CN1932370B - 照明设备和具有该照明设备的显示设备 - Google Patents

照明设备和具有该照明设备的显示设备 Download PDF

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Publication number
CN1932370B
CN1932370B CN2006101539556A CN200610153955A CN1932370B CN 1932370 B CN1932370 B CN 1932370B CN 2006101539556 A CN2006101539556 A CN 2006101539556A CN 200610153955 A CN200610153955 A CN 200610153955A CN 1932370 B CN1932370 B CN 1932370B
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CN
China
Prior art keywords
light
phosphor
color
conversion element
blue
Prior art date
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Expired - Fee Related
Application number
CN2006101539556A
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English (en)
Chinese (zh)
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CN1932370A (zh
Inventor
栗原慎
加藤一也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Seven Day Science And Technology Service Center LP
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of CN1932370A publication Critical patent/CN1932370A/zh
Application granted granted Critical
Publication of CN1932370B publication Critical patent/CN1932370B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN2006101539556A 2005-09-15 2006-09-15 照明设备和具有该照明设备的显示设备 Expired - Fee Related CN1932370B (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2005268517 2005-09-15
JP2005-268517 2005-09-15
JP2005268517 2005-09-15
JP2005355736 2005-12-09
JP2005-355736 2005-12-09
JP2005355736 2005-12-09
JP2006029856 2006-02-07
JP2006029856 2006-02-07
JP2006-029856 2006-02-07
JP2006200347A JP4898332B2 (ja) 2005-09-15 2006-07-24 表示装置
JP2006200347 2006-07-24
JP2006-200347 2006-07-24

Publications (2)

Publication Number Publication Date
CN1932370A CN1932370A (zh) 2007-03-21
CN1932370B true CN1932370B (zh) 2012-03-14

Family

ID=37854395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101539556A Expired - Fee Related CN1932370B (zh) 2005-09-15 2006-09-15 照明设备和具有该照明设备的显示设备

Country Status (4)

Country Link
US (1) US7661841B2 (enExample)
JP (1) JP4898332B2 (enExample)
CN (1) CN1932370B (enExample)
TW (1) TW200722867A (enExample)

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WO2018201618A1 (zh) * 2017-05-04 2018-11-08 深圳市华星光电技术有限公司 一种用于背光模组的光学膜、背光模组及显示设备

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WO2008146290A2 (en) * 2007-05-29 2008-12-04 Oree, Advanced Illumination Solutions Inc. Method and device for providing circumferential illumination
US8384092B2 (en) * 2007-08-30 2013-02-26 Nichia Corporation Light emitting device
JP5211667B2 (ja) * 2007-12-07 2013-06-12 ソニー株式会社 照明装置及び表示装置
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EP2260341A2 (en) * 2008-03-05 2010-12-15 Oree, Advanced Illumination Solutions INC. Illumination apparatus and methods of forming the same
JP5418762B2 (ja) * 2008-04-25 2014-02-19 ソニー株式会社 発光装置および表示装置
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US7888691B2 (en) * 2008-08-29 2011-02-15 Koninklijke Philips Electronics N.V. Light source including a wavelength-converted semiconductor light emitting device and a filter
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JP5717949B2 (ja) * 2009-01-26 2015-05-13 デクセリアルズ株式会社 光学部材および表示装置
US7995911B2 (en) * 2009-01-26 2011-08-09 Koninklijke Philips Electronics N.V. Matching led flash to camera's ambient light compensation algorithm
US20100208469A1 (en) * 2009-02-10 2010-08-19 Yosi Shani Illumination surfaces with reduced linear artifacts
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US8727597B2 (en) 2009-06-24 2014-05-20 Oree, Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
JP5255527B2 (ja) * 2009-07-03 2013-08-07 デクセリアルズ株式会社 色変換部材および表示装置
KR101091348B1 (ko) 2010-07-09 2011-12-07 엘지이노텍 주식회사 퀀텀 도트를 이용한 도광판과 그의 제조 방법, 및 백라이트 유닛
IT1401974B1 (it) * 2010-09-28 2013-08-28 Università Degli Studi Di Milano Bicocca Dispositivo illuminante
KR101210101B1 (ko) * 2010-11-23 2012-12-07 엘지이노텍 주식회사 표시장치
DE102011078402A1 (de) 2011-06-30 2013-01-03 Osram Ag Konversionselement und Leuchtdiode mit einem solchen Konversionselement
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
WO2014006501A1 (en) 2012-07-03 2014-01-09 Yosi Shani Planar remote phosphor illumination apparatus
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DE102013222430A1 (de) * 2013-11-05 2015-05-07 Osram Gmbh Beleuchtungsvorrichtung und Verfahren zum Erzeugen von Licht mittels einer Wellenlängenkonversionsanordnung und eines Bandstoppfilters sowie Verfahren zum Bereitstellen eines Bandstoppfilters
WO2015170814A1 (en) * 2014-05-09 2015-11-12 Lg Electronics Inc. Apparatus of light source for display and apparatus of display using the same
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WO2018201618A1 (zh) * 2017-05-04 2018-11-08 深圳市华星光电技术有限公司 一种用于背光模组的光学膜、背光模组及显示设备

Also Published As

Publication number Publication date
US7661841B2 (en) 2010-02-16
TW200722867A (en) 2007-06-16
JP4898332B2 (ja) 2012-03-14
US20070057626A1 (en) 2007-03-15
JP2007243135A (ja) 2007-09-20
CN1932370A (zh) 2007-03-21

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20211026

Address after: 527-b, 5 / F, building 10, yard a 69, Fushi Road, Haidian District, Beijing

Patentee after: Beijing seven day science and Technology Service Center (L.P.)

Address before: Chiba, Chiba, Japan

Patentee before: Seiko Instruments Inc.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120314

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