CN108047694A - Semiconductor packaging mold cleaning material and preparation method thereof - Google Patents
Semiconductor packaging mold cleaning material and preparation method thereof Download PDFInfo
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- CN108047694A CN108047694A CN201711458024.1A CN201711458024A CN108047694A CN 108047694 A CN108047694 A CN 108047694A CN 201711458024 A CN201711458024 A CN 201711458024A CN 108047694 A CN108047694 A CN 108047694A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C33/722—Compositions for cleaning moulds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
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Abstract
The invention belongs to semiconductor packaging industry to the cleaning technique field of mold, it is related to a kind of semiconductor packaging mold cleaning material and preparation method thereof.Semiconductor packaging mold cleaning material provided by the invention, is mainly prepared by the raw material of following parts by weight：0.5~2 part of 45~65 parts of rubber, 15~35 parts of Modification material, 1~4 part of bleeding agent, 2~7 parts of cleaning agent and crosslinking agent；Wherein, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 60%~80%, EP rubbers 10%~20% and butadiene rubber 10%~20%.The present invention can greatly reduce the residual of cleaning material, while increase and imitate fruit clearly, and greatly reduce the synthesis cost using cleaning material.
Description
Technical field
The invention belongs to semiconductor packaging industry to the cleaning technique field of mold, and in particular to a kind of semiconductor package is die-filling
Tool cleaning material and preparation method thereof.
Background technology
In Electronic Packaging industry, widely use metal die and epoxy molding plastic etc. realize semiconductor chip packaging into
The industrialized production of type.Due to injection moulding repeatedly or the operations such as shaping are transferred, is attached with and adds on the die surface of mold
Releasing agent used when the volatile ingredient that is generated during heat-formable material, the exudate on formed products surface, shaping etc., and these are attached
Object may go bad due to oxidation, and thus mold is contaminated.When mold is contaminated, to the completion size of formed products, appearance,
Release property etc. can all have a negative impact, while be also possible to generate mold and corrode and influence production efficiency；So to Encapsulation Moulds
The cleaning of tool seems particularly significant.
At present, the polluter on mold is remained in during packaged semiconductor for removing thermosetting resin etc.,
There are mainly two types of mode, one kind is using heat cured melmac compounding substances, is sticked by melamine and remained in
Polluter on mold；Another kind is using the uncrosslinked rubber containing cleaning agent, passes through the curing and suction of uncrosslinked rubber
Remaining polluter is disposed in attached effect, and cleaning agent main function is to reduce the dirty adsorption capacity in die face, and rubber is main
As adhering to dirty and take away dirty function.Wherein, it is complicated for operation using the clear mould of melmac mode, the clear mould time
Long, synthesis is of high cost, is all the auxiliary as the clear clear mould of mould item at present seldom all using the clear mould of melmac.And work as
The preceding clear clear mould of mould item is inadequate there are cleaning ability, increases the amount of cleaning agent and can improve clear mould ability to a certain extent, still
It can cause cigarette greatly and smell is big, while will also result in the inadequate from mould of entire adhesive tape, easily remain and pollute the situation of mold.
With the continuous upgrading of encapsulating material, environmentally protective material starts to use on a large scale, and the mold of encapsulation was producing
Cheng Zhong, booty are remaining more, it more difficult to wash.And current not the handing over containing cleaning agent using melmac or use
It is not high there are cleaning efficiency to join the clear cleaning material used in mould mode of two kinds of rubber, cleaning ingredient smell and cigarette are big, cause
The problems such as environmental pollution, cleaning material mixture easily remains.
In consideration of it, special propose the present invention.
The content of the invention
The first object of the present invention is to provide a kind of residual that can greatly reduce cleaning material, while increases and imitate clearly
Fruit greatly reduces the semiconductor packaging mold cleaning material of the synthesis cost using cleaning material.
The second object of the present invention is to provide a kind of preparation method of semiconductor packaging mold cleaning material, this method
Easy to operate, mild condition is at low cost, efficient.
