CN1931981A - Demolding material for integrated circuit packaging - Google Patents
Demolding material for integrated circuit packaging Download PDFInfo
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- CN1931981A CN1931981A CN 200610096270 CN200610096270A CN1931981A CN 1931981 A CN1931981 A CN 1931981A CN 200610096270 CN200610096270 CN 200610096270 CN 200610096270 A CN200610096270 A CN 200610096270A CN 1931981 A CN1931981 A CN 1931981A
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- demolding
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- demolding material
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Abstract
The present invention relates to demolding material for integrated circuit packaging, and is especially one kind of material as the supplementary material for large scale integrated circuit packaging and capable of facilitating demolding, reducing residue on the mold and maintaining mold clean. The demolding material is produced through adding wax, silica powder and organic peroxide into synthetic rubber; mixing to form homogeneous rubber material; flattening in a rolling mill; and cutting into rubber strip.
Description
Technical field
The present invention relates to a kind of demolding material of unicircuit encapsulation usefulness, specifically clear up and conveniently shirk film in the large-scale integrated circuit encapsulation process, reduce the resistates on the mould, keep the material of mould cleaning, belong to the subsidiary material in the large-scale integrated circuit production.
Background technology
Along with development of integrated circuits, moulding the fat encapsulated integrated circuit with epoxy has become main flow.Mould the fat encapsulated integrated circuit after certain quantity with epoxy, its die surface produces incrustation, the product surface obfuscation, the serious sticking to mould of wanting, mold damage, using clear, releasing agent to carry out the demoulding is indispensable important step in the plastic package process, its effect guarantees to produce normal.It has played the effect that guarantees plastic packaged integrated circuit reliability and visual appearance and prolong die life.
Before the present invention makes, in prior art, the large-scale integrated circuit packaging mould surface is produced the following method cleaning of the general employing of incrustation shirk: 1, adopt liquid spray; 2, aminoresin is matrix resin, and the inorganic mineral fine powder is a main stuffing, and cooperates clear, the releasing agent of multiple additives; 3, have clear, the releasing agent of the complementary thermosetting material of identical Shooting Technique with epoxy resin encapsulating material, its main composition is melamine resin, fibrous packing, granular filler, and part lubricant and solidifying agent; 4, use trimeric cyanamide and condition mixture as clear, releasing agent; Adopt aforesaid method to clear up mould following problems are generally arranged: need machine to shut down when 1, using; 2, the particle because of the reparation of die production line can cause environmental pollution; 3, irritating smell can cause environmental pollution.Be convenient in demoulding in the time of will taking into account reworking simultaneously when adopting above-mentioned materials cleaning mould, often can not make the best of both worlds.
Summary of the invention
The objective of the invention is to overcome above-mentioned weak point, thereby provide a kind of synthetic rubber of selecting for use as tackiness agent; Select for use natural/synthetic cured as lubricant, by osmosis, reduce the clinging power that stains thing that is bonded at die surface; Select for use silica flour as sorbent material, absorption has penetrated into the thing of staining on curing rubber sheet surface; Selecting organo-peroxide for use is elastomeric solidifying agent; , non-environmental-pollution easy to use, efficient by the demolding material that the organic assembling of above-mentioned component is made, and the material of the demoulding and the material of clear mould can be separated.
Main solution of the present invention is achieved in that
Its composition of demolding material and the proportioning of unicircuit encapsulation usefulness of the present invention by umber are:
The present invention adopts following processing step to make: gets 40～47 parts of synthetic rubber, adds natural/synthetic cured 15～25 parts, 38～45 parts of silica flours, 2～3 parts of organo-peroxides, and mixing at normal temperatures through stirring, discharge after mixture forms even colloid; Mixing time: 30～45 minutes; Above-mentioned mixing colloid is flattened, hacks and make colloid bar finished product through rolling press.
Colloid bar demolding material length of the present invention is: 170～220mm; Width is: 10～15mm; Thickness is: 5～10mm.
Organo-peroxide employing peroxidation phenylformic acid of the present invention or dibenzoyl peroxide are as the solidifying agent of sheet rubber.
