  A display device according to a second aspect of the present invention is the display device described above, wherein the organic film is removed so that the insulating film is exposed in the disconnection repair region. Thereby, the disconnection of the display device can be easily repaired.

  A display device according to a third aspect of the present invention is the display device described above, wherein a part of the organic film is removed and the organic film is thinned in the disconnection repair region. Thereby, the disconnection of the display device can be easily repaired.

  A display device according to a fourth aspect of the present invention is the display device described above, wherein one or more disconnection repair regions are formed for almost all pixels. Thereby, the disconnection in each pixel can be easily repaired.

  A display device according to a fifth aspect of the present invention is the above-described display device, wherein the second pixel in the repaired pixel is outside the overlapping region where the first conductive layer and the second conductive layer overlap. The connection between the first conductive layer and the second conductive layer in another pixel can be separated. Thereby, it is possible to repair the disconnection without affecting other pixels.

  A display device according to a sixth aspect of the present invention is the above-described display device, wherein the first conductive layer is a source line, and the second conductive layer is a common electrode disposed to face the pixel electrode. And a lateral electric field type liquid crystal display device in which liquid crystal is driven in a direction parallel to the substrate by a display signal supplied to the pixel electrode through the source wiring.

  A method for manufacturing a display device according to a seventh aspect of the present invention includes a step of forming a first conductive layer on a substrate, a step of forming an insulating film on the first conductive layer, and the insulating film Forming an insulating organic film on the insulating film; removing the organic film on the insulating film to provide a disconnection repairing area; and a second overlapping with the first conductive layer in a certain area. Forming a conductive layer on the organic film; and conducting the first conductive layer and the second conductive layer formed in the disconnection repair region. Thereby, disconnection can be easily repaired.

  A method for manufacturing a display device according to an eighth aspect of the present invention is the above-described display device, wherein in the step of connecting the first conductive layer and the second conductive layer, a laser beam is irradiated. The first conductive layer and the second conductive layer are electrically connected.

  A display device manufacturing method according to a ninth aspect of the present invention is the display device described above, wherein one or two of the disconnection repair regions are formed for almost all pixels. Is. Thereby, the disconnection in each pixel can be repaired.

  A method for manufacturing a display device according to a tenth aspect of the present invention is the above-described display device, wherein the first conductive layer and the second conductive layer are electrically connected in a plurality of disconnection repair regions. It is characterized by bypassing a disconnection portion arranged between the disconnection repair regions. Thereby, a disconnection location can be bypassed easily.

  According to an eleventh aspect of the present invention, there is provided a method for manufacturing a display device according to the above-described display device, wherein the first conductive layer and the second conductive layer are out of an overlapping region where the repaired pixel is outside the overlapping region. A disconnection repair isolation region capable of isolating the connection between the second conductive layer and the second conductive layer in another pixel, and cutting the second conductive layer in the disconnection repair isolation region; The step of performing is further provided. Thereby, it is possible to repair a pixel in which a disconnection has occurred without affecting other pixels.

  A display device manufacturing method according to a twelfth aspect of the present invention is the above-described display device, wherein in the step of cutting the second conductive layer, the second conductive layer is formed by irradiating a laser beam. It is characterized by cutting.

  A display device manufacturing method according to a thirteenth aspect of the present invention is the above-described display device, wherein the organic film is formed of a photosensitive resin. Thereby, a disconnection repair region can be easily formed.

  ADVANTAGE OF THE INVENTION According to this invention, the display apparatus which can repair a disconnection easily, and its manufacturing method can be provided.

Hereinafter, embodiments to which the present invention can be applied will be described. The following description is to describe the embodiment of the present invention, and the present invention is not limited to the following embodiment. For clarity of explanation, the following description is omitted and simplified as appropriate. Further, those skilled in the art will be able to easily change, add, and convert each element of the following embodiments within the scope of the present invention. In addition, what attached | subjected the same code | symbol in each figure has shown the same element, and abbreviate | omits description suitably.
Embodiment 1 of the Invention

  In the liquid crystal display device according to the present invention, a pair of CF substrates and a TFT array substrate are arranged to face each other at a certain distance. A liquid crystal layer is sandwiched between these substrates. On the TFT array substrate, gate wirings and source wirings are formed so as to cross each other via a gate insulating film. Further, a switching element such as a thin film transistor connected to the gate wiring and the source wiring is formed. In addition, a comb-like pixel electrode including a plurality of electrodes provided in parallel with the source wiring is connected to the switching element. Furthermore, a comb-like common electrode is formed which includes a plurality of electrodes arranged in parallel and alternately with the plurality of electrodes of the pixel electrode. By applying a voltage between the pixel electrode and the common electrode, an electric field substantially parallel to the substrate surface is applied to the liquid crystal layer.