To achieve the above object, the technical solution adopted by the present invention is：
According to an aspect of the present invention, the present invention provides a kind of semiconductor packaging mold cleaning material, the clear mould
Material is mainly prepared by the raw material of following parts by weight：
45~65 parts of rubber, 15~35 parts of Modification material, 1~4 part of bleeding agent, 2~7 parts of cleaning agent and crosslinking agent 0.5
~2 parts；
Wherein, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 60%~80%, second
Third rubber 10%~20% and butadiene rubber 10%~20%.
As further preferred technical solution, the cleaning material is mainly prepared by the raw material of following parts by weight：
50~60 parts of rubber, 20~30 parts of Modification material, 2~3 parts of bleeding agent, 3~6 parts of cleaning agent and crosslinking agent 0.5
~1.5 parts；
Preferably, the cleaning material is mainly prepared by the raw material of following parts by weight：
52~58 parts of rubber, 22~28 parts of Modification material, 2.2~2.8 parts of bleeding agent, 3.5~5.5 parts of cleaning agent and friendship
Join 0.6~1.2 part of agent.
As further preferred technical solution, the rubber is mainly made of the component of following weight percentage：Poly- ammonia
Ester rubber 64%~76%, EP rubbers 12%~18% and butadiene rubber 12%~18%；
Preferably, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 66%~74%,
EP rubbers 13%~17% and butadiene rubber 13%~17%.
As further preferred technical solution, the polyurethane rubber is millable polyurethane elastomer, polyurethane rubber
Molecular weight is 2~30,000.
As further preferred technical solution, the Modification material contains carrier and can be to table that carrier is modified
Face modifying agent, wherein, the surface modifier accounts for the 3~15% of the weight percentage of Modification material, preferably 4~
12%, further preferably 5~10%.
As further preferred technical solution, the carrier is selected from white carbon, silicon powder, aluminium oxide, zinc oxide, titanium dioxide
One kind in titanium and talcum powder is preferably one kind in white carbon and silicon powder, further preferably white carbon；
Preferably, the surface modifier is selected from γ-glycidoxypropyl trimethoxy silane, gamma-amino propyl
Triethoxysilane, gamma-amino propyl trimethoxy silicane, double-[γ-(triethoxy) propyl] tetrasulfide and double-
At least one of [γ-(triethoxy) propyl] disulphide, preferably γ aminopropyltriethoxy silane and γ-
At least one of TSL 8330.
As further preferred technical solution, the bleeding agent is selected from JFC, JFC-1, JFC-2, JFC-E, quickly oozes
At least one of saturating agent T, seeping at high temperature agent JFC-M and SF, are preferably seeping at high temperature agent JFC-M.
As further preferred technical solution, the cleaning agent is in alcamines, ethers, ketone or their derivative
At least one.
As further preferred technical solution, the cleaning material further includes 0.5~2 parts by weight of pigment, preferably 0.5~
1.5 parts by weight, further preferably 0.6~1.2 parts by weight.
According to another aspect of the present invention, the present invention also provides the semiconductor packaging molds described in more than one with clear mould
The preparation method of material, comprises the following steps：
Each raw material of formula ratio is uniformly mixed, is kneaded 40~60 minutes at a temperature of 40~70 DEG C, obtains colloid；By glue
Body is cut after calender flattens, and obtains the semiconductor packaging mold cleaning material.
Compared with prior art, the beneficial effects of the present invention are：
1st, semiconductor packaging mold cleaning material of the invention, based on polyurethane rubber, EP rubbers and suitable fourth rubber
Supplemented by glue, using the Modification material after surface treated as filler, while bleeding agent and cleaning agent etc. are equipped with, pass through molded curing
Process remain in the dirt of die surface to remove semiconductor packaging mold in production process is encapsulated, and pass through above-mentioned original
The synergistic effect of material can realize the cleaning performance more excellent than existing cleaning material.
2nd, raw material sources of the present invention are wide, of low cost, environmentally protective, environmentally safe, can greatly reduce using clear
The synthesis cost of mold materials.
3rd, the present invention can effectively clean the dirt of packaging mould surface, and cleaning performance is excellent, while can greatly reduce
The residual of cleaning material avoids secondary pollution, while cleaning efficiency is high, clear mould operation simple, efficient, safe ready.
4th, the preparation method of semiconductor packaging mold cleaning material of the invention, simple for process, preparation process is easy to grasp
Make, mild condition, clear mould mode is easy, and actual application value is high, reduces production cost, improves production efficiency, and is made
Stability of material it is good, be suitble to industrialization large-scale production.
Specific embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment and embodiment, but this field skill
Art personnel will be understood that following embodiments and embodiment are merely to illustrate the present invention, and be not construed as the model of the limitation present invention
It encloses.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
Every other embodiment, belongs to the scope of protection of the invention.The person that is not specified actual conditions, builds according to normal condition or manufacturer
The condition of view carries out.Reagents or instruments used without specified manufacturer is the conventional production that can be obtained by commercially available purchase
Product.
In a first aspect, a kind of semiconductor packaging mold cleaning material, the cleaning material are provided in some embodiments
Mainly it is prepared by the raw material of following parts by weight：
45~65 parts of rubber, 15~35 parts of Modification material, 1~4 part of bleeding agent, 2~7 parts of cleaning agent and crosslinking agent 0.5
~2 parts；
Wherein, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 60%~80%, second
Third rubber 10%~20% and butadiene rubber 10%~20%.
Above-mentioned cleaning material is based on polyurethane rubber, supplemented by EP rubbers and butadiene rubber, after surface treated
Modification material for filler, while be equipped with bleeding agent and cleaning agent etc., semiconductor package removed by the process of molded curing
It is die-filling to have the dirt that die surface is remained in production process is encapsulated.
Wherein, polyurethane rubber has the spies such as high-strength high elasticity, high-wearing feature, ageing-resistant, tear-resistant, good electric conductivity
Point, at the same polyurethane rubber have certain mechanics rigidity and and the degree of cross linking, mainly using on the basis of polyurethane rubber,
It is aided with suitable EP rubbers and butadiene rubber, whole elasticity and intensity can be improved.It is in addition, whole to further improve
Intensity employs the Modification material after surface treated as filler, and Modification material after processing has with rubber
Better compatibility and dispersiveness.Meanwhile fruit is imitated clearly in order to improve, it also added bleeding agent simultaneously and with cleaning function
Cleaning agent, the dirty adsorption capacity on metal die surface is reduced by bleeding agent, can greatly improve and imitate fruit clearly.So as to lead to
The coordinated effect of the raw materials such as polyurethane rubber, butadiene rubber, EP rubbers, Modification material, bleeding agent and cleaning agent is crossed,
So that the cleaning material realizes the cleaning performance more excellent than existing cleaning material.
Meanwhile the raw material sources of the cleaning material are wide, and it is at low cost, it is environmentally protective, it can greatly reduce using cleaning material
Synthesis cost；And the residual of cleaning material is greatly reduced, avoid secondary pollution, operation is easy during cleaning, and cleaning efficiency is high, can
The time is saved, saves cost.
Count in parts by weight, the typical but non-limiting content of rubber for 45 parts, 46 parts, 48 parts, 50 parts, 52 parts, 54 parts,
55 parts, 56 parts, 58 parts, 60 parts, 62 parts, 64 parts or 65 parts；The typical but non-limiting content of Modification material for 15 parts, 16
Part, 18 parts, 20 parts, 22 parts, 24 parts, 25 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts or 35 parts；Bleeding agent is typical but unrestricted
Property content be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts or 4 parts；The typical but non-limiting content of cleaning agent for 2 parts,
2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts 6.5 parts or 7 parts；The typical but non-limiting content of crosslinking agent
For 0.5 part, 0.8 part, 1 part, 1.2 parts, 1.5 parts, 1.6 parts, 1.8 parts or 2 parts.
In the rubber, the typical but non-limiting weight percentage of polyurethane rubber is 60%, 62%, 64%,
65%th, 66%, 68%, 70%, 72%, 74%, 75%, 76%, 78% or 80%；EP rubbers is typical but non-limiting heavy
It is 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19% or 20% to measure percentage composition；Butadiene rubber
Typical but non-limiting weight percentage is 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%,
19% or 20%.
In a preferred embodiment, the cleaning material is mainly prepared by the raw material of following parts by weight：
50~60 parts of rubber, 20~30 parts of Modification material, 2~3 parts of bleeding agent, 3~6 parts of cleaning agent and crosslinking agent 0.5
~1.5 parts；
Preferably, the cleaning material is mainly prepared by the raw material of following parts by weight：
52~58 parts of rubber, 22~28 parts of Modification material, 2.2~2.8 parts of bleeding agent, 3.5~5.5 parts of cleaning agent and friendship
Join 0.6~1.2 part of agent.
By the content for further optimizing each raw material so that the proportioning of each raw material is more scientific and reasonable, so that clear mould
Better, the residual of cleaning material is less, cleaning efficiency higher.
In a preferred embodiment, the rubber is mainly made of the component of following weight percentage：Poly- ammonia
Ester rubber 64%~76%, EP rubbers 12%~18% and butadiene rubber 12%~18%；
Preferably, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 66%~74%,
EP rubbers 13%~17% and butadiene rubber 13%~17%.
By the content for further optimizing three kinds of rubber in rubber so that the proportioning of three kinds of rubber is more scientific and reasonable, into
And so that whole intensity and elasticity are preferably, further improve the clear raising imitated fruit, realize washing and cleaning operation.
In a preferred embodiment, the polyurethane rubber is millable polyurethane elastomer, polyurethane rubber
Molecular weight is 2~30,000.
In the rubber, polymer uses molecular weight to polymerize as 20,000~30,000 mixed milling type using the polyurethane rubber of polarity
Based on object, the polymer of the type has a rigidity and the degree of cross linking of certain mechanics, appropriate and with EP rubbers and butadiene rubber,
Whole elasticity and intensity can be improved.Meanwhile the cooperation of above-mentioned three kinds of rubber cause shaping when pollution it is few, whole physical mechanical
Performance is more high.In addition, using millable polyurethane elastomer in cleaning material, because there is many in the structure of the rubber
The functional group of close dirt, such as carbamate groups, urea groups, so that dirt and rubber more can be firmly combined together,
Fruit is preferably imitated clearly to reach.
In a preferred embodiment, the Modification material contains carrier and can be to table that carrier is modified
Face modifying agent, wherein, the surface modifier accounts for the 3~15% of the weight percentage of Modification material, preferably 4~
12%, further preferably 5~10%.
By the addition of Modification material, the intensity of material entirety can be further enhanced, especially with by surface
Treated Modification material enables to filler material to have good compatibility and dispersiveness with other basis materials, reduces
Time of fusion improves production efficiency.
The typical but non-limiting weight percentage of surface modifier is 3%, 4%, 5%, 6%, 7%, 8%, 9%,
10%th, 11%, 12%, 13%, 14% or 15%.
The average grain diameter of Modification material is about 10~80 nanometers, and specific surface area is 200 ± 100m2/ g, preferably 200 ±
50m2/g.The large specific surface area of Modification material can improve integral hardness and intensity, while to dirty adsorption capacity bigger,
Production cost can be reduced and improve production environment.
In a preferred embodiment, the carrier is selected from white carbon, silicon powder, aluminium oxide, zinc oxide, titanium dioxide
One kind in titanium and talcum powder is preferably one kind in white carbon and silicon powder, further preferably white carbon；
Preferably, the surface modifier is selected from γ-glycidoxypropyl trimethoxy silane, gamma-amino propyl
Triethoxysilane, gamma-amino propyl trimethoxy silicane, double-[γ-(triethoxy) propyl] tetrasulfide and double-
At least one of [γ-(triethoxy) propyl] disulphide, preferably γ aminopropyltriethoxy silane and γ-
At least one of TSL 8330.
Modification material in present embodiment is preferably using modified white carbon black or improved silica, modified dioxy
SiClx is treated surface-modified dose of surface white carbon so that surface wettability, dispersiveness of material etc. are improved, and are added
Strong wearability, tear resistance and tensile strength.In addition, the polar group in these surface modifiers can be with dirty generation
Cross-linked structure achievees the purpose that enhancing removal is dirty.
Optionally, the preparation method of improved silica is as follows：By white carbon and water according to 1：5 ratio mixes to
After being uniformly dispersed, high-speed stirred is carried out in the stirred tank at a temperature of 60~70 DEG C, hard charcoal black wash is obtained after the completion of stirring；It will be white
Carbon black and surface modifier are mixed by proportioning, and high-speed stirred is carried out in the stirred tank at a temperature of 60~70 DEG C, is then carried out
Filtering means dehydration is starched after the completion of dehydration in half tide, and half tide is starched and is sent into pulper and carries out slurrying, then is dried to get to modification
Silica.
Since white carbon is three-dimensional globular Nano filling, even if grain size is about nanometer, its addition can play reinforcement effect
Fruit further improves the mechanical mechanics property of rubber, plays humidification；In addition, by after the surface-modified processing of white carbon, it can
So that it is more advantageous to, rubber matrix is compatible, obtain it is a kind of with excellent dispersiveness and with the good phase of other basis materials
The packing material of capacitive, and further obtain the clear mould with mechanical property, processing performance, the dynamic property significantly improved etc.
Material.
In a preferred embodiment, the bleeding agent is selected from JFC, JFC-1, JFC-2, JFC-E, quickly oozes
At least one of saturating agent T, seeping at high temperature agent JFC-M and SF, are preferably seeping at high temperature agent JFC-M.
Bleeding agent in present embodiment has good permeance property preferably using seeping at high temperature agent JFC-M,
It is easy to wash away various dirts, the dirty adsorption capacity on metal die surface can be significantly reduced, is realized with cleaning agent cooperation fine
Synergistic effect, accelerate cleaning speed, shorten scavenging period, increase substantially and imitate fruit clearly.
In a preferred embodiment, the cleaning agent is in alcamines, ethers, ketone or their derivative
At least one.
It is clear with cleaning function that alcamines commonly used in the art, ethers etc. can be used in cleaning agent in present embodiment
Lotion includes but not limited to monoethanolamine, diethanol amine, triethanolamine, diethylenetriamine, N- dimethylethanolamines, N- fourths
Base diethanol amine, phenylhydroxylamine, 4- amidos amylalcohol, cyclohexanone, diacetone alcohol, propylene-glycol ethyl ether, Propylene glycol n-propyl ether, the third two
The tertiary butyl ether of alcohol, diethylene glycol diethyl ether, aminomethyl propanol etc..
In a preferred embodiment, the cleaning material further includes 0.5~2 parts by weight of pigment, preferably 0.5~
1.5 parts by weight, further preferably 0.6~1.2 parts by weight.
It in present embodiment, is not particularly limited for crosslinking agent and pigment, what it is using type commonly used in the art is
It can.Such as pigment can be lithopone, chrome yellow, titanium viridescent etc., crosslinking agent can be double (t-butyl peroxy) hexamethylenes of 1,1-,
Double (t-butyl peroxy) hexanes of Isosorbide-5-Nitrae-dual-tert-butyl peroxy isopropyl base benzene, 2,5- dimethyl -2,5- etc..
Second aspect provides the preparation method of the semiconductor packaging mold cleaning material described in more than one, including with
Lower step：
Each raw material of formula ratio is uniformly mixed, is kneaded 40~60 minutes at a temperature of 40~70 DEG C, obtains colloid；By glue
Body is cut after calender flattens, and obtains the semiconductor packaging mold cleaning material.
Further speaking, using open mill or mixer by compounding rubber into cake shape, then add again Modification material and
Other auxiliary agents such as bleeding agent finally add peroxide cure object or other vulcanizing agents again, treat that the in vivo material of glue is uniformly dispersed
Afterwards, after colloid is flattened using calender, the semiconductor packaging mold cleaning material stated.
The preparation method is simple for process, and preparation process is easily operated, mild condition, and actual application value is high, and obtained
Stability of material is good, is suitble to industrialization large-scale production.
Meanwhile cleaning material using the present invention carries out clear mould operation, conveniently, safely, efficiently, can significantly reduce production
Cost improves production efficiency.
With reference to specific embodiment and comparative example, the invention will be further described.
Embodiment 1
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
0.5 part of 65 parts of rubber, 15 parts of modified white carbon black, JFC-M1 parts of seeping at high temperature agent, 2 parts of cleaning agent and crosslinking agent；
Wherein, the rubber is mainly made of the component of following weight percentage：Millable polyurethane elastomer 60%, second
Third rubber 20% and butadiene rubber 20%；
Surface modifier is γ aminopropyltriethoxy silane, and surface modifier accounts for the weight percent of modified white carbon black
The 5% of content；Cleaning agent is alcamines cleaning agent.
Embodiment 2
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
2 parts of 45 parts of rubber, 32 parts of modified white carbon black, JFC-M4 parts of seeping at high temperature agent, 7 parts of cleaning agent and crosslinking agent；
Remaining is the same as embodiment 1.
Embodiment 3
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
1 part of 50 parts of rubber, 30 parts of modified white carbon black, JFC-M2 parts of seeping at high temperature agent, 4 parts of cleaning agent and crosslinking agent；
Remaining is the same as embodiment 1.
Embodiment 4
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
1.2 parts of 56 parts of rubber, 28 parts of modified white carbon black, JFC-M2.5 parts of seeping at high temperature agent, 5 parts of cleaning agent and crosslinking agent；
Remaining is the same as embodiment 1.
Embodiment 5
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
58 parts of rubber, 28 parts of modified white carbon black, JFC-M2.5 parts of seeping at high temperature agent, 4.5 parts of cleaning agent, 1 part of crosslinking agent and
1 part of pigment；
Wherein, the rubber is mainly made of the component of following weight percentage：Millable polyurethane elastomer 66%, second
Third rubber 17% and butadiene rubber 17%；
Surface modifier is γ aminopropyltriethoxy silane, and surface modifier accounts for the weight percent of modified white carbon black
The 10% of content；Cleaning agent is ethers cleaning agent.
Embodiment 6
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
50 parts of rubber, 20 parts of modified white carbon black, JFC-M2 parts of seeping at high temperature agent, 3 parts of cleaning agent, 1 part of crosslinking agent and pigment
0.6 part；
Wherein, the rubber is mainly made of the component of following weight percentage：Millable polyurethane elastomer 76%, second
Third rubber 12% and butadiene rubber 12%；
Surface modifier is γ aminopropyltriethoxy silane, and surface modifier accounts for the weight percent of modified white carbon black
The 8% of content；Cleaning agent is ethers cleaning agent.
Embodiment 7
A kind of semiconductor packaging mold cleaning material, with differing only in for embodiment 6：Modified white carbon black is replaced with
Modified silicon powder.
Embodiment 8
A kind of semiconductor packaging mold cleaning material, with differing only in for embodiment 6：By three second of gamma-amino propyl
Oxysilane replaces with γ-glycidoxypropyl trimethoxy silane.
Embodiment 9
A kind of semiconductor packaging mold cleaning material, with differing only in for embodiment 6：By seeping at high temperature agent JFC-M
Replace with penetrating agent JFC-E.
The preparation method of semiconductor packaging mold cleaning material described in embodiment 1-9, comprises the following steps：
Each raw material of formula ratio is uniformly mixed, is kneaded 40 minutes at a temperature of 60 DEG C, obtains colloid；By colloid through calendering
Machine is cut after flattening, and obtains the semiconductor packaging mold cleaning material.
Comparative example 1
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
80 parts of rubber, 10 parts of modified white carbon black, JFC-M5 parts of seeping at high temperature agent, 8 parts of cleaning agent, 3 parts of crosslinking agent and pigment
3 parts；
Remaining is the same as embodiment 6.
In this comparative example, the content of each raw material is not in scope provided by the present invention.
Comparative example 2
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
75 parts of rubber, 12 parts of modified white carbon black, JFC-M3 parts of seeping at high temperature agent, 5 parts of cleaning agent, 1 part of crosslinking agent and pigment
1 part；
Remaining is the same as embodiment 6.
In this comparative example, the content of rubber and modified white carbon black is not in scope provided by the present invention.
Comparative example 3
A kind of semiconductor packaging mold cleaning material, is mainly prepared by the raw material of following parts by weight：
50 parts of rubber, 20 parts of modified white carbon black, JFC-M2 parts of seeping at high temperature agent, 3 parts of cleaning agent, 1 part of crosslinking agent and pigment
0.6 part；
Wherein, the rubber is mainly made of the component of following weight percentage：Millable polyurethane elastomer 40%, second
Third rubber 30% and butadiene rubber 30%；
Remaining is the same as embodiment 6.
In this comparative example, the proportioning of millable polyurethane elastomer, EP rubbers and butadiene rubber is not provided by the present invention
In the range of.
Comparative example 4
A kind of semiconductor packaging mold cleaning material, with differing only in for embodiment 6：Modified white carbon black is replaced with
Common white carbon.
Comparative example 5
A kind of semiconductor packaging mold cleaning material, with differing only in for embodiment 6：Polyurethane rubber is replaced with
Acrylic rubber.
Comparative example 6
Existing melamine cleaning material (DONGJIN SEMICHEM CO., ltd.).
Respectively to the cleaning material in embodiment 1-9 and comparative example 1-6, using effect evaluation test, test side are carried out
Method is：By the mold clean material clip of sheet in mold for forming, apply 190 DEG C of temperature, pressure 60kgf/cm2, continue into
Row 5 minutes.Test result is as shown in table 1.
1 test result of table
As can be seen from Table 1, the cleaning material of semiconductor packaging mold made from 1-9 of the embodiment of the present invention has higher
Mechanical property and suitable intensity, compared to comparative example 1-6, have and superior imitate fruit clearly.
From the comparative analysis of comparative example 1-3 and embodiment 6, change one or more raw materials in cleaning material
Proportioning makes its raw material proportioning not in the scope of protection of the invention, its using effect can be caused to be deteriorated；Thus illustrate in this hair
Under the proportioning of bright restriction, each raw material cooperates so that material has superior performance, enhances and imitates fruit clearly.
From the comparative analysis of comparative example 4-5 and embodiment 6, using treated Modification material and using poly-
Urethane rubber can improve mechanical property, improve whole elasticity and intensity, improve and imitate fruit clearly, complete to mold
Thoroughly cleaning.
From the comparative analysis of comparative example 6 and embodiment 6, the side such as mechanical property, intensity of cleaning material of the invention
Face is superior to the melamine cleaning material used in the prior art, and rate and better cleaning performance are imitated clearly with higher.
To sum up, cleaning material of the invention meets basic mechanical property requirements, possesses higher mechanical property, favorably
It is thoroughly taken out from mold without being polluted to mold in it, and takes pollutant out of, complete the cleaning to mold.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical characteristic into
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is not made to depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of semiconductor packaging mold cleaning material, which is characterized in that the cleaning material is mainly by following parts by weight
Raw material is prepared：
45~65 parts of rubber, 15~35 parts of Modification material, 1~4 part of bleeding agent, 2~7 parts of cleaning agent and crosslinking agent 0.5~2
Part；
Wherein, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 60%~80%, the third rubber of second
Glue 10%~20% and butadiene rubber 10%~20%.
2. semiconductor packaging mold cleaning material according to claim 1, which is characterized in that the cleaning material is main
It is prepared by the raw material of following parts by weight：
50~60 parts of rubber, 20~30 parts of Modification material, 2~3 parts of bleeding agent, 3~6 parts of cleaning agent and crosslinking agent 0.5~1.5
Part；
Preferably, the cleaning material is mainly prepared by the raw material of following parts by weight：
52~58 parts of rubber, 22~28 parts of Modification material, 2.2~2.8 parts of bleeding agent, 3.5~5.5 parts of cleaning agent and crosslinking agent
0.6~1.2 part.
3. semiconductor packaging mold cleaning material according to claim 1, which is characterized in that the rubber mainly by with
The component of lower weight percentage is formed：Polyurethane rubber 64%~76%, EP rubbers 12%~18% and butadiene rubber
12%~18%；
Preferably, the rubber is mainly made of the component of following weight percentage：Polyurethane rubber 66%~74%, second third
Rubber 13%~17% and butadiene rubber 13%~17%.
4. according to claims 1 to 3 any one of them semiconductor packaging mold cleaning material, which is characterized in that described poly-
Urethane rubber is millable polyurethane elastomer, and the molecular weight of polyurethane rubber is 2~30,000.
5. according to claims 1 to 3 any one of them semiconductor packaging mold cleaning material, which is characterized in that described to change
Property filler material contain carrier and can to the surface modifier that carrier is modified, wherein, the surface modifier account for modification fill out
The 3~15% of the weight percentage of charge are preferably 4~12%, and further preferably 5~10%.
6. semiconductor packaging mold cleaning material according to claim 5, which is characterized in that the carrier is selected from hard charcoal
One kind in black, silicon powder, aluminium oxide, zinc oxide, titanium dioxide and talcum powder is preferably one in white carbon and silicon powder
Kind, it is more preferably white carbon；
Preferably, the surface modifier is selected from γ-glycidoxypropyl trimethoxy silane, three second of gamma-amino propyl
Oxysilane, gamma-amino propyl trimethoxy silicane, double-[γ-(triethoxy) propyl] tetrasulfide and double-[γ-
At least one of (triethoxy) propyl] disulphide, it is preferably γ aminopropyltriethoxy silane and gamma-amino
At least one of propyl trimethoxy silicane.
7. according to claims 1 to 3 any one of them semiconductor packaging mold cleaning material, which is characterized in that described to ooze
Saturating agent in JFC, JFC-1, JFC-2, JFC-E, fast penetrant T, seeping at high temperature agent JFC-M and SF at least one
Kind, it is preferably seeping at high temperature agent JFC-M.
8. according to claims 1 to 3 any one of them semiconductor packaging mold cleaning material, which is characterized in that described clear
Lotion is selected from least one of alcamines, ethers, ketone or their derivative.
9. according to claims 1 to 3 any one of them semiconductor packaging mold cleaning material, which is characterized in that described clear
Mold materials further includes 0.5~2 parts by weight of pigment, is preferably 0.5~1.5 parts by weight, further preferably 0.6~1.2 parts by weight.
10. such as the preparation method of claim 1~9 any one of them semiconductor packaging mold cleaning material, feature exists
In comprising the following steps：
Each raw material of formula ratio is uniformly mixed, is kneaded 40~60 minutes at a temperature of 40~70 DEG C, obtains colloid；Colloid is passed through
Calender is cut after flattening, and obtains the semiconductor packaging mold cleaning material.
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| CN201711458024.1A CN108047694A (en) | 2017-12-27 | 2017-12-27 | Semiconductor packaging mold cleaning material and preparation method thereof |
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Cited By (3)
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| CN110845772A (en) * | 2019-11-22 | 2020-02-28 | 深圳市硕立特科技有限公司 | Mold moistening adhesive tape without sodium ions and manufacturing process of mold moistening adhesive tape |
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Application publication date: 20180518 |