Compared with the prior art the present invention has the following advantages:
The present invention can reduce the clinging power that stains thing that is bonded at die surface, and absorption has penetrated into the thing of staining on curing rubber sheet surface; The material cost of using is low; Need not use lead frame; Can enhance productivity, the time of comparing with the mold cleaner that uses epoxy resin encapsulating material to have the complementary thermosetting material of identical Shooting Technique can shorten about 70%; The material of clear mould and the material of the demoulding can be separated, realize making the best of both worlds; Need not preheating; Need not self-vulcanizing; Method for demoulding is simple and easy, efficient, non-environmental-pollution (tasteless smokeless); When using demolding material to shirk mould, as long as after using the clear mould of die cleaning material, the adhesive tape of demolding material is put behind the die surface matched moulds 1～2 time, the empty envelope of tape tree fat can be finished mold releasability work 1 time then, and is convenient, fast again.
Embodiment
Following the present invention will be further described in conjunction with the embodiments:
Embodiment one:
The demolding material of unicircuit encapsulation usefulness of the present invention adopts following processing step to make:
At first taking adhesive is 40 parts of synthetic rubber, add natural/synthetic cured 15 parts, by osmosis, reduce the clinging power that stains thing that is bonded at die surface as lubricant.Add 43 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, organo-peroxide is got 2 parts in peroxidation phenylformic acid.With said mixture stir carry out again mixing, mixing time: 30 minutes, mixing at normal temperatures; Mixture forms discharge behind the even colloid; Above-mentioned mixing colloid is flattened, hacks and make colloid bar finished product through rolling press.Finished product is through the packing warehouse-in.
Colloid bar demolding material length of the present invention is: 210mm; Width is: 10mm; Thickness is: 8mm.
Embodiment two:
The demolding material of unicircuit encapsulation usefulness of the present invention adopts following processing step to make:
At first taking adhesive is 45 parts of synthetic rubber, add natural/synthetic cured 15 parts, by osmosis, reduce the clinging power that stains thing that is bonded at die surface as lubricant.Add 38 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, organo-peroxide is got 2 parts in peroxidation phenylformic acid.With said mixture stir carry out again mixing, mixing time: 40 minutes, mixing at normal temperatures; Mixture forms discharge behind the even colloid; Above-mentioned mixing colloid flattens, hacks and make colloid stick demolding material through rolling press; Colloid stick demolding material length of the present invention is: 200mm; Width is: 12mm; Thickness is: 7mm.
Embodiment three:
The demolding material of unicircuit encapsulation usefulness of the present invention adopts following processing step to make:
At first taking adhesive is 47 parts of synthetic rubber, add natural/synthetic cured 15 parts, by osmosis, reduce the clinging power that stains thing that is bonded at die surface as lubricant.Add 43 parts of sorbent material silica flours, absorption has penetrated into the thing of staining on curing rubber sheet surface.Add the solidifying agent organo-peroxide of sheet rubber, organo-peroxide is got 2 parts in peroxidation phenylformic acid.With said mixture stir carry out again mixing, mixing time: 45 minutes, mixing at normal temperatures; Mixture forms discharge behind the even colloid; Above-mentioned mixing colloid flattens, hacks and make colloid stick demolding material through rolling press; Colloid stick demolding material length of the present invention is: 190mm; Width is: 10mm; Thickness is: 9mm.
The demolding material physical features that adopts different formula rates to make among three embodiment of the present invention is: proportion: 1.15～1.30g/cc; Mooney viscosity: 105～145; Tensile strength: 〉=30Kgf/sq cm; Extensibility: 〉=40%; Demolding material color: grey.
The present invention uses operation to carry out according to the following steps in conjunction with reality:
Mold pressure was made as when 1, the present invention used: 50～60kgf/cm2; Die temperature is: 175～200 ℃; Be set time: 360～400 seconds; Adopt automatic or MGP formula press, clear mould adhesive tape is put die surface, trigger " compression cleaning interval " then.As when adopting manual type (common) press, adhesive tape put die surface after, press the counterdie button that makes progress and make, counterdie is matched moulds immediately, and presses lower punch and make it to descend.After the operation, timing register set time on the control panel begins to count up to whole end cycle like this.