  FIG. 1 is an enlarged view of a plurality of pixel portions in a liquid crystal display device according to the present invention. In the figure, the configurations denoted by the same reference numerals as those in FIGS. 6, 7, and 8 are the same as or equivalent to the configurations described in FIGS. 6, 7, and 8, and description thereof is omitted.

  In FIG. 1, reference numeral 3 denotes a source wiring, which extends in a direction substantially perpendicular to the direction of an electric field generated between a common electrode 5 and a pixel electrode 6 (described later) at an end of one pixel. The film thickness of the source wiring 3 is, for example, 400 nm to 500 nm. Reference numeral 5 denotes a comb-like common electrode composed of a plurality of electrodes arranged in parallel and alternately with a plurality of electrodes of a pixel electrode 6 to be described later, and is also called a counter electrode. The film thickness of the common electrode 5 is, for example, 100 nm. Reference numeral 6 denotes a comb-like pixel electrode connected to the thin film transistor and composed of a plurality of electrodes provided in parallel with the source wiring 3, and is made of a metal such as chromium (Cr) or transparent such as ITO (Indium Tin Oxide). It is formed of a conductive film. Reference numeral 7 denotes a common capacitance wiring made of a metal such as chromium (Cr), and is connected to the common electrode 5 through a through hole. In this example, the source wiring 3, the common electrode 5, and the pixel electrode 6 are bent once at the center. The bending point is provided in the common capacitor wiring 7. In this manner, the bent electrode configuration can obtain two directions of liquid crystal driving directions, and can improve the deterioration of viewing angle characteristics that occur in a specific direction in a horizontal electric field type liquid crystal panel.

  As shown in FIG. 1, the source line 3 and the common electrode 5 provided between pixels adjacent in the horizontal direction, which is the direction in which the electric field is generated, overlap each other. In other words, the common electrode 5 is provided on the source wiring 3 so as to overlap the source wiring 3 via the insulating film 4 and the organic planarizing film 9.

  In the structure shown in FIG. 1, a case where a disconnection occurs in the region 31 on the source wiring 3 will be described. This region 31 is a region where the common electrode 5 and the source wiring 3 are overlapped between pixels adjacent in the horizontal direction. In this case, first, the laser beam is irradiated to the common electrode 5 in the disconnection repair region 51 and the disconnection repair region 52 from the common electrode 5 side. Here, the disconnection repair regions 51 and 52 are regions where the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction overlap, and are regions where the region 31 is sandwiched. In the disconnection repair regions 51 and 52, at least a part of the organic planarizing film 9 is removed. As this laser, for example, a YAG laser or an excimer laser is used. Thus, the metal of the common electrode 5 is melted in the disconnection repair region 51 and the disconnection repair region 52, the insulating film 4 is dielectrically broken, and the source wiring 3 and the common electrode 5 are processed so as to be in a conductive state. Such disconnection correction is performed, for example, after the array inspection process or the panel inspection process.

  FIG. 2 shows a cross-sectional view of the portion where the disconnection has occurred. As described above, in the TFT array substrate according to this example, the source wiring 3, the insulating film 4, the organic planarizing film 9, and the common electrode 5 are stacked on the gate insulating film 2. Here, the insulating film 4 is made of, for example, silicon nitride or silicon oxide and has a thickness of about 100 nm to 300 nm. The thickness of the organic planarizing film 9 is 2 to 3 μm, and for example, a photosensitive acrylic resin is used.

  In this example, as shown in FIG. 2A, a disconnection occurs in the region 31 of the source wiring 3. In the present embodiment, the organic planarization film 9 is removed in the disconnection repair region 51 and the disconnection repair region 52 in order to repair the disconnection in the region 31. In the portion where the organic planarizing film 9 is removed, the insulating film 4 is exposed and an opening is formed. Since the common electrode is formed from above the opening, the insulating film 4 and the common electrode 5 are in contact with each other. In the structure shown in FIG. 2A, the conductive layer of the common electrode 5 in the disconnection repair region 51 and the disconnection repair region 52 is melted by using a laser, the insulating film 4 is dielectrically broken, and the source wiring 3 is brought into conduction. If it processes so that it may become, it will be processed into the structure shown in FIG.2 (b). In the structure shown in FIG. 2B, a source signal is applied to the disconnected source wiring 3 via a bypass path of the molten metal in the disconnection repair region 51, the common electrode 5, and the molten metal in the disconnection repair region 52.

Alternatively, as shown in FIG. 2C, the organic planarization film 9 may be thinned by removing a part of the organic planarization film 9 in the disconnection repair region 51 and the disconnection repair region 52 sandwiching the region 31. In this case, the insulating film 4 may be omitted. For example, the disconnection can be repaired by reducing the thickness of the organic planarizing film 9 having a thickness of 2 to 3 μm to about 0.5 μm. Even when the organic planarization film 9 is provided between the source wiring 3 and the common electrode 5 by providing the disconnection repair region in which at least a part of the organic planarization film 9 is removed, The disconnection can be easily repaired. It is desirable to provide at least one such disconnection repair region for each pixel. Thereby, it is possible to repair the pixel corresponding to the position where the disconnection has occurred and the adjacent pixel.
Further, it is desirable that the number of disconnection repair regions be two or less for each pixel. This is because if three or more disconnection repair regions are provided for one pixel, the parasitic capacitance increases. In addition, it is desirable to form one disconnection repair region with 10 μm ² or more and 100 μm ² or less (please let us know if there is a numerical value). This is because it is difficult to repair the disconnection when the disconnection repair region is 10 μm ² or less, and the parasitic capacitance increases when the disconnection repair region is 100 μm ² or more.

  Next, a laser beam is applied to the common electrode 5 in the region 531, the region 532, and the region 533 illustrated in FIG. 1 using a laser. Then, the common electrode 5 in these regions 531, 532, and 533 is cut. These regions 531, 532, and 533 function as disconnection repair isolation regions. Here, the region 531 is a region in which the overlapping portion of the common electrode 5 and the source wiring 3 between adjacent pixels in the horizontal direction can be separated from the common electrode 5 extending in the horizontal direction other than the overlapping portion. The region 532 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction can be separated from the common electrode 5 extending in the horizontal direction opposite to the region 531. . The region 533 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between the pixels adjacent in the horizontal direction and the common electrode 5 extending in the horizontal direction and connected to the common capacitor wiring 7 can be separated. is there. As a result, the common electrode 5 of the portion processed into the conductive state with the source wiring 3 by the irradiation of the laser beam in the disconnection repair region 51 and the disconnection repair region 52 is caused to generate an electric field between at least the pixel electrode 6. It can be electrically separated from the electrode 5. For this reason, no conductor such as the source wiring 3 is provided below the region 531, the region 532, and the region 533 of the common electrode 5, that is, below the disconnection repair isolation region. Since it has such a structure, it does not become conductive with other conductors even when irradiated with a laser beam. This disconnection repair isolation region is preferably a region where there is no other conductor supplying a potential different from that of the common electrode within 4 μm from the source wiring.

The laser beam applied to the region 531, the region 532, and the region 533 of the common electrode 5 may be the same and different in type and intensity as the laser beam applied to the disconnection repair region 51 and the disconnection repair region 52. It may be. For example, the laser beam applied to the region 531, the region 532, and the region 533 may have lower intensity than the laser beam applied to the disconnection repair region 51 and the disconnection repair region 52. Thus, when a disconnection occurs between the disconnection repair regions of one pixel, the disconnection can be repaired without affecting other pixels by bypassing the disconnection repair region of one pixel.
Embodiment 2 of the Invention

  FIG. 3 is an enlarged view of a plurality of pixel portions in the liquid crystal display device according to the present invention. The configuration shown in the figure is the same as the configuration shown in FIG. 1, and only the disconnected portion of the source wiring 3 is different.

  In the structure shown in FIG. 3, a case where a disconnection occurs in the region 32 on the source wiring 3 will be described. The region 32 is a source wiring 3 between pixels adjacent in the horizontal direction, and is a region overlapping with the common electrode 5 in the central portion. In this case, first, the laser beam is irradiated to the common electrode 5 in the disconnection repair region 51 and the disconnection repair region 52 from the common electrode 5 side. Here, the disconnection repair regions 51 and 52 are regions where the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction overlap, and are regions where the region 32 is sandwiched.

  In the disconnection repair region 51 and the disconnection repair region 52, at least a part of the organic planarization film 9 is removed as in the first embodiment. Therefore, similarly to the configuration shown in FIG. 2A, an opening through which the insulating film 4 is exposed is provided in the organic planarization film 9 in the disconnection repair region 51 and the disconnection repair region 52. Or the organic planarization film | membrane 9 of the disconnection repair area | region 51 and the disconnection repair area | region 52 is thinned similarly to the structure shown in FIG.2 (c). Thus, the metal of the common electrode 5 in the disconnection repair region 51 and the disconnection repair region 52 is melted, the insulating film 4 is dielectrically broken, and the source wiring 3 and the common electrode 5 are processed to be in a conductive state. Thereby, it becomes the structure similar to the structure shown in FIG.2 (b), a disconnection area | region is bypassed, and a disconnection is restored. A source signal is applied to the disconnected source wiring 3 through a bypass path of the molten metal in the disconnection repair region 51, the common electrode 5, and the molten metal in the disconnection repair region 52.

  Next, a laser beam is applied to the regions 541, 542, and 543 of the common electrode 5 and the regions 71 and 72 of the common capacitor wiring 7 shown in FIG. Here, the region 541 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between adjacent pixels in the horizontal direction can be separated from the common electrode 5 extending in the horizontal direction. The region 542 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction can be separated from the common electrode 5 extending in the horizontal direction opposite to the region 531. The region 543 separates the overlapping portion of the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction and the common electrode 5 extending in the horizontal direction and extending in the vertical direction via the gate wiring 1. This is an area where The region 71 is a region in which the common electrode 5 and the overlapping portion of the source wiring 3 between the pixels adjacent in the horizontal direction and the common capacitor wiring 7 can be separated. Then, the common electrode 5 in these regions 541, 542, and 543 and the regions 71 and 72 in the common capacitor wiring 7 are cut. As a result, the common electrode 5 in a portion that is electrically connected to the source wiring 3 by irradiation of the laser beam in the disconnection repair area 51 and the disconnection repair area 52 is electrically separated from the other common electrode 5 and the common capacitor wiring 7. be able to. Therefore, a conductor such as the source wiring 3 is not provided below the region 541, the region 542, and the region 543 of the common electrode 5 and the region 71 of the common capacitor wiring 7. Since it has such a structure, it does not become conductive with other conductors even when irradiated with a laser beam.

As described above, even when the source wiring 3 is disconnected outside the disconnection repair region in one pixel, other pixels are affected by bypassing the disconnection portion between the disconnection repair regions of adjacent pixels. Disconnection can be repaired without any problems.
Embodiment 3 of the Invention

  FIG. 4 is an enlarged view of a plurality of pixel portions in the liquid crystal display device according to the present invention. The configuration shown in the figure is the same as the configuration shown in FIG. 1, and only the disconnected portion of the source wiring 3 is different.

  In the structure shown in FIG. 4, a case where a disconnection occurs in the region 33 on the source wiring 3 will be described. Here, the region 33 is in the vicinity of a portion where the source wiring 3 overlaps the semiconductor film of the switching element. That is, the region 33 is in the vicinity of the switching element. In the disconnection repair regions 51 and 52, the organic planarization film 9 is removed as in the above-described embodiment. That is, as in the above-described embodiment, an opening is formed in the organic planarization film 9 in the disconnection repair region as shown in FIG. 2 (a), or the thickness is reduced as shown in FIG. 2 (c). Has been. In this case, first, the laser beam is irradiated to the common electrode 5 in the disconnection repair region 51 and the disconnection repair region 52 from the common electrode 5 side. Here, the disconnection repair regions 51 and 52 are regions where the common electrode 5 and the source wiring 3 are adjacent to each other in the lateral direction, and are regions where the region 33 is sandwiched. As a result, the metal of the common electrode 5 is melted in the disconnection repair region 51 and the disconnection repair region 52, and the insulating film 4 is subjected to dielectric breakdown and processed so as to be conductive with the source wiring 3. A source signal is applied to the disconnected source wiring 3 through a bypass path of the molten metal in the disconnection repair region 51, the common electrode 5, and the molten metal in the disconnection repair region 52.

  Next, a laser beam is irradiated to the region 551, the region 552, the region 553, the region 554, and the region 555 of the common electrode 5 illustrated in FIG. 4 using a laser. Here, the region 551 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction can be separated from the common electrode 5 connected to the common capacitor wiring 7. The region 552 is a region in which the common electrode 5 between the pixels adjacent in the horizontal direction and the overlapping portion of the source wiring 3 can be separated from the other common electrode 5. The region 553 is a region where the common electrode 5 and the source wiring 3 between the pixels adjacent in the horizontal direction can be separated from the other common electrode 5. The region 554 is a region where the overlapping portion of the common electrode 5 and the source wiring 3 between pixels adjacent in the horizontal direction can be separated from the common electrode 5 opposite to the region 553 side. The region 555 is a region where the common electrode 5 having the disconnection repair region 52 can be separated from other common electrodes 5. Then, the common electrode 5 in these regions 551 to 555 is cut. As a result, the common electrode 5 in the portion which is processed to be conductive with the source wiring 3 by irradiation of the laser beam in the disconnection repair region 51 and the disconnection repair region 52 can be electrically separated from the other common electrode 5. Therefore, no conductor such as the source wiring 3 is provided below the regions 551 to 555 of the common electrode 5. Since it has such a structure, it does not become conductive with other conductors even when irradiated with a laser beam.

  As described above, even when the source wiring 3 is disconnected outside the disconnection repair region in one pixel, other pixels are affected by bypassing the disconnection portion between the disconnection repair regions of adjacent pixels. Disconnection can be repaired without any problems.

  In this example, between the adjacent pixels in the vertical direction (substantially perpendicular to the electric field generated between the common electrode 5 and the pixel electrode 6), that is, between the common electrodes 5 between the pixels with the gate wiring 1 as a boundary. Are connected by two electrode patterns 501 and 502. The region 552 and the region 553 that are cut by the laser beam are provided in the common electrode 5 between the portion where the electrode pattern 501 protrudes and the portion where the electrode pattern 502 protrudes. Therefore, even when the region 552 and the region 553 are cut, the connection state of the common electrode 5 between the pixels adjacent in the vertical direction is maintained by the one electrode pattern 501. Therefore, the region A shown in the figure can be prevented from becoming a defective region. The electrode patterns 501 and 502 are not limited to two, but may be a plurality of three or more.

Although the above embodiment shows the case where the pixel unit is bent once, it may be used two or more times or when it is not bent. Further, the pixel electrode and the common electrode are bent, and the same is used when the source wiring is not bent.
A method for manufacturing a liquid crystal display device according to the present invention.

  Next, the manufacturing process of the liquid crystal display device according to the first to third embodiments of the present invention will be described with reference to FIG. FIG. 5 is a process cross-sectional view illustrating a manufacturing process of the liquid crystal display device.

  First, as shown in FIG. 5A, an insulating substrate such as Cr, Al, Ti, Ta, Mo, W, Ni, Cu, Au, Ag, or an alloy containing them as a main component, or ITO is used. A light-transmitting conductive film or a multilayer film thereof is formed by sputtering, vapor deposition, or the like, and the gate wiring 1, the gate electrode, and the common capacitor wiring are formed by photolithography and processing. Next, as shown in FIG. 5B, a gate insulating film 2 made of silicon nitride or the like is formed, a semiconductor film 93 made of amorphous Si, polycrystalline poly-Si, or the like, and an n-type TFT. Is a contact film made of n + amorphous Si, n + polycrystalline poly-Si or the like doped with an impurity such as P at a high concentration, for example, by plasma CVD, atmospheric pressure CVD, or low pressure CVD. . Next, the contact film and the semiconductor film 93 are processed into an island shape.

  Next, as shown in FIG. 5 (c), Cr, Al, Ti, Ta, Mo, W, Ni, Cu, Au, Ag, etc., alloys based on them, or translucency of ITO, etc. After forming the conductive film, or a multilayer film thereof, by sputtering or vapor deposition, the source wiring 3, the source electrode, the drain electrode, the storage capacitor electrode, and the like are formed by photolithography and fine processing techniques. Further, the contact film is etched using the source and drain electrodes or the photoresist on which they are formed as a mask, and removed from the channel region.

  Next, an insulating film 4 made of an inorganic material such as silicon nitride or silicon oxide is formed. Thereafter, contact holes are formed by photolithography and subsequent etching. By providing the contact hole, the source wiring 3 or the gate wiring 1 is exposed.

  Next, an organic planarizing film 9 is provided on the insulating film 4. The organic planarizing film 9 is made of, for example, a photosensitive acrylic resin. A resin is provided on the insulating film 4 by spin coating, and the pattern of the organic planarizing film 9 is formed by exposure and development. Thereby, a contact hole for exposing the source line 3 or the gate line 1 is formed. Further, in the disconnection repair region 51 and the disconnection repair region 52 for repairing the disconnection, the organic planarization film 9 is removed and an opening is formed. In this case, for example, if a negative photosensitive resin is used for the organic planarizing film, a photomask having a light shielding portion at a position corresponding to the disconnection repair region is used. As a result, an opening is formed in the organic planarization film 9 in the disconnection repair region.

  Alternatively, in the disconnection repair region 51 and the disconnection repair region 52 for repairing the disconnection, a part of the organic planarizing film 9 is removed and thinned. In this case, a photomask in which a translucent portion having light and shade corresponding to the disconnection repair region is formed is used. Thereby, in the disconnection repair region, the exposure amount can be changed so that the exposure amount is between the light shielding portion and the light transmitting portion. A part of the organic flattening film 9 is removed in the disconnection repair region, and the organic flattening film 9 can be thinned. In this way, the organic planarizing film 9 can be thinned in the disconnection repair region.

  As shown in FIG. 5E from the top of the organic flattened film 9, Cr, Al, Ti, Ta, Mo, W, Ni, Cu, Au, Ag, etc., alloys containing them as main components, ITO, etc. The pixel electrode and the common electrode 5 are formed by patterning after forming a light-transmitting conductive film or a multilayer film thereof. Thereby, a common electrode can be formed on the opening of the organic planarization film 9 or the thinned portion in the disconnection repair region.

  Through the above process, a TFT substrate included in the horizontal electric field liquid crystal display device in this embodiment can be manufactured. Further, a liquid crystal is sandwiched between the TFT substrate and the counter substrate and bonded with a sealing material. At this time, liquid crystal molecules are aligned at a predetermined angle by a method such as rubbing or photo-alignment. Any known method may be used for aligning the liquid crystal. Further, a liquid crystal display device is manufactured by connecting a gate line driving circuit, a source line driving circuit, and a common capacitor wiring power source to the gate wiring, the source wiring, and the common capacitor wiring, respectively.

  When disconnection is detected after the array inspection process or in the panel inspection process, the disconnection repair areas 51 and 52 of the pixel corresponding to the disconnection portion are irradiated with laser to repair the disconnection. Further, the connection is separated by irradiating a laser to the disconnection repairing separation region that separates the connection in the overlapping region. Thereby, the disconnection can be easily repaired, and the display quality and productivity of the liquid crystal display device can be improved.

  In the above-described embodiment, the step of bringing the source electrode and the common electrode into a conductive state is performed prior to the step of separating a part of the common electrode, but the order of these steps may be reversed. Good. In addition, the contact hole of the organic planarizing film 9 is provided after the contact hole of the insulating film 4 is provided, but the contact hole of the organic planarizing film 9 and the contact hole of the insulating film 4 may be formed successively.

  In the above-described embodiment, the horizontal electric field type liquid crystal display device has been described. However, the present invention is not limited to this. That is, the present invention can provide a method for easily repairing the disconnection beyond the organic film, and can be used for other types of liquid crystal display devices. Furthermore, even in a display device other than a liquid crystal display device, the disconnection can be repaired beyond the organic film disposed between the first conductive layer and the second conductive layer.

It is a figure which shows the pixel part of the liquid crystal display device concerning this invention. It is sectional drawing of the pixel part of the liquid crystal display device concerning this invention. It is a figure which shows the pixel part of the liquid crystal display device concerning this invention. It is a figure which shows the pixel part of the liquid crystal display device concerning this invention. It is a figure which shows the manufacture flow of the liquid crystal display device concerning this invention. It is a figure which shows the pixel part of the conventional liquid crystal display device. It is a figure which shows the pixel part of the conventional liquid crystal display device. It is a figure which shows the pixel part of the conventional liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Gate wiring 2 Gate insulating film 3 Source wiring 4 Insulating film 5 Common electrode 6 Pixel electrode 7 Common capacity electrode 8 Gate electrode 9 Organic planarization film 51 Disconnection repair region 52 Disconnection repair region

Claims (13)

A first conductive layer to be a source wiring provided on the substrate;
An insulating film provided on the first conductive layer;
An insulating organic film formed on the insulating film;
A common electrode formed on the organic film and disposed opposite to the pixel electrode, the second conductive layer overlapping the first conductive layer in a certain region;
A display device in which a disconnection repair region from which the organic film has been removed is formed on the insulating film in a region where the first conductive layer and the second conductive layer overlap.   The display device according to claim 1, wherein the organic film is removed so that the insulating film is exposed in the disconnection repair region.   The display device according to claim 1, wherein a part of the organic film is removed and the organic film is thinned in the disconnection repair region.   The display device according to claim 1, wherein at least one disconnection repair region is formed for almost all pixels.   Separating the connection between the second conductive layer in the repaired pixel and the second conductive layer in another pixel outside the overlapping region where the first conductive layer and the second conductive layer overlap. The display device according to claim 4, further comprising a disconnection repair isolation region. The first conductive layer is a source wiring;
The second conductive layer is a common electrode disposed opposite to the pixel electrode;
6. A lateral electric field type liquid crystal display device in which a liquid crystal is driven in a direction parallel to the substrate by a display signal supplied to the pixel electrode through the source wiring. The display device described in 1. Forming a first conductive layer to be a source wiring on a substrate;
Forming an insulating film on the first conductive layer;
Forming an insulating organic film on the insulating film;
Removing the organic film on the insulating film to provide a disconnection repair region;
Forming a second conductive layer formed on the organic film and serving as a common electrode opposed to the pixel electrode, and overlapping the first conductive layer in a certain region;
And a step of electrically connecting the first conductive layer and the second conductive layer formed in the disconnection repair region of the pixel corresponding to the disconnection portion after detecting the disconnection of the source wiring. Production method.   The step of conducting the first conductive layer and the second conductive layer is characterized in that the first conductive layer and the second conductive layer are conducted by irradiating a laser beam. Item 8. A method for manufacturing a display device according to Item 7.   9. The method of manufacturing a display device according to claim 7, wherein one or two disconnection repair regions are formed for almost all pixels.   8. The disconnection portion disposed between the disconnection repair regions is bypassed by conducting the first conductive layer and the second conductive layer in a plurality of disconnection repair regions. 9. A manufacturing method of a display device according to any one of 9 above. Separating the connection between the second conductive layer in the repaired pixel and the second conductive layer in another pixel outside the overlapping region where the first conductive layer and the second conductive layer overlap. It further has a separation area for disconnection repair,
The method for manufacturing a display device according to claim 10, further comprising a step of cutting the second conductive layer in the disconnection repair separation region.   12. The method for manufacturing a display device according to claim 11, wherein in the step of cutting the second conductive layer, the second conductive layer is cut by irradiating a laser beam.   The method for manufacturing a display device according to claim 7, wherein the organic film is formed of a photosensitive resin.

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