2, after clear mould end cycle and upper and lower mould are thrown off, to 3～5 seconds of curing rubber sheet surface hydro-peening, disperse smell and smog with spray gun.
3, be with gloves, injection air takes off the curing rubber sheet from die surface, and it is very easy to take off sheet rubber with the spray gun use from die surface.As solidify film viscous, cracked, film not phenomenon such as gel should improve die temperature, reduce mold pressure, prolong gel time.
4, check whether die surface has the resistates that attaches, and checks simultaneously whether the curing rubber sheet has the alveolus filling incomplete.As filling full situation in alveolus takes place should increase adhesive tape thickness.
5, with (actual matched moulds number of times can change according to the clean level of mould) behind the releasing agent matched moulds 3～5 times, close film again 1～2 time with remover, the empty envelope of tape tree fat can be finished for 1 time then.
Adopt conventional equipment to use among the present invention, starting material are purchased by market.
Claims (4)
1, a kind of demolding material of unicircuit encapsulation usefulness, it is characterized in that: adopt following processing step to make: to get 40～47 parts of synthetic rubber, add natural/synthetic cured 15～25 parts, 38～45 parts of silica flours, 2～3 parts of organo-peroxides, through stirring, mixing at normal temperatures, discharge after mixture forms even colloid; Mixing time: 30～45 minutes; Above-mentioned mixing colloid is flattened, hacks and make colloid bar finished product through rolling press.
2, the demolding material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described colloid bar length is: 170～220mm; Width is: 10～15mm; Thickness is: 5～10mm.
3, the demolding material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described organo-peroxide adopts peroxidation phenylformic acid or dibenzoyl peroxide.
4, the demolding material of a kind of unicircuit encapsulation usefulness according to claim 1 is characterized in that described demolding material color is a grey.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100962702A CN100529031C (en) | 2006-09-28 | 2006-09-28 | Demolding material for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100962702A CN100529031C (en) | 2006-09-28 | 2006-09-28 | Demolding material for integrated circuit packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1931981A true CN1931981A (en) | 2007-03-21 |
| CN100529031C CN100529031C (en) | 2009-08-19 |
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ID=37878014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100962702A Active CN100529031C (en) | 2006-09-28 | 2006-09-28 | Demolding material for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100529031C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772288B (en) * | 2008-12-31 | 2011-09-14 | 中国航空工业第一集团公司第六三一研究所 | Encapsulating technique for electronic components |
| CN102775656A (en) * | 2012-07-15 | 2012-11-14 | 湖州师范学院 | Rubber composition used for cleaning integrated circuit (IC) die |
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
-
2006
- 2006-09-28 CN CNB2006100962702A patent/CN100529031C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772288B (en) * | 2008-12-31 | 2011-09-14 | 中国航空工业第一集团公司第六三一研究所 | Encapsulating technique for electronic components |
| CN102775656A (en) * | 2012-07-15 | 2012-11-14 | 湖州师范学院 | Rubber composition used for cleaning integrated circuit (IC) die |
| CN102775656B (en) * | 2012-07-15 | 2015-06-03 | 湖州师范学院 | Rubber composition used for cleaning integrated circuit (IC) die |
| CN103817836A (en) * | 2014-02-18 | 2014-05-28 | 成都先进功率半导体股份有限公司 | Semiconductor die cleaning method |
| CN103817836B (en) * | 2014-02-18 | 2016-04-06 | 成都先进功率半导体股份有限公司 | The clear modeling method of a kind of semiconductor dies |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100529031C (en) | 2009-08-19 |
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| C06 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Demolding material for integrated circuit packaging Effective date of registration: 20140425 Granted publication date: 20090819 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: WuXi Le Dong Microelectronics Co., Ltd. Registration number: 2014990000297 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170418 Granted publication date: 20090819 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: WuXi Le Dong Microelectronics Co., Ltd. Registration number: 2014990000297 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Demolding material for integrated circuit packaging Effective date of registration: 20170418 Granted publication date: 20090819 Pledgee: Agricultural Bank of China Limited by Share Ltd Wuxi science and Technology Branch Pledgor: WuXi Le Dong Microelectronics Co., Ltd. Registration number: 2017990000319 